CN2494034Y - Means for testing semiconductor package element - Google Patents
Means for testing semiconductor package element Download PDFInfo
- Publication number
- CN2494034Y CN2494034Y CN 01233050 CN01233050U CN2494034Y CN 2494034 Y CN2494034 Y CN 2494034Y CN 01233050 CN01233050 CN 01233050 CN 01233050 U CN01233050 U CN 01233050U CN 2494034 Y CN2494034 Y CN 2494034Y
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- CN
- China
- Prior art keywords
- needle plate
- needle
- pin hole
- tool
- flexible member
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- Expired - Fee Related
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Abstract
A utensil for testing packaging components of a semiconductor has a needle board device which is provided with a plurality of needle holes corresponding to a plurality of target measuring points of the semiconductor packaging components. A groove is formed on a face of the needle board device to match the size of the semiconductor packaging components and a plurality of elastic elements are arranged inside the needle holes of the needle board device. Each needle body of the most needle bodies is provided with a first endpoint which is inserted into needle holes through the needle board and contacted with the elastic elements, and a second endpoint which is exposed through the needle hole and contacted with the target measuring points of the semiconductor packaging components. A plurality of conductive elements are provided with an upper endpoint which is contacted with the elastic elements of the needle holes of the needle board device and a lower endpoint which is exposed from the needle hole and connected to a testing machine. The device has functions of easy manufacture and reducing test cost.
Description
Technical field
The utility model is a kind of tool that is used for the measuring semiconductor potted element, is meant especially a kind ofly can heavily cover the measurement jig that uses and can simple and easy maintenance, and testing cost is significantly reduced.
Background technology
General semiconductor element must be tested its electrical or function after encapsulation (package) is finished, the defective products that all factors caused in the encapsulation process is screened.
Consulting semiconductor encapsulated element test mode shown in Figure 1, traditional, is that semiconductor encapsulated element 10 is put in the measurement jig 12, carries out test jobs.Measurement jig 12 includes a pedestal 14 and most probes 16, and pedestal 14 is formed with the groove 18 of a conjunction with semiconductors potted element 10 sizes, lives semiconductor encapsulated element 10 in order to ccontaining and location.Each probe 16 is that tested point 20 fixed-site according to semiconductor encapsulated element 10 are in base 14, the one end protrudes from the groove 18, in order to contact with the tested point 20 of semiconductor encapsulated element 10, the other end protrudes from base 14 outsides, in order to plant in the default perforation 24 of a printed circuit board (PCB) 22, to test signal by printed circuit board (PCB) 22 again and be passed on the test machine (figure shows), with the electrical or function of measuring semiconductor potted element I0.Because semiconductor encapsulated element 10 is directly to compress with probe 16 to contact, therefore, for the tested point 20 that does not undermine semiconductor encapsulated element 10, probe 16 must be arranged to have elastic effect, to increase the cushion effect of 16 of semiconductor encapsulated element 10 and probes.Consult shown in Figure 2, for the amplification view probe 16 of probe 16 includes urceolus 26, a flexible member 28 is to be arranged in the urceolus 26 and needle bodies 30 are to plant in the urceolus 26, and press against flexible member 28,10 of probe 16 and semiconductor encapsulated elements have buffering effect, can avoid undermining the tested point 20 of semiconductor package part 10.Above-mentioned traditional test tool has following shortcoming:
1, probe 16 complex structures, when adopting trickleer probe, its manufacturing cost is quite high.
2, probe 16 is on the solid lock base 14, when wherein a probe 16 damages, can't substitute, and must be with whole tool subscription rate.
3, when kind, the model difference of semiconductor encapsulated element 10, so that its tested point 20 positions are not simultaneously, and this tool can't use, and must give subscription rate, and probe 16 can't reclaim use, cause the waste and the environmental issue of resource.
Summary of the invention
At above-mentioned defective, the inventor develops the tool that the utility model is used for the measuring semiconductor potted element, and it can solve the aforesaid drawbacks.
