CN109256368A - SOT23-X lead frame and its packaging method - Google Patents
SOT23-X lead frame and its packaging method Download PDFInfo
- Publication number
- CN109256368A CN109256368A CN201811317871.0A CN201811317871A CN109256368A CN 109256368 A CN109256368 A CN 109256368A CN 201811317871 A CN201811317871 A CN 201811317871A CN 109256368 A CN109256368 A CN 109256368A
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- frame
- sot23
- pin
- lead frame
- plastic
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
The invention discloses a kind of SOT23-X (X=3,5 or 6) lead frame and its packaging method, including frame body and frame unit, one transverse direction is set between transversely attached two rows of frame units and connects muscle, the plastic packaging material injection molding channel of one article of longitudinal direction is set between the n-th column and (n+1) column frame unit, one article of longitudinal direction is set between (n+1) column and (n+2) column frame unit and connects muscle, n is odd number, and 1≤n≤47；Each frame unit is made of bonding die Ji Dao and pin, and when X=3, three false pins are arranged；When X=5, a false pin is set；When X=6, not set vacation pin.When the packaging method includes plastic packaging, false pin one end of setting and plastic-sealed body boundary are tangent, and the plastic packaging that end does not enter mold is intracavitary；When molding separation, the false pin of setting is removed in the effect for the forming force that bends.The present invention realizes the plastic package die and molding/separation mold compatibility of tri- kinds of packing forms of SOT23-X, and the area density for improving frame unit is high.
Description
Technical field
The invention belongs to technical field of semiconductor encapsulation, and in particular to a kind of SOT23-X lead frame and its packaging method.
Background technique
Integrated antenna package is the key link in semiconductor production process, and effect is by IC interior chip
Bonding point is electrically connected with outside, and is provided mechanical protection for chip, protected it from physical damnification.The encapsulation of integrated circuit
Quality directly affects its electrical parameter performance and stability.
The basic procedure of integrated antenna package is: integrated circuit wafer being ground, is cut into one chip, is led to
It crosses conducting resinl, insulating cement or eutectic technology etc. to be adhered on lead frame Ji Dao, from chip bonding point lead to corresponding lead
On the pin of frame, then its plastic packaging is formed by specific plastic package die with high molecular material again, eventually passes through electrical parameter survey
Become the integrated circuit device for meeting particular demands after examination is qualified.
The lead frame of existing SOT23-X mainly has 3 pins (X=3), 5 pins (X=5) and 6 pins (X=6) three
Kind, the lead frame of these three forms, which has plastic packaging equipment die and molding/separation equipment mold, to be compatible with, packaging line
Equipment input cost is high and production line board dispatching difference and the low defect of production efficiency.
In addition to drawbacks described above, there is also frame unit (also referred to as installation unit) is close for the lead frame of existing SOT23-X
Spend low, the small defect of the output quantity of every furnace plastic packaging.
Summary of the invention
The purpose of the present invention is intended to overcome the plastic packaging equipment die of the above-mentioned prior art and molding/separation equipment mold cannot
Compatible and the low density defect of frame unit, the purpose are achieved through the following technical solutions:
A kind of SOT23-X lead frame, including frame body and frame unit, frame body in frame and frame by equidistantly dividing
Criss-cross company's muscle (including laterally connect muscle and longitudinal direction and connect muscle) composition of cloth, frame body are equipped with arrangement in length and breadth, equidistantly divide
The frame unit of cloth, one transverse direction of setting connects muscle, the n-th column and (n+1) column frame between transversely attached two rows of frame units
The plastic packaging material injection molding channel of one longitudinal direction is set between unit, is arranged one article between (n+1) column and (n+2) column frame unit
Longitudinal direction connects muscle, and n is odd number, and 1≤n≤47；Each frame unit is by bonding die Ji Dao and is distributed in the two sides bonding die Ji Dao and cross
The pin composition connected to even muscle is SOT23-3 lead frame when X=3, and there are three be false pin in six pins of setting；
It is SOT23-5 lead frame, having one in six pins of setting is false pin when X=5；It is SOT23-6 lead when X=6
Frame is not provided with false pin, and six pins of setting are actual use pin.
