CN218827099U

CN218827099U - Lead frame structure and packaging structure

Info

Publication number: CN218827099U
Application number: CN202223130807.6U
Authority: CN
Inventors: 吕娟娟
Original assignee: Anhui Jixin Microelectronics Technology Co ltd
Current assignee: Anhui Jixin Microelectronics Technology Co ltd
Priority date: 2022-11-24
Filing date: 2022-11-24
Publication date: 2023-04-07
Anticipated expiration: 2032-11-24

Abstract

The utility model discloses a lead frame structure and packaging structure belongs to chip package technical field, include the lead frame that comprises a plurality of lead frame units, the lead frame unit includes the frame, is provided with first base island and second base island in the frame, and one side symmetry of first base island is provided with second even muscle, and the opposite side symmetry of first base island is provided with first even muscle, and the one end that second even muscle and first even muscle kept away from first base island all is fixed on the inner wall of frame, and one side of second base island is provided with a plurality of drain electrode pins, and the one end that the drain electrode pin kept away from second base island is connected with frame fixed connection; the utility model discloses usable current packaging material supply line encapsulates, need not to customize the new part of moulding plastics, can effectively practice thrift the cost to satisfy the demand of two MOSFET chip series connection encapsulation.

Description

Lead frame structure and packaging structure

Technical Field

The utility model relates to a chip package technical field, concretely relates to lead frame structure and packaging structure.

Background

A conventional PDFN leadframe, as generally shown in fig. 4-5, includes a plurality of leadframe units, each of which includes a base island, one side of which is connected to a frame through a drain lead, and both sides of which are connected to the frame through tie bars (Tiebar), and a plurality of interconnected source leads and a single gate lead are provided on the frame on a side away from the drain lead, which are mostly applied to the packaging of MOSFET chips. In the packaging process, the packaging material is supplied into the mold by a pipeline for supplying the packaging material to package the chip, the pipeline is generally led in from the upper part of the frame (as shown in fig. 4) and led into the mold (not shown) through a material injection head; after the packaging is finished, a packaging body is formed, and the packaging body is mostly installed on the circuit board for use.

With the development of the technology and the improvement of the functional requirements, the serial packaging mode of two MOSFET chips is more and more common, and the induction capacitance can be effectively reduced. The new package not only needs to meet the size requirement of the original circuit board, but also needs to be the same as the conventional frame of PDFN to ensure that the package can be applied to the PCB, but the conventional lead frame is difficult to meet the requirement.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a lead frame structure and packaging structure solve following technical problem:

the existing lead frame is difficult to meet the packaging requirements of two MOSFET chips.

The purpose of the utility model can be realized by the following technical proposal:

the utility model provides a lead frame structure, includes the lead frame of constituteing by a plurality of lead frame units, the lead frame unit includes the frame, is provided with first base island and second base island in the frame, and one side symmetry of first base island is provided with the even muscle of second, and the opposite side symmetry of first base island is provided with first even muscle, and the one end that first base island was kept away from to the even muscle of second and first even muscle is all fixed on the inner wall of frame, and one side of second base island is provided with a plurality of drain electrode pins, and the one end and the frame fixed connection of second base island are kept away from to the drain electrode pin.

As a further aspect of the present invention: one side of the lead frame is provided with a packaging material supply pipeline, and a plurality of injection molding heads are uniformly arranged on two sides of the packaging material supply pipeline along the length direction.

As a further aspect of the present invention: and one end of each second connecting rib, which is far away from the first base island, extends outwards in an inclined mode to form a splayed structure.

As a further aspect of the present invention: the frame is provided with a first grid pin and a plurality of source electrode pins which are connected with each other, the first grid pin and the source electrode pins are located between the two second connecting ribs, one side of the second base island is provided with a notch, the notch is provided with a second grid pin, and one end of the second grid pin is fixedly connected with the frame.

A second MOSFET chip is loaded on a second base island, a first MOSFET chip is loaded on the first base island, a source electrode pin is bonded with a source electrode area of the first MOSFET chip through a bonding wire, a first grid electrode pin is bonded with a grid electrode area of the first MOSFET chip through the bonding wire, the first base island is bonded with the source electrode area of the second MOSFET chip through the bonding wire, and a second grid electrode pin is connected with the grid electrode area of the second MOSFET chip through the bonding wire.

The utility model has the advantages that:

the utility model discloses a set up first base island and second base island, first base island and second base island setting have a determining deviation between first base island and the second base island, can utilize current encapsulating material supply line to encapsulate, and the second that the slope set up links the muscle and can avoid current head of moulding plastics, need not to customize new part of moulding plastics, can effectively practice thrift the cost, satisfies the demand of two MOSFET chip series connection encapsulation.

Drawings

The present invention will be further described with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a single lead frame unit according to the present invention;

FIG. 2 is a schematic view of the package structure of the present invention;

FIG. 3 is a schematic structural view of the present invention during packaging;

FIG. 4 is a schematic view of a prior art single lead frame unit;

fig. 5 is a schematic structural view of a prior art package.