Main purpose of the present utility model provides a kind of tool that is used for the measuring semiconductor potted element, overcomes the drawback of prior art, reaches to make purpose easy and the reduction testing cost.
Second purpose of the present utility model provides a kind of tool that is used for the measuring semiconductor potted element, and it has the reusable effect of recovery, reaches the purpose of saving resource.
The 3rd purpose of the present utility model provides a kind of tool that is used for the measuring semiconductor potted element, and it has the effect of being convenient to keep in repair and change probe, reaches the purpose that reduces measurement jig expenditure cost.
The 4th purpose of the present utility model provides a kind of tool that is used for the measuring semiconductor potted element, and its probe cost is quite cheap, reaches the cheap purpose of tool expense.
The purpose of this utility model is achieved in that a kind of tool that is used for the measuring semiconductor potted element, it is characterized in that: the needle plate device is provided with most the pin holes corresponding to most tested point positions of semiconductor encapsulated element, and one end is formed with the groove of conjunction with semiconductors potted element size; A most flexible member are arranged at respectively in the pin hole of this needle plate device; Each needle body of a most needle body is provided with first end points and second end points, and this first end points is to be inserted in the pin hole by this needle plate, contacts with this flexible member, and this second end points is exposed by this pin hole, contacts with the tested point of this semiconductor encapsulated element; Most conducting elements are provided with upper extreme point and lower extreme point, and the interior flexible member of this upper extreme point and the pin hole of this needle plate contacts, and this lower extreme point is exposed by this pin hole and is connected to test machine.
This needle plate device includes needle plate, middle needle plate reaches needle plate down, and needle plate is provided with pin hole on this, and needle plate is provided with middle pin hole in this, and this time needle plate is provided with lower pinhole, and this flexible member is arranged in this pin hole, and this groove is to be formed on the needle plate.Should go up between needle plate and middle needle plate and in needle plate and be provided with the retaining element of fixing needle body and conducting element between needle plate down, this retaining element is the soft board that can be pierced through by this needle body and conducting element, this needle body and conducting element are clamped.This needle plate device include needle plate and in needle plate, needle plate is provided with pin hole this on, needle plate is provided with middle pin hole in this, the upper extreme point of this conducting element wears that the middle pin hole of needle plate in this is interior to be contacted with this flexible member.This groove is to be formed on this on needle plate.The upper extreme point of this conducting element is formed with the room of ccontaining flexible member.Should go up between needle plate and middle needle plate and be provided with in order to fix the retaining element of this needle body.This retaining element is for being pierced through by needle body and the soft board of this needle body that is clamped.This needle plate device is provided with the pin hole of most latticed criss-cross arrangements, and one end is formed with the groove of a conjunction with semiconductors potted element size, and semiconductor encapsulated element is positioned in this groove.The lower extreme point of this conducting element is inserted in the default perforation of a printed circuit board (PCB), is connected with this test machine.One end of this flexible member is provided with the dragging to portion in order to this needle body of correcting of internal diameter convergent.
Second end points of this needle body can contact with the tested point of semiconductor encapsulated element, and will test signal and be passed to printed circuit board (PCB) by conducting element and again signal is passed to test machine.
Further specify below in conjunction with preferred embodiment and accompanying drawing.
Description of drawings
Fig. 1 is the cross-sectional schematic of traditional test tool.
Fig. 2 is the enlarged diagram of the probe of Fig. 1.
Fig. 3 is a decomposing schematic representation of the present utility model.
Fig. 4 is a combination cross-sectional schematic of the present utility model.
Fig. 5 is a user mode schematic diagram of the present utility model.
Fig. 6 is another user mode schematic diagram of the present utility model.
Fig. 7 is the enlarged diagram of conducting element of the present utility model.
Embodiment
Consult Fig. 3-Fig. 4, the utility model includes a needle plate device 31, most flexible members 32, most needle bodies 34, a majority conducting element 36 and retaining elements 40 in order to the tool of measuring semiconductor potted element.
