CN219716862U - Double-sided heat dissipation power module - Google Patents
Double-sided heat dissipation power module Download PDFInfo
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- CN219716862U CN219716862U CN202321099033.7U CN202321099033U CN219716862U CN 219716862 U CN219716862 U CN 219716862U CN 202321099033 U CN202321099033 U CN 202321099033U CN 219716862 U CN219716862 U CN 219716862U
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- substrate
- lead frame
- power module
- upper substrate
- lower substrate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 159
- 239000000945 filler Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000004634 thermosetting polymer Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims 12
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000007723 die pressing method Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a double-sided heat dissipation power module, which comprises a lower substrate, an upper substrate and a connecting module, wherein the lower substrate is connected with the upper substrate; the lower substrate is provided with a chip; the upper substrate is arranged above the chip; at least one of the lower substrate and the upper substrate is composed of not less than 2 blocks; when the lower substrate is composed of not less than 2 pieces; the lower substrate is structurally and electrically connected through a connecting module; when the upper substrate is composed of not less than 2 pieces; the upper substrate is structurally and electrically connected through a connecting module; according to the utility model, the substrates are arranged into independent small blocks, and the independent substrates are connected through the connecting module to realize structure and electric connection, and the connecting module has certain flexibility, so that the requirement on the precision of the gasket can be reduced; meanwhile, the absolute warping of the independent small substrates is reduced, and glue overflow, substrate breakage and the like are easier to control during die pressing; the utility model has the advantages of low manufacturing difficulty, high yield and low cost.
Description
Technical Field
The utility model belongs to the technical field related to technical improvement of double-sided heat dissipation power modules, and particularly relates to a double-sided heat dissipation power module with low manufacturing difficulty, high yield and low cost.
Background
The existing double-sided heat dissipation power module comprises a lower substrate and an upper substrate; the lower substrate is an integral body and is provided with a chip; the lower substrate is also provided with a lead frame; the chip, the lower substrate and the lead frame are respectively and correspondingly electrically connected; the upper base plate is also an integral body; gaskets are respectively arranged between the chip and the corresponding upper substrate; after the upper substrate is mounted, the upper substrate, the lead frame, the lower substrate and the chip are respectively and correspondingly electrically connected; finally, the lower substrate, the chip, the upper substrate and the gasket are totally sealed and protected by using a plastic packaging process, and only the part of the lead frame is exposed so as to be externally connected.
The existing double-sided heat dissipation power module is generally produced by adopting the following process: the substrate, the bonding wire for fixing the crystal, the chip surface mounting gasket for realizing the electric interconnection, the upper substrate and the lower substrate, the bonding wire, the chip and the like form an electric loop at the same time, and the design function, the plastic package, the test and the package are realized.
The shortcomings of the prior art scheme are:
1. the precision requirement of the chip surface gasket is very high, and after the gasket is installed, the upper surface of the bottom plate is guaranteed to be on the same plane, so that the upper substrate can be guaranteed to be well connected with the upper substrate when being welded or sintered, and the phenomena of cracking, stripping and the like can not occur in the working process due to the electric conduction, heat conduction and bonding performance of each chip; the gasket with high precision has high cost and difficult manufacture;
2. when in mould pressing, the upper substrate can only be supported by the gasket, cannot bear larger pressure, and is easy to crack or deform;
thus, the double-sided power module produced by the prior art has the problems of high cost, low yield and high manufacturing difficulty.
Therefore, the double-sided heat dissipation power module is low in manufacturing difficulty, high in yield and low in cost.
Disclosure of Invention
The utility model aims to provide a double-sided heat dissipation power module which is low in manufacturing difficulty, high in yield and low in cost.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a double-sided heat dissipation power module comprises a lower substrate, an upper substrate and a connecting module; at least one of the lower substrate and the upper substrate is composed of not less than 2 blocks; when the lower substrate is composed of not less than 2 pieces; the lower substrate is structurally and electrically connected through a connecting module; when the upper substrate is composed of not less than 2 pieces; the upper substrate is structurally and electrically connected through the connecting module.
