CN1192533A - Semiconductor device testing apparatus - Google Patents
Semiconductor device testing apparatus Download PDFInfo
- Publication number
- CN1192533A CN1192533A CN98106267A CN98106267A CN1192533A CN 1192533 A CN1192533 A CN 1192533A CN 98106267 A CN98106267 A CN 98106267A CN 98106267 A CN98106267 A CN 98106267A CN 1192533 A CN1192533 A CN 1192533A
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- China
- Prior art keywords
- carriage
- test
- groove
- semiconductor devices
- deflashing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
An IC testing device can eliminate the attached raw edges at four corners of a contained IC encapsulation part for testing and can encase an IC which is processed for eliminating the raw edges into a part containing base of a bracket used for testing by high positioning precision. A pair of raw edge eliminating parts are formed at a position correction device (an exact localizer) which is used for transferring the IC for testing from a bracket KST to a bracket TST in an encasing part used for testing.
Description
The present invention relates to a kind ofly be used for test and comprise the semiconductor device testing apparatus of semiconductor devices integrated circuit (hereinafter referred is IC) at interior various semiconductor devices, or rather, relate to and a kind ofly have that the semiconductor devices that is connected to proving installation transmits and the semiconductor device testing apparatus for the treatment of apparatus (being commonly referred to as mechanical arm), this transmission and treating apparatus are used to carry various types of semiconductor devices to be measured, promptly, device under test (being commonly referred to as DUT) is sent to the part of detecting that is used for its test, and the semiconductor devices self-test that will survey is partly taken out, and is transported to desired location.
Having much semiconductor device testing apparatus (claiming the IC tester usually) from preassigned pattern to device that measure semiconductor devices electrical specification to be measured by the signal that applies have the semiconductor devices that is connected thereto transmits and treating apparatus (hereinafter being referred to as mechanical arm), these devices are sent to part of detecting with semiconductor devices to be measured, make the test jack in semiconductor devices and the proving installation form electric and Mechanical Contact at this place, the semiconductor devices that to survey is sent this part of detecting and is made it to arrive the precalculated position then, and according to test result with they be divided into certified products (by) and unacceptable product (cranky).For the ease of explaining, will for example the present invention be introduced in order to the IC semiconductor device testing apparatus (hereinafter being referred to as the IC tester) of test general semiconductor device in the introduction hereinafter.
At first introduce an example of a kind of semiconductor device testing apparatus that the present invention will adopt with reference to Fig. 7 and 8.
Fig. 7 is a general structure synoptic diagram of representing an example of conventional IC tester in fragmentary, perspective view's mode, and this tester has the mechanical arm of the what is called " horizontal transmission formula " that is connected thereto, and this figure expresses the general structure of mechanical arm especially.This mechanical arm comprises surveys chamber part 100, is used for when for example semiconductor memory is introduced wherein and install on the test usefulness carriage TST that can bear high/low temperature with IC IC being tested; IC stores part 200, is used to store with measured IC (IC to be measured) and has tested the IC that finishes and with its classification; The part 300 of packing into, therein install in advance by the user user with carriage or client with the tested IC on carriage (will be called the user and the use carriage) KST carry the new clothes of laying equal stress on to the test that can bear high/low temperature with on the carriage TST; And unload lower part 400, and make therein to be contained in test and to transfer to user's carriage KST from test bracket TST with the IC that the test on the carriage TST (having left therein the survey chamber part 100 of testing in proper order) finishes, on the latter, reload.The structure of unloading lower part 400 is configured to usually and can IC be after tested classified according to test result data, and they are installed on corresponding user's carriage.
Surveying chamber part 100 comprises: constant temperature enclosure 101 is used for applying thermal stress handle under the high temperature of appointment or low temperature being contained in tested IC on the test bracket TST; Part of detecting 102 is used for the IC that is applied in the thermal stress processing at constant temperature enclosure 101 is carried out conductive test; And heat elimination/cold decontamination chamber 103, be used for from eliminating the thermal stress that constant temperature enclosure 101, is applied in through the IC of test at part of detecting 102.Comprise in the part of detecting 102: the tester head 104 of IC tester, tester head 104 are used for the IC that Xiang Yuqi electrically contacts and apply various test electric signal, receive and send this response signal from the response signal of IC and to tester.
Test bracket TST moves through constant temperature enclosure 101, the test cabinet of surveying the chamber part 100 102 respectively and surveys heat elimination/cold decontamination chamber 103 in the chamber part 100, unloads lower part 400 and turn back to the part 300 of packing into from the part 300 beginnings order of packing in a looping fashion.
When IC has stood pyroprocessing in constant temperature enclosure 101 after, they are shifted out deliver to unload lower part 400 before, in heat elimination/cold decontamination chamber 103, make IC drop to room temperature by forced draft cooling.After in constant temperature enclosure 101, having made IC for example stand about-30 ℃ low temperature, they are shifted out deliver to unload lower part 400 before, utilize the air of heating or well heater to make it to rise to and do not produce the temperature of condensing.
The test that IC tested in the part 300 of packing into is housed is moved by the constant temperature enclosure 101 of part 300 in surveying chamber part 100 of packing into carriage TST.The thermal stress that applies in the constant temperature enclosure 101 partly is equipped with the vertical conveying device that is suitable for supporting a plurality of (for example 10) test usefulness carriage TST that places by the mode of stacking.In described example, the test that is received by the part 300 of packing into just uses bearing bracket at the top of lamination, and the lower side test is transported to part of detecting 102 with carriage.
When corresponding test with carriage TST by vertical conveyer move top by lamination straight down when moving to the bottom in proper order and in the waiting time before test cabinet 102 becomes skies, tested IC is applied predetermined high temperature or low temperature thermal stress.At the center of part of detecting 102 tester head 104 is housed.The test of shifting out thermal stress applying portion in the constant temperature enclosure 101 is one by one placed on the tester head 104 with carriage, at this place, be contained in test and electrically contact with the IC of the predetermined quantity among the tested IC on the carriage and the IC socket (not shown) formation that is configured in the tester head 104.When all IC that a test by tester head 104 is placed on carriage finish test, test moves to heat elimination/cold decontamination chamber 103 with carriage TST, wherein, TST is transported to unload lower part 400 before, make tested IC release heat to return to room temperature.
With in the aforesaid constant temperature enclosure 101 to apply the thermal stress part similar, heat eliminations/cold decontamination chamber 103 also is equipped with the vertical conveying device that is suitable for supporting the test usefulness carriage TST that a plurality of (for example 10) stack each other.In described example, in the bottom of lamination, and the test of the top is discharged to carriage and unloads lower part 400 with bearing bracket in the test that is received by test cabinet 102 just.When corresponding test with carriage TST mobile straight up by vertical conveying device sequentially, when moved at the top, tested IC release heat was so that return to external temperature (room temperature) by the bottom of lamination.
Be contained in IC that test finishes with the test on the carriage TST and be sent to and unload lower part 400, therein according to the data of test result with IC according to category classification, transfer to and be stored among corresponding user's usefulness carriage KST.In the test of unloading lower part 400 mid-skies with carriage TST by the anti-part 300 of packing into of delivering to, load onto once more therein from the user with the IC to be tested of carriage, so that repeat the identical operations step.
IC storage part 200 comprises an IC storage screen work 201 to be measured, is used to hold the user that IC to be measured is housed and uses carriage KST; And finish the IC storage screen work 202 of test and the user that is used to hold according to the C of test I of test result classification uses carriage KST.The user that IC to be measured storage screen work 201 and the structure of finishing the IC storage screen work 202 of test are suitable for holding the lamination form uses carriage.
The user that tested IC is housed with the storage of lamination form in IC storage screen work 201 to be measured sequentially is transported to the part 300 of packing into by the top of lamination with carriage KST, is transferred to carriage KST by the user at this tested IC to be in the part 300 of packing on the standby test usefulness carriage TST.It should be noted that IC storage screen work 201 to be measured and the IC storage screen work 202 of finishing test can be of similar shape and structure.
In example shown in Figure 7, provide 8 screen work STK-1, STK-2 ... STK-8 is as the IC storage screen work 202 of finishing test, so that can be according to the maximum IC that finishes test that can be divided into 8 classes of test result storage.This is because in some application scenario, IC after tested may not only be categorized as " certified products (passing through goods) " and " unacceptable product (cranky goods) ", but also can segment them, height, the low arithmetic speed of neutralization are arranged in " certified products ", and in unacceptable product, need part and other classification part of testing again.
Even number that can be sub-category is up to 8, in described example, unloads lower part 400 and only can hold 4 users and use carriage KST.For this reason, if some IC in tested IC, occurs, its classification that should divide is different from the classification of user's carriage KST appointment of configuration in unloading lower part 400, the running program of taking is to make user's carriage KST turn back to the IC storage part 200 of finishing test from unloading lower part 400, and replace and storage is belonged to the user that newly adds classification IC transfer to from the idle carriage storage screen work 206 of the IC storage part 200 of finishing test with carriage and unload lower part 400, those IC are stored in the new carriage at this.
Fig. 8 represents to test the structure with the example of carriage TST.Shown test comprises rectangular frame 12 with carriage TST, it has in framework a plurality of parallel horizontal stripes 13 that evenly separate between two couples of side frame member 12a and the 12b, each horizontal stripe 13 has and a plurality ofly evenly separates, with lug 14, each has similar by the installation usefulness lug 14 that stretches out on it with adjacent horizontal stripe opposed side edges framing component 12a, 12b in its both sides and by its installation of stretching out.The installation of stretching out from the relative both sides of each horizontal stripe 13 is disposed like this with lug 14, i.e. each installation of being stretched out by a side of horizontal stripe 13 is used between the lug 14 in two adjacent installations that the offside by adjacent horizontal stripe stretches out with lug 14.Similarly, each installation of being stretched out respectively by each side frame frame member 12a and 12b is used between the lug 14 in two adjacent installations that the horizontal stripe by offside stretches out with lug 14.Between each is to opposed horizontal stripe 13 and the interval that forms between the horizontal stripe of side frame frame member 12a, 12b and offside be used for holding side by side a plurality of semiconductor devices holders (be referred to as " carriage insert " or be called for short " insert ") in the present technique field.
More particularly, each semiconductor devices holder 16 is placed in one of the array in the rectangle holder interval 15 that limits in each above-mentioned interval, each interval 15 comprises two staggered tiltedly right installations being positioned at two diagonal positions on the interval diagonal with lugs 14.In described embodiment,,, 16 semiconductor devices holders 16 are installed wherein so in each above-mentioned interval, be formed with 16 holder intervals 15 because each horizontal stripe 13 has 16 installations with lug 14 in its each side.Because 4 intervals are arranged in described example, be 64 IC holders so can install altogether 16 * 4 in carriage TST at a side test.
Each semiconductor devices holder 16 is of similar shape and size aspect profile, and has IC tank 19 at the center, is used for laying therein the IC device.The shape and size of the IC tank 19 in each semiconductor devices holder 16 are to determine according to the shape and size of the IC device that wherein will hold.The physical dimension of determining IC holder 16 makes it use in the space that limits between the lug 14 with the opposed installation that the loose fit mode is installed in the holder interval 15.IC holder 16 has the bead that is suitable for being shelved on the corresponding installation usefulness lug 14 in its two opposite end, these beads are formed with the mounting hole that is used to hold the securing member 17 that therefrom passes 21 of perforation and are used to pass the hole 22 of register pin.
In the part 300 of packing into, adopt the IC transfer device, be used for IC is transferred to test carriage TST from the user with carriage KST.As shown in Figure 9, the IC transfer device can be the form of X-Y direction transfer device 304, it comprises a pair of Y that is parallel to each other that separates at certain intervals to guide rail 301, be installed in parallel on the part 300 of packing into, guide rail extends along the fore-and-aft direction (be above-below direction when observing in the drawings, and be called the Y direction here) of IC tester; A movable support arm 302, its two opposite end is across being installed in this to also moving along the Y direction on the guide rail 301; And be installed in slip-on head on the removable support arm 302 (be referred to as to pick up in the present technique field and in place) with head, be used for along support arm vertically, promptly the left and right directions (being referred to as directions X here) along the IC tester moves.
According to this configuration, slip-on head 303 moves back and forth along removable support arm 302 with carriage KST with between testing with carriage TST and at directions X the user along the Y direction.
Moving head 303 has the IC sticking liner 306 that is installed on its basal surface, moves in order to vertical (upper and lower) direction (vertically the direction by the accompanying drawing page and be referred to as the Z direction).Moving head 303 moves and sticking liner 306 moving along the Z direction along X and Y direction, make sticking liner 306 can abut in the user and go up on the IC that places, use carriage TST so that utilize the vacuum hold effect IC to be picked up and transfer to test with carriage KST from the user with carriage KST.Moving head 303 is equipped with the IC sticking liner of some, this quantity with once in corresponding by the IC quantity of this conveying.In this example, moving head 303 is equipped with 8 IC sticking liners, makes once 8 IC to be transported to test carriage TST by the user with carriage KST.
In addition, the position correction apparatus 305 that is used for accurately determining the IC position that is referred to as " precise localizer " in the prior art the user with carriage KST and test between the stop position with carriage TST.The position correction position that is referred to as " precise localizer " 305 comprises: the setting element 330 of predetermined quantity, each setting element has deep IC storage tank, inhale the IC that pastes by sticking liner 306, pick up and transfer to test and be released in this groove before with carriage TST being subjected to once more sticking.The periphery of IC storage tank is that the sidewall by vertical direction band tapering limits, the position when these sidewalls have stipulated to make IC fall in this groove by tapering.In case utilize precise localizer 305 that 8 IC are accurately located each other, these pinpoint IC just are attracted and cling on the sticking liner 306 at every turn, and transfer to test carriage TST.
The size that it should be noted that the above-mentioned IC storage tank that forms in carriage KST the user is compared greatly with the size of IC, causes the user with the position of the IC that stores among the carriage KST bigger deviation to be arranged.Thereby, if the pull of vacuum effect that utilizes the sticking liner is picked up and directly transferred to test to the IC of location like this and uses carriage TST, then have in the IC tank 19 of built-in test that some IC can not be successful with the device holder of installing among the carriage TST 16 (insert).Here it is needs the reason of precise localizer 305, and this precise localizer 305 is in order to accurately to dispose IC according to being installed in the configuration precision of test with the IC tank 19 in the device holder 16 among the carriage TST.
Unload lower part 400 two groups of X-Y direction transfer device (not shown)s also are housed, structurally the X-Y direction transfer device 304 with part 300 installings of packing into is identical for they.Unloading X-Y direction transfer device in the lower part 400 constitutes and is suitable for transferring to the user who unloads in the lower part 400 by the IC that finishes test that test is shifted out with carriage TST and uses carriage KST.
As mentioned above, include therein in the IC tester of above-mentioned horizontal transmission formula mechanical arm and (wherein to be transported to before the part of detecting 102 (surveying chamber part 101) of testing usefulness, the IC that should survey is used on the carriage TST with the test that carriage KST transfers in the part 300 of packing into by the user), precise localizer 305 is located at the user and uses between the stop position of carriage TST with carriage KST and test.Precise localizer 305 be used for be installed in test and accurately dispose tested IC with the identical precision of the configuration precision of the device holder 16 of carriage TST, therefore, the precision of the IC tank 19 of configuration device before on described precision that is the device holder 16 in test usefulness carriage TST that IC is packed into.
Because in this example, the formation of precise localizer 305 is suitable for 8 tested IC of one-time positioning, so it must equip 8 setting elements 330, as shown in Figure 9.Introduce an example of setting element 330 in more detail below with reference to Figure 10-12.
Figure 10 is the amplification view that is illustrated in an example of the setting element of installing in the precise localizer 305 330; Figure 11 is the longitudinal sectional drawing of the setting element 330 got along the subdivision line 11-11 among Figure 10, is situation about seeing from the direction that arrow is represented; Figure 12 is the transverse cross-sectional view of the setting element 330 got along the subdivision line 12-12 among Figure 10, is situation about seeing from the direction that arrow is represented.In described embodiment, the structure of setting element 330 is designed to make is placed on one in (on the planimetric map for rectangle) packaging part, and have IC location by its two relative termination section of drawing than long side surface.
That setting element 330 has is relatively darker (on planimetric map for rectangle) groove 320 is used to hold tested IC.The size of groove 320 is such, promptly be approximately equal on the tested IC packaging part that will hold length than long side surface along its size than long side surface (being viewed as above-below direction on the figure), be approximately equal to the distance (, the size of the shorter side of packaging part adds by relative termination section length of stretching out than long side surface on the packaging part) of between the termination section outermost end face that long two faces relative on the packaging part by tested IC stretch out (when in planimetric map, measuring) along the size of shorter side direction (being viewed as left and right directions on the figure).
As recognizing by Figure 12, when inserting tested IC in the groove 320, the bottom surface of packaging part is by bump 321 supporting, makes the termination section of packaging part be contained in the transverse edge part 320Z of groove 320 so that the additonal pressure that needn't rely on the bottom surface by transverse edge part 320Z to produce is packed into.
In addition, the periphery removed outside its 4 jiaos of groove 320 is centered on than the opposing inclined surface 322Y of long side surface and a pair of opposing inclined surface 322X along shorter side by a pair of edge.Will be appreciated that with near the represented position of arrow, by removing the sticking of sticking liner 306, IC is put down from sticking liner 306 in Figure 12, this IC utilize the surperficial 322X that tilts and 322Y be imported within the groove 320 in place.
Or rather, when IC being inserted in the groove 320, make the tip at the termination top of IC packaging part be adjacent to paired inclined surface 322Y, 322Y, meanwhile, not by the end edge at its termination top of stretching out and paired inclined surface 322X, 322X forms contact on the packaging part.When lead in the surface that utilizes these inclinations, IC descends and to abut on the bump 321 at place, bottom of groove 320 and by its support up to the bottom surface of IC packaging part.When the bottom surface of IC packaging part abuts in the bump 321 at groove 320 bottoms places and is supported by it, utilization is limiting the position of IC than the paired inclined surface 322Y of long side surface with at the paired inclined surface 322X of shorter side, so as with its be provided with in position with attitude on.Thereby, when IC is attracted to cling on the sticking liner 306 and carry and the device holder 16 of built-in test usefulness carriage TST in the time, IC will suitably be packed in the device holder 16.
Introduce the details of test below with reference to Figure 13, and use identical label to mark, and unless necessary, will no longer further introduce at counterpart shown in Fig. 8 and element with the device holder 16 among the carriage TST.
The structure of the IC tank 19 in the device holder 16 is corresponding with the specific IC packaging part that needs test.As noted above, when IC packaging part in planimetric map is a rectangle, and when having the relative termination section of drawing than long side surface of by packaging part two, as shown in Figure 13, IC tank 19 is recessed rectangle in planimetric map, and its size is such, promptly be approximately equal to the length than long side surface of the tested IC packaging part that will hold along the size of its direction (when observing in the drawings, being above-below direction) than long side surface, and be a bit larger tham distance between the outermost edges of the termination section that (when measuring) stretched out than long side surface by relative two on the tested IC packaging part (size of the shorter side of packaging part adds the length of the termination section of being stretched out than long side surface by relative two on the packaging part) along the size of the direction (being left and right directions) of its shorter side when observing in the drawings in planimetric map, in other words, the size of IC tank 19 is determined to want to prevent to be contacted with the sidewall surfaces of IC tank by the outermost edges of the relative termination section of stretching out than long side surface on the packaging part.
Utilize 4 director elements 312, for example square column makes IC packaging part location in IC tank 19 effectively, and these square columns are integrally formed, extend upward preset distance by four jiaos of corresponding positions with the IC packaging part and form.This 4 director elements 312 form not the geometry that reclines mutually with the termination section of being drawn by packaging part, promptly along two termination section of holding between corresponding two two relevant director elements respect to one another than long side surface by packaging part of drawing than long side surface.
In case the configuration precision of IC is with when test is consistent with the IC tank among the carriage TST 19, IC through this position and attitude correction is attracted and maintenance by sticking liner 306, and be transported in test with the position above the IC tank 19 among the carriage TST, down to preposition, it is dropped in the corresponding IC tank 19 then.
Pei Zhi IC can descend in IC tank 19 separately like this, they are loaded into suitable position and keep suitable attitude in IC tanks 19 separately at this IC by the bottom of 4 director elements 312 guiding in the bottom surface of IC packaging part suitably reclines separately IC tank 19.
In this manner, repeat to utilize precise localizer 305 once the IC of 8 need tests to be transferred to test by the user with carriage KST and transfer to the operation that carriage TST is used in test from the user with carriage KST, till the user uses carriage KST change sky with the operation of carriage TST and with IC.Then, with next user with carriage KST be transported to pack into the part in the precalculated position, then repeat aforesaid operations.Similarly,, just next one test is transported to precalculated position in packing into partly with carriage TST, then repeats above-mentioned steps when when test all is equipped with IC in all IC tank 19 in carriage TST.
As mentioned above, when the relative position relation between 8 sticking liners 306 in tested IC and slip-on head 303 is correct, by being contacted with the bump of locating in groove 320 bottoms 321 up to the bottom surface of IC through groove 320 declines, IC reaches correct location, in this course, utilize the relative shorter end face edge of most advanced and sophisticated or its outermost edges and IC packaging part at the termination top of tested IC, abut in respectively than paired opposing inclined surface 322Y on the long side surface and the paired inclined surface 322X on the shorter side and go up and be directed to.In this course, four jiaos of this IC packaging part are separated with the stop portion that is used to locate.That is, design above-mentioned precise localizer 305, so that determine the position of IC packaging part according to the outline of IC as benchmark, but four jiaos of IC packaging part are what to be separated with the stop portion that is used to locate.
Thereby, both having made four jiaos of burr that stretch out by the IC packaging part, IC still can correctly be positioned in the precise localizer 305.Four jiaos of burr that stretch out by the IC packaging part change the appearance profile of IC packaging part, but its influence can be ignored in precise localizer 305.
In contrast, the described test of reference Figure 13 with carriage TST in, being used for IC is as the IC packaging part of pointing out above four jiaos with respect to the final positioning reference at the IC tank 19 of the holder 16 of this IC device.Therefore, position and the attitude of IC were correctly determined by precise localizer 305, as noted above, burr that the quadrangle of IC packaging part becomes can with four director elements 312 in IC tank 19 in any contacts or reclines, and cause packaging part to tilt.Therefore, the suitable importing of IC to be able to not be packed into and IC tank 19 in place therein in, promptly the situation that misalignment is packed into can take place.
In fact, form burr at four jiaos of places of IC packaging part through regular meeting.Pack into the practice in the IC tank 19 with IC is forced in the inclination of not considering the IC packaging part that causes when 4 director elements 312 in IC tank 19 contact or recline owing to the burr that stretched out by the IC packaging part, may damage in test with the IC device holder 16 among the carriage TST and/or make termination section bending on the IC.
The purpose of this invention is to provide a kind of semiconductor device testing apparatus, it can pack tested semiconductor devices into test with in the device holder in the carriage in the mode of hi-Fix.
According to an aspect of the present invention, have in semiconductor device testing apparatus: the semiconductor devices that is connected thereto transmits and treating apparatus, and the semiconductor devices that is used for that semiconductor devices to be measured is transported to part of detecting and is used for finishing test takes out and be transported to the precalculated position by part of detecting.This semiconductor device testing apparatus is characterised in that, comprises a position correction apparatus with deflashing device, is used to eliminate adhere to the apparent burr of the packaging part that is used for the holding semiconductor device.
Above-mentioned position correction apparatus comprises at least one setting element, is formed with in this setting element to observe in planimetric map totally to be the groove of rectangle, is used for holding therein and locating semiconductor devices.Above-mentioned deflashing device only has the local deflashing end sections that stretches in four jiaos of above-mentioned groove.
Deflashing is viewed as rectangle with the shape on the top of end sections in planimetric map.Sidewall is formed with the targeting part of inclination around the above-mentioned groove, is used for semiconductor devices is led.The height basis of the end of deflashing is determined near the height of the oblique targeting part 322X of the lower edge of this end.
According to the present invention, when tested semiconductor devices is transferred to carriage by the user pack into the part in test with carriage on the time, use the position correction apparatus of calibrating semiconductor device position that the deflashing device is housed, be used to remove the burr on device package, therefore before test that semiconductor devices is packed into is with carriage, attached to the burr on the semiconductor device package outside surface particularly the burr on its angle can be removed for certain.So just guarantee that semiconductor devices can correctly import the device holder of test with the device that is used on the carriage to pack into, misalignment or be damaged in the time of therefore preventing to pack into.
Fig. 1 is the amplification view that expression is used in a setting element in the position correction apparatus (precise localizer) among the embodiment of semiconductor device according to the invention proving installation,
Fig. 2 is the longitudinal sectional drawing of the setting element got along the subdivision line 2-2 among Fig. 1, and is situation about seeing along the direction shown in the arrow;
Fig. 3 is the transverse cross-sectional view of the setting element got along the subdivision line 3-3 among Fig. 1, and is situation about seeing along the direction shown in the arrow;
Fig. 4 is another amplification view of the part of the setting element in the presentation graphs 1;
Fig. 5 is the longitudinal sectional drawing of the setting element got along the subdivision line 5-5 among Fig. 4, and is the situation that the direction of following the arrow is seen;
Fig. 6 is the transverse cross-sectional view of the setting element got along the subdivision line 6-6 among Fig. 4, and is the situation that the direction of following the arrow is seen;
Fig. 7 is the schematic plan view of general structure of an example of the conventional semiconductor device testing apparatus represented in fragmentary, perspective view's mode;
Fig. 8 is that expression is used in test in the semiconductor device testing apparatus with the skeleton view of the structure of an example of carriage;
Fig. 9 is the planimetric map that is illustrated in the sub-population structure of packing into of the semiconductor device testing apparatus shown in Fig. 7;
Figure 10 is the amplification view of a setting element in the position correction apparatus in the semiconductor device testing apparatus shown in the presentation graphs 7 (precise localizer);
Figure 11 is the longitudinal sectional drawing of the setting element got along the subdivision line 11-11 among Figure 10, and the expression direction of following the arrow situation about seeing;
Figure 12 is the transverse cross-sectional view of the setting element got along the subdivision line 12-12 among Figure 10, and the expression direction of following the arrow situation about seeing;
Figure 13 is illustrated in the planimetric map of the test shown in Fig. 8 with a device holder (insert) of installing in the carriage.
Below with reference to the embodiment of Fig. 1-6 introduction according to semiconductor test apparatus of the present invention.Though in following introduction, in order to simplify introduction, with reference to an example the present invention is introduced, apply the present invention to semiconductor device testing apparatus in this example, promptly be applied to test IC tester as the IC of general semiconductor devices, but for those skilled in the art clearly owing to have the various advantages of the equivalent function of expection, in the semiconductor test apparatus that the present invention designs applicable to the various IC semiconductor devices that are different from for test.
Owing to the invention is characterized in position correction apparatus (being referred to as " precise localizer " in association area), it is used for when tested semiconductor devices (IC) is transferred to the test of the part of packing into when using carriage from the user with carriage, with the position of this tested semiconductor device (IC) of high-precision correction, introduce the present invention so below will concentrate on precise localizer.
Fig. 1-the 3rd represents to be used in the planimetric map and the drawing in side sectional elevation of a setting element in the precise localizer among embodiment of semiconductor device according to the invention proving installation by magnification ratio, Fig. 4-the 6th, the planimetric map of the further amplification of Fig. 1-3 and sectional drawing, be to be understood that, the corresponding part of expression and the element with among Figure 11-13 of expression utilize identical label to mark in Fig. 1-6, unless necessary, will introduce no longer in detail.
To similar at the setting element 330 shown in Figure 11-13, at the setting element 330 shown in Fig. 1-6, its structural design also is suitable for IC is effectively located, this IC has two relative termination section of drawing than long side surface by the packaging part that is shown rectangle in planimetric map, and this setting element has (being seen as rectangle on the plane) the darker groove 320 relatively that is used for holding tested IC.The size of groove 320 is to determine like this, promptly be approximately equal to the length than long side surface of the tested IC packaging part that is held along its size than long side surface direction (being above-below direction when observing in the drawings), and be approximately equal to (when when planimetric map measures) by the distance between the outermost edges of answering two relative termination section of extending of test I C packaging part (, the size of the shorter side of packaging part adds the length by two relative termination section of stretching out than long side surface on the packaging part) than long side surface along the size of the direction (being left and right directions when watching in the drawings) of its shorter side.
Four bight 320C form in the mode of outside protrusion, make when inserting tested IC in the groove 320, and four jiaos of the rectangle packaging part with loose fit mode this groove (the sidewall surfaces with groove 320 does not contact) of packing into.Remove beyond described two relative long surperficial relative transverse edge parts of extending, the rectangular base surface of groove 330 forms bump 321.In addition, remove peripheries beyond its four jiaos in the groove 320 for along the paired opposing inclined surface 322X of shorter side and along being centered on than the surperficial 322Y of the paired opposing inclined of long side surface.
In the present invention, a pair of deflashing (burr elimination) parts 230,230 and setting element 330 whole formation, they on two side faces relative on the setting element 330 to form with bump 321 relations respect to one another that are configured in therebetween.Deflashing parts 230 comprise: with the main part of parallel corresponding extensions one of among the 322Y of paired opposing inclined surface, and by meet at right angles deflashing (burr elimination) part 231,231 among the bight 320C that extends to the correspondence increasing of two of this main part relative ends.
Determine the longitudinal length (being above-below direction when watching in the drawings) of the main part in each deflashing parts 230 by this way, even it is approximately equal to the length of the part at the termination top of stretching out on the IC packaging part to be tested, and this main part constitutes like this, promptly when IC was placed groove 320, this main part was faced the termination top of being drawn by the packaging part of IC to be measured.In other words, main part than the length than the length shortage of long side surface of IC packaging part be equal to nothing the IC packaging part that extends the termination top than the upper part of long side surface and the length of end portion (when watching in the drawings).Therefore can understand, by vertically going up relative upper and lower end parts the deflashing part 231 that extends to rectangular channel 320 that meets at right angles than long side surface and be located at some positions like this in the main part of deburring parts 230 than the upper and lower end parts of long side surface, promptly when IC being contained in the groove 320, it does not disturb the termination top of IC packaging part.
Extending to rectangular channel 320 is that the deflashing end sections 232 of eliminating burr limits than those parts in the deflashing part 231 of the upper and lower end parts of long side surface to function, and these burr may be formed on any a jiao in four jiaos of the IC packaging parts.In this example, this deflashing end sections 232 is rectangular in planimetric map, height and position is near equaling along the paired inclined surface 322X of shorter side with along the height than the paired inclined surface 322Y of long side surface.
As mentioned above, each deflashing end sections 232 stretches into the bight 320 of increasing corresponding in the groove 320.The degree of stretching out of deburring end sections is to determine size like this, if promptly four jiaos at the IC packaging part all do not have burr, when IC being inserted in the groove 320, the inclined surface 322Y that the tip at the termination top of IC packaging part reclines paired, 322Y, and do not stretch out the end edge of packaging part at termination top and paired inclined surface 322X simultaneously, 322X contacts, thereby when utilizing these inclined surface guiding, IC is descended, suitably abut in the bump 321 at groove 320 bottoms places up to the bottom surface of IC packaging part and in this maintenance, if and burr are arranged among four jiaos on the IC packaging part, burr will produce with relevant deflashing end sections 232 interferes, overslaugh IC suitably falls into groove 320, and this can be determined by design.
Be appreciated that by above-mentioned part, structure according to the precise localizer 305 of routine, when when four jiaos of IC packaging part do not have burr, the inclined surface 322Y that IC is will be in utilizing the groove 320 paired and inclined surface 322X appropriate location attitude proofreading and correct and limit is in place in pairs, recline the suitably bump 321 at place, groove 320 bottoms and of the bottom surface of IC by its maintenance.
In contrast, if form burr among four jiaos in the IC packaging part, when IC being inserted in the groove 320, the tip at the termination top on the IC packaging part and paired inclined surface 322Y, 322Y reclines mutually, and simultaneously, do not stretch out the end edge edge and paired inclined surface 322X of the packaging part at termination top, 322X contacts, after this, in the process that IC descends, utilize the surface guiding of these inclinations, one or more burr that are formed on one or more in four jiaos will interfere with relevant one or more deflashing parts 232 in burr part (one or more) 231, thereby stop further moving down of IC.
In this respect, be used for the moving head 303 of vacuum hold and conveying IC according to the present invention, its formation is suitable for exerting pressure to the IC packaging part that the top surface top from packaging part contacts one or more deburring end parts 232 by this sticking liner 306.Or rather, in case one or more relevant in one or more burr that the one or more places in four jiaos of IC packaging part form and one or more deflashing part 231 deflashing end sections 232 contacts, moving head 303 can by 306 pairs of packaging part end faces of sticking liner exert pressure up to the bottom surface of IC packaging part abut in the bump 321 located groove 320 bottoms and by its support till.Utilize by sticking liner 306 applied pressures, one or more burr at one or more place in four jiaos of IC packaging part are owing to one or more relevant deflashing part is eliminated.Therefore, make IC can drop to the end, suitably abut in up to the IC bottom surface groove bottom place bump 321 and support by it till, therefore, IC can place suitable position and utilize the paired inclined surface 322Y of groove 320 and paired inclined surface 322X proofreaies and correct and determines attitude.
Should be appreciated that by top introduction, according to the present invention, IC be loaded into test with the device holder in the carriage before, use deflashing parts 320 to eliminate for certain to be attached to IC packaging part appearance particularly at the burr at Qi Gejiao place, therefore, guarantee that IC can correctly import test with in the carriage.Thereby the device holder of the IC that packs into.Thereby in loading procedure, can prevent misalignment or damage.
In addition, the advantage that the present invention also has is, termination top of IC is damaged for it and/or crooked possibility is reduced to minimumly, therefore, improves the degree of accuracy of IC location.
Claims (4)
1. semiconductor device testing apparatus, having the semiconductor devices that is connected thereto transmits and treating apparatus, be used for that semiconductor devices to be tested is transported to part of detecting and be transported to the precalculated position by the part of detecting taking-up with the semiconductor devices that is used for after tested, it is characterized in that, comprise a position correction apparatus with the deflashing device that is used to eliminate the apparent burr of semiconductor device package that are attached to wherein to be held.
2. semiconductor device testing apparatus according to claim 1, wherein said position correction apparatus comprises at least one setting element, be formed with the groove that in planimetric map, is generally rectangle in this element, be used for holding and locating semiconductor devices at groove, described groove has peripheral side wall and four jiaos, and
Described deflashing device has only local four jiaos the deflashing end sections that stretches into described groove.
3. semiconductor device testing apparatus according to claim 2, wherein said each deflashing end sections have one and be the end of rectangle in planimetric maps.
4. according to the proving installation of claim 2 or 3 described semiconductor devices, the peripheral side wall of wherein said groove is formed with the targeting part of inclination, be used for the semiconductor devices guiding, and
The height that described each deflashing end portion branch has is corresponding to the height of the targeting part of the described inclination at edge, contiguous its underpart.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9031732A JPH10227831A (en) | 1997-02-17 | 1997-02-17 | Ic testing device |
| JP031732/97 | 1997-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1192533A true CN1192533A (en) | 1998-09-09 |
Family
ID=12339226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98106267A Pending CN1192533A (en) | 1997-02-17 | 1998-02-17 | Semiconductor device testing apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH10227831A (en) |
| KR (1) | KR19980071417A (en) |
| CN (1) | CN1192533A (en) |
| DE (1) | DE19806564A1 (en) |
| TW (1) | TW359752B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101738500A (en) * | 2008-11-20 | 2010-06-16 | 未来产业株式会社 | Equipment for correcting user tray position and test processor |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3591679B2 (en) * | 1997-04-17 | 2004-11-24 | 株式会社アドバンテスト | IC tray removal device and IC tray storage device |
| KR100334655B1 (en) * | 1998-11-30 | 2002-06-20 | 정문술 | modulan I.C handling method and carrier handling method in modular I.C handler |
| KR100287558B1 (en) * | 1998-12-09 | 2001-11-02 | 정문술 | device and method for circulating pallet ot elevator wnit in modrl I.C handler |
| KR100715459B1 (en) * | 2005-09-12 | 2007-05-07 | 학교법인 포항공과대학교 | Carrier module of test handler for semiconductor package |
| KR100704467B1 (en) * | 2006-02-28 | 2007-04-09 | (주)티에스이 | Insert for semiconductor package |
| US8829939B2 (en) * | 2011-06-03 | 2014-09-09 | Texas Instruments Incorporated | Shuttle plate having pockets for accomodating multiple semiconductor package sizes |
-
1997
- 1997-02-17 JP JP9031732A patent/JPH10227831A/en not_active Withdrawn
-
1998
- 1998-02-16 TW TW087102192A patent/TW359752B/en active
- 1998-02-17 KR KR1019980004747A patent/KR19980071417A/en not_active Application Discontinuation
- 1998-02-17 CN CN98106267A patent/CN1192533A/en active Pending
- 1998-02-17 DE DE19806564A patent/DE19806564A1/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101738500A (en) * | 2008-11-20 | 2010-06-16 | 未来产业株式会社 | Equipment for correcting user tray position and test processor |
| CN101738500B (en) * | 2008-11-20 | 2013-01-16 | 未来产业株式会社 | Equipment for correcting user tray position and test processor |
Also Published As
| Publication number | Publication date |
|---|---|
| TW359752B (en) | 1999-06-01 |
| KR19980071417A (en) | 1998-10-26 |
| DE19806564A1 (en) | 1998-08-20 |
| JPH10227831A (en) | 1998-08-25 |
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