In the present embodiment, needle plate device 31 includes needle plate 42 on, middle needle plate 44 reaches needle plate 46, last needle plate 42 is provided with the last pin hole 48 of latticed criss-cross arrangement, middle needle plate 44 is provided with the middle pin hole 50 of latticed criss-cross arrangement, following needle plate 46 is provided with the lower pinhole 52 of latticed criss-cross arrangement, and last pin hole 48 in the aperture of middle pin hole 50 and lower pinhole 52 are bigger.
Certainly, needle plate device 31 might not need to be set as the pin hole of latticed criss-cross arrangement, only needs to be set as perforation in the tested point position with respect to semiconductor encapsulated element and gets final product (not shown).
A most flexible member 32, be in the middle pin hole 50 of needle plate 44 in being arranged at respectively,, flexible member 32 can be fixed in the middle pin hole 50 of middle needle plate 44 by last needle plate 42 and the clamping of needle plate 46 down, and having an elastic recovery effect, the one end is provided with dragging to portion 33 that an internal diameter dwindles.
A most conducting element 36, be to be respectively equipped with upper extreme point 58 and lower extreme point 60, upper extreme point 58 is by in the pin hole 50 during needle plate 46 insertion lower pinholes 52 reach down, contacts with flexible member 32, lower extreme point 60 is exposed by lower pinhole 52, is passed to test machine (figure does not show) in order to will test signal.
Retaining element 40 is a soft board, its be arranged at respectively needle plate 42 and middle needle plate 44 and in 46 of needle plate 44 and following needle plates, can be pierced through by needle body 34 and conducting element 36, with needle body 34 and conducting element 36 clampings location, the plasticity by soft board 40 can make needle body 34 and conducting element telescopic moving about in the of 36.
Consult Fig. 4, the pin hole of needle plate device 31 is the tested point position settings with respect to semiconductor encapsulated element, and flexible member 32, needle body 34 and conducting element 36 are in the middle pin hole 50 of needle plate 44 in being arranged at respectively, needle body 34 and conducting element 36 pierce through retaining element 40 respectively, fix by retaining element 40, and contact with flexible member 34.
Consult Fig. 5, when the utility model is implemented, it is the semiconductor encapsulated element 66 that has most tested points 64 in order to test, flexible member 32 is to be arranged in the middle pin hole 50 of middle needle plate 44 of tested point 64 positions of corresponding semiconductor encapsulated element 66, first end points 54 of needle body 34 is to be inserted in the middle pin hole 50 that is provided with flexible member 32, contact with flexible member 32, second end points 56 is exposed by the last pin hole 48 of last needle plate 42, in order to contact with the tested point 64 of semiconductor encapsulated element 66, it also can pierce through retaining element 40, makes needle body 34 effectively be fixed the element location firmly.
The upper extreme point 58 of conducting element 36 is by in the pin hole 50 during needle plate 46 insertion lower pinholes 52 reach down, contact with flexible member 32, lower extreme point 60 is exposed by lower pinhole 52, in order to be electrically connected and to be fixed in the default perforation 70 of printed circuit board (PCB) 68, be passed to printed circuit board (PCB) 68 will test signal, will test signal again and be passed on the test machine (figure does not show).
Consult Fig. 6, another user mode embodiment of the present utility model, wherein needle plate 31 only includes on one needle plate 44 in the needle plate 42 and, last needle plate 42 is provided with the last pin hole 48 of latticed criss-cross arrangement, middle needle plate 44 also is provided with the middle pin hole 52 of latticed criss-cross arrangement, flexible member 32 is to be arranged in the middle pin hole 50 of middle needle plate 44 of tested point 64 positions of relative semiconductor encapsulated element 66, retaining element 40 is to be arranged at 44 of needle plate 42 and middle needle plates, first end points 54 of needle body 34 is to be inserted in the middle pin hole 50 that is provided with flexible member 32, contact with flexible member 32, second end points 56 is exposed by the last pin hole 48 of last needle plate 42, and be positioned at needle plate 42 formed grooves 38, in order to contact with the tested point 64 of semiconductor encapsulated element 66, it also can pierce through retaining element 40, and needle body 34 is effectively lived the location.