Preferably, the lower substrate is provided with a chip; an upper substrate is arranged at the upper part of the chip; after the upper substrate, the connecting module, the lower substrate and the chip are respectively and correspondingly electrically connected; and finally, the lower substrate, the chip, the upper substrate and the gasket are totally sealed and protected by using fillers, and only the part of the connecting module is exposed so as to be externally connected.
Preferably, gaskets are respectively arranged between the chips and the corresponding upper substrates.
Preferably, the connection module is a lead frame.
Preferably, the number of the lower base plates is not less than 2, and the lower base plates are arranged at intervals; the lower substrate is structurally and electrically connected through a bottom lead frame; the bottom lead frame is a unitary structure; chips are respectively arranged on the lower substrate; the lower substrates are connected together by a bottom lead frame; the chip, the lower substrate and the bottom lead frame are respectively and correspondingly electrically connected; the upper substrate is provided with at least 2 blocks which are arranged at intervals; the upper substrate is structurally and electrically connected through the top lead frame; the top lead frame is also a unitary structure; after the upper substrate, the top lead frame, the bottom lead frame, the lower substrate and the chip are respectively and correspondingly electrically connected; and finally, the lower substrate, the chip, the upper substrate and the gasket are totally enclosed and protected by the filler, and only the parts of the bottom lead frame and the top lead frame are exposed so as to be externally connected.
Preferably, the lower substrates are respectively disposed on the bottom lead frames.
Preferably, the lower substrate or the upper substrate is a ceramic substrate or a printed wiring board with one or more surfaces.
Preferably, the lead frame is a metal frame or a printed wiring board.
Preferably, when the upper substrate is composed of not less than 2 pieces, the lower substrate is provided as one body.
Preferably, when the lower substrate is composed of not less than 2 pieces, the upper substrate is provided as a single body.
Preferably, the bottom lead frame or the top lead frame is a metal frame or a printed wiring board.
Preferably, the filler is made of a thermosetting polymer material.
Preferably, the thermosetting polymer material is epoxy resin or silica gel.
Compared with the prior art, the utility model provides a double-sided heat dissipation power module, which has the following beneficial effects:
the double-sided heat dissipation power module designs the substrate into independent small blocks, corresponds to corresponding chips respectively, then connects the independent substrates through the lead frame to play roles of fixing, connecting and supporting and electric interconnection, and can allow certain movement in the vertical direction of the substrate before the substrate is welded or sintered and fixed due to certain flexibility of the lead frame; thus, the precision requirement on the gasket is reduced; meanwhile, the absolute warping of the independent small substrates is reduced, and glue overflow, substrate breakage and the like are easier to control during die pressing; the double-sided heat dissipation power module can greatly reduce the material cost, and has the advantages of low manufacturing difficulty, high yield and low cost because the substrate is designed into independent small blocks.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate and together with the embodiments of the utility model and do not constitute a limitation to the utility model, and in which:
fig. 1 is a schematic perspective view of a first angle of a connection structure of a lower substrate, a chip and a bottom lead frame in a dual-sided heat dissipation power module according to the present utility model;
fig. 2 is a schematic perspective view of a second angle of a connection structure of a lower substrate, a chip and a bottom lead frame in the dual-sided heat dissipation power module according to the present utility model;
fig. 3 is a schematic perspective view of a first angle of a connection structure of an upper substrate, a top lead frame and a pad in a dual-sided heat dissipation power module according to the present utility model;
fig. 4 is a schematic perspective view of a second angle of a connection structure of an upper substrate, a top lead frame and a pad in the dual-sided heat dissipation power module according to the present utility model;
