CN218482240U - SOT89 lead frame structure - Google Patents
SOT89 lead frame structure Download PDFInfo
- Publication number
- CN218482240U CN218482240U CN202222931104.7U CN202222931104U CN218482240U CN 218482240 U CN218482240 U CN 218482240U CN 202222931104 U CN202222931104 U CN 202222931104U CN 218482240 U CN218482240 U CN 218482240U
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- installation unit
- lead frame
- runner
- unit group
- sot89
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Abstract
The utility model discloses a SOT89 lead frame structure, include: lead frame, installation unit group, pin and the runner of moulding plastics, installation unit group array arranges on the lead frame, the one end and the installation unit group of pin are connected, the other end and the lead frame of pin are connected, the runner of moulding plastics sets up between two adjacent installation unit groups to with this two each installation unit group intercommunication in. The utility model discloses a single runner of moulding plastics realizes two injection moulding of installation unit group to avoid the installation unit group unfavorable condition such as glue shrinkage to appear, can optimize the quantity that has increased unit area's installation unit group simultaneously to the runner of moulding plastics, realize arranging of high density large matrix, improve whole machining efficiency with this, synthesize manufacturing cost greatly reduced.
Description
Technical Field
The utility model relates to an integrated circuit packaging technology field especially relates to a SOT89 lead frame structure.
Background
Chip packaging is a technology for packaging an integrated circuit by using an insulating plastic or ceramic material, not only plays a role in placing, fixing, sealing, protecting the chip and enhancing the heat conduction performance, but also is a bridge for communicating the internal world of the chip with an external circuit. A Small Outline Transistor package (SOT) is a Small chip package that is commonly used at present. The MOS transistor is a very common discrete device at present, and compared with an IC, the MOS transistor is widely applied to consumer and portable electronic products because of its irreplaceable advantages due to its unique switching characteristic. The single-die MOSFET has three electrodes of Gate, source and Drain, the package of the single-die MOSFET needs at least three terminals, and common package forms are SOT-23, SOT23-6L, SOP, SOT89 and the like. In the lead frame of SOT89, a plurality of rows are generally arranged in a group, and a runner is arranged between two adjacent groups, that is, injection molding is performed to both sides through the runner. However, because a single runner needs more unit islands for injection molding, the unit islands far away from the runner are prone to have problems such as glue shrinkage.
Accordingly, the prior art is deficient and needs improvement.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art, provide a SOT89 lead frame structure.
The technical scheme of the utility model as follows: provided is an SOT89 lead frame structure, including: lead frame, installation unit group, pin and the runner of moulding plastics, installation unit group array arranges on the lead frame, the one end and the installation unit group of pin are connected, the other end and the lead frame of pin are connected, the runner of moulding plastics sets up in adjacent two and is listed as between the installation unit group to with this each installation unit group intercommunication in two.
Furthermore, the injection molding runner is arranged on a center line between two adjacent rows of mounting unit groups.
Further, the mounting unit group includes: the packaging layer is subjected to injection molding through an injection molding flow channel, the chip is arranged on the substrate, the pins are welded on the welding positions of the chip, and the packaging layer covers the chip and the substrate.
Furthermore, a connecting rib is arranged between the substrate and the lead frame, and the substrate is connected with the lead frame through the connecting rib.
Further, the substrate and the chip are connected in a silver adhesive bonding or eutectic mode.
Furthermore, a plurality of locking holes are formed in the injection molding runner, and the locking holes are in a round-corner rectangular shape.
Furthermore, the number of the locking holes on each injection molding runner is 2-4.
Adopt above-mentioned scheme, the utility model discloses a single runner of moulding plastics realizes two injection moulding work of installing the unit group to avoid the installation unit group unfavorable condition such as glue shrinkage to appear, can optimize the quantity that has increased unit area's installation unit group to the runner of moulding plastics simultaneously, realize arranging of high density big matrix, improve whole machining efficiency with this, synthesize manufacturing cost greatly reduced.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1, the present invention provides a SOT89 lead frame structure, including: lead frame 1, installation unit group 2, pin 3 and the runner 4 of moulding plastics, 2 array arrangements of installation unit group are on lead frame 1, the one end and the installation unit group 2 of pin 3 are connected, the other end and the lead frame 1 of pin 3 are connected, the runner 4 of moulding plastics sets up between adjacent two installation unit groups 2 to with each installation unit group 2 intercommunication in this two. The injection molding runner 4 is arranged on a center line between two adjacent rows of the mounting unit groups 2. Realize two injection molding work of installing the unit group 2 through single runner 4 of moulding plastics to avoid installing the unit group 2 unfavorable condition such as glue shrinkage to appear, can optimize the quantity that has increased unit area's installing the unit group 2 simultaneously to runner 4 of moulding plastics, realize arranging of the big matrix of high density, with this improvement whole machining efficiency, synthesize manufacturing cost greatly reduced.
