CN103785619B - Testing, sorting machine plug-in unit - Google Patents
Testing, sorting machine plug-in unit Download PDFInfo
- Publication number
- CN103785619B CN103785619B CN201310426373.0A CN201310426373A CN103785619B CN 103785619 B CN103785619 B CN 103785619B CN 201310426373 A CN201310426373 A CN 201310426373A CN 103785619 B CN103785619 B CN 103785619B
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- China
- Prior art keywords
- semiconductor element
- terminal
- jack
- open bore
- guide portion
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a kind of testing, sorting machine plug-in unit.The present invention disclose a kind of by the open bore in the support member being formed at plug-in unit or be formed on the guiding groove in anticreep projection formed have with the guide portion of the equal-sized radius of the terminal of semiconductor element and the technology of product reliability is improved in the position that accurately sets semiconductor element.
Description
Technical field
The present invention relates to a kind of can be used for loading the plug-in unit of the test panel of semiconductor element in testing, sorting machine.
Background technology
Testing, sorting machine be a kind of by the semiconductor element being manufactured by predetermined manufacturing process from client's disk（CUSTOMER
TRAY）Move to test panel（TEST TRAY）Afterwards, the semiconductor element for enabling to be loaded on test panel is tested simultaneously
Machine（TESTER）Test（TEST）And provide support, and according to test result, semiconductor element is carried out with grade separation and from survey
Examination disk moves to the device of client's disk, and it is disclosed in many open files.
Equipped with the plug-in unit for disposing semiconductor element on test panel, this is referred to korean patent application 10-2012-
No. 0089602（Denomination of invention：Testing, sorting machine plug-in unit, hereinafter referred to as prior art 1）Or korean patent application 10-
No. 2012-0107985（Denomination of invention：Testing, sorting machine plug-in unit, hereinafter referred to as prior art 2）Deng.
With reference first to prior art 1, the open bore being formed in support member will have the terminal institute energy of semiconductor element
The size being adequately inserted.Therefore, by the maximum allowance being sized to there is the terminal of semiconductor element of open bore, half
The maximum chi that tolerance between conductor element terminal and the tolerance between the socket of the termination contact of semiconductor element are added
Very little.For example if it is assumed that the terminal of semiconductor element has 0.23mm ± 0.05mm（Tolerance parts）The diameter of size, then its maximum
Diameter is 0.28mm.That is, again assume that the tolerance between the terminal of semiconductor element and the terminal with semiconductor element connect
Tolerance between tactile socket is ± 0.04mm, then open bore will have the diameter of 0.32mm size.That is, when all tolerances of consideration
When, only open bore has the diameter of 0.32mm size just can make the terminal of semiconductor element come in and go out without restriction open bore.
It is under the optimal conditionss of 0.00mm in all tolerances, as shown in figure 1, the terminal of semiconductor element is just being preferably placed at open bore
Central authorities.It may be noted that Fig. 1 is the figure observing semiconductor element from plug-in unit lower surface, wherein, why is represented with a chain-dotted line and partly lead
Volume elements part, be for the ease of open bore between differentiation, also schemed in the same manner in Fig. 7 to be illustrated later
Show.
And, also as shown in Fig. 2 under conditions of only reaching 0.32mm/2 in the radius of guiding groove in prior art 2
The terminal of semiconductor element just can be made to obtain the guide properly of guiding groove.
Generally, in the test of semiconductor element, most important sport technique segment is between semiconductor element and test machine socket
Electrical contact.Therefore, the position of semiconductor element terminal is accurately corresponding with the position of test machine socket, and this necessity with
The semiconductor element terminal sizes that the prosperity of technology brings to diminish and more and more urgent.
