CN216902909U

CN216902909U - Chip silver paste pasting packaging structure

Info

Publication number: CN216902909U
Application number: CN202220768537.2U
Authority: CN
Inventors: 陈贤明
Original assignee: Guangdong Sige Semiconductor Technology Co ltd
Current assignee: Guangdong Sige Semiconductor Technology Co ltd
Priority date: 2022-03-31
Filing date: 2022-03-31
Publication date: 2022-07-05
Anticipated expiration: 2032-03-31

Abstract

The utility model discloses a packaging structure for silver paste pasting of a chip, which comprises a shell, wherein a cover plate is arranged at the top of the shell, four corners of the bottom in the shell are respectively provided with a fixing foot, the top of each fixing foot is provided with a base plate, the top of each base plate is provided with a mounting groove, the bottoms of two sides of each mounting groove are respectively provided with an anti-overflow groove, the bottom in each mounting groove is provided with a silver paste pasting layer, and the top of each silver paste pasting layer is provided with a chip main body; the top of the chip main body is provided with a heat conducting plate assembly, a plurality of welding spots are arranged on two sides of the chip main body, a plurality of pins are arranged on two sides of the shell, and gold threads are arranged between the pins and the welding spots; an epoxy resin sealing colloid is arranged between the shell and the cover plate. Through seting up mounting groove, anti-overflow groove and the tackification groove at the base plate top, can improve the area of contact between silver thick liquid layer of pasting and the base plate greatly to improve the bonding strength between base plate and the chip main part, guarantee the stability of chip main part, anti-overflow groove can avoid silver thick liquid too much to cause and climb gluey and cause the pollution to the chip simultaneously.

Description

Chip silver paste pasting packaging structure

Technical Field

The utility model relates to the technical field of chip packaging, in particular to a chip silver paste pasting packaging structure.

Background

At present, in the prior art, for the packaging of chips, a sealing adhesive fixing mode is adopted to protect the connection stability of the chips, lead frames and gold wires, and the packaged chips after being subjected to sealing adhesive treatment are convenient to transport and carry, have a good shockproof effect and greatly prolong the service life of the chips; moreover, with the continuous progress of the packaging process, the cost of chip packaging is also continuously reduced, the requirements of electronic products are greatly met, and the development of the electronic products is accelerated. In the field of semiconductor packaging, it is generally required to attach a semiconductor chip to a substrate with an adhesive such as silver paste.

With the demand for miniaturization of semiconductors, the volume of semiconductor chips is becoming smaller. For smaller chips, excessive silver paste can cause too high paste climbing and pollute the chips, and too little silver paste can cause silver paste cavities between the chips and the substrate, so that the coverage rate of the silver paste is insufficient, the thickness of the silver paste is insufficient, and the product performance is influenced. And common glue sealing fixation can not effectively ensure the heat dispersion of the chip, and heat accumulation in long-term operation is easy to condense into water vapor to cause the failure of the chip.

Patent number CN214254394U discloses a chip package structure, this package structure frame, wire rod and the silver thick liquid colloid of setting between frame and chip, the frame is equipped with the holding recess, the chip is arranged in the holding recess, the chip bonds through silver thick liquid colloid and frame through high temperature anaerobic baking process and solidifies as an organic wholely for chip package proportion is rationalized more, reduce the volume, make the operation of PCB upper plate process change, and effectively reduce occupation space, chip package efficiency has been promoted, but this packaging structure still has certain defect, for example it further consolidates the chip not, optimize heat-sinking capability, influence the stability and the heat-sinking capability of chip.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

The utility model provides a chip silver paste pasting packaging structure aiming at the problems in the related art, so as to overcome the technical problems in the prior related art.

Therefore, the utility model adopts the following specific technical scheme:

a packaging structure for chip silver paste comprises a shell, wherein a cover plate is arranged at the top of the shell, four corners of the bottom in the shell are respectively provided with a fixing foot, the top of each fixing foot is provided with a base plate, the top of each base plate is provided with a mounting groove, the bottoms of two sides of each mounting groove are respectively provided with an anti-overflow groove, the bottom in each mounting groove is provided with a silver paste layer, and the top of each silver paste layer is provided with a chip main body; the top of the chip main body is provided with a heat conducting plate assembly, a plurality of welding spots are arranged on two sides of the chip main body, a plurality of pins are arranged on two sides of the shell, and gold threads are arranged between the pins and the welding spots; an epoxy resin sealing colloid is arranged between the shell and the cover plate.

Further, in order to increase the contact surface between silver paste layer and the base plate and increase the joint strength between the two, the anti-overflow groove of seting up through the slant can be deposited the silver thick liquid and hold, has avoided the excessive upward climbing of silver thick liquid to glue and has caused the pollution to the chip main part, and a plurality of equidistance arrangements are seted up to the mounting groove bottom and are the tackified groove of rectangle distribution, and the anti-overflow groove upwards gradually for the one end of keeping away from the mounting groove for slope structure and direction.

