CN220420571U - Power module - Google Patents

Abstract

The utility model discloses a power module, which comprises: the heat dissipation substrate is provided with a plurality of base islands which are arranged along a first direction, and the length of the heat dissipation substrate in the first direction is L; the power chips are respectively arranged on the base islands; the plastic package body encapsulates the heat dissipation substrate and the power chips, n jacking holes which are distributed along the first direction are formed on the surface of the plastic package body opposite to the heat dissipation substrate, the jacking holes are holes reserved after the jacking pins prop against the heat dissipation substrate, when L is less than or equal to 40mm, n is less than or equal to 2 and less than or equal to 4, and the jacking holes at two ends of the first direction correspond to the base islands at two ends of the first direction respectively; when L is more than 40mm, n is more than 4, and each base island is correspondingly provided with at least one top pinhole. Therefore, the plastic package forming effect of the power module is better, the glue overflow problem of the heat dissipation substrate can be effectively solved, and the process procedures of removing the glue overflow on the surface of the heat dissipation substrate can be reduced.

Description

Power module

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a power module.

Background

In the prior art, in the design of an intelligent power module, a thimble is usually designed on an injection mold to press a heat-dissipating substrate in the plastic packaging process, and the thimble (a fixed needle or a loose core needle) is arranged on the mold in the opposite direction of the heat-dissipating substrate, so that the thimble is propped against the heat-dissipating substrate to fix a heat-dissipating fin during injection molding. When the power module is changed along with the change of the internal structure, the size and the size of the ejector pins are changed, so that the positions, the sizes and the number of the ejector pins are required to be changed, the sizes of the radiating substrates are different aiming at intelligent power modules with different sizes, and the problem is how to reasonably fix the number and the positions of the ejector pins on the radiating substrates.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an objective of the present utility model is to provide a power module, which can effectively solve the problem of glue overflow of a heat dissipation substrate in a power module plastic packaging process, can make the effect of plastic packaging and molding of the power module better, and can reduce the process steps of removing glue overflow on the surface of the heat dissipation substrate, thereby improving the production efficiency.

According to an embodiment of the utility model, a power module includes: the heat dissipation substrate is provided with a plurality of islands arranged along a first direction, and is provided with a heat dissipation bottom surface, and the length of the heat dissipation substrate in the first direction is L; the power chips are respectively arranged on the base islands; the plastic package body encapsulates the heat dissipation substrate and the power chips, the bottom surface of the plastic package body is level with the heat dissipation bottom surface, n jacking holes which are distributed along a first direction are formed on the surface of the plastic package body opposite to the heat dissipation substrate, the jacking holes are holes reserved after the jacking pins prop the heat dissipation substrate, when L is less than or equal to 40mm, n is less than or equal to 2 and less than or equal to 4, and the jacking holes at two ends of the first direction respectively correspond to the base islands at two ends of the first direction; when L is more than 40mm, n is more than 4, and each base island is correspondingly provided with at least one top pinhole.

Therefore, the number and the positions of the top pinholes are optimized for power modules with different sizes, the problem of glue overflow of the heat dissipation substrate in the power module plastic package process can be effectively solved, the plastic package forming effect of the power module is better, the process steps of removing glue overflow on the surface of the heat dissipation substrate can be reduced, and accordingly production efficiency can be improved.

According to some embodiments of the utility model, n=2 when l.ltoreq.25 mm.

According to some embodiments of the utility model, n=3, where 25mm < l.ltoreq.32 mm, the top pinholes in the middle of the first direction correspond to the edges of two adjacent islands at the same time.

According to some embodiments of the utility model, the plurality of islands comprises: first base island, second base island, third base island and fourth base island that arrange along first direction, a plurality of power chips include: the low-voltage power chip is respectively arranged on the first base island, the second base island and the third base island, the high-voltage power chip is arranged on the fourth base island, and the top pinhole in the middle of the first direction corresponds to the edges of the third base island and the fourth base island.

According to some embodiments of the utility model, when 32mm < l.ltoreq.40 mm, n=4, the two top pinholes in the middle of the first direction correspond to the two islands in the middle of the first direction.