In addition, there being vertical testing, sorting machine in testing, sorting machine（Also referred to as side dock testing, sorting machine）And level
Formula testing, sorting machine（Also referred to as head dock testing, sorting machine）, wherein the former is in test panel vertically erectility
Under the conditions of complete the test of semiconductor element, and the latter completes quasiconductor under conditions of test panel in the horizontal direction erectility
The test of element.As shown in figure 3, making plug-in unit because test panel is vertically upright especially in vertical testing, sorting machine
And the semiconductor element being placed on plug-in unit tested, therefore as shown in figure 4, semiconductor element exists in the state of erecting
The position of lower side will be in the open bore of plug-in unit under Gravitative Loads, and there is also remaining space due on left and right directions,
Therefore may offset to one side.So in vertical testing, sorting machine insert design is with the lower end of semiconductor element as base
Standard will contact the position of the semiconductor element terminal on test machine socket to set.
Content of the invention
It is an object of the invention to provide a kind of make the open bore of plug-in unit or guiding groove have the end of guiding semiconductor element
Son is in the technology of the function of optimal location.
In order to reach purpose as above, included according to the testing, sorting machine plug-in unit of the present invention first form：Main body,
It is formed with the jack for inserting semiconductor element；Support member, supports from the side of described jack and inserts described jack
Semiconductor element；Fixed component, described support member is fixed on described main body；Locking devicen, for protecting semiconductor element
Hold in described jack, wherein, described support member is formed with for towards the open semiconductor element terminal in test machine direction
Open bore, so that the terminal of the semiconductor element being supported by described support member can be electrically connected to test pusher side, and institute
State the specific open bore of at least one of open bore to include：Amplification portion, has the song bigger than the terminal radius of semiconductor element
Rate radius；Guide portion, has the radius of curvature of the radius of curvature size different from described amplification portion, thus to semiconductor element
Terminal guides.
Preferably, the radius of curvature of described guide portion is less than the radius of curvature in described amplification portion.
Preferably, at least one specific open bore described is formed at when semiconductor element stands as vertical state and can make place
On the position of the terminal insertion of lower side.
Preferably, the radius of curvature of described guide portion is equal with the radius of semiconductor element terminal.
Preferably, described specific open bore also includes connecting the connecting portion of described amplification portion and described guide portion, and described
Connecting portion has when test panel stands as vertical state more to the form that downside width is narrower.
And, in order to reach purpose as above, included according to the testing, sorting machine plug-in unit of the present invention second form：
Main body, is formed with the jack for inserting semiconductor element；Locking devicen, for being maintained at described jack by semiconductor element
Interior, wherein, described main body has guiding groove, and this guiding groove is formed in anticreep projection, and this anticreep projection goes up in the horizontal direction
Opposite side projects to prevent from inserting the semiconductor element in described jack in the tetragon opening of the lower surface being constituted described jack
Depart from downward on face, and at least one of described guiding groove particular pilot groove includes：Guide portion, for guiding semiconductor element
The terminal of part；Amplification portion, expands and has the width bigger than the Breadth Maximum of described guide portion.
Preferably, at least one specific open bore described is formed at when semiconductor element stands as vertical state and can make place
On the position of the terminal insertion of lower side.
Preferably, the radius of curvature of described guide portion is equal with the radius of curvature of the terminal of semiconductor element.
And, in order to reach purpose as above, included according to the testing, sorting machine plug-in unit of the present invention the 3rd form：
Main body, is formed with the jack for inserting semiconductor element；Support member, supports from the side of described jack and inserts described jack
In semiconductor element；Fixed component, described support member is fixed on described main body；Locking devicen, for by semiconductor element
Part is maintained in described jack, wherein, described support member is formed with for opening semiconductor element end towards test machine direction
The open bore of son is so that the terminal of the semiconductor element being supported by described support member is electrically connected to test pusher side and described
The lower end of the specific open bore of at least one of open bore be in than be arranged side by side in the horizontal direction under vertical state other
Commonly on the higher position in the lower end of open bore.
And, in order to reach purpose as above, included according to the testing, sorting machine plug-in unit of the present invention the 4th form：
Main body, is formed with the jack for inserting semiconductor element；Locking devicen, for being maintained at described jack by semiconductor element
Interior, wherein, described main body has guiding groove, and this guiding groove is formed in anticreep projection, and this anticreep projection goes up in the horizontal direction
Opposite side projects to prevent from inserting the semiconductor element in described jack in the tetragon opening of the lower surface being constituted described jack
Depart from downward on face, and the lower end of at least one of described guiding groove particular pilot groove be in than under vertical state in level
On the higher position in the lower end of other normal guidance grooves being arranged side by side on direction.
