CN109256368B - SOT23-X lead frame and packaging method thereof - Google Patents
SOT23-X lead frame and packaging method thereof Download PDFInfo
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- CN109256368B CN109256368B CN201811317871.0A CN201811317871A CN109256368B CN 109256368 B CN109256368 B CN 109256368B CN 201811317871 A CN201811317871 A CN 201811317871A CN 109256368 B CN109256368 B CN 109256368B
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- 238000000465 moulding Methods 0.000 claims abstract description 14
- 238000005452 bending Methods 0.000 claims abstract description 6
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- 230000032683 aging Effects 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 4
- 238000003878 thermal aging Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 230000002950 deficient Effects 0.000 claims description 3
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- 239000003292 glue Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 210000003205 muscle Anatomy 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses an SOT23-X (X is 3,5 or 6) lead frame and a packaging method thereof, comprising a frame body and frame units, wherein a transverse connecting rib is arranged between two rows of transversely connected frame units, a longitudinal plastic package material injection molding runner is arranged between the nth row of frame units and the (n +1) th row of frame units, a longitudinal connecting rib is arranged between the (n +1) th row of frame units and the (n +2) th row of frame units, n is an odd number, and n is more than or equal to 1 and less than or equal to 47; each frame unit consists of a bonding pad base island and pins, and when X is 3, three false pins are arranged; when X is 5, a false pin is arranged; when X is 6, no dummy pin is set. The packaging method comprises the steps that during plastic packaging, one end of a false pin is tangent to the boundary of a plastic packaging body, and the end head does not enter a plastic packaging cavity of a mold; when the forming is separated, the arranged false pins are cut off under the action of bending forming force. The invention realizes the compatibility of the plastic package mold and the molding/separating mold of three package forms of SOT23-X, and improves the area density of the frame unit.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to an SOT23-X lead frame and a packaging method thereof.
Background
The integrated circuit packaging is a key link in the semiconductor production process, and has the functions of electrically connecting bonding points of chips in the integrated circuit with the outside, and providing mechanical protection for the chips so as to prevent the chips from being physically damaged. The packaging quality of an integrated circuit directly affects its electrical parametric performance and stability.
The basic flow of integrated circuit packaging is as follows: grinding and cutting an integrated circuit wafer into single chips, bonding the single chips on a lead frame base island through conductive adhesive, insulating adhesive or eutectic process and the like, leading wires from chip bonding points to corresponding pins of a lead frame, then plastically packaging and molding the single chips by using a high polymer material through a specific plastic packaging mold, and finally obtaining the integrated circuit device meeting specific requirements after passing electrical parameter test.
The existing SOT23-X lead frame mainly has three types, namely 3 pins (X ═ 3), 5 pins (X ═ 5) and 6 pins (X ═ 6), and the three types of lead frames all have the defects that a plastic package equipment mold cannot be compatible with a molding/separating equipment mold, the equipment investment cost of a package line is high, and the machine scheduling capability and the production efficiency of a production line are poor.
In addition to the above drawbacks, the conventional SOT23-X lead frame has the disadvantages of low density of frame units (also referred to as mounting units) and small yield per oven molding.
Disclosure of Invention
The invention aims to overcome the defects that the plastic packaging equipment mold and the molding/separating equipment mold in the prior art cannot be compatible and the frame unit density is low, and the aim is realized by the following technical scheme:
an SOT23-X lead frame compatible with three lead frames of SOT23-3, SOT23-5 and SOT23-6 comprises a frame body and frame units, wherein the frame body consists of a frame and criss-cross connecting ribs (including transverse connecting ribs and longitudinal connecting ribs) which are distributed in the frame at equal intervals, the frame body is provided with the frame units which are arranged in a longitudinal and transverse mode and are distributed at equal intervals, a transverse connecting rib is arranged between two rows of transversely connected frame units, a longitudinal plastic sealing material injection molding runner is arranged between the nth row of frame units and the (n +1) th row of frame units, a longitudinal connecting rib is arranged between the (n +1) th row of frame units and the (n +2) th row of frame units, n is an odd number, and n is more than or equal to 1 and less than or equal to 47; each frame unit consists of an adhesive sheet base island and pins which are distributed on two sides of the adhesive sheet base island and connected with the transverse connecting ribs, when X is 3, the frame unit is an SOT23-3 lead frame, and three of six pins are false pins; when X is 5, the lead frame is an SOT23-5 lead frame, and one of six pins is a dummy pin; when X is 6, the lead frame is an SOT23-6 lead frame, no dummy pin is provided, and all six pins are actually used pins.