Based on the above technical solution, the present invention can further add following technological means:
The frame body is equipped with the frame unit of 10 row, 48 column equidistantly distributed.
Further, the length of the frame body is 228 ± 0.102mm, and width is 53 ± 0.05mm, the face of frame unit
Product density reaches 0.0397mm-2.
Further, it is the double muscle structures of hollow out that the longitudinal direction, which connects muscle,.
Further, four angles of the bonding die Ji Dao are circular arc chamfering.
Further, pin corresponding to the circular arc chamfering of bonding die Ji Dao is bent angle shape in the frame unit.
The present invention still further provides a kind of packaging method of SOT23-X lead frame comprising following steps:
Step 1: chip being bonded on the bonding die Ji Dao of frame unit by silver paste or insulating cement, whole frame units are viscous
Solidified after complete, solidification temperature is 175 ± 5 DEG C, and curing time is ± ten minutes 2 hours；
Step 2: welding lead welds the aluminium electrode of chip pin lead corresponding with frame unit
Come；
Step 3: plastic packaging, by being encapsulated to product with high molecule plastic for step 2；
Step 4: the product after encapsulation is carried out heat ageing by heat ageing, and thermal aging temperature is 170 ± 5 DEG C, thermal aging time
It is 300 ± 10 minutes；
Step 5: removing flash, the extra plastic flash of spraying product after heat ageing；
Step 6: deoxidation is bright, and upper one layer tin layers uniformly, fine and close are deposited on pin, are made it have good solderable
Property and electric conductivity.
Step 7: molding/separation carries out the electronic device product that entire row is formed after above-mentioned steps to form/separate, make
Single electronic device of formation.
Step 8: the product after separation test and separate qualified product stepping and waster by inner quality standard, and will
Share shelves printing, braid, packaging.
Further, in implementation steps 3, false pin one end of setting and plastic-sealed body boundary are tangent, and end does not enter mould
The plastic packaging of tool is intracavitary, so that plastic package die used in plastic packaging equipment is compatible for X=3,5 or 6 three kind of lead frame.
Further, in implementation steps 7, the false pin of setting is removed under the action of bending forming force, so that right
In X=3,5 or 6 three kind of lead frame, molding/separation mold used in molding/separation equipment is compatible.
Beneficial effects of the present invention are as follows:
1, by the setting of false pin, for X=3,5 or 6 three kind of lead frame, the present invention is realized used in plastic packaging equipment
Plastic package die compatibility and molding/separation equipment used in molding/separation mold compatibility, to be greatly reduced
Production cost improves production efficiency.
2, the technological means of the frame unit of 10 row, 48 column equidistantly distributed, this hair are set on frame body due to using
Frame unit (also referred to as installation unit) area density in bright is high, and the output quantity of every furnace plastic packaging is big.
Detailed description of the invention
Fig. 1 is the overall structure diagram of existing SOT23-3 lead frame；
Fig. 2 is the overall structure diagram of lead frame in the embodiment of the present invention 1；
Fig. 2-1 is the partial enlarged view of Fig. 2；
Fig. 3 is the structural schematic diagram of the frame unit in the embodiment of the present invention 1；
Fig. 4 is the structural schematic diagram of the frame unit in the embodiment of the present invention 2；
Fig. 5 is the structural schematic diagram of the frame unit in the embodiment of the present invention 3；
Fig. 6 is the schematic diagram of the plastic package process in existing SOT23-X lead-frame packages method；
Fig. 7 is the schematic diagram of the plastic package process in SOT23-X lead-frame packages method of the present invention.