According to the present invention, due to the position of the terminal of semiconductor element can be set by specific open bore or guiding groove,
The terminal of therefore semiconductor element can be located to greatest extent on the point of ideal position, thus have to improve product reliability
The effect of property.
Brief description
Fig. 1 represents the shape of the open bore on the plug-in unit according to prior art 1.
Fig. 2 represents the shape of the guiding groove on the plug-in unit according to prior art 2.
Fig. 3 and Fig. 4 be for illustrate background technology with reference to figure.
Fig. 5 is the schematic plan view of the testing, sorting machine according to the embodiment of the present invention.
Fig. 6 a is the diagrammatic plan view of the plug-in unit according to first embodiment of the invention.
Fig. 6 b is the axonometric chart illustrating for the ease of observing the plug-in unit in Fig. 6 a from bottom surface.
Fig. 7 and Fig. 8 is with reference to figure for explanation according to the effect of open bore specific in the plug-in unit of Fig. 6.
Fig. 9 is the diagrammatic plan view of the plug-in unit according to second embodiment of the invention.
Figure 10 be for illustrate plug-in unit according to another embodiment of the present invention with reference to figure.
Symbol description：
IS1、IS2：Plug-in unit 61,91：Main body
61a、91a：Jack 91b：Anticreep projection
S：Guiding groove S0：Normal guidance groove
S1：Particular pilot groove G：Guide portion
E：Amplification portion 62：Support member
H：Open bore H0：Common open bore
H1：Specific open bore E：Amplification portion
G：Guide portion J：Connecting portion
63：Fixed component 64,94：Locking devicen
Specific embodiment
Hereinafter, with reference to the accompanying drawings of above-mentioned according to a preferred embodiment of the invention, and brevity in order to illustrate, save as far as possible
Omit or reduce the explanation for known technology or duplicate contents.
<Testing, sorting machine>
Fig. 5 is the schematically plane pie graph to testing, sorting machine 500 according to embodiments of the present invention.
As shown in figure 5, testing, sorting machine 500 includes test panel 510, loading attachment 520, the first rotor 530, test cabinet
540th, the second rotor 550 and discharge mechanism 560.
Multiple plug-in units that semiconductor element can be disposed are had on test panel 510.Wherein, will use individually below for plug-in unit
Length illustrate.
Semiconductor element is loaded by loading attachment 520（loading）In positioned at " loaded " position（LP：Loading
Position）Test panel 510 on.
The test panel 510 that the first rotor 530 has been completed the loading of semiconductor element rotates to be vertical state.
Test cabinet 540 is used for being in test position（TP：Test Position）The test panel 510 of vertical state on
The semiconductor element loading is tested.For this reason, the inside of test cabinet 540 maintains adapts to semiconductor element test temperature conditionss
Ambient condition.
The test panel 510 of the vertical state of the second rotor self-test in 550 future room 540 rotates to be horizontality.
Discharge mechanism 560 is from horizontality arrival unloading position（UP：Unloading Position）Test panel 510
Upper unloading（unloading）Semiconductor element.
Then the example of the plug-in unit being provided to test panel 510 in above-mentioned testing, sorting machine 500 is illustrated.
<First case about plug-in unit>
The plane graph of reference picture 6a and the bottom isometric view of Fig. 6 b, include main body, supporting part according to the plug-in unit IS1 of first case
Part 62, fixed component 63 and locking devicen 64.
The jack 61a of pluggable semiconductor element is formed with main body 61.
Support member 62 supports, in the downside of jack 61a, the semiconductor element being inserted in jack 61a.In this supporting part
Multiple open bore H for opening the terminal of semiconductor element to the socket side of test machine are had on part 62, and is formed at and half
On the corresponding position of the terminal position of conductor element.