fig. 5 is a schematic perspective view of the double-sided heat dissipation power module before plastic packaging;
fig. 6 is a front view of the double-sided heat dissipation power module according to the present utility model before plastic packaging;
fig. 7 is an enlarged view of a portion a in fig. 6;
fig. 8 is a schematic perspective view of a dual-sided heat dissipation power module according to the present utility model;
in the figure: 1. a lower substrate; 2. a chip; 3. a bottom lead frame; 4. an upper substrate; 5. a top lead frame; 6. a gasket; 7. and (5) filling.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-8, the present utility model provides a technical solution: a double-sided heat dissipation power module comprises a lower substrate 1 and an upper substrate 4; the lower substrate 1 is provided with 3 blocks which are arranged at intervals; the lower substrates 1 are respectively arranged on the bottom lead frames 3; the bottom lead frame 3 is a unitary structure; wherein 3 chips 2 are respectively arranged on the two lower substrates 1; the lower substrates 1 are connected together by a bottom lead frame 3; the chip 2, the lower substrate 1 and the bottom lead frame 3 are respectively and correspondingly electrically connected; the number of the upper substrates 4 is 6, and each upper substrate 4 corresponds to one chip 2; a gasket 6 is respectively arranged between each chip 2 and the corresponding upper substrate 4; the upper substrates 4 are connected together by a top lead frame 5; the top lead frame 5 is also a unitary structure; when the upper substrate 4 is mounted, the upper substrate 4, the top lead frame 5, the bottom lead frame 3, the lower substrate 1 and the chip 2 are respectively and correspondingly electrically connected; finally, the lower substrate 1, the chip 2, the upper substrate 4 and the gasket 6 are totally sealed and protected by using a filling 7 by using a plastic packaging process, and only the parts of the bottom lead frame 3 and the top lead frame 5 are exposed so as to be externally connected.
In this embodiment, the substrates include a lower substrate 1 and an upper substrate 4; the substrate can be a ceramic substrate with single surface or multiple surfaces, or a printed circuit board, such as a fiber board, a flexible circuit board and the like, and the surface of the substrate is provided with circuits according to the design requirement, so that the surface is metallized, the welding, the electrical interconnection, the heat conduction and the like are facilitated.
In this embodiment, the lead frame includes a bottom lead frame 3 and a top lead frame 5; the lead frame can be a metal frame or a printed circuit board, a flexible substrate and the like, is designed into a required circuit structure, and plays a role of connection support and internal and external electrical interconnection after being connected with the substrate.
In this embodiment, the lower substrate 1 has a multi-piece structure, and the lower substrate 1 may be integrally provided on the premise that the upper substrate 4 has a multi-piece structure.
In this embodiment, the upper substrate 4 has a multi-piece structure, and the upper substrate 4 may be integrally provided on the premise that the lower substrate 1 has a multi-piece structure.
In this embodiment, the lower substrates 1 are connected together by a bottom lead frame 3; the upper substrates 4 are connected together by a top lead frame 5; it is of course also possible to combine the bottom lead frame 3 and the top lead frame 5 into one integral lead frame.
In this embodiment, the lower substrate 1 and the upper substrate 4 are respectively integrated with circuits therein, and the corresponding bottom lead frame 3 and top lead frame 5 are also provided with corresponding circuits according to the functional requirements; if one of the lower and upper substrates 1, 4 has no integrated circuit therein, the corresponding bottom and top lead frames 3, 5 are provided with respective circuits or no circuits, as functional needs.
In special cases, some small pieces of the lower base plate 1 are not provided with chips 2 for the purpose of weight.
In special cases, the upper substrate 4 is not provided on the upper portion of the chip 2 provided on the lower substrate 1, because the arrangement of the lower substrate 1 and the corresponding chip 2 is sufficient to realize the functions thereof, and the upper substrate 4 is not required, so that the cost can be saved.