Specific embodiment
Technical solution of the present invention is discussed in detail below in conjunction with attached drawing:
Embodiment 1
Fig. 1 be existing SOT23-3 lead frame overall structure diagram (existing SOT23-5 lead frame,
The overall structure of SOT23-6 lead frame is identical as the overall structure of existing SOT23-3 lead frame, and difference is pin
Quantity is different；In addition, whole frame units are not shown in figure in order to avoid Fig. 1 is excessively complicated), Fig. 2 is the embodiment of the present invention 1
In lead frame (SOT23-3 lead frame) overall structure diagram (present invention in SOT23-5 lead frame,
The overall structure of SOT23-6 lead frame is identical as the overall structure of SOT23-3 lead frame in embodiment 1, and difference is to draw
The setting of foot is different；In addition, whole frame units are not shown in figure in order to avoid Fig. 2 is excessively complicated), it, can by Fig. 1 and Fig. 2
Intuitively to find out that the SOT23-3 lead frame in the present embodiment (also includes the SOT23-5 lead in the embodiment of the present invention 2,3
Frame, SOT23-6 lead frame) in frame unit (also referred to as installation unit) area density be higher than existing SOT23-3
The area density of lead frame (also including existing SOT23-5 lead frame, SOT23-6 lead frame) is (in unit area
Frame unit quantity).
Fig. 2-1 is the partial enlarged view of Fig. 2, and what is amplified is the part that the dashed circle in Fig. 2 is drawn a circle to approve；Fig. 3 is
The structural schematic diagram of frame unit in the embodiment of the present invention 1.As shown in Fig. 2, Fig. 2-1 and Fig. 3, a kind of SOT23-X lead frame
Frame, including frame body 1 and frame unit 2, frame body 1 by equidistantly distributed in frame and frame criss-cross company's muscle group
At.Frame body 1 is equipped with the frame unit 2 of arrangement in length and breadth, equidistantly distributed.It is set between transversely attached two rows of frame units 2
It sets a transverse direction and connects muscle 3, the plastic packaging material injection molding channel 5 of one article of longitudinal direction is set between the n-th column and (n+1) column frame unit, the
(n+1) one article of longitudinal direction of setting connects muscle 4 between column and (n+2) column frame unit 2, and n is the odd number of 1≤n≤47, and last is arranged
Frame unit 2 is (n+1) column frame unit 2.Frame unit 2 by bonding die base island 27 and be distributed in 27 two sides of bonding die base island, with
Laterally connect connected six pins 21,22,23,24,25,26 of muscle 3 to form, wherein it is set to false as pin there are three pin, that is,
Pin 21,23,25 is that false pin, the other three pin, that is, pin 22,24,26 are actual use pin.False pin 21,23,
25 is tangent (dotted line frame in Fig. 3 is plastic packaging plastic-sealed body boundary after molding) close to one end of plastic-sealed body and plastic-sealed body boundary.
As a preferred scheme of the present embodiment, frame body 1 is equipped with the frame list of 10 row, 48 column equidistantly distributed
Member 2, the length of frame body 1 are 228 ± 0.102mm, and width is 53 ± 0.05mm, and the area density of frame unit reaches
0.0397mm-2, longitudinally connecting muscle 4 is the double muscle structures of hollow out.The medium design that longitudinal direction connects muscle 4 is hollow out, forms and is equivalent to double muscle
The effect of support improves the support force needed for increasing due to number of rows, it is therefore prevented that the warpage that may cause in transmission process, and
Reduce the consuming of frame material.Further, four angles on bonding die base island 27 are set as circular arc chamfering, corresponding with circular arc chamfering
Pin 24,26 (refer to the pin of actual use, do not include false pin, in addition, pin 22 is directly connected to bonding die base island 27
Pin is not belonging to pin corresponding with circular arc chamfering) inner end be arranged to clubfoot shape.The present embodiment is by the circle on bonding die base island 27
The advantages of design of the clubfoot of arc chamfering and pin 24,26 combines, this design is: corresponding pin and plastic packaging material can be improved in one
The binding force of material improves stability and reliability；Secondly under the premise of keeping plastic-sealed body size and constant pin outer end pin pitch,
The area of bonding die Ji Dao can be made to increase as much as possible, to improve the dissipated power of electronic device.
Embodiment 2
It is SOT23-5 lead frame involved in embodiment 2, with SOT23-3 lead frame phase involved in embodiment 1
Than the overall structure of the two is identical, the difference is that the pin setting in embodiment 2 is different from drawing in embodiment 1
Foot setting.