In addition, specific open bore H in multiple open bore H1There is no remaining common open bore（Institute on open bore border
There is the circular open hole at position with same curvature radius）H0As consistent round-shaped of radius, and be created as will
Semiconductor element is loaded into be easy to make semiconductor element on test panel 510 or when erecting semiconductor element with vertical state
Terminal position obtains the shape of open bore guiding.Thus, specific open bore H1There is amplification portion E, guide portion G and connecting portion
J.
Hereinafter, stood with test panel 510 makes plug-in unit IS1 and semiconductor element found the feelings as vertical state as vertical state
As a example shape, each several part is illustrated.
Amplification portion E as upside half-circle area, reflects all tolerances mentioned in background technology, and it has and compares semiconductor element
The bigger radius of curvature of the radius of part terminal（Such as 0.32mm/2）.
Guide portion G is as specific open bore H1Underside area, meet the condition that all tolerances are 0.00mm, it has
The radius of curvature equal with the terminal radius of semiconductor element（Such as 0.23mm/2）.
Connecting portion J is the region of ligation amplification portion E and guide portion G.Wherein, connecting portion J has more to the shape that downside is narrower
The inclination of state, so that the semiconductor element terminal of vertical state is guided to guide portion G.
Support member 62 is fixed on main body 61 side by fixed component 63.
Semiconductor element is maintained in jack 61a locking devicen 64.
In the plug-in unit IS1 of above-mentioned composition, if test panel 510 stands makes plug-in unit IS1 and semiconductor element for vertical state
Part stands as vertical state, then as shown in fig. 7, due to semiconductor element terminal T position by specific open bore H1Guide portion G
Set, even if therefore rock in test panel 510 or impact in mobile, still can accurately set semiconductor element when testing
Position.That is, due to having above-mentioned specific open bore H1Structure, specific opening therefore when test panel 510 stands as vertical state
Hole H1Lower end position than common open bore H being arranged side by side in horizontal direction0Lower end position exceed predetermined altitude d, that is, half
The terminal T location of conductor element is set as except specific open bore H1Common open bore H in addition0The end of place's semiconductor element
The lower end of sub- T not with common open bore H0Lower end in contact, but the center C of the terminal T of semiconductor element but with commonly open
Hole H0Center C' consistent.Therefore, from this point of view, guide portion G can be used as the terminal position for determining semiconductor element
Position configuration part, thus can ensure that the exact contact between the terminal T of semiconductor element and the socket of test machine.
Certainly, specific open bore H1Can have multiple, but if all open bore H-shaped be become specific open bore H1, then
Terminal directed section G due to may have semiconductor element clamps, and therefore preferably only the part in open bore H is formed as special
Determine open bore H1.
And although specific open bore H1Can be at any position, stand and be yet with when plug-in unit IS1 and semiconductor element
The lower end of jack 61a during vertical state（Or the lower end of semiconductor element）Become datum line, be therefore preferably formed in and can make partly to lead
It is in the position of the terminal insertion of lower side in the terminal of volume elements part.
If the terminal running into semiconductor element is sized more than ideal（The diameter of 0.23mm）Situation（Such as terminal
A diameter of 0.27mm）, then the terminal of semiconductor element may be in specific open bore H1Interior slightly offset to upside, but reference
Fig. 8 understands to make semiconductor element by means of the amplification portion E with the diameter having contemplated that all tolerances in this case
The terminal T of part is contained in specific open bore H1In.
<Second case about plug-in unit>
With reference to the plane graph of Fig. 9, main body 91 and locking devicen 94 are included according to the plug-in unit IS2 of second case.
The jack 91a of pluggable semiconductor element is formed with main body 91.And, main body 91 is constituted under jack 91a at it
Anticreep projection 91b that opposite side in the horizontal direction projects is had on the tetragon open surface in face, to prevent from inserting in jack 91a
Semiconductor element depart from downwards.And, anticreep projection 91b is formed with the multiple of terminal for guiding semiconductor element
Guiding groove S.
Particular pilot groove S in guiding groove S1With remaining normal guidance groove S0Different and there is guide portion G and amplification portion E.