Further, in order to realize that the installation of insulating conducting strip is fixed, hug closely the heat conduction to the chip main part, heat-conducting plate assembly is including setting up the insulating conducting strip at chip main part top, and a plurality of equidistance are arranged and are the filling tank that the rectangle distributes at insulating conducting strip top, and insulating conducting strip openly all is provided with the reinforcement curb plate with the back, consolidates the reinforcing connection claw that the curb plate bottom was provided with a plurality of equidistance and arranges.

Further, in order to make the reinforcing side plate extend to the outside of the shell and transfer heat to the external environment, the heat dissipation effect is improved, the reinforcing side plate is of an L-shaped structure, and the front side and the top of the back side of the shell are provided with through holes matched with the reinforcing side plate.

Furthermore, in order to glue through elastic connection and silver paste holes between the reinforcing connection claws and the connection holes, the heat conducting plate assembly is positioned, the installation difficulty is reduced, the connection strength is improved, the reinforcing connection claws are of a combined structure of the upper half portion of the cylinder and the lower half portion of the cylinder, the reinforcing connection claws are of four-claw-shaped elastic structures, the front surface and the back portion of the top of the base plate are provided with a plurality of connection holes matched with the reinforcing connection claws, and the bottom of each connection hole is provided with silver paste holes.

The utility model has the beneficial effects that:

1. through the mounting groove, the anti-overflow groove and the tackifying groove which are formed in the top of the substrate, the contact area between the silver paste pasting layer and the substrate can be greatly increased, so that the bonding strength between the substrate and the chip main body is increased, the stability of the chip main body is ensured, and meanwhile, the anti-overflow groove can prevent excessive silver paste from causing glue climbing to pollute the chip, so that the difficulty of chip packaging is effectively reduced; through setting up the heat conduction board subassembly, can realize thermal high-efficient transmission through the direct contact heat conduction to the chip to guarantee the heat dispersion of chip.

2. Through setting up insulating conducting strip, avoid taking place the electric conduction under the prerequisite of guaranteeing chip heat dispersion and lead to the fact the harm to the chip, the filling groove can carry out the packing of epoxy resin sealing colloid simultaneously, further strengthens the joint strength between each structure, consolidates the curb plate simultaneously and is connected the claw with the reinforcement and can fix a position the heat conduction board subassembly to reduce the degree of difficulty of installation, further improve structural strength.

3. Through the fixed mode of integration multilayer point gluing with the joint, improve impact resistance, antidetonation and dustproof moisture resistance of chip greatly to guarantee the stability of chip, the heat-sinking capability of chip is guaranteed to the heat-conducting plate subassembly that embeds simultaneously, makes the chip can satisfy more adaptation scenes.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic perspective view of a chip silver paste-on package structure according to an embodiment of the present invention;

fig. 2 is a front cross-sectional view of a chip silver paste bonded package structure according to an embodiment of the utility model;

fig. 3 is a side cross-sectional view of a chip silver paste bonded package structure according to an embodiment of the utility model;

fig. 4 is one of three-dimensional assembly views of a chip silver paste bonded package structure according to an embodiment of the utility model;

fig. 5 is a second perspective assembly view of a chip silver paste package structure according to an embodiment of the utility model;

fig. 6 is a third perspective assembly view of a chip silver paste package structure according to an embodiment of the utility model;

FIG. 7 is an enlarged view of a portion of FIG. 3 at A;

fig. 8 is a partial enlarged view of fig. 5 at B.

In the figure:

1. a housing; 2. a cover plate; 3. a fixing leg; 4. a substrate; 5. mounting grooves; 6. an anti-overflow groove; 7. a silver paste layer; 8. a chip body; 9. a heat conducting plate assembly; 901. an insulating heat-conducting sheet; 902. filling the groove; 903. reinforcing the side plate; 904. reinforcing the connecting claw; 10. welding spots; 11. a pin; 12. gold thread; 13. epoxy resin sealing colloid; 14. a tackifying tank; 15. a through hole; 16. connecting holes; 17. and (5) silver paste pore-forming glue.

Detailed Description

For further explanation of the various embodiments, the drawings which form a part of the disclosure and which are incorporated in and constitute a part of this specification, illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and to enable others of ordinary skill in the art to understand the various embodiments and advantages of the utility model, and, by reference to these figures, reference is made to the accompanying drawings, which are not to scale and wherein like reference numerals generally refer to like elements.

According to the embodiment of the utility model, the utility model provides a chip silver paste pasting packaging structure.