As shown in figure 4, the frame unit 6 in SOT23-5 lead frame by bonding die base island 67 and is distributed in bonding die base island 67
Two sides connect the composition of pin 61,62,63,64,65,66 that muscle 3 is connected with transverse direction, wherein pin 65 is set to false as pin, in addition
Five pins are the pin of actual use.The one end and the tangent (dotted line in Fig. 4 in plastic-sealed body boundary of false pin 65 close to plastic-sealed body
Frame is plastic packaging plastic-sealed body boundary after molding).
Embodiment 3
It is SOT23-6 lead frame involved in embodiment 3, with SOT23-3 lead frame phase involved in embodiment 1
Than the overall structure of the two is identical, the difference is that the pin setting in embodiment 2 is different from drawing in embodiment 1
Foot setting.
As shown in figure 5, the frame unit 7 in SOT23-6 lead frame by bonding die base island 77 and is distributed in bonding die base island 77
Two sides connect the composition of pin 71,72,73,74,75,76 that muscle 3 is connected with transverse direction, and six pins are the pin of actual use.
More than, structure feature of the invention is described in more detail by three embodiments.It needs to be emphasized that
SOT23-3 lead frame and SOT23-5 lead frame in the present invention are provided with six pins in form, certainly, the former
It is false pin there are three pin, it is false pin that the latter, which has a pin,.As shown in fig. 7, SOT23-X lead frame of the present invention is benefited
In the design of false pin, so that X is respectively equal to plastic-sealed body (the dotted line side in figure of three kinds of frame units corresponding when 3,5,6
Frame expression plastic-sealed body boundary) external structure be consistent, this is allowed for used in the plastic packaging equipment of above-mentioned three kinds of frame units
Plastic package die 8 be it is compatible, this external structure it is consistent, but also molding/separation mold of above-mentioned three kinds of frame units
It is also compatible.It is different from SOT23-X lead frame of the present invention, as shown in fig. 6, existing SOT23-X lead frame is due to frame
The external structure of the plastic-sealed body of frame unit is different, needs three kinds of different plastic package dies --- and plastic package die 9 is (with SOT23-3
It is corresponding), plastic package die 10 (corresponding with SOT23-5), plastic package die 11 (corresponding with SOT23-6) --- progress plastic packaging.Due to this
Three kinds of plastic package dies cannot be compatible with, therefore be unfavorable for the plastic packaging equipment scheduling of production line, cause plastic packaging equipment input cost high, production
Low efficiency.Similarly, existing SOT23-X lead frame needs 3 kinds of different moldings/separation molds, and three kinds of molding/separation
Mold be also it is incompatible, so as to cause the high cost and poor efficiency of production.
It should also be noted that drawing with the existing SOT23-X (X=3,5 or 6, the same below) for being provided only with 240 frame units
Wire frame is compared, and the present invention improves frame unit density on the whole, reduces the consuming of frame material.Due to frame unit
Area density is high, and for SOT23-X lead frame of the present invention in plastic packaging process, each furnace can produce 8 lead frames totally 3840
Frame unit, compared with 8 lead frames of each furnace production of existing SOT23-X lead frame totally 1920 frame units, often
The production quantity of one furnace improves 1 times, and under plastic packaging material injection time, curing time the same terms, production efficiency improves 1 times.
Hereinafter, being further described the packaging method in the present invention:
Firstly, going out lead frame as shown in Figures 2 to 5 according to lead frame drawing --- respectively correspond SOT23-
Then the lead frame of 3, SOT23-5 and SOT23-6, tri- kinds of encapsulating structures implements following step:
Step 1: electronic device chip is pasted on the bonding die base island 27 of frame unit 2 one by one by silver paste or insulating cement
Perhaps above above the bonding die base island 67 of the frame unit 6 or bonding die base island 77 of frame unit 7, whole frame units are viscous in face
Entire lead frame is solidified after complete, 175 ± 5 DEG C of solidification temperature, curing time ± 10 minutes 2 hours.
Step 2: by copper wire or alloy wire by the bonding die Ji Dao of the electrode welding on electronic device chip to frame unit
On pin.As shown in figure 3, the inner end of corresponding SOT23-3 packaging pin device, bonding die base island 27 and pin 24,26 is bonding wire
Region；Or as shown in figure 4, corresponding SOT23-5 packaging pin device, the inner end on bonding die base island 67 and pin 61,63,64,65
For bonding wire region；Or as shown in figure 5, corresponding SOT23-6 packaging pin device, bonding die base island 77 and pin 71,73,74,75,
76 be bonding wire region.
Step 3: plastic packaging being carried out to the high molecular material used for lead frame of above-mentioned bonding wire, also i.e. by step 3 to product
It is encapsulated with high molecule plastic.In plastic packaging, the pin package of X=3, false 21,23,25 one end of pin and plastic-sealed body side are corresponded to
Boundary is tangent, and the plastic packaging that end does not enter mold is intracavitary；Corresponding X=5 pin package, false 65 one end of pin and plastic-sealed body boundary phase
It cuts, the plastic packaging that end does not enter mold is intracavitary；Corresponding X=6 pin package, whole pin ends enter the plastic packaging chamber of mold
It is interior.
Step 4: heat ageing, by after encapsulation product carry out heat ageing, 170 ± 5 DEG C of thermal aging temperature, thermal aging time
300 ± 10 minutes.
Step 5: removing flash, the extra plastic flash of spraying product after heat ageing.
Step 6: deoxidation is bright, and one layer of tin layers uniformly, fine and close are deposited on pin, has pin good solderable
Property and electric conductivity.
Step 7: molding separation carries out the electronic device product that entire row is formed after above-mentioned steps to form/separate, be allowed to
Form single electronic device.In separation, correspondence X=3 pin package, whole pins connect one end that muscle 3 is connected with transverse direction and are cut
It is disconnected, wherein the other end of false pin 21,23 and 25 is due to tangent with plastic-sealed body boundary and do not enter inside plastic-sealed body, even if phase
Cutting position has plastic flash to connect it with plastic-sealed body, also it can be made to fall off as waste material under the action of power is bended in molding,
Remaining practical pin is stamped molding under the action of power is bended in molding；Corresponding X=5 pin package, whole pins connect muscle 3 with lateral
Connected one end is cut off, and false pin 65 falls off under acting on above-mentioned principle as waste material, remaining pin is stamped molding；It is corresponding
X=6 pin package, whole pins are stamped molding.
Step 8: the product after separation test and separate qualified product stepping and waster by inner quality standard, and will
Shelves printing, braid, packaging are shared, electronic component is become.It is formed with the highdensity SOT23-X lead-frame packages of the present invention
Electronic component, can be crystal two, triode, mosfet (Metal-Oxide Semiconductor field effect transistor), and pressure stabilizing integrates
Circuit, power management integrated circuit and other special function integrated circuits etc..
Claims (9)
1. a kind of SOT23-X lead frame, including frame body and frame unit, frame body is by equidistantly distributed in frame and frame
Criss-cross company's muscle composition, frame body is equipped with the frame unit of arrangement in length and breadth, equidistantly distributed, it is characterised in that: horizontal
Connect muscle to a transverse direction is arranged between connected two rows of frame units, is arranged one article between the n-th column and (n+1) column frame unit
Longitudinal plastic packaging material injection molding channel, one article of longitudinal direction of setting connects muscle between (n+1) column and (n+2) column frame unit, and n is surprise
Number, and 1≤n≤47；Each frame unit is by bonding die Ji Dao and is distributed in the two sides bonding die Ji Dao, draws with laterally connect that muscle is connected
Foot composition is SOT23-3 lead frame when X=3, and there are three be false pin in six pins of setting；When X=5, it is
SOT23-5 lead frame, having one in six pins of setting is false pin；When X=6, it is SOT23-6 lead frame, does not have
False pin is set, and six pins of setting are actual use pin.
2. SOT23-X lead frame as described in claim 1, it is characterised in that: frame body is equipped with 10 rows 48 and arranges equidistantly
The frame unit of distribution.