According to some embodiments of the utility model, the plurality of islands comprises: first base island, second base island, third base island and fourth base island that arrange along first direction, a plurality of power chips include: the low-voltage power chip is respectively arranged on the first base island, the second base island and the third base island, the high-voltage power chip is arranged on the fourth base island, and the first base island, the second base island, the third base island and the fourth base island are respectively corresponding to one top pinhole.

According to some embodiments of the utility model, the plurality of islands comprises: first base island, second base island, third base island and fourth base island that arrange along first direction, a plurality of power chips include: the low-voltage power chip is arranged on the first base island, the second base island and the third base island respectively, and the high-voltage power chip is arranged on the fourth base island; when L > 40mm and n=5, the first base island, the second base island and the third base island each correspond to one of the top pinholes, and the fourth base island corresponds to two of the top pinholes.

According to some embodiments of the utility model, the plurality of islands comprises: first base island, second base island, third base island and fourth base island that arrange along first direction, a plurality of power chips include: the low-voltage power chip is arranged on the first base island, the second base island and the third base island respectively, and the high-voltage power chip is arranged on the fourth base island; when L is more than 40mm and n is more than 5, a top pinhole is arranged on one side, deviating from the second base island, of the first base island, the edge of the second base island, the edge of the third base island and the edge of the fourth base island are respectively and simultaneously corresponding to one top pinhole, and at least two top pinholes are correspondingly arranged on the fourth base island.

According to some embodiments of the utility model, the power module further comprises: the lead frame is arranged on one side of the second direction of the heat dissipation substrate, and the second direction is perpendicular to the first direction; when n is less than or equal to 5, the top pinholes are positioned at the other side of the second direction of the base island, and the top pinholes at the two ends of the first direction respectively correspond to the end angles of the base island at the two ends of the first direction; when n is more than 5, n top pinholes are positioned in the middle of the base island in the second direction.

According to some embodiments of the utility model, the heat dissipating substrate comprises: insulating resin layer and copper layer that the stromatolite set up, copper layer with insulating resin layer's opposite side surface constitutes the heat dissipation bottom surface, power module still includes: a lead frame provided on the insulating resin layer of the heat dissipation substrate, the lead frame having a plurality of islands at a portion thereof opposite to the insulating resin layer; or the heat dissipation substrate includes: ceramic plate and copper layer, the copper layer set up in on the ceramic plate, the copper layer is formed with a plurality of the base island, the ceramic plate with copper layer opposite one side surface constitutes the heat dissipation bottom surface, power module still includes: a lead frame connected to the copper layer; or the heat dissipation substrate includes: the ceramic plate with locate the copper layer of ceramic plate both sides, the surface on one side copper layer of ceramic plate constitutes the heat dissipation bottom surface, the opposite side copper layer of ceramic plate is formed with a plurality of the base island, power module still includes: and the lead frame is connected with the copper layer on the other side of the ceramic plate.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

fig. 1 is a schematic diagram of a power module according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a structure in which there are two top pinholes on a heat dissipating substrate according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram of a heat dissipating substrate with three top pinholes according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a heat dissipating substrate with five top pinholes according to an embodiment of the present utility model;

FIG. 5 is a schematic diagram of a heat dissipating substrate with seven top pinholes according to an embodiment of the present utility model;

fig. 6 is a schematic structural diagram of a heat dissipating substrate mated with a leadframe according to an embodiment of the utility model.

Reference numerals:

100. a power module;

10. a heat-dissipating substrate;

20. a plurality of power chips; 21. a low voltage power chip; 22. a high voltage power chip;

30. a plastic package body;

40. a base island; 41. a first island; 42. a second island; 43. a third island; 44. a fourth island;

50. a top pinhole; 60. and a lead frame.

Detailed Description

Embodiments of the present utility model will be described in detail below, with reference to the accompanying drawings, which are exemplary.