Referring to the drawings and the detailed description, as shown in fig. 1-8, the chip silver paste packaging structure according to the embodiment of the utility model includes a housing 1, a cover plate 2 is disposed on the top of the housing 1, four corners of the bottom of the housing 1 are provided with fixing pins 3, the top of the fixing pins 3 is provided with a substrate 4, the top of the substrate 4 is provided with an installation groove 5, the bottoms of two sides of the installation groove 5 are provided with anti-overflow grooves 6, the bottom of the installation groove 5 is provided with a silver paste layer 7, and the top of the silver paste layer 7 is provided with a chip main body 8; a heat conducting plate component 9 is arranged at the top of the chip main body 8, a plurality of welding spots 10 are arranged on two sides of the chip main body 8, a plurality of pins 11 are arranged on two sides of the shell 1, and gold wires 12 are arranged between the pins 11 and the welding spots 10; an epoxy resin sealing colloid 13 is arranged between the shell 1 and the cover plate 2.

By means of the technical scheme, the contact area between the silver paste sticking layer 7 and the substrate 4 can be greatly increased through the mounting groove 5 and the anti-overflow groove 6 which are formed in the top of the substrate 4, so that the bonding strength between the substrate 4 and the chip main body 8 is improved, the stability of the chip main body 8 is ensured, and meanwhile, the anti-overflow groove 6 can prevent excessive silver paste from causing glue climbing to pollute the chip, so that the difficulty in chip packaging is effectively reduced; through setting up heat-conducting plate subassembly 9, can realize thermal high-efficient transmission through the direct contact heat conduction to chip main part 8 to guarantee the heat dispersion of chip. Through the fixed mode of integration multilayer point gluing with the joint, improve impact resistance, antidetonation and dustproof moisture resistance of chip greatly to guarantee the stability of chip, the heat-sinking capability of chip is guaranteed to built-in heat-conducting plate subassembly 9 simultaneously, makes the chip can satisfy more adaptation scenes.

In an embodiment, for above-mentioned mounting groove 5, the tackification groove 14 that a plurality of equidistance range are the rectangular distribution is seted up to mounting groove 5 bottom, and anti-overflow groove 6 is the slope structure and the direction upwards gradually for the one end of keeping away from mounting groove 5 to can increase the contact surface that silver thick liquid pasted between layer 7 and the base plate 4 and strengthen the joint strength between the two, can save silver thick liquid through the anti-overflow groove 6 of seting up in the slant, avoided the excessive upward climbing of silver thick liquid to glue and cause the pollution to chip main part 8.

In an embodiment, for the above heat conducting plate assembly 9, the heat conducting plate assembly 9 includes an insulating heat conducting plate 901 disposed on the top of the chip body 8, the top of the insulating heat conducting plate 901 is provided with a plurality of filling grooves 902 which are equidistantly arranged and distributed in a rectangular shape, the front and back of the insulating heat conducting plate 901 are both provided with a reinforcing side plate 903, and the bottom of the reinforcing side plate 903 is provided with a plurality of reinforcing connecting claws 904 which are equidistantly arranged, so that the insulating heat conducting plate 901 can be fixedly mounted, and the chip body 8 is tightly attached and thermally conducted.

In an embodiment, for the reinforcing side plate 903, the reinforcing side plate 903 is an L-shaped structure, and the top of the front surface and the top of the back surface of the casing 1 are both provided with through holes 15 matched with the reinforcing side plate 903, so that the reinforcing side plate 903 can extend to the outside of the casing 1 to transfer heat to the external environment, and the heat dissipation effect is improved.

In an embodiment, to above-mentioned reinforcement connection claw 904, reinforcement connection claw 904 is the spheroidal integrated configuration of half cylinder the latter half of the first half, and reinforcement connection claw 904 is four claw shape elastic construction, base plate 4 top front and back have all been seted up a plurality of and have been connected claw 904 matched with connecting hole 16 with reinforcement, the bottom is provided with silver thick liquid hole and glues 17 in connecting hole 16, thereby can fix a position heat-conducting plate subassembly 9 through elastic connection and the silver thick liquid hole between reinforcement connection claw 904 and the connecting hole 16 and glue 17, reduce the installation degree of difficulty, improve joint strength.

For the convenience of understanding the technical solutions of the present invention, the following detailed description will be made on the working principle or the operation mode of the present invention in the practical process.