The mounting unit group 2 includes: the packaging structure comprises a substrate 21, a chip and a packaging layer 22, wherein the packaging layer 22 is formed by injection molding through an injection molding runner 4, the chip is arranged on the substrate 21, a pin 3 is welded on a welding position of the chip, and the packaging layer 22 is coated outside the chip and the substrate 21.
A connecting rib 23 is arranged between the substrate 21 and the lead frame 1, and the substrate 21 and the lead frame 1 are connected through the connecting rib 23. The substrate 21 and the chip are fixed conveniently, so that the injection molding of the packaging layer 22 is carried out.
The substrate 21 and the chip are connected by silver glue adhesion or eutectic crystal. The inner pin is connected with an external welding wire, and the outer pin is connected with the PCB through external soldering tin.
The injection molding runner 4 is provided with a plurality of locking holes 41, and the locking holes 41 are in a round-corner rectangular shape. In order to increase the strength of the SOT89 lead frame 1 after injection molding and prevent the lead frame 1 from warping due to the thin thickness and other factors, a plurality of locking holes 41 are formed in each injection molding runner 4. The arrangement of the locking holes 41 enables the locking holes 41 to be filled when the plastic package material is injected through the injection runner 4, the strength of the lead frame 1 is improved after the plastic package material located in the locking holes 41 is solidified, and the warping phenomenon is effectively prevented.
The number of the locking holes 41 on each injection runner 4 is 2-4. The number of the lead frames 1 may be set according to the strength of the SOT89, and may be set to 2 when the strength of the lead frame 1 is large, and may be set to 4 when the strength of the lead frame 1 is small.
To sum up, the utility model discloses a single runner of moulding plastics realizes two injection moulding work of installing the unique tuple to avoid the installation unique tuple to appear unfavorable condition such as the shrinkages, can optimize the quantity that has increased unit area's installation unique tuple to the runner of moulding plastics simultaneously, realize arranging of high density big matrix, with this improvement whole machining efficiency, synthesize manufacturing cost greatly reduced.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A SOT89 leadframe structure, comprising: lead frame, installation unit group, pin and the runner of moulding plastics, installation unit group array arranges on the lead frame, the one end and the installation unit group of pin are connected, the other end and the lead frame of pin are connected, the runner of moulding plastics sets up between two adjacent installation unit groups to with this two each installation unit group intercommunication in.
2. The SOT89 leadframe structure according to claim 1, wherein the injection molding runner is disposed on a centerline between two adjacent columns of mounting unit sets.
3. The SOT89 lead frame structure of claim 1, wherein the set of mounting units comprises: the packaging layer is subjected to injection molding through an injection molding flow channel, the chip is arranged on the substrate, the pins are welded on the welding positions of the chip, and the packaging layer covers the chip and the substrate.
4. The SOT89 leadframe structure according to claim 3, wherein a connecting rib is disposed between the substrate and the leadframe, and the substrate and the leadframe are connected by the connecting rib.
5. The SOT89 leadframe structure according to claim 3, wherein the substrate and the chip are connected by silver paste adhesion or eutectic bonding.
6. The SOT89 leadframe structure according to claim 1, wherein the injection runner is provided with a plurality of locking holes, and the locking holes are in the shape of rounded rectangles.
7. The SOT89 leadframe structure according to claim 6, wherein the number of locking holes on each injection runner is 2-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222931104.7U CN218482240U (en) | 2022-11-03 | 2022-11-03 | SOT89 lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222931104.7U CN218482240U (en) | 2022-11-03 | 2022-11-03 | SOT89 lead frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218482240U true CN218482240U (en) | 2023-02-14 |
Family
ID=85171674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222931104.7U Active CN218482240U (en) | 2022-11-03 | 2022-11-03 | SOT89 lead frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218482240U (en) |
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2022
- 2022-11-03 CN CN202222931104.7U patent/CN218482240U/en active Active
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