CN213635963U

CN213635963U - Integrated circuit package

Info

Publication number: CN213635963U
Application number: CN202022326287.0U
Authority: CN
Inventors: 李志林
Original assignee: Core Semiconductor Technology Shenzhen Co ltd
Current assignee: Core Semiconductor Technology Shenzhen Co ltd
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2021-07-06
Anticipated expiration: 2030-10-19

Abstract

The utility model discloses an integrated circuit packaging body, comprises a lower box body, the first fixed plate of the equal fixedly connected with of two inside walls of box body down, bottom fixedly connected with fixing base in the box body down, fixing base both ends lateral wall all with two first fixed plate lower extreme fixed connection, the mounting groove has been seted up to fixing base upper end fixed, the inside fixed integrated circuit chip that is provided with of mounting groove, the fixing base up end is provided with a plurality of interior pins at the fixed mounting groove both sides, a plurality of interior pins are all through fixing bolt and fixing base fixed connection, box body lateral wall under a plurality of interior pins all run through, the outer pin of the equal fixedly connected with of one end that box body lateral wall stretches out under a plurality of interior pins run through. The utility model discloses an integrated circuit packaging body can prevent that the component from shaking, improves the chip and shocks resistance, anti-vibration ability, and the life of extension component can improve the radiating effect, and this utility model is rational in infrastructure, convenient to use.

Description

Integrated circuit package

Technical Field

The utility model relates to a circuit packaging body field especially relates to an integrated circuit packaging body.

Background

The integrated circuit package is advanced along with the development of the integrated circuit, and along with the continuous development of various industries such as aerospace, aviation, machinery, light industry, chemical industry and the like, the whole machine is changed towards multifunction and miniaturization, so that the integrated circuit is required to have higher and higher integration level and more complex functions.

The existing integrated circuit packaging body has some defects, for example, the integrated circuit packaging body is not provided with a heat dissipation device, the heat dissipation effect is poor, the circuit packaging body has a complex structure, the packaging is inconvenient, a fixing device is not arranged, the integrated circuit chip is not firmly fixed, the impact resistance and the vibration resistance are weak, and the service life of the chip is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a shortcoming in order to solve exist among the prior art, and the integrated circuit packaging body that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme: an integrated circuit package comprises a lower box body, wherein two inner side walls of the lower box body are fixedly connected with a first fixing plate, the bottom in the lower box body is fixedly connected with a fixed seat, the side walls at two ends of the fixed seat are fixedly connected with the lower ends of the two first fixed plates, the upper end of the fixed seat is fixedly provided with a mounting groove, an integrated circuit chip is fixedly arranged in the mounting groove, the upper end surface of the fixed seat is fixedly provided with a plurality of inner pins at two sides of the mounting groove, the inner pins are all fixedly connected with the fixed seat through fixing bolts, the inner pins penetrate through the side wall of the lower box body, the extending ends of the inner pins penetrating through the side wall of the lower box body are fixedly connected with the outer pins, the upper box body is fixedly arranged on the upper portion of the lower box body, a second fixing plate is fixedly connected inside the upper box body, and a heat dissipation layer is fixedly arranged between the upper end face of the second fixing plate and the upper inner wall of the upper box body.

As a further description of the above technical solution:

twelve inner pins are arranged on two sides of the upper end face of the fixed seat.

As a further description of the above technical solution:

the upper ends of the fixing bolts are fixedly connected with copper head contacts, and the copper head contacts are connected with an internal circuit and an external circuit.

As a further description of the above technical solution:

the inner pins are connected through connecting wires.

As a further description of the above technical solution:

a plurality of heat dissipation holes are fixedly formed in the top of the upper box body.

As a further description of the above technical solution:

the same lateral wall of box body all is provided with semicircular groove down with last box body.

As a further description of the above technical solution:

two draw-in grooves have all been fixed to lower box body both sides wall upper end and have been seted up, it is all fixed two buckles that are provided with to go up box body both sides wall bottom, four buckles and the equal fixed joint of four draw-in grooves.

The utility model discloses following beneficial effect has:

the utility model provides an integrated circuit packaging body, this utility model is rational in infrastructure, high durability and convenient use, be provided with heat dissipation layer and louvre in the packaging body, the radiating effect has been improved, it is longer to make packaging body live time, it is ageing-resistant more, the setting up of mounting groove makes the integrated circuit chip card crouch inside the mounting groove, integrated circuit chip is fixed more firmly, fixed plate in the box body and the fixed plate of lower box lateral wall in the cooperation, further fixed to integrated circuit chip, it is more firm to make fixed effect, can prevent that the component from shaking, improve the chip and shock resistance, anti-vibration ability, the life of extension element, fixing bolt is more convenient to the fixed of pin, also do benefit to the pin and change, a plurality of copper head contacts electric conductive property is good, be used for connecting inner circuit and outer circuit.

Drawings

Fig. 1 is an internal structural view of an integrated circuit package according to the present invention;

fig. 2 is a top view of an integrated circuit package according to the present invention;

fig. 3 is a top view of a lower case of an ic package according to the present invention;

fig. 4 is a side view of an integrated circuit package according to the present invention;

fig. 5 is a diagram illustrating a structure of a clip of an ic package according to the present invention.