Consult Fig. 7, enlarged drawing for conducting element 36 of the present utility model, the upper extreme point 58 of conducting element 36 is by in the pin hole 50 in middle needle plate 44 insertions, and be fixed on the middle needle plate 44, it is provided with room 72, uses so that flexible member 32 is positioned at the room 72 of conducting element 36, the lower extreme point 60 of conducting element 36 exposes middle pin hole 50, in order to be fixed in the default perforation 70 of printed circuit board (PCB) 68, will test signal and be passed to printed circuit board (PCB) 68, will test signal again and be passed on the test machine (scheming demonstration).
Above-mentioned tectonic association the utlity model has following advantage:
1, the utility model separates setting with flexible member 32 with needle body 34, but not is coated in the sleeve, thereby it makes when quite tiny, and its cost is also quite cheap.
2, when needle body in the tool 34 damages.Can directly substitute needle body 34, and needn't the whole tool of subscription rate.
3, after the semiconductor encapsulated element test of same model specification is finished, can readjust needle body 34 positions, tool can be reused.
4, go up needle plate 42 and directly be provided with the groove 38 that matches with semiconductor encapsulated element 66 sizes, can make suitable precision, when making semiconductor encapsulated element 66 insert in the groove 38, most tested points 64 can critically contact with needle body 34 on it.
Take a broad view of above explanation, the utility model is used for the tool of semiconductor encapsulated element test, really can reach its practical novel purpose and effect, and have novelty and creativeness.
Claims (10)
1, a kind of tool that is used for the measuring semiconductor potted element is characterized in that: the needle plate device is provided with most the pin holes corresponding to most tested point positions of semiconductor encapsulated element, and one end is formed with the groove of conjunction with semiconductors potted element size; A most flexible member are arranged at respectively in the pin hole of this needle plate device; Each needle body of a most needle body is provided with first end points and second end points, and this first end points is to be inserted in the pin hole by this needle plate, contacts with this flexible member, and this second end points is exposed by this pin hole, contacts with the tested point of this semiconductor encapsulated element; Most conducting elements are provided with upper extreme point and lower extreme point, and the interior flexible member of this upper extreme point and the pin hole of this needle plate contacts, and this lower extreme point is exposed by this pin hole and is connected to test machine.
2, the tool that is used for the measuring semiconductor potted element according to claim 1, it is characterized in that: this needle plate device includes needle plate, middle needle plate reaches needle plate down, should go up needle plate and be provided with pin hole, should be provided with middle pin hole by middle needle plate, this time needle plate is provided with lower pinhole, this flexible member is arranged in this pin hole, and this groove is to be formed on the needle plate.
3, the tool that is used for the measuring semiconductor potted element according to claim 2, it is characterized in that: needle plate reaches down and is provided with the retaining element of fixing needle body and conducting element between needle plate in reaching between needle plate and middle needle plate on this, the soft board of this retaining element for being pierced through by this needle body and conducting element, this needle body and conducting element are clamped.
4, the tool that is used for the measuring semiconductor potted element according to claim 1, it is characterized in that: this needle plate device includes needle plate and middle needle plate, should go up needle plate and be provided with pin hole, should be provided with middle pin hole by middle needle plate, the upper extreme point of this conducting element wears in the middle pin hole of needle plate in this and contacts with this flexible member, and this groove is to be formed on this on needle plate.
5, the tool that is used for the measuring semiconductor potted element according to claim 1 is characterized in that: the upper extreme point of this conducting element is formed with the room of ccontaining flexible member.