Guide portion G has the terminal identical radius of curvature with desirable amount（The e.g., from about radius of 0.23mm/2）, it is used for
In loading operation or test panel 510 stand for during vertical state guide semiconductor element terminal.
Amplification portion E is designed to expand and has the width of the Breadth Maximum W more than guide portion G, thus in semiconductor element
The terminal of part be formed as bigger than desirable amount in the case of also can be in corresponding particular pilot groove S1Middle receiving semiconductor element
Terminal.Here, amplification portion E has the inclination more to the narrower form of downside width, partly leading of vertical state will to be in
The terminal of volume elements part guides to guide portion G.
It is also preferably in the present embodiment by particular pilot groove S1It is formed at the energy when semiconductor element stands as vertical state
Enough make on the position that the terminal positioned at lower side inserts, and in order to appropriately arrange the position on the above-below direction of semiconductor element terminal
Put, make particular pilot groove S1Lower end be in than the normal guidance groove S being arranged side by side in horizontal direction0Lower end exceed predetermined height
On the position of degree d.
Locking devicen 94 is used for semiconductor element is maintained in jack 91a.
In addition, plug-in unit IS1, IS2 consideration of reference picture 6a and Fig. 9 explanation is guide portion G（Or position configuration part）'s
The relatively small situation of radius of curvature, but then can regard specifically real in the main upper-lower height considering semiconductor element terminal
Apply situation and as Figure 10（a）With（b）Shown by specific open bore H2Or particular pilot groove S2Radius of curvature be set greater than
Common open bore H0Or normal guidance groove S0Radius of curvature, make specific open bore H simultaneously2Or particular pilot groove S2Lower end
In than horizontal direction（Vertically stand on the horizontal direction in the state of test panel）On common open bore H that is arranged side by side0Or it is common
Guiding groove S0Lower end exceed on the position of predetermined altitude d.
Certainly, due to, during according to plug-in unit IS1, IS2 of Fig. 6 a and Fig. 9, not only can accurately set half in the vertical direction
The position of conductor element terminal, and can accurately set in the lateral direction, therefore the embodiment of Fig. 6 a and Fig. 9 may be than figure
10 embodiment is more highly preferred to.
It is more than to be illustrated taking vertical testing, sorting machine as a example, but if according to KR published patent 10-
No. 2008-0062984（Denomination of invention：The plug-in package of testing, sorting machine test panel and testing, sorting machine）Deng and adopt court
Side technology to be ranked up semiconductor element to the semiconductor element pressure being placed on plug-in unit, or using other
Semiconductor element ordering techniques, then the present invention also can be completely applied in horizontal type test handler.And in this situation
Under, the position of guide portion can change according to the pressurized direction of semiconductor element.
As described above, the embodiment by combining accompanying drawing is illustrated to the present invention, yet with above-mentioned reality
Applying example is only the preferred embodiments of the present invention, therefore must not believe that the present invention is limited only to above-described embodiment, be by power
Sharp claim and its equivalent concepts go to understand the interest field of the present invention.
Claims (7)
1. a kind of testing, sorting machine plug-in unit is it is characterised in that include：
Main body, is formed with the jack for inserting semiconductor element；
Support member, supports, from the side of described jack, the semiconductor element being inserted into described jack；
Fixed component, described support member is fixed on described main body；
Locking devicen, for semiconductor element is maintained in described jack,
Wherein, described support member is formed with for the open bore towards the open semiconductor element terminal in test machine direction, so that
The terminal of the semiconductor element being supported by described support member is electrically connected in test pusher side, and described open bore at least one
Individual specific open bore includes：
Amplification portion, has the radius of curvature bigger than the terminal radius of semiconductor element；
Guide portion, has the radius of curvature of the radius of curvature less than described amplification portion, thus carrying out to the terminal of semiconductor element
Guiding,
Wherein, under testing, sorting machine plug-in unit stands as vertical state, described guide portion is located at the downside in described amplification portion,
The radius of curvature of described guide portion is equal with the radius of curvature of the terminal of semiconductor element.