Illustration of the drawings:

1. a lower box body; 2. a first fixing plate; 3. an upper box body; 4. a heat dissipation layer; 5. a second fixing plate; 6. An integrated circuit chip; 7. fixing the bolt; 8. an inner pin; 9. a semicircular groove; 10. a fixed seat; 11. An outer pin; 12. heat dissipation holes; 13. mounting grooves; 14. a connecting wire; 15. a card slot; 16. buckling; 17. And a copper head contact.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-5, the present invention provides an embodiment: the utility model provides an integrated circuit packaging body, including box body 1 down, the equal fixedly connected with first fixed plate 2 of two inside walls of box body 1 down, bottom fixedly connected with fixing base 10 in box body 1 down, fixing base 10 both ends lateral wall all with 2 lower extreme fixed connection of two first fixed plates, fixing base 10 upper end is fixed and has been seted up mounting groove 13, the inside fixed integrated circuit chip 6 that is provided with of mounting groove 13, fixing base 10 up end is fixed on mounting groove 13 both sides and is provided with a plurality of interior pins 8, a plurality of interior pins 8 all pass through fixing bolt 7 and fixing base 10 fixed connection, a plurality of interior pins 8 all run through box body 1 lateral wall down, the equal fixedly connected with outer pin 11 of one end that a plurality of interior pins 8 run through box body 1 lateral wall down stretches out, 1 fixed portion of box body is provided with box body 3 down, the inside fixedly connected with second fixed plate 5 of last box body 3, the fixed heat dissipation layer 4 that is provided with between the.

The interior pin 8 of fixing base 10 up end both sides is provided with twelve altogether, the equal fixedly connected with copper head contact 17 in the upper end of a plurality of fixing bolt 7, circuit and outer circuit in the copper head contact 17 is connected, connect through connecting wire 14 between a plurality of interior pins 8, go up the fixed a plurality of louvres 12 of having seted up in 3 tops of box body, box body 1 all is provided with semicircular groove 9 with the same lateral wall of last box body 3 down, two draw-in grooves 15 have all been fixed to the equal fixed two buckle of having seted up in 1 both sides wall upper end of box body down, it is provided with two buckles 16 to go up the equal fixed joint in 3 both sides wall bottom of box body, four buckles 16 and.

The working principle is as follows: the inside heat dissipation layer 4 that sets up of last box body 3 of integrated circuit packaging body, louvre 12 is seted up at the top, the radiating effect has been improved, it is longer to make the packaging body live time, it is ageing-resistant more, set up mounting groove 13 on fixing base 10, fix integrated circuit chip 6 and place, first fixed plate 2 and the setting of second fixed plate 5 are further fixed integrated circuit chip 6, prevent electronic component vibrations, the improvement chip shocks resistance, anti-vibration ability, the life of extension component, in use, connect inside integrated circuit chip 6 through copper head contact 17 and connecting wire 14, be connected with external electrical components through interior pin 8 and outer pin 11, buckle 16 of going up 3 lateral walls lower extremes of box body and the 15 looks joints of draw-in groove of 1 lateral wall of lower box body, it is inseparable to make the packaging body combine, become an organic whole.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. An integrated circuit package comprising a lower case (1), characterized in that: the inner side walls of the two inner side walls of the lower box body (1) are fixedly connected with first fixing plates (2), the bottom of the lower box body (1) is fixedly connected with a fixing seat (10), the side walls of the two ends of the fixing seat (10) are fixedly connected with the lower ends of the two first fixing plates (2), the upper end of the fixing seat (10) is fixedly provided with a mounting groove (13), an integrated circuit chip (6) is fixedly arranged in the mounting groove (13), the upper end surface of the fixing seat (10) is fixedly provided with a plurality of inner pins (8) at the two sides of the mounting groove (13), the inner pins (8) are fixedly connected with the fixing seat (10) through fixing bolts (7), the inner pins (8) penetrate through the side wall of the lower box body (1), the outer pins (11) are fixedly connected with the end, extending out of the side wall of the lower box body (1), the upper part of the lower box body (1) is fixedly provided with, go up box body (3) inside fixedly connected with second fixed plate (5), fixed heat dissipation layer (4) that are provided with between second fixed plate (5) up end and last box body (3) upper inner wall.

2. The integrated circuit package of claim 1, wherein: twelve inner pins (8) on two sides of the upper end face of the fixed seat (10) are arranged.

3. The integrated circuit package of claim 1, wherein: the upper ends of the fixing bolts (7) are fixedly connected with copper head contacts (17), and the copper head contacts (17) are connected with an internal circuit and an external circuit.

4. The integrated circuit package of claim 1, wherein: the inner pins (8) are connected through connecting wires (14).

5. The integrated circuit package of claim 1, wherein: the top of the upper box body (3) is fixedly provided with a plurality of heat dissipation holes (12).

6. The integrated circuit package of claim 1, wherein: the same side wall of the lower box body (1) and the same side wall of the upper box body (3) are both provided with semicircular grooves (9).

7. The integrated circuit package of claim 1, wherein: two draw-in grooves (15) have all been fixed to box body (1) both sides wall upper end down, it is provided with two buckle (16) all to go up box body (3) both sides wall bottom, four buckle (16) and four equal fixed joint of draw-in groove (15).