On the basis of the technical scheme, the invention can further add the following technical means:
the frame body is provided with 10 rows of 48 columns of frame units which are distributed at equal intervals.
Further, the length of the frame body is 228 +/-0.102 mm, the width of the frame body is 53 +/-0.05 mm, and the area density of the frame unit reaches 0.0397mm & lt-2 & gt.
Further, the longitudinal connecting ribs are of hollow-out double-rib structures.
Furthermore, four corners of the bonding pad base island are arc-shaped chamfers.
Furthermore, the pins corresponding to the arc chamfers of the die bonding pad base islands in the frame units are in a bent angle shape.
The invention further provides a packaging method of the SOT23-X lead frame compatible with three lead frames of SOT23-3, SOT23-5 and SOT23-6, which comprises the following steps:
step 1: bonding the chip on the bonding pad substrate of the frame unit by silver paste or insulating glue, and curing after all the frame units are bonded, wherein the curing temperature is 175 +/-5 ℃, and the curing time is 2 hours +/-ten minutes;
step 2: welding an inner lead, and welding the aluminum electrode of the chip and the corresponding pin of the frame unit by using the inner lead;
and step 3: plastic package, namely packaging the product to be processed in the step 2 by using high polymer plastic;
and 4, step 4: heat aging, namely performing heat aging on the packaged product, wherein the heat aging temperature is 170 +/-5 ℃, and the heat aging time is 300 +/-10 minutes;
and 5: removing flash, and spraying excessive plastic flash of the product after thermal aging;
step 6: and removing oxidation brightness, and depositing a uniform and compact tin layer on the pin to ensure that the pin has good solderability and conductivity.
And 7: and (3) molding/separating, namely molding/separating the electronic device products formed by the steps in the whole row to form a single electronic device.
And 8: and testing the separated products, grading the qualified products and the defective products according to an internal control standard, and printing, taping and packaging the combined file.
Further, when step 3 is implemented, one end of the dummy pin is tangent to the boundary of the plastic package body, and the end of the dummy pin does not enter the plastic package cavity of the mold, so that the plastic package molds used by the plastic package equipment are compatible for three lead frames X3, 5 or 6.
Further, in the implementation of step 7, the dummy pins provided are cut off by bending forming force, so that the forming/separating mold used by the forming/separating apparatus is compatible for three lead frames of X — 3,5, or 6.
The invention has the following beneficial effects:
1. through the arrangement of the dummy pins, the compatibility of a plastic package mold used by plastic package equipment and the compatibility of a forming/separating mold used by forming/separating equipment are realized for three lead frames of which X is 3,5 or 6, so that the production cost is greatly reduced, and the production efficiency is improved.
2. As the technical means of arranging 10 rows of frame units with 48 rows of frame units distributed at equal intervals on the frame body is adopted, the area density of the frame units (also called as mounting units) in the invention is high, and the output quantity of plastic packaging in each furnace is large.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a conventional SOT23-3 lead frame;
fig. 2 is a schematic view of the overall structure of a lead frame in embodiment 1 of the present invention;
FIG. 2-1 is an enlarged view of a portion of FIG. 2;
fig. 3 is a schematic structural view of a frame unit in embodiment 1 of the present invention;
fig. 4 is a schematic structural view of a frame unit in embodiment 2 of the present invention;
fig. 5 is a schematic structural view of a frame unit in embodiment 3 of the present invention;
FIG. 6 is a schematic diagram of a plastic molding process in a conventional SOT23-X lead frame packaging method;
FIG. 7 is a schematic diagram of a plastic molding process in the SOT23-X lead frame packaging method of the present invention.