As the use of Intelligent Power Modules (IPMs) continues to expand, existing electrical appliance settings require that the volume of the intelligent power module must be maintained within a small range. The drive chip and the power chip are arranged in the substrate of the intelligent power module, so that the whole volume of the intelligent power module is kept in a smaller range, the smaller power chip is generally adopted to save space, but the smaller power chip is relatively difficult to manufacture and relatively high in cost, so that the cost of the whole intelligent power module is greatly increased, and further application and popularization of the intelligent power module are limited. Generally, a plurality of base islands are arranged at intervals in the transverse direction of the power module, namely in the transverse direction of the power module, a plurality of base islands are arranged at intervals, some base islands are used for placing lower bridge chips in the inverter circuit, other base islands are used for placing upper bridge chips in the inverter circuit, a plurality of power side pins are arranged at intervals in the transverse direction of the power module, so that the power requirements of different circuits can be met, the mutual interference between different power domains can be avoided, and the stability and the reliability of the power chips are ensured. The power chips are arranged on the base islands, so that the power chips can be packaged on the packaging body, the base islands are packaged by the packaging body, the base islands are required to be filled with resin for plastic packaging, therefore, a plurality of pinholes are formed in one side surface of the packaging body, the thimble penetrates through the pinholes when the packaging body is injected into the packaging body to support the frame or fix the radiating substrate, the packaging body can be made of flowing resin, at least one pinhole is correspondingly formed in each base island in the vertical direction of the power module, namely in the thickness direction of the power module, for supporting the base islands by penetrating through the pinholes when the packaging body is injected into the packaging body, in addition, in the plastic packaging process, the pinholes can be conveniently penetrated to support the lower surface of the frame or press the radiating substrate by the thimble, due to the characteristic that the resin is filled with flowing resin, the frame is pressed down to deform due to low heat conductivity of the resin, the product radiating performance of the power module is degraded in the plastic packaging process, the radiating substrate is easy to deform, and glue is caused to occur.

A power module 100 according to an embodiment of the present utility model is described below with reference to fig. 1-6.

As shown in fig. 1 to 5, a power module 100 according to an embodiment of the present utility model includes: the heat dissipation substrate 10, a plurality of power chips 20 and the plastic package body 30, a plurality of islands 40 are arranged on the heat dissipation substrate 10 along the first direction, the heat dissipation substrate 10 is provided with a heat dissipation bottom surface, the length of the heat dissipation substrate 10 in the first direction is L, the power chips 20 are respectively arranged on the islands 40, the plastic package body 30 encapsulates the heat dissipation substrate 10 and the power chips 20, the bottom surface of the plastic package body 30 is flush with the heat dissipation bottom surface, n jacking holes 50 are formed on the surface of the plastic package body 30 opposite to the heat dissipation substrate 10 and are distributed along the first direction, the jacking holes 50 are holes reserved after the jacking pins prop the heat dissipation substrate 10, when L is less than or equal to 40mm, n is less than or equal to 4, the jacking holes 50 at two ends of the first direction are respectively corresponding to the islands 40 at two ends of the first direction, when L is more than 40mm, n is more than 4, and each of the islands 40 is corresponding to at least one jacking hole 50.