2. testing, sorting machine plug-in unit as claimed in claim 1 is it is characterised in that at least one specific open bore described is formed
On the position that can make the terminal insertion being in lower side when semiconductor element stands as vertical state.
3. testing, sorting machine plug-in unit as claimed in claim 1 is it is characterised in that described specific open bore also includes connecting institute
State amplification portion and the connecting portion of described guide portion, and described connecting portion has when test panel stands as vertical state more to downside width
Spend narrower form.
4. a kind of testing, sorting machine plug-in unit is it is characterised in that include：
Main body, is formed with the jack for inserting semiconductor element；
Locking devicen, for semiconductor element is maintained in described jack,
Wherein, described main body has guiding groove, and this guiding groove is formed in anticreep projection, and this anticreep projection goes up in the horizontal direction
Opposite side projects, to prevent the semiconductor element being inserted in described jack from opening in the tetragon of the lower surface being constituted described jack
Put and depart from downward on face, and at least one of described guiding groove particular pilot groove includes：
Guide portion, for guiding the terminal of semiconductor element；
Amplification portion, expands and has the width bigger than the Breadth Maximum of described guide portion,
Wherein, under testing, sorting machine plug-in unit stands as vertical state, described guide portion is located at the downside in described amplification portion,
The radius of curvature of described guide portion is equal with the radius of curvature of the terminal of semiconductor element.
5. testing, sorting machine plug-in unit as claimed in claim 4 is it is characterised in that at least one particular pilot groove described is formed
On the position that can make the terminal insertion being in lower side when semiconductor element stands as vertical state.
6. a kind of testing, sorting machine plug-in unit is it is characterised in that include：
Main body, is formed with the jack for inserting semiconductor element；
Support member, supports, from the side of described jack, the semiconductor element being inserted into described jack；
Fixed component, described support member is fixed on described main body；
Locking devicen, for semiconductor element is maintained in described jack,
Wherein, described support member is formed with for the open bore towards the open semiconductor element terminal in test machine direction, so that
The terminal of the semiconductor element being supported by described support member is electrically connected in test pusher side, and described open bore at least one
The lower end of individual specific open bore is in the lower end than other the common open bore being arranged side by side in the horizontal direction under vertical state
On higher position,
At least one specific open bore described includes being arranged at the underside area of at least one specific open bore described and half-and-half leads
The guide portion that the terminal of volume elements part guides, described guide portion has the curvature equal with the terminal radius of semiconductor element half
Footpath.
7. a kind of testing, sorting machine plug-in unit is it is characterised in that include：
Main body, is formed with the jack for inserting semiconductor element；
Locking devicen, for semiconductor element is maintained in described jack,
Wherein, described main body has guiding groove, and this guiding groove is formed in anticreep projection, and this anticreep projection goes up in the horizontal direction
Opposite side projects, to prevent the semiconductor element being inserted in described jack from opening in the tetragon of the lower surface being constituted described jack
Put and depart from downward on face, and the lower end of at least one of described guiding groove particular pilot groove be in than under vertical state in water
On the higher position in the lower end of square other normal guidance grooves being arranged side by side upwards,
At least one particular pilot groove described includes being arranged at the underside area of at least one particular pilot groove described and is used for drawing