In the figure: 1. a frame; 2. a first base island; 3. a second base island; 4. a second connecting rib; 5. a first connecting rib; 6. a first gate pin; 7. a source lead; 8. a drain lead; 9. a second gate pin; 10. a first MOSFET chip; 11. a second MOSFET chip; 12. a lead frame; 13. a packaging material supply line; 14. an injection molding head.

Detailed description of the preferred embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

Please refer to fig. 1-5, the utility model relates to a lead frame structure, include the lead frame 12 that comprises a plurality of lead frame units, the lead frame unit includes frame 1, be provided with first base island 2 and second base island 3 in the frame 1, a side symmetry of first base island 2 is provided with the even muscle of second 4, the opposite side symmetry of first base island 2 is provided with first muscle 5, the one end that first base island 2 was kept away from to even muscle 4 of second and first even muscle 5 is all fixed on the inner wall of frame 1, one side of second base island 3 is provided with a plurality of drain electrode pins 8, and drain electrode pin 8 keeps away from the one end and frame 1 fixed connection of second base island 3.

As a further aspect of the present invention: a packaging material supply pipeline 13 is arranged on one side of the lead frame 12, and a plurality of injection molding heads 14 are uniformly arranged on two sides of the packaging material supply pipeline 13 along the length direction.

As a further aspect of the present invention: one end of each of the two second connecting ribs 4, which is far away from the first base island 2, extends obliquely outwards to form a splayed structure.

As a further aspect of the present invention: install a first grid pin 6 and a plurality of interconnect's source electrode pin 7 on the frame 1, and first grid pin 6 and source electrode pin 7 all are located between two second even muscle 4, and one side of second base island 3 is provided with the breach, and breach department is provided with second grid pin 9, the one end and the frame 1 fixed connection of second grid pin 9.

A second MOSFET chip 11 is loaded on a second base island 3, a first MOSFET chip 10 is loaded on a first base island 2, a source lead 7 is bonded with a source region of the first MOSFET chip 10 through a bonding wire, a first grid lead 6 is bonded with a grid region of the first MOSFET chip 10 through the bonding wire, the first base island 2 is bonded with the source region of the second MOSFET chip 11 through the bonding wire, and a second grid lead 9 is connected with the grid region of the second MOSFET chip 11 through the bonding wire.

The utility model discloses a theory of operation: firstly, a drain region of a first MOSFET chip 10 is fixed on a first base island 2 through an adhesive substance (solder paste or conductive adhesive), a drain region of a second MOSFET chip 11 is fixed on a second base island 3 through the adhesive substance and then bonded, a source lead 7 is bonded with the source region of the first MOSFET chip 10 through a bonding wire (copper wire, gold wire, aluminum wire and the like), a first gate lead 6 is bonded with a gate region of the first MOSFET chip 10 through the bonding wire, the first base island 2 is bonded with the source region of the second MOSFET chip 11 through the bonding wire, further, the drain region of the first MOSFET chip 10 and the source region of the second MOSFET chip 11 are electrically conducted to realize series connection of the two, the second gate lead 9 is connected with the gate region of the second MOSFET chip 11 through the bonding wire, so that the whole welding process can be completed, then, a single double MOSFET chip series connection encapsulation structure is formed after encapsulation and singulation is carried out by utilizing an encapsulation material supply pipeline 13 and an injection head 14, in addition, the second connection rib 4 is obliquely arranged, so that the existing injection head can be adapted, the injection molding cost can be saved effectively.

Although an embodiment of the present invention has been described in detail, the description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. Lead frame structure, include lead frame (12) of constituteing by a plurality of lead frame units, the lead frame unit includes frame (1), its characterized in that, be provided with first base island (2) and second base island (3) in frame (1), the one side symmetry of first base island (2) is provided with second even muscle (4), the opposite side symmetry of first base island (2) is provided with first muscle (5), the one end that first base island (2) were kept away from in second even muscle (4) and first muscle (5) is all fixed on the inner wall of frame (1), one side of second base island (3) is provided with a plurality of drain electrode pins (8), and drain electrode pin (8) keep away from the one end and frame (1) fixed connection of second base island (3).

2. Leadframe structure according to claim 1, characterized in that the ends of the two second webs (4) remote from the first base island (2) extend obliquely outwards in a splayed configuration.

3. The lead frame structure according to claim 1, wherein a first gate lead (6) and a plurality of source leads (7) connected to each other are mounted on the frame (1), the first gate lead (6) and the source leads (7) are located between two second connecting ribs (4), a notch is formed in one side of the second base island (3), a second gate lead (9) is disposed in the notch, and one end of the second gate lead (9) is fixedly connected to the frame (1).

4. A package structure comprising a lead frame structure according to any one of claims 1 to 3, wherein the second base island (3) carries the second MOSFET chip (11), the first base island (2) carries the first MOSFET chip (10), the source lead (7) is bonded to the source region of the first MOSFET chip (10) by a bonding wire, the first gate lead (6) is bonded to the gate region of the first MOSFET chip (10) by a bonding wire, the first base island (2) is bonded to the source region of the second MOSFET chip (11) by a bonding wire, and the second gate lead (9) is connected to the gate region of the second MOSFET chip (11) by a bonding wire.