Detailed Description
The technical scheme of the invention is described in detail in the following with reference to the attached drawings:
example 1
FIG. 1 is a schematic diagram of the overall structure of a conventional SOT23-3 lead frame (the overall structure of the conventional SOT23-5 lead frame and the SOT23-6 lead frame is the same as that of the conventional SOT23-3 lead frame, except that the number of leads is different; in order to avoid the complexity of FIG. 1, all frame units are not shown), FIG. 2 is a schematic diagram of the overall structure of a lead frame (SOT23-3 lead frame) in embodiment 1 of the present invention (the overall structure of the SOT23-5 lead frame and the SOT23-6 lead frame in the present invention is the same as that of the SOT23-3 lead frame in embodiment 1, except that the arrangement of the leads is different; in order to avoid the complexity of FIG. 2, all frame units are not shown), and from FIG. 1 and FIG. 2, the SOT23-3 lead frame in the present embodiment (including the SOT23-3 lead frame in embodiment 2 of the present invention, also, The area density of the frame units (also called mounting units) in the SOT23-5 lead frame and the SOT23-6 lead frame) in the lead frame 3 is higher than the area density (the number of the frame units in a unit area) of the prior SOT23-3 lead frame (also comprising the prior SOT23-5 lead frame and the SOT23-6 lead frame).
FIG. 2-1 is an enlarged fragmentary view of FIG. 2, enlarged to the extent encircled by the dashed circle in FIG. 2; fig. 3 is a schematic structural diagram of a frame unit in embodiment 1 of the present invention. As shown in fig. 2, 2-1 and 3, the SOT23-X lead frame comprises a frame body 1 and a frame unit 2, wherein the frame body 1 is composed of a frame and criss-cross connecting ribs which are distributed at equal intervals in the frame. The frame body 1 is provided with frame units 2 arranged in a longitudinal and transverse manner and distributed at equal intervals. A transverse connecting rib 3 is arranged between two rows of transversely connected frame units 2, a longitudinal plastic sealing material injection molding runner 5 is arranged between the nth row frame unit and the (n +1) th row frame unit, a longitudinal connecting rib 4 is arranged between the (n +1) th row frame unit and the (n +2) th row frame unit 2, n is an odd number which is more than or equal to 1 and less than or equal to 47, and the last row frame unit 2 is the (n +1) th row frame unit 2. The frame unit 2 is composed of a die pad 27 and six leads 21, 22, 23, 24, 25, 26 distributed on both sides of the die pad 27 and connected to the transverse connecting rib 3, wherein three leads are set as dummy leads, that is, the leads 21, 23, 25 are dummy leads, and the other three leads, that is, the leads 22, 24, 26 are actually used leads. One end of each dummy pin 21, 23, 25 close to the plastic package body is tangent to the boundary of the plastic package body (the dashed line frame in fig. 3 is the boundary of the plastic package body after plastic package molding).
As a preferable scheme of the embodiment, 10 rows of 48 columns of frame units 2 distributed at equal intervals are arranged on the frame body 1, the length of the frame body 1 is 228 +/-0.102 mm, the width of the frame body 1 is 53 +/-0.05 mm, and the area density of the frame units reaches 0.0397mm-2The longitudinal connecting ribs 4 are hollow double-rib structures. The middle of the longitudinal connecting rib 4 is designed to be hollow, so that the effect equivalent to double-rib support is formed, the supporting force required by the increase of the number of rows is improved, the warping possibly caused in the transmission process is prevented, and the consumption of frame materials is reduced. Further, four corners of the die pad base 27 are provided with arc chamfers, and inner ends of the leads 24 and 26 (actually used leads, not including dummy leads, and in addition, the lead 22 is a lead directly connected to the die pad base 27 and not belonging to the lead corresponding to the arc chamfers) corresponding to the arc chamfers are provided with bent-leg shapes. The embodiment combines the arc chamfer of the die pad base 27 and the bending foot design of the pins 24 and 26, and the design has the advantages that: the bonding force between the corresponding pins and the plastic package material can be improved, and the stability and the reliability are improved; secondly, on the premise of keeping the size of the plastic package body and the pin pitch of the outer ends of the pins unchanged, the area of the bonding pad base island can be increased as much as possible, and therefore the dissipation power of the electronic device is improved.
Example 2
The example 2 relates to an SOT23-5 lead frame, and the overall structure of the two lead frames is the same as that of the SOT23-3 lead frame according to the example 1, except that the lead arrangement in the example 2 is different from that in the example 1.
As shown in fig. 4, the frame unit 6 in the SOT23-5 lead frame is composed of a die pad 67 and leads 61, 62, 63, 64, 65, 66 distributed on both sides of the die pad 67 and connected to the transverse tie bars 3, wherein the lead 65 is a dummy lead, and the other five leads are actually used leads. One end of the dummy pin 65 close to the plastic package body is tangent to the plastic package body boundary (the dashed line frame in fig. 4 is the plastic package body boundary after plastic package molding).
Example 3
The example 3 relates to an SOT23-6 lead frame, and the overall structure of the two lead frames is the same as that of the SOT23-3 lead frame according to the example 1, except that the lead arrangement in the example 2 is different from that in the example 1.
As shown in fig. 5, the frame unit 7 in the SOT23-6 lead frame is composed of a die pad 77 and leads 71, 72, 73, 74, 75 and 76 distributed on both sides of the die pad 77 and connected with the transverse tie bars 3, wherein six leads are all actually used leads.
The structural features of the present invention are described in more detail above with three embodiments. It is particularly emphasized that the SOT23-3 lead frame and the SOT23-5 lead frame of the present invention are each configured with six leads, of course, three leads are dummy leads and one lead is dummy lead. As shown in fig. 7, the SOT23-X lead frame of the present invention benefits from the dummy lead design, so that the external structures of the plastic packages (the dashed borders in the figure represent the boundaries of the plastic packages) of the three frame units corresponding to X being equal to 3,5, and 6, respectively, are consistent, which makes the plastic packages 8 used in the plastic package apparatuses of the three frame units compatible, and the consistency of the external structures also makes the molding/separating molds of the three frame units compatible. Different from the SOT23-X lead frame of the invention, as shown in fig. 6, the conventional SOT23-X lead frame requires three different plastic package molds, namely a plastic package mold 9 (corresponding to SOT 23-3), a plastic package mold 10 (corresponding to SOT 23-5) and a plastic package mold 11 (corresponding to SOT 23-6), for plastic package because the external structures of the plastic package bodies of the frame units are different. The three plastic package molds cannot be compatible, so that the plastic package mold is not beneficial to the scheduling of the plastic package equipment of a production line, and the plastic package equipment has high input cost and low production efficiency. Similarly, the existing SOT23-X lead frame requires 3 different molding/separating dies, and the three molding/separating dies are also incompatible, resulting in high cost and low efficiency of production.
In addition, compared with the conventional SOT23-X (X is 3,5 or 6, the same shall apply hereinafter) lead frame only provided with 240 frame units, the present invention improves the frame unit density as a whole and reduces the frame material consumption. Because the area density of the frame units is high, each furnace of the SOT23-X lead frame can produce 3840 frame units of 8 lead frames in the plastic packaging process, compared with the conventional SOT23-X lead frame which produces 1920 frame units of 8 lead frames in each furnace, the production quantity of each furnace is increased by 1 time, and the production efficiency is increased by 1 time under the condition that the injection molding time and the curing time of the plastic packaging material are the same.
The packaging method of the present invention is further described below:
firstly, punching lead frames shown in FIGS. 2 to 5, which correspond to three package structures of SOT23-3, SOT23-5 and SOT23-6 respectively, according to the lead frame drawings, and then, implementing the following steps:
step 1: the electronic device chips are adhered on the adhering piece base islands 27 of the frame units 2, the adhering piece base islands 67 of the frame units 6 or the adhering piece base islands 77 of the frame units 7 one by one through silver paste or insulating glue, and the whole lead frame is cured after all the frame units are adhered, wherein the curing temperature is 175 +/-5 ℃, and the curing time is 2 hours +/-10 minutes.
Step 2: electrodes on the electronic device chip are soldered to the die pad and the leads of the frame unit via copper wires or alloy wires. As shown in fig. 3, corresponding to the SOT23-3 packaged lead device, the die attach pad 27 and the inner ends of the leads 24 and 26 are wire bonding areas; or as shown in fig. 4, corresponding to the SOT23-5 packaged pin device, the inner ends of the die pad 67 and the pins 61, 63, 64, 65 are wire bonding areas; alternatively, as shown in fig. 5, die pad 77 and leads 71, 73, 74, 75, 76 are wire bond regions for a SOT23-6 packaged lead device.
And step 3: and (3) plastically packaging the lead frame with the welded wires by using a high polymer material, namely packaging the product to be processed in the step (3) by using high polymer plastic. During plastic packaging, corresponding to the pin package with the X being 3, one end of each of the false pins 21, 23 and 25 is tangent to the boundary of the plastic packaging body, and the end head does not enter a plastic packaging cavity of the mold; corresponding to the package with the X-5 pin, one end of the false pin 65 is tangent to the boundary of the plastic package body, and the end head does not enter the plastic package cavity of the die; and (3) correspondingly packaging the X-6 pins, and enabling all pin ends to enter a plastic packaging cavity of the die.
And 4, step 4: and (3) thermal aging, namely thermally aging the packaged product at the temperature of 170 +/-5 ℃ for 300 +/-10 minutes.
And 5: and (4) removing the flash, and spraying the excessive plastic flash of the product after thermal aging.
Step 6: and removing oxidation brightness, and depositing a uniform and compact tin layer on the pin to ensure that the pin has good weldability and conductivity.
And 7: and (4) forming and separating, namely forming/separating the electronic device products formed by the steps in the whole row to form a single electronic device. When the pins are separated, corresponding to the packaging of the X-3 pins, one end of each of all the pins connected with the transverse connecting rib 3 is cut off, wherein the other ends of the false pins 21, 23 and 25 are tangent to the boundary of the plastic packaging body and do not enter the plastic packaging body, even if plastic burrs are arranged at the tangent part to connect the plastic packaging body, the plastic burrs fall off to form waste materials under the action of forming bending force, and other actual pins are subjected to punch forming under the action of forming bending force; corresponding to the packaging of the X-5 pins, one end of all the pins connected with the transverse connecting rib 3 is cut off, the false pins 65 fall off under the action of the principle to become waste materials, and the rest pins are formed by punching; for a 6 pin package, all pins are stamped and formed.
And 8: testing the separated product, grading the qualified product and the defective product according to the internal control standard, and printing, braiding and packaging the combined file to form the electronic component. The electronic components formed by packaging the high-density SOT23-X lead frame can be a transistor II, a triode, a mosfet (metal-oxide semiconductor field effect transistor), a voltage stabilizing integrated circuit, a power management integrated circuit and other special function integrated circuits.
Claims (9)
1. The utility model provides a lead frame SOT23-X compatible with three kinds of lead frames SOT23-3, SOT23-5, SOT23-6, includes frame body and frame cell, and the frame body comprises frame and the crisscross even muscle of equidistant distribution in the frame, is equipped with the frame cell of vertically and horizontally arranging, equidistant distribution on the frame body, its characterized in that: a transverse connecting rib is arranged between two rows of transversely connected frame units, a longitudinal plastic package material injection molding runner is arranged between the nth row frame unit and the (n +1) th row frame unit, a longitudinal connecting rib is arranged between the (n +1) th row frame unit and the (n +2) th row frame unit, n is an odd number, and n is more than or equal to 1 and less than or equal to 47; each frame unit consists of an adhesive sheet base island and pins which are distributed on two sides of the adhesive sheet base island and connected with the transverse connecting ribs, when X is 3, the frame unit is an SOT23-3 lead frame, and three of six pins are false pins; when X is 5, the lead frame is an SOT23-5 lead frame, and one of six pins is a dummy pin; when X is 6, the lead frame is an SOT23-6 lead frame, no dummy pin is provided, and all six pins are actually used pins.
2. The SOT23-X leadframe of claim 1 compatible with three types SOT23-3, SOT23-5, SOT23-6, wherein: the frame body is provided with 10 rows of 48 columns of frame units which are distributed at equal intervals.
3. The SOT23-X leadframe of claim 2 compatible with three types SOT23-3, SOT23-5, SOT23-6, wherein: the length of the frame body is 228 +/-0.102 mm, the width of the frame body is 53 +/-0.05 mm, and the area density of the frame unit reaches 0.0397mm-2。
4. The SOT23-X leadframe of claim 1 compatible with three types SOT23-3, SOT23-5, SOT23-6, wherein: the longitudinal connecting ribs are in hollow-out double-rib structures.