Specifically, as shown in fig. 1-5, the heat dissipating substrate 10 is provided with a plurality of islands 40, the plurality of power chips 20 are correspondingly arranged on the plurality of islands 40, for power modules 100 with different sizes, the heat dissipating substrate 10 is provided with a length L in a first direction, the heat dissipating substrate 10 is molded by the molding body 30, the lead frame 60 is fixed in a designed mold and then injected with a molding material for fixing and molding, in the process of packaging the heat dissipating substrate 10 by the molding body 30, the non-fixed side of the heat dissipating substrate 10 cannot be perfectly attached to the mold, and under the condition of heating, the heat dissipating substrate 10 may also warp and deform, thereby affecting the attaching property of the heat dissipating substrate 10 to the mold, and in addition, during the injection of the molding material, the stress generated by the flow of the molding material can deform the heat dissipating substrate 10 and the junction of the heat dissipating substrate 10 and the lead frame 60, therefore, the adhesion of the heat dissipation substrate 10 and the mold is further affected, so that the heat dissipation substrate 10 has the problem of glue overflow around, a method is generally adopted that ejector pins (fixed pins or movable pins) are added on the plastic package mold, the heat dissipation substrate 10 is ejected on the mold to be fixed from the upper surface of the heat dissipation substrate 10, aiming at the problem of glue overflow of the heat dissipation substrate 10 in the power module 100 with different sizes, the positions of n ejector pins fixed on the heat dissipation substrate 10 with different sizes are required to be designed, n ejector pin holes 50 which are distributed along the first direction are formed on the surface of the plastic package body 30 opposite to the heat dissipation substrate 10, and further, the positions and the number of the ejector pins fixed on the heat dissipation substrate 10 with different sizes are required to be optimally designed, wherein when the length L of the heat dissipation substrate 10 in the first direction is less than or equal to 40mm, the number of ejector pins fixed on the heat dissipation substrate 10 is required to be 2 to 4, thus, 2 to 4 ejector pin holes 50 are formed on the surface of the plastic package body 30, and the ejector pin holes 50 are formed on the islands 40 at two ends in the first direction, so that the ejector pins are correspondingly pressed against two ends of the non-fixed side of the heat dissipation substrate 10 by the ejector pin holes 50, the heat dissipation substrate 10 can be attached to a mold, when the length L of the heat dissipation substrate 10 in the first direction is greater than 40mm, more than 4 ejector pins are needed to fix the heat dissipation substrate 10, more than 4 ejector pin holes 50 are formed on the surface of the plastic package body 30, so that the ejector pins are correspondingly pressed against the non-fixed side of the heat dissipation substrate 10 by the ejector pin holes 50, and each island 40 is correspondingly provided with at least one ejector pin hole 50, thus, the problem of glue overflow of the heat dissipation substrate 10 in the plastic package process of the power module 100 can be effectively solved, the plastic package forming effect of the power module 100 is better, the reliability of a product can be improved, the process procedure of removing glue overflow on the surface of the heat dissipation substrate 10 can be reduced, and the production efficiency can be improved.

Therefore, by optimizing the number and positions of the top pinholes 50 for the power modules 100 with different sizes, the problem of glue overflow of the heat dissipation substrate 10 in the plastic packaging process of the power modules 100 can be effectively solved, the plastic packaging forming effect of the power modules 100 is better, and the process steps of removing glue overflow on the surface of the heat dissipation substrate 10 can be reduced, so that the production efficiency can be improved.

According to an embodiment of the present utility model, as shown in fig. 2, n=2 when l.ltoreq.25 mm. Specifically, when the length L of the heat dissipating substrate 10 in the first direction is less than or equal to 25mm, the heat dissipating substrate 10 is smaller, when the size of the heat dissipating substrate 10 is less than or equal to 25×12mm, 2 ejector pins can fix the heat dissipating substrate 10 by adopting a two-point fixing method, 2 ejector pin holes 50 are formed on the surface of the plastic package body 30, and thus the 2 ejector pins press two ends, for example, corners of two ends, of the heat dissipating substrate 10 correspondingly through the ejector pin holes 50, so that the 2 ejector pins can be respectively arranged at corners of the heat dissipating substrate 10, no ejector pins are arranged at other positions, the heat dissipating substrate 10 with the length of the first direction being less than or equal to 25mm can be fixed, and the plastic package forming speed of the power module 100 can be improved. For example, the maximum dimension of the plastic package 30 is 35.6mm×18.8mm, the dimension of the heat dissipation substrate 10 is 22.7mm×9.15mm, the length L is 22.7mm, and the width D is 9.15mm.