Compared with the prior art, the utility model has the following beneficial effects:
the double-sided heat dissipation power module designs the substrate into independent small blocks, corresponds to corresponding chips respectively, then connects the independent substrates through the lead frame to play roles of fixing, connecting and supporting and electric interconnection, and can allow certain movement in the vertical direction of the substrate before the substrate is welded or sintered and fixed due to certain flexibility of the lead frame; thus, the precision requirement on the gasket is reduced; meanwhile, the absolute warping of the independent small substrates is reduced, and glue overflow, substrate breakage and the like are easier to control during die pressing; the double-sided heat dissipation power module can greatly reduce the material cost, and has the advantages of low manufacturing difficulty, high yield and low cost because the substrate is designed into independent small blocks.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (14)
1. A double-sided heat dissipation power module comprises a lower substrate, an upper substrate and a connecting module; the lower substrate is provided with a chip; the upper substrate is arranged above the chip; the method is characterized in that: at least one of the lower substrate and the upper substrate is composed of not less than 2 blocks; when the lower substrate is composed of not less than 2 pieces; the lower substrate is structurally and electrically connected through a connecting module; when the upper substrate is composed of not less than 2 pieces; the upper substrate is structurally and electrically connected through the connecting module.
2. The dual sided thermal power module of claim 1, wherein: the upper part of the chip is correspondingly provided with an upper substrate.
3. The dual sided thermal power module of claim 2, wherein: the chips are electrically interconnected with the corresponding upper substrates; after the upper substrate, the connecting module, the lower substrate and the chip are respectively and correspondingly electrically connected; and finally, the lower substrate, the chip and the upper substrate are totally sealed and protected by fillers.
4. The dual sided thermal power module of claim 1, wherein: at least part of the chips are provided with gaskets between the chips and the corresponding upper base plates.
5. The dual sided thermal power module of claim 1, wherein: the connection module is a lead frame.
6. The dual sided thermal power module of claim 5, wherein: the lead frame comprises a bottom lead frame and a top lead frame; the number of the lower base plates is not less than 2, and the lower base plates are arranged at intervals; the lower substrate is structurally and electrically connected through a bottom lead frame; the bottom lead frame is a unitary structure; chips are respectively arranged on the lower substrate; the lower substrates are connected together by a bottom lead frame; the chip, the lower substrate and the bottom lead frame are respectively and correspondingly electrically connected; the upper substrate is provided with at least 2 blocks which are arranged at intervals; the upper substrate is structurally and electrically connected through the top lead frame; the top lead frame is also a unitary structure; after the upper substrate, the top lead frame, the bottom lead frame, the lower substrate and the chip are respectively and correspondingly electrically connected; and finally, protecting the lower substrate, the chip and the upper substrate by using the filler.
7. The dual sided thermal power module of claim 6, wherein: the lower substrates are respectively arranged on the bottom lead frames.
8. The dual sided thermal power module of claim 1, wherein: the lower substrate or the upper substrate is a ceramic substrate or a printed circuit board with one or more surfaces.
9. The dual sided thermal power module of claim 5, wherein: the lead frame is a metal frame or a printed wiring board.
10. The dual sided thermal power module of claim 1, wherein: when the upper substrate is composed of not less than 2 pieces, the lower substrate is provided as a whole.
11. The dual sided thermal power module of claim 1, wherein: when the lower substrate is composed of not less than 2 pieces, the upper substrate is provided as a whole.
12. The dual sided thermal power module of claim 6, wherein: the bottom lead frame or the top lead frame is a metal frame or a printed wiring board.
13. The double sided heat dissipating power module of claim 3 or 6, wherein: the filler is made of thermosetting polymer materials.
14. The dual sided thermal power module of claim 13, wherein: the thermosetting polymer material is epoxy resin or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321099033.7U CN219716862U (en) | 2023-05-09 | 2023-05-09 | Double-sided heat dissipation power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321099033.7U CN219716862U (en) | 2023-05-09 | 2023-05-09 | Double-sided heat dissipation power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219716862U true CN219716862U (en) | 2023-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321099033.7U Active CN219716862U (en) | 2023-05-09 | 2023-05-09 | Double-sided heat dissipation power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219716862U (en) |
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2023
- 2023-05-09 CN CN202321099033.7U patent/CN219716862U/en active Active
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