Lead the guide portion of the terminal of semiconductor element, described guide portion has bent with the terminal identical of the desirable amount of semiconductor element
Rate radius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710049963.4A CN106862093B (en) | 2012-10-26 | 2013-09-18 | Plug-in for test handler |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120119984A KR101955194B1 (en) | 2012-10-26 | 2012-10-26 | Insert for test handler |
| KR10-2012-0119984 | 2012-10-26 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710049963.4A Division CN106862093B (en) | 2012-10-26 | 2013-09-18 | Plug-in for test handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103785619A CN103785619A (en) | 2014-05-14 |
| CN103785619B true CN103785619B (en) | 2017-03-01 |
Family
ID=50661917
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710049963.4A Active CN106862093B (en) | 2012-10-26 | 2013-09-18 | Plug-in for test handler |
| CN201310426373.0A Active CN103785619B (en) | 2012-10-26 | 2013-09-18 | Testing, sorting machine plug-in unit |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710049963.4A Active CN106862093B (en) | 2012-10-26 | 2013-09-18 | Plug-in for test handler |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101955194B1 (en) |
| CN (2) | CN106862093B (en) |
| TW (1) | TWI503557B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101535245B1 (en) * | 2013-09-27 | 2015-07-09 | 세메스 주식회사 | Insert assembly of test tray |
| KR102252638B1 (en) * | 2015-05-04 | 2021-05-17 | (주)테크윙 | Insert for test handler |
| KR102229229B1 (en) * | 2015-06-17 | 2021-03-18 | (주)테크윙 | Insert for test handler |
| KR102470315B1 (en) * | 2016-01-29 | 2022-11-25 | (주)테크윙 | Insert for test handler |
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| KR200444066Y1 (en) * | 2007-04-19 | 2009-04-10 | (주)테크윙 | Insert for test handler |
| CN102299088A (en) * | 2010-06-23 | 2011-12-28 | 泰克元有限公司 | Insertion piece for testing separator and device for operating the insertion piece |
| CN102338849A (en) * | 2010-07-15 | 2012-02-01 | 泰克元有限公司 | Insert for test handler |
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| JPH08146086A (en) * | 1994-11-24 | 1996-06-07 | Advantest Corp | Tray insert of test tray of handler for ic tester |
| JP2005134373A (en) * | 2003-10-09 | 2005-05-26 | Alps Electric Co Ltd | Connection device using spiral contactor |
| US20070103179A1 (en) * | 2005-11-10 | 2007-05-10 | Silicon Integrated Systems Corp. | Socket base adaptable to a load board for testing ic |
| JP2007227341A (en) * | 2006-01-30 | 2007-09-06 | Alps Electric Co Ltd | Guide member, connecting board with guide member, and method for manufacturing guide member |
| KR200427177Y1 (en) * | 2006-07-06 | 2006-09-20 | 주식회사 오킨스전자 | Semiconductor Chip Carrier |
| KR100892606B1 (en) * | 2007-08-23 | 2009-04-08 | 파워테크 테크놀로지 인코포레이티드 | Universal insert tool for fixing a bga package under test |
| KR100898411B1 (en) * | 2007-09-12 | 2009-05-21 | 주식회사 오킨스전자 | Carrier for semiconductor chip |
| KR101495201B1 (en) * | 2008-12-19 | 2015-02-24 | 삼성전자주식회사 | Insert module for test handler and method of manufacturing the same |
| KR101016327B1 (en) * | 2009-05-18 | 2011-02-22 | 주식회사 티에프이스트포스트 | Insert carrier of Semiconductor Package |
| JP2011003423A (en) * | 2009-06-19 | 2011-01-06 | Alps Electric Co Ltd | Connection device |
| US8727328B2 (en) * | 2010-06-24 | 2014-05-20 | Isc Co., Ltd. | Insert for handler |
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2012
- 2012-10-26 KR KR1020120119984A patent/KR101955194B1/en active Application Filing
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- 2013-09-18 CN CN201710049963.4A patent/CN106862093B/en active Active
- 2013-09-18 CN CN201310426373.0A patent/CN103785619B/en active Active
- 2013-09-23 TW TW102134135A patent/TWI503557B/en active
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| KR200444066Y1 (en) * | 2007-04-19 | 2009-04-10 | (주)테크윙 | Insert for test handler |
| CN102299088A (en) * | 2010-06-23 | 2011-12-28 | 泰克元有限公司 | Insertion piece for testing separator and device for operating the insertion piece |
| CN102338849A (en) * | 2010-07-15 | 2012-02-01 | 泰克元有限公司 | Insert for test handler |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140057700A (en) | 2014-05-14 |
| CN103785619A (en) | 2014-05-14 |
| KR101955194B1 (en) | 2019-03-08 |
| CN106862093A (en) | 2017-06-20 |
| TWI503557B (en) | 2015-10-11 |
| TW201418734A (en) | 2014-05-16 |
| CN106862093B (en) | 2020-01-03 |
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