According to some embodiments of the present utility model, as shown in fig. 3, when 25mm < l.ltoreq.32 mm, n=3, the top pinhole 50 located in the middle of the first direction corresponds to the edges of two adjacent islands 40 at the same time. When the length of the heat dissipation substrate 10 in the first direction is 25mm < l.ltoreq.32 mm, in order to fix the heat dissipation substrate 10, when the size range of the heat dissipation substrate 10 is between 25mm×12mm and 32mm×15mm, a three-point fixing method is adopted, wherein 1 thimble is arranged at the middle position of the edge of the heat dissipation substrate 10, which is close to one side edge of the lead frame 60, two adjacent islands 40 are contained at the middle position of the edge, 1 thimble can be pressed on the edges of the two adjacent islands 40 at the same time, so that the middle thimble can fix the two islands 40 at the same time, the other 2 thimbles are respectively arranged at the edges of the corners of the islands 40 in the first direction of the heat dissipation substrate 10, two thimble holes 50 are respectively formed at the edges of the two end islands 40 in the first direction of the heat dissipation substrate 10, and fix the two ends of the heat dissipation substrate 10, so that the problem of the substrate 10 with the length range of 25mm-32mm in the first direction can be effectively solved, in addition, the middle 1 thimble 50 and the edges of the two corner islands 40 can be pressed on the two pinholes at the edges of the two end islands 40 to form the same line with the same pin hole, and the heat dissipation substrate 10 can be prevented from being deformed when the heat dissipation material is pressed on the heat dissipation substrate 10, and the heat dissipation material can be deformed at the same time, and the heat dissipation stress can be prevented from being deformed. For example, the maximum size of the plastic package body 30 is 38mm×24mm, the size of the heat dissipation substrate 10 is 30.2mm×14.2mm, the length L is 30.2mm, the width D is 14.2mm, the positions of ejector pins (core-pulling pins) of the plastic package mold are as shown in fig. 3, the number of the ejector pins is 3, and the ejector pins 10 are pressed at two corners and the middle of the non-fixed side of the heat dissipation substrate 10.

According to an embodiment of the present utility model, as shown in fig. 3, the plurality of islands 40 includes: the first, second, third, and fourth islands 41, 42, 43, and 44 arranged along the first direction, the plurality of power chips 20 include: the low-voltage power chip 21 and the high-voltage power chip 22, the low-voltage power chip 21 is respectively arranged on the first base island 41, the second base island 42 and the third base island 43, the high-voltage power chip 22 is arranged on the fourth base island 44, and the top pinhole 50 positioned in the middle of the first direction corresponds to the edges of the third base island 43 and the fourth base island 44. Specifically, when four islands 40 are disposed on the heat dissipating substrate 10, the pins in the middle of the first direction are pressed against the edges of the third island 43 and the fourth island 44, and then the edge corner of the first island 41 is fixed by one pin, and then the edge corner of the fourth island 44 is fixed by one pin, so that the heat dissipating substrate 10 can be fixed, and the problem of glue overflow of the heat dissipating substrate 10 in the plastic packaging process of the power module 100 can be effectively solved.

According to some embodiments of the present utility model, when 32mm < L.ltoreq.40 mm, n=4, the two top pinholes 50 located in the middle of the first direction correspond to the two islands 40 located in the middle of the first direction. When the size of the heat dissipating substrate 10 ranges from 32mm×15mm to 40mm×16mm, the heat dissipating substrate 10 adopts a four-point fixing method, pins press two corners and two middle points on the non-fixing side of the heat dissipating substrate 10, pin holes 50 are formed on the surface of the plastic package body 30 corresponding to the corner edges of the two end islands 40 of the heat dissipating substrate 10 in the first direction, so that the corner edges of the two end islands 40 of the heat dissipating substrate 10 are fixed by the two pins, then, the two pin holes 50 located in the middle of the first direction are formed, so that the two middle pins are respectively pressed on the two middle islands 40, and the 4 pins are arranged in such a way, thereby realizing the fixing of the heat dissipating substrate 10 with the length of 32mm-40mm in the first direction and preventing the power module 100 from overflowing glue in the plastic package process.