3. SOT23-X lead frame as claimed in claim 2, it is characterised in that: the length of the frame body be 228 ±
0.102mm, width are 53 ± 0.05mm, and the area density of frame unit reaches 0.0397mm-2。
4. SOT23-X lead frame as described in claim 1, it is characterised in that: it is the double muscle structures of hollow out that the longitudinal direction, which connects muscle,.
5. such as the described in any item SOT23-X lead frames of Claims 1-4, it is characterised in that: four of the bonding die Ji Dao
Angle is circular arc chamfering.
6. SOT23-X lead frame as claimed in claim 4, it is characterised in that: the circle of bonding die Ji Dao in the frame unit
Pin corresponding to arc chamfering is bent angle shape.
7. a kind of SOT23-X lead-frame packages method, which comprises the following steps:
Step 1: chip being bonded on the bonding die Ji Dao of frame unit by silver paste or insulating cement, after whole frame units have glued
Solidified, solidification temperature is 175 ± 5 DEG C, and curing time is ± ten minutes 2 hours；
Step 2: welding lead welds the aluminium electrode of chip with the corresponding pin of frame unit with lead；
Step 3: plastic packaging, by being encapsulated to product with high molecule plastic for step 2；
Step 4: the product after encapsulation is carried out heat ageing by heat ageing, and thermal aging temperature is 170 ± 5 DEG C, and thermal aging time is
300 ± 10 minutes；
Step 5: removing flash, the extra plastic flash of spraying product after heat ageing；
Step 6: deoxidation is bright, and upper one layer tin layers uniformly, fine and close are deposited on pin, make it have good solderability and
Electric conductivity.
Step 7: molding/separation carries out the electronic device product that entire row is formed after above-mentioned steps to form/separate, is allowed to shape
At single electronic device.
Step 8: the product after separation test and qualified product stepping and waster are separated by inner quality standard, and will be shared
Shelves printing, braid, packaging.
8. the packaging method of SOT23-X lead frame as claimed in claim 7, it is characterised in that: in implementation steps 3, if
The false pin one end set and plastic-sealed body boundary are tangent, and the plastic packaging that end does not enter mold is intracavitary, so that for X=3,5 or 6 three kind
Lead frame, plastic package die used in plastic packaging equipment is compatible.
9. the packaging method of SOT23-X lead frame as claimed in claim 7, it is characterised in that: in implementation steps 7, if
The false pin set is removed under the action of bending forming force, so that for X=3,5 or 6 three kind of lead frame, molding/separation
Molding used in equipment/separation mold is compatible.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811317871.0A CN109256368B (en) | 2018-11-07 | 2018-11-07 | SOT23-X lead frame and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811317871.0A CN109256368B (en) | 2018-11-07 | 2018-11-07 | SOT23-X lead frame and packaging method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111180397A (en) * | 2020-01-03 | 2020-05-19 | 深圳市奥伦德元器件有限公司 | Preparation process of photoelectric coupler compatible with different pin positions |
| CN112820709A (en) * | 2019-11-15 | 2021-05-18 | 无锡华润安盛科技有限公司 | Lead frame, plastic package mold and package structure |
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| CN105789169A (en) * | 2016-05-19 | 2016-07-20 | 中国电子科技集团公司第五十八研究所 | Lead frame structure for lead packaging |
| CN208014690U (en) * | 2017-12-01 | 2018-10-26 | 泰州友润电子科技股份有限公司 | A kind of improved 220FW-2L lead frames easy to process |
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| CN112820709B (en) * | 2019-11-15 | 2024-03-22 | 无锡华润安盛科技有限公司 | Lead frame, plastic package mold and package structure |
| CN111180397A (en) * | 2020-01-03 | 2020-05-19 | 深圳市奥伦德元器件有限公司 | Preparation process of photoelectric coupler compatible with different pin positions |
| CN111180397B (en) * | 2020-01-03 | 2021-11-05 | 深圳市奥伦德元器件有限公司 | Preparation process of photoelectric coupler compatible with different pin positions |
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