5. The SOT23-X lead frame of any one of claims 1 to 4 that is compatible with the three lead frames SOT23-3, SOT23-5, SOT23-6, wherein: four corners of the bonding pad base island are arc-shaped chamfers.
6. The SOT23-X lead frame of claim 4 compatible with three lead frames SOT23-3, SOT23-5, SOT23-6, wherein: and the pins corresponding to the arc chamfers of the bonding pad base islands in the frame units are in bent angle shapes.
7. A SOT23-X lead frame packaging method compatible with three lead frames of SOT23-3, SOT23-5 and SOT23-6 is characterized by comprising the following steps:
step 1: bonding the chip on the bonding pad substrate of the frame unit by silver paste or insulating glue, and curing after all the frame units are bonded, wherein the curing temperature is 175 +/-5 ℃, and the curing time is 2 hours +/-ten minutes;
step 2: welding an inner lead, and welding the aluminum electrode of the chip and the corresponding pin of the frame unit by using the inner lead;
and step 3: plastic package, namely packaging the product to be processed in the step 2 by using high polymer plastic;
and 4, step 4: heat aging, namely performing heat aging on the packaged product, wherein the heat aging temperature is 170 +/-5 ℃, and the heat aging time is 300 +/-10 minutes;
and 5: removing flash, and spraying excessive plastic flash of the product after thermal aging;
step 6: and removing oxidation brightness, and depositing a uniform and compact tin layer on the pin to ensure that the pin has good solderability and conductivity.
And 7: and (3) molding/separating, namely molding/separating the electronic device products formed by the steps in the whole row to form a single electronic device.
And 8: and testing the separated products, grading the qualified products and the defective products according to an internal control standard, and printing, taping and packaging the combined file.
8. The packaging method of the SOT23-X lead frame compatible with the three lead frames SOT23-3, SOT23-5 and SOT23-6 as claimed in claim 7, wherein: when step 3 is implemented, one end of the dummy pin is tangent to the boundary of the plastic package body, and the end head does not enter the plastic package cavity of the mold, so that the plastic package mold used by the plastic package equipment is compatible for three lead frames, namely X3, 5 or 6.
9. The packaging method of the SOT23-X lead frame compatible with the three lead frames SOT23-3, SOT23-5 and SOT23-6 as claimed in claim 7, wherein: in step 7, the dummy leads are cut off by bending forming force, so that the forming/separating die used in the forming/separating device is compatible with the three lead frames of X3, 5 or 6.
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| CN112820709B (en) * | 2019-11-15 | 2024-03-22 | 无锡华润安盛科技有限公司 | Lead frame, plastic package mold and package structure |
| CN111180397B (en) * | 2020-01-03 | 2021-11-05 | 深圳市奥伦德元器件有限公司 | Preparation process of photoelectric coupler compatible with different pin positions |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105470234A (en) * | 2016-01-12 | 2016-04-06 | 气派科技股份有限公司 | SOT23 lead frame and packaging process flow thereof |
| CN105789169A (en) * | 2016-05-19 | 2016-07-20 | 中国电子科技集团公司第五十八研究所 | Lead frame structure for lead packaging |
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| JPH0870090A (en) * | 1994-08-30 | 1996-03-12 | Kawasaki Steel Corp | Semiconductor integrated circuit |
| US5763945A (en) * | 1996-09-13 | 1998-06-09 | Micron Technology, Inc. | Integrated circuit package electrical enhancement with improved lead frame design |
| US7078792B2 (en) * | 2004-04-30 | 2006-07-18 | Atmel Corporation | Universal interconnect die |
| CN208014690U (en) * | 2017-12-01 | 2018-10-26 | 泰州友润电子科技股份有限公司 | A kind of improved 220FW-2L lead frames easy to process |
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|---|---|---|---|---|
| CN105470234A (en) * | 2016-01-12 | 2016-04-06 | 气派科技股份有限公司 | SOT23 lead frame and packaging process flow thereof |
| CN105789169A (en) * | 2016-05-19 | 2016-07-20 | 中国电子科技集团公司第五十八研究所 | Lead frame structure for lead packaging |
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