When in actual application, install inside components and parts according to follow supreme order down in proper order, install at fixed foot 3 tops with base plate 4 earlier, paste layer 7 as the silver thick liquid to the inside dropwise add silver thick liquid of mounting groove 5, then prevent that chip main part 8 from making it aim at mounting groove 5 to press down, make the silver thick liquid paste layer 7 and solidify through making under the high temperature environment, and arrange unnecessary silver thick liquid to 6 insides of anti-overflow groove and avoid climbing to glue and cause the chip to pollute. And then, the welding points 10 at the two sides of the chip main body 8 are sequentially and correspondingly connected with the pins 11 through gold wires 12, so that the circuit connection of the chip is completed. Then, the heat conducting plate assembly 9 is tightly attached to the top of the chip main body 8, silver paste is arranged in the connecting hole 16 in advance, then the reinforcing connecting claw 904 elastically contracts and extends into the connecting hole 16, and the silver paste is extruded to be expanded outwards after reaching the bottom, and finally the silver paste is solidified to fix the chip. Finally, epoxy resin sealing colloid 13 is dripped into the shell 1, and the cover plate 2 is covered to complete the encapsulation of the chip.

In summary, according to the technical scheme of the utility model, the mounting groove 5, the anti-overflow groove 6 and the tackifying groove 14 which are formed in the top of the substrate 4 can greatly increase the contact area between the silver paste pasting layer 7 and the substrate 4, so that the bonding strength between the substrate 4 and the chip main body 8 is increased, the stability of the chip main body 8 is ensured, and meanwhile, the anti-overflow groove 6 can prevent the chip from being polluted by glue climbing caused by excessive silver paste, thereby effectively reducing the difficulty of chip packaging; through setting up heat-conducting plate subassembly 9, can realize thermal high-efficient transmission through the direct contact heat conduction to chip main part 8 to guarantee the heat dispersion of chip. Through setting up insulating conducting strip 901, avoid taking place the electric conduction under the prerequisite of guaranteeing chip heat dispersion and lead to the fact the harm to the chip, fill groove 902 simultaneously and can carry out epoxy resin sealing colloid 13's packing, further strengthen the joint strength between each structure, consolidate curb plate 903 simultaneously and consolidate and connect claw 904 and can fix a position heat-conducting plate assembly 9 to reduce the degree of difficulty of installation, further improve structural strength. Through the fixed mode of integration multilayer point gluing with the joint, improve impact resistance, antidetonation and dustproof moisture resistance of chip greatly to guarantee the stability of chip, the heat-sinking capability of chip is guaranteed to built-in heat-conducting plate subassembly 9 simultaneously, makes the chip can satisfy more adaptation scenes.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a packaging structure that chip silver thick liquid was pasted, includes casing (1), and this casing (1) top is provided with apron (2), its characterized in that:

fixing feet (3) are arranged at four corners of the bottom in the shell (1), a substrate (4) is arranged at the top of each fixing foot (3), a mounting groove (5) is formed in the top of each substrate (4), anti-overflow grooves (6) are formed in the bottoms of two sides of each mounting groove (5), a silver paste pasting layer (7) is arranged at the bottom in each mounting groove (5), and a chip main body (8) is arranged at the top of each silver paste pasting layer (7);

a heat conducting plate assembly (9) is arranged at the top of the chip main body (8), a plurality of welding spots (10) are arranged on two sides of the chip main body (8), a plurality of pins (11) are arranged on two sides of the shell (1), and gold wires (12) are arranged between the pins (11) and the welding spots (10);

and an epoxy resin sealing colloid (13) is arranged between the shell (1) and the cover plate (2).

2. The chip silver paste packaging structure according to claim 1, wherein the bottom end of the mounting groove (5) is provided with a plurality of thickening grooves (14) which are equidistantly arranged and are distributed in a rectangular shape.

3. The chip silver paste packaging structure according to claim 1, wherein the anti-overflow groove (6) is of an inclined structure and the direction is gradually upward from the end far away from the mounting groove (5).

4. The chip silver paste package structure according to claim 1, wherein the heat conducting plate assembly (9) comprises an insulating heat conducting plate (901) arranged on the top of the chip main body (8), a plurality of filling grooves (902) which are equidistantly arranged and distributed in a rectangular shape are formed in the top of the insulating heat conducting plate (901), reinforcing side plates (903) are arranged on the front surface and the back surface of the insulating heat conducting plate (901), and a plurality of reinforcing connecting claws (904) which are equidistantly arranged are arranged at the bottoms of the reinforcing side plates (903).

5. The chip silver paste package structure according to claim 4, wherein the reinforcing side plate (903) is an L-shaped structure, and through holes (15) matched with the reinforcing side plate (903) are formed in the top of the front surface and the top of the back surface of the shell (1).

6. The chip silver paste packaging structure of claim 5, wherein the reinforcing connecting claws (904) are a combination structure of an upper half cylinder and a lower half sphere, and the reinforcing connecting claws (904) are four-claw-shaped elastic structures.

7. The chip silver paste packaging structure according to claim 6, wherein the front surface and the back of the top of the substrate (4) are both provided with a plurality of connecting holes (16) matched with the reinforcing connecting claws (904), and the bottom of the connecting holes (16) is provided with silver paste hole glue (17).