According to an embodiment of the present utility model, the plurality of islands 40 includes: the first, second, third, and fourth islands 41, 42, 43, and 44 arranged along the first direction, the plurality of power chips 20 include: the low-voltage power chip 21 and the high-voltage power chip 22, the low-voltage power chip 21 is respectively arranged on the first base island 41, the second base island 42 and the third base island 43, the high-voltage power chip 22 is arranged on the fourth base island 44, and the first base island 41, the second base island 42, the third base island 43 and the fourth base island 44 are respectively provided with a top pinhole 50. Specifically, when four islands 40 are disposed on the heat dissipating substrate 10, four pin holes 50 are formed on the surface of the molding body 30 opposite to the four islands 40, and when the molding material is injected, stress generated by the flow of the molding material deforms the heat dissipating substrate 10, and the first islands 41, the second islands 42, the third islands 43 and the fourth islands 44 arranged along the first direction are respectively fixed by one pin, so that the first islands 41, the second islands 42, the third islands 43 and the fourth islands 44 are bonded to the mold more stably, thereby preventing the heat dissipating substrate 10 from overflowing during the molding process.

According to some embodiments of the utility model, as shown in fig. 4, the plurality of islands 40 includes: the first, second, third, and fourth islands 41, 42, 43, and 44 arranged along the first direction, the plurality of power chips 20 include: the low-voltage power chip 21 and the high-voltage power chip 22, the low-voltage power chip 21 is respectively arranged on the first base island 41, the second base island 42 and the third base island 43, the high-voltage power chip 22 is arranged on the fourth base island 44, when L is more than 40mm and n=5, the first base island 41, the second base island 42 and the third base island 43 are respectively provided with one top pinhole 50, and the fourth base island 44 is provided with two top pinholes 50. When the size of the heat dissipation substrate 10 is above 40mm×16mm, the pins are pressed against two corners and three or more points in the middle of the non-fixed side of the heat dissipation substrate 10, and when the length L of the heat dissipation substrate 10 in the first direction is greater than 40mm, the surfaces of the plastic packages 30 corresponding to the first base island 41, the second base island 42, the third base island 43 and the fourth base island 44 arranged along the first direction are formed with 5 pin holes 50 in total, wherein one pin hole 50 is formed at the corner edge of the first base island 41 corresponding to the surface of the plastic package 30, one pin hole 50 is formed at the corner edge of the second base island 42 corresponding to the surface of the plastic package 30, one pin hole 50 is formed at the middle of the edge of the third base island 43 corresponding to the surface of the plastic package 30, and two separated pin holes 50 are formed at the middle of the edge of the fourth base island 44 corresponding to the surface of the plastic package 30, so that the power module 100 can be prevented from overflowing in the plastic package process by fixing the 5 pins to the first direction length of the heat dissipation substrate 10. For example, the maximum size of the plastic package body 30 is 52.5mm×31mm, the size of the heat dissipation substrate 10 is 40.9mm×17.3mm, the length L is 40.9mm, the width D is 17.3mm, and the number of plastic package mold ejector pins (core-pulling pins) is 5 as shown in fig. 4.

According to some embodiments of the utility model, as shown in fig. 5, the plurality of islands 40 includes: the first, second, third, and fourth islands 41, 42, 43, and 44 arranged along the first direction, the plurality of power chips 20 include: the low-voltage power chip 21 and the high-voltage power chip 22, the low-voltage power chip 21 is respectively arranged on the first base island 41, the second base island 42 and the third base island 43, the high-voltage power chip 22 is arranged on the fourth base island 44, when L is more than 40mm and n is more than 5, a top pinhole 50 is arranged on one side, away from the second base island 42, of the first base island 41 and the second base island 42, on the edge of the second base island 42 and the edge of the third base island 43, on the edge of the third base island 43 and the edge of the fourth base island 44, respectively, and at least two top pinholes 50 are correspondingly arranged on the fourth base island 44. When the size of the heat dissipation substrate 10 is above 40mm×16mm, a pressing method with more than 5 points is adopted, the ejector pin is pressed at five points or more in the middle of the non-fixed side and the fixed side of the heat dissipation substrate 10, when the length L of the heat dissipation substrate 10 in the first direction is greater than 40mm, and when the number of ejector pin holes 50 formed on the surface of the heat dissipation substrate 10 corresponding to the plastic package body 30 is greater than 5, for example, one side of the first base island 41 facing away from the second base island 42 is formed with one ejector pin hole 50, namely, the side edge of the first base island 41 facing away from the second base island 42, the middle of the side edge of the first base island 41 and the side edge of the second base island 42 is formed with one ejector pin hole 50, the middle of the side edge of the second base island 42 and the side edge of the third base island 43 is formed with one ejector pin hole 50, the middle position of the fourth base island 44 is formed with two ejector pin holes 50, and the middle position of the side edge of the fourth base island 44 facing away from the third base island 43 is formed with one ejector pin hole 50, so that the heat dissipation power of the heat dissipation substrate 10 can be further fixed to the heat dissipation substrate 10 by the length of the ejector pin 50. For example, the maximum size of the plastic package body 30 is 52.5mm×31mm, the size of the heat dissipation substrate 10 is 40.9mm×17.3mm, the length L is 40.9mm, the width D is 17.3mm, and the number of plastic package mold ejector pins (core-pulling pins) is 7 as shown in fig. 5.