6, the tool that is used for the measuring semiconductor potted element according to claim 4 is characterized in that: be provided with in order to fix the retaining element of this needle body between needle plate and middle needle plate on this.
7, the tool that is used for the measuring semiconductor potted element according to claim 6 is characterized in that: this retaining element is for being pierced through by needle body and the soft board of this needle body that is clamped.
8, the tool that is used for the measuring semiconductor potted element according to claim 1, it is characterized in that: this needle plate device is provided with the pin hole of most latticed criss-cross arrangements, one end is formed with the groove of a conjunction with semiconductors potted element size, and semiconductor encapsulated element is positioned in this groove.
9, the tool that is used for the measuring semiconductor potted element according to claim 1 is characterized in that: the lower extreme point of this conducting element is inserted in the default perforation of printed circuit board (PCB), is connected with this test machine.
10, the tool that is used for the measuring semiconductor potted element according to claim 1 is characterized in that: an end of this flexible member is provided with the dragging to portion in order to this needle body of correcting of internal diameter convergent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01233050 CN2494034Y (en) | 2001-08-13 | 2001-08-13 | Means for testing semiconductor package element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01233050 CN2494034Y (en) | 2001-08-13 | 2001-08-13 | Means for testing semiconductor package element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2494034Y true CN2494034Y (en) | 2002-05-29 |
Family
ID=33646974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01233050 Expired - Fee Related CN2494034Y (en) | 2001-08-13 | 2001-08-13 | Means for testing semiconductor package element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2494034Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957389B (en) * | 2009-07-13 | 2013-09-04 | 巧橡科技有限公司 | Test device and manufacturing method thereof |
| CN103472380A (en) * | 2013-09-17 | 2013-12-25 | 中国振华集团永光电子有限公司 | Burn-in device of ceramic surface mount type encapsulating semiconductor power element |
| CN101997257B (en) * | 2009-08-27 | 2014-03-26 | 希姆通信息技术（上海）有限公司 | Method for overhauling adapter of chip burner |
| CN107958862A (en) * | 2016-10-18 | 2018-04-24 | 台湾积体电路制造股份有限公司 | Semiconductor is with gauge, the gauge and method of the protective layer pin hole test of semiconductor |
| CN109950770A (en) * | 2017-12-20 | 2019-06-28 | 中航光电科技股份有限公司 | Contact pin welds auxiliary tool and contact pin component |
| CN110744513A (en) * | 2019-09-20 | 2020-02-04 | 深南电路股份有限公司 | Drill bit transfer assembly |
-
2001
- 2001-08-13 CN CN 01233050 patent/CN2494034Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101957389B (en) * | 2009-07-13 | 2013-09-04 | 巧橡科技有限公司 | Test device and manufacturing method thereof |
| CN101997257B (en) * | 2009-08-27 | 2014-03-26 | 希姆通信息技术（上海）有限公司 | Method for overhauling adapter of chip burner |
| CN103472380A (en) * | 2013-09-17 | 2013-12-25 | 中国振华集团永光电子有限公司 | Burn-in device of ceramic surface mount type encapsulating semiconductor power element |
| CN103472380B (en) * | 2013-09-17 | 2015-10-28 | 中国振华集团永光电子有限公司 | The ageing device of ceramic paster formula encapsulated semiconductor power device |
| CN107958862A (en) * | 2016-10-18 | 2018-04-24 | 台湾积体电路制造股份有限公司 | Semiconductor is with gauge, the gauge and method of the protective layer pin hole test of semiconductor |
| CN109950770A (en) * | 2017-12-20 | 2019-06-28 | 中航光电科技股份有限公司 | Contact pin welds auxiliary tool and contact pin component |
| CN109950770B (en) * | 2017-12-20 | 2020-12-04 | 中航光电科技股份有限公司 | Contact pin welding auxiliary tool and contact pin assembly |
| CN110744513A (en) * | 2019-09-20 | 2020-02-04 | 深南电路股份有限公司 | Drill bit transfer assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |