CN102299088A

CN102299088A - Insertion piece for testing separator and device for operating the insertion piece

Info

Publication number: CN102299088A
Application number: CN201110170441A
Authority: CN
Inventors: 罗闰成; 具泰兴; 柳晛准; 黄正佑
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2010-06-23
Filing date: 2011-06-20
Publication date: 2011-12-28
Anticipated expiration: 2031-06-20
Also published as: TW201221961A; KR101532952B1; KR20110139334A; TWI436067B; CN102299088B

Abstract

The invention provides an insertion piece for testing a separator, comprising a body having a loading groove with a semiconductor device, and a pair of locking devices which are used for holding two ends of the semiconductor device in the loading groove. The bottom of the loading groove is provided with an exposing hole and a plurality of access holes. The exposing hole is used for exposing downwards the end portion of the loaded semiconductor device. The plurality of access holes are used for guiding the semiconductor device to pass through the pair of locking devices.

Description

The insert and the equipment that is used to operate this insert that are used for Test handler

Technical field

The present invention relates to a kind of insert that is used for loading and transmit semiconductor device in the Test handler and a kind ofly be used to operate this insert and make it be ready to semiconductor device is loaded in equipment on the insert.

Background technology

For the test of semiconductor device, need a kind of tester and a kind of Test handler that is used for semiconductor device is electrically connected to this tester that be used to test the semiconductor device of electrical connection.

In order to increase test capacity, Test handler uses support plate (being also referred to as " test pallet ") to load a plurality of semiconductor device simultaneously, and it comprises operating equipment and is used for semiconductor device is loaded in fetching device on the support plate.

Support plate comprises plate framework and is installed in a plurality of inserts in the plate framework with matrix form.

As the explanation of example illustration in Fig. 1 cross-sectional view, insert comprises a pair of

locking device

121 and 122, is used for stoping the semiconductor device D of the loading chute 111 that is loaded in insert 100 to separate.

As the explanation of example illustration in Fig. 2 A, operating equipment 200 comprises the operation panel 210 that promotes and fall by cylinder 220.

Operation panel 210 comprises many to operative pin 211 and 212.When operation panel 210 is picked up, this moves the

locking device

121 and 122 of insert 100 to unclamp insert 100 to

operative pin

211 and 212, make that insert is (" opening " refers to and allow the insert of loading semiconductor device to unclamp) of opening, as Fig. 2 B graphic extension.

As Fig. 3 graphic extension, the fetching device 300 that is used to transmit semiconductor device comprises a plurality of pick-ups 310, and a plurality of pick-ups 310 provide with matrix form and are used for picks up semiconductor devices.

Semiconductor device is loaded in the insert 100 and carries out in order, wherein be loaded in independent loading part, for example the semiconductor device on the user tray is chosen by fetching device 300 and is got, be sent to insert 100 tops, discharge from fetching device 300 then, so that it is loaded on the insert of opening by operating equipment 200 100.

Usually, in the Test handler that can test 512 semiconductor device simultaneously, use 10 to 15 support plates.Because single semiconductor device is loaded in the single insert usually, therefore the quantity of required insert is about 2560 to 3840.

But because semiconductor device has different size, therefore when semiconductor device to be tested changed, support plate and operating equipment needed correspondingly to change.For replacing, this has brought resource and the waste of time of not expecting.Therefore, need in identical insert, load the technology of different semiconductor device.One of technology of developing on above demand is the korean patent application open (being called as hereinafter, " correlation technique 1 ") that is entitled as " Insert for carrier board of test handler (a kind of insert that is used for the support plate of Test handler) " for 10-2009-0084007 number.

In correlation technique 1, the main body of insert (being defined as " insert main body " in correlation technique 1) is reusable, and only changes and insert bag so that can obtain the high reusability of resource.

Correlation technique 1 is considered the utilization again of insert main body, has produced economic benefit.But, must carry out to be used to detect and insert the test whether bag is connected to main body well, and this has spent many times to change the insertion bag.

On the other hand, when semiconductor device was not loaded in the insert well, semiconductor device can damage or fall when transmitting support plate.In addition and since with semiconductor device bad machinery or electrically contact, tester can damage.Therefore, need continuously research and develop semiconductor device accurately is loaded into technology in the insert.

The korean patent application open (being called as hereinafter, " correlation technique 2 ") that is entitled as " Unit for opening insert for test tray and method of mounting semiconductor device using the same (a kind of unit of the insert that is used to open test pallet and use this unit that the method for semiconductor device is installed) " for 10-2009-0102167 number is semiconductor device suitably to be loaded into one of technology example in the loading chute of insert.

Summary of the invention

Consider above content, the invention provides and a kind of the different size semiconductor device accurately is loaded in technology in the identical insert.

According to one aspect of the present invention, a kind of insert that is used for Test handler is provided, it comprises:

Main body, described main body is included in the loading chute of the semiconductor device of wherein packing into; With

A pair of locking device is used for keeping being loaded into the two ends of the described semiconductor device of described loading chute,

Wherein, have exposed hole and a plurality of access hole in the bottom of described loading chute, described exposed hole is used for exposing the end of the semiconductor device that is loaded downwards, and described a plurality of access holes are used for the loading by the described semiconductor device of operation guide of described a pair of locking device.

According to another aspect of the present invention, a kind of and the operating equipment insert logotype are provided here, wherein said insert has a pair of locking device, and described a pair of locking device is configured to keep being loaded semiconductor device thereon, and described operating equipment comprises:

Operation panel is used to make described semiconductor device can be loaded in described insert; With

Lifting device is used for promoting and falling described operation panel,

Wherein said operation panel comprises: a plurality of operative pins and a plurality of directing pin, per two one group of formations in described a plurality of operative pin are right with the described locking device of operating described insert, and per at least two constitute one group to guide semiconductor device to be loaded in the described insert in described a plurality of directing pin.

Description of drawings

Consider together with accompanying drawing that from the description of following execution mode target of the present invention and feature will become apparent, wherein:

Fig. 1 is the schematic cross section of traditional insert;

Fig. 2 A has schematically shown the perspective view of traditional operation equipment;

Fig. 2 B illustrate by the operating equipment shown in Fig. 2 A carry out insert opening operation with reference to the property cross-sectional view;

Fig. 3 is the perspective schematic view of traditional fetching device;

Fig. 4 is the schematic plan according to the insert of embodiment of the present invention;

Fig. 5 A and Fig. 5 B be the insert shown in Fig. 4 with reference to the property vertical view;

Fig. 6 is the perspective schematic view according to the operating equipment of embodiment of the present invention;

Fig. 7 and Fig. 8 be used to describe the operating equipment shown in Fig. 6 with reference to the property view;

Fig. 9 is the perspective schematic view of a part that is suitable for the fetching device of the insert shown in Fig. 4;

Figure 10 to Figure 14 be used to describe semiconductor device loading operation with reference to the property view, the loading operation of this semiconductor device is carried out by operating equipment shown in the insert shown in Fig. 4, Fig. 6 and the fetching device shown in Fig. 9; And

Figure 15 A and Figure 15 B be in the description that changes situation about dimensions of semiconductor devices with reference with reference to the property view.

Embodiment

Hereinafter, will describe embodiment of the present invention in detail with reference to the accompanying drawing that constitutes a part of the present invention.About above execution mode, like is specified by similar reference number and being described in herein of these elements omitted.

(embodiment of insert)

Fig. 4 is the schematic plan according to the insert 400 of embodiment of the present invention.

A plurality of inserts 400 are installed on the support plate (not shown) with matrix form, and as Fig. 4 graphic extension, insert 400 comprises main body 410 and a pair of

locking device

421 and 422.

Main body 410 has the loading chute 411 of loading semiconductor device therein, and wherein the bottom of loading chute 411 comprises exposed hole 412 and a plurality of access hole, for example six access hole 413a to 413f.

Exposed hole 412 forms the end that electrically contacts that exposes the semiconductor device that loaded downwards.The exemplary insert that can load BGA (ball grid array) semiconductor device thereon that shows of Fig. 4.

Six access hole 413a to 413f form and allow directing pin to pass thus.Directing pin binding operation equipment is after a while described.

As Fig. 5 A and Fig. 5 B graphic extension, six access hole 413a to 413f are longitudinally forming on the direction through the bisector L1 of the center C of loading chute 411 and five equilibrium loading chute 411 and L2, no matter (S1＜S2) how, and the vertical open pores part of bottom can be positioned at the side of semiconductor device D1 and D2 so that the width S 1 of semiconductor device D1 and D2 and S2.

Among six access hole 413a to 413f, four access hole 413a to 413d are the vertical holes that forms on bisector L2 direction, and the reinforcing rib 414 that is used for reinforced bottom intensity is formed between four access hole 413a to 413d and the exposed hole 412, and is illustrated as Fig. 4.But, might not have 414, four access hole 413a to 413d of reinforcing rib and exposed hole 412 to communicate with each other yet.

A pair of positioning recess 415a and 415b diagonal angle are formed on the last corner of main body 410 symmetrically.This is used for accurately limiting relation with the pick-up of fetching device to positioning

recess

415a and 415b.

This is provided to remain on two ends of the semiconductor device that has loaded in the loading chute 411 to

locking device

421 and 422, and comprises

rotatable lock unit

421a and 422a and

spring

421b and 422b that elastic-restoring force is provided to lock unit 421a and 422a.Because

locking device

421 and 422 is well-known in the art, so their detailed description will be omitted.

(embodiment of operating equipment)

Fig. 6 is the perspective schematic view according to the operating equipment 600 of embodiment of the present invention.

As Fig. 6 graphic extension, operating equipment 600 comprises: operation panel 610 and lifting device 620.

Operation panel 610 is thin square plates and has

operative pin

611a and 611b and directing pin 612a to 612f.

Two

operative pin

611a and 611b form one group and be used for operating the locking device of insert 400 to 421 and 422.

Six directing pin 612a to 612f form one group and be arranged on this between operative pin 611a and the 611b.When operation panel 610 rose, the group that six directing pin 612a to 612f form was raised and be inserted among six access hole 413a to 413f, thereby was ready to guide semiconductor device accurately to be loaded in the insert 400.

This group directing pin 612a to 612f has towards three couple each other, a pair of (612e wherein, 612f) be configured to be parallel to operative pin to 611a and 611b, all the other are two to (612a, 612b) and (612c, 612d) be provided in perpendicular to operative pin to 611a and 611b towards the P1 of direction each other and above the P2 direction towards each other.Illustrated as Fig. 7, the distance between the directing pin 612a to 612f is defined so that semiconductor device D can be accommodated in the rectangular area that is limited by directing pin 612a to 612f.

In addition, illustrated as Fig. 8, each among the directing pin 612a to 612f has such top: along with the bottom of going to directing pin, upper part diameter increases gradually, so that at the loading days of semiconductor device, semiconductor device D can accurately be guided.In addition, a pair of towards each other among directing pin 612a to 612f, for example 612a and 612b, between its tip top apart from the width S of T greater than semiconductor device D, and this is to equaling the width S of semiconductor device D apart from B between the directing pin bottom.Among directing pin 612a to 612f, towards each other this to having plus tolerance so that semiconductor device D can slide into the inner rectangular zone that is limited by directing pin 612a to 612f smoothly down apart from B between the directing pin bottom.

Lifting device 620 is mentioned and is fallen operation panel 610, and lifting device 620 can be formed by pneumatic cylinder, hydraulic cylinder etc.

(embodiment of fetching device)

Fig. 9 is the perspective schematic view of the part of fetching device 900.

Fetching device 900 comprises: a plurality of pick-ups 910, the main body 920 that a plurality of pick-ups 910 are installed on it, fixed strip 930 and spring 940.

In the pick-up 910 each comprises: be used for drawing semiconductor device suction pad 911, be used to limit and suck pad 911 and be inserted into the stopper 913 of the degree of depth of loading chute 411 of insert 400 and a pair of alignment pin 912a and the 912b of the bottom that the diagonal angle is located at stopper 913 symmetrically.

When pick-up 910 was fallen by the decline of fetching device 900, the bottom side that stopper 913 stops pick-up 910 declines to surpass pick-up 910 contacted the required limit with the top side of insert 400.

When pick-up 910 is fallen, in the

positioning recess

415a and 415b that is inserted into insert 400 corresponding to a pair of alignment pin 912a and the 912b of

positioning recess

415a and 415b, thereby accurately locate pick-up 910 and insert 400.For this reason, the distance between the center of

alignment pin

912a and 912b equals the distance between the center of

positioning recess

415a and 415b.

Fixed strip 930 and pick-up 910 are connected to each other with fixing pick-up 910, make pick-up 910 not rotate.

Spring 940 flexiblely support body 920 and pick-up 910 between main body 920 and pick-up 910, when descending with convenient fetching device 900, pick-up 910 be blocked device 913 stop descend after, spring 940 can cushion the decline of the main body 920 that surpasses lower limit.

(embodiment of operation)

Subsequently, will the loading of the semiconductor device of carrying out by insert 400, operating equipment 600 and fetching device 900 be described.

Semiconductor device is taken out by fetching device 900 from loading member, moves above support plate, and the pick-up 910 that stops at fetching device 900 then is corresponding to insert 400 positions that are installed on the support plate, as shown in figure 10.

Along with operating equipment 600 moves to lift operation panel 610,

operative pin

611a and 611b

operation locking device

421 and 422 are with unlatching insert 400, and directing pin 612a to 612f rises and passes six access hole 413a to 413f, as graphic extension in Figure 11.Operation while, execution before it or after it of semiconductor device can be taken out and transmit to the operation of operating equipment 600 with fetching device 900.

Subsequently, pick-up 910 descends from state shown in Figure 11, and then as Figure 12 graphic extension,

alignment pin

912a and 912b insert in positioning recess 415a and the 415b, so that pick-up 910 and insert 400 are accurately located.

When fetching device 900 when state shown in Figure 12 discharges the semiconductor device D that has taken out, semiconductor device D falls.Simultaneously, the side end of semiconductor device D is directed falling and keeps in touch with the inboard of this group directing pin 612a to 612f simultaneously, so that semiconductor device D can accurately be placed on the bottom of loading chute 411, as Figure 13 graphic extension.

In other words, owing to the top of directing pin 612a to 612f has the slope that diameter increases along with decline, therefore semiconductor device D falls to accurate " loaded " position, simultaneously its position is suitably controlled along the slope, even when semiconductor device D does not drop on the exact position in the state in early days.Therefore, as Fig. 7 graphic extension, when semiconductor device D fell fully, semiconductor device D accurately was contained in the rectangular area that the inboard by directing pin 612a to 612f limits.

Drop on directing pin 612a to 612f top under the semiconductor device D although Figure 12 and associated description thereof have illustrated and explained, semiconductor device D can drop on the top (its diameter increases along with decline) of directing pin 612a to 612f especially.Therefore, the position, whereabouts of semiconductor device D can be selected by the structure of consideration operating equipment 600 and the height of directing pin 612a to 612f.

When operating equipment 600 is operated with reduction operation panel 610 from opposite states shown in Figure 13 ground, the locking device of being controlled by

operative pin

611a and

611b

421 and 422 unclamps, and locking

device

421 and 422 keeps semiconductor device D, as Figure 14 graphic extension, thereby finish the loading of semiconductor device D.

Meanwhile, under the situation that size of semiconductor device to be tested changes, for example, larger sized semiconductor device only needs to change according to size of semiconductor device to be tested the operation panel 610 of operating equipment 600 with tested.

Figure 15 A is consistent with Fig. 7, and Figure 15 B illustrates semiconductor device D2 size to be tested situation greater than the semiconductor device D1 shown in Figure 15 A.Comparison by Figure 15 A and Figure 15 B, when illustrated test has than the larger sized semiconductor device D2 of semiconductor device D1 size in as Figure 15 B, operation panel is substituted by another operation panel, and wherein the directing pin 612a ' of the operation panel of Ti Daiing is to the consistent size of the distance between the 612f ' with semiconductor device D2.In this case, because the access hole 413a to 413f of insert 400 longitudinally forms from the bisector to the outside, when therefore even face to face paired directing pin 612a to 612f towards each other or the distance of 612a ' between 612f ' increased, directing pin 612a to 612f or 612a ' also must pass access hole 413a to 413f to 612f '.

Correspondingly, be standard at least if pass the end of exposed hole 412 semiconductor device to be exposed, might only not change the test that insert 400 just can support to have the semiconductor device of different size so by changing operation panel 610.Here, the distal end that the term of the standardization end of semiconductor device only refers to semiconductor device can be positioned at the outside of exposed hole 412 (referring to Fig. 4, many groove shaped become the distal end corresponding to semiconductor device, so that distal end can be inserted wherein desired depth), rather than refer to that the quantity of semiconductor device end is identical.

According to the present invention described above, the semiconductor device of different size can be loaded in the insert, thereby improves the utilization again of resource.

In addition, although semiconductor device to be tested can change,, therefore