According to some embodiments of the utility model, as shown in fig. 1-5, the power module 100 further comprises: and the lead frame 60 is arranged on one side of the second direction of the heat dissipation substrate 10, the second direction is perpendicular to the first direction, when n is less than or equal to 5, the top pinholes 50 are positioned on the other side of the second direction of the base island 40, the top pinholes 50 positioned at two ends of the first direction correspond to the end angles of the base island 40 positioned at two ends of the first direction respectively, and when n is more than 5, the n top pinholes 50 are positioned in the middle of the second direction of the base island 40. When the number of the pin holes 50 formed on the heat dissipation substrate 10 is less than or equal to 5, the pins at the two ends of the first direction are pressed at the end corners of the base island 40 to fix, and when the number of the pin holes 50n formed on the heat dissipation substrate 10 is greater than 5, the n pin holes 50 are located in the middle of the second direction of the base island 40, so that the heat dissipation substrate 10 can be fixed, and therefore, the power module 100 can be prevented from overflowing glue in the plastic packaging process.

According to some embodiments of the present utility model, the heat dissipation substrate 10 includes: insulating resin layer and copper layer that the stromatolite set up, copper layer and insulating resin layer opposite side surface constitute the heat dissipation bottom surface, and power module 100 still includes: and a lead frame 60, wherein the lead frame 60 is provided on the insulating resin layer of the heat dissipation substrate 10, and a portion of the lead frame 60 facing the insulating resin layer has a plurality of islands 40.

According to other embodiments of the present utility model, the heat dissipating substrate 10 includes: the ceramic board and copper layer, the copper layer sets up on the ceramic board, and the copper layer is formed with a plurality of base islands 40, and the ceramic board constitutes the heat dissipation bottom surface with the relative one side surface of copper layer, and power module 100 still includes: and a lead frame 60, the lead frame 60 being connected to the copper layer.

According to still other embodiments of the present utility model, the heat dissipating substrate 10 includes: the ceramic plate and locate the copper layer of ceramic plate both sides, the surface on one side copper layer of ceramic plate constitutes the heat dissipation bottom surface, and the opposite side copper layer of ceramic plate is formed with a plurality of base islands 40, and power module 100 still includes: and a lead frame 60, the lead frame 60 being connected to the other side copper layer of the ceramic board.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A power module, comprising:

the heat dissipation substrate is provided with a plurality of islands arranged along a first direction, and is provided with a heat dissipation bottom surface, and the length of the heat dissipation substrate in the first direction is L;

the power chips are respectively arranged on the base islands;

the plastic package body encapsulates the heat dissipation substrate and the power chips, the bottom surface of the plastic package body is level with the heat dissipation bottom surface, n jacking holes which are distributed along a first direction are formed on the surface of the plastic package body opposite to the heat dissipation substrate, the jacking holes are holes reserved after the jacking pins jack the heat dissipation substrate, wherein,

when L is less than or equal to 40mm, n is less than or equal to 2 and less than or equal to 4, and the top pinholes at the two ends of the first direction respectively correspond to the islands at the two ends of the first direction;

when L is more than 40mm, n is more than 4, and each base island is correspondingly provided with at least one top pinhole.

2. The power module of claim 1, wherein n = 2 when L is 25 mm.

3. The power module of claim 1, wherein n = 3, where 25mm < L +.32 mm, the top pinholes in the middle of the first direction correspond to the edges of two adjacent islands at the same time.

4. A power module in accordance with claim 3, wherein a plurality of said islands comprise: first base island, second base island, third base island and fourth base island that arrange along first direction, a plurality of power chips include: the low-voltage power chip is respectively arranged on the first base island, the second base island and the third base island, the high-voltage power chip is arranged on the fourth base island, and the top pinhole in the middle of the first direction corresponds to the edges of the third base island and the fourth base island.

5. The power module according to claim 1, wherein when 32mm < l.ltoreq.40 mm, n=4, two of the tip pinholes located in the middle of the first direction correspond to two of the islands located in the middle of the first direction.

6. The power module of claim 5, wherein a plurality of the islands comprise: first base island, second base island, third base island and fourth base island that arrange along first direction, a plurality of power chips include: the low-voltage power chip is respectively arranged on the first base island, the second base island and the third base island, the high-voltage power chip is arranged on the fourth base island, and the first base island, the second base island, the third base island and the fourth base island are respectively corresponding to one top pinhole.

7. The power module of claim 1 wherein a plurality of said islands comprises: first base island, second base island, third base island and fourth base island that arrange along first direction, a plurality of power chips include: the low-voltage power chip is arranged on the first base island, the second base island and the third base island respectively, and the high-voltage power chip is arranged on the fourth base island;

when L > 40mm and n=5, the first base island, the second base island and the third base island each correspond to one of the top pinholes, and the fourth base island corresponds to two of the top pinholes.

8. The power module of claim 1 wherein a plurality of said islands comprises: first base island, second base island, third base island and fourth base island that arrange along first direction, a plurality of power chips include: the low-voltage power chip is arranged on the first base island, the second base island and the third base island respectively, and the high-voltage power chip is arranged on the fourth base island;

when L is more than 40mm and n is more than 5, a top pinhole is arranged on one side, deviating from the second base island, of the first base island, the edge of the second base island, the edge of the third base island and the edge of the fourth base island are respectively and simultaneously corresponding to one top pinhole, and at least two top pinholes are correspondingly arranged on the fourth base island.

9. The power module of claim 1, further comprising: the lead frame is arranged on one side of the second direction of the heat dissipation substrate, and the second direction is perpendicular to the first direction;

when n is less than or equal to 5, the top pinholes are positioned at the other side of the second direction of the base island, and the top pinholes at the two ends of the first direction respectively correspond to the end angles of the base island at the two ends of the first direction;

when n is more than 5, n top pinholes are positioned in the middle of the base island in the second direction.

10. The power module of claim 1, wherein the heat sink substrate comprises: insulating resin layer and copper layer that the stromatolite set up, copper layer with insulating resin layer's opposite side surface constitutes the heat dissipation bottom surface, power module still includes: a lead frame provided on the insulating resin layer of the heat dissipation substrate, the lead frame having a plurality of islands at a portion thereof opposite to the insulating resin layer; or (b)

The heat dissipation substrate includes: ceramic plate and copper layer, the copper layer set up in on the ceramic plate, the copper layer is formed with a plurality of the base island, the ceramic plate with copper layer opposite one side surface constitutes the heat dissipation bottom surface, power module still includes: a lead frame connected to the copper layer; or (b)

The heat dissipation substrate includes: the ceramic plate with locate the copper layer of ceramic plate both sides, the surface on one side copper layer of ceramic plate constitutes the heat dissipation bottom surface, the opposite side copper layer of ceramic plate is formed with a plurality of the base island, power module still includes: and the lead frame is connected with the copper layer on the other side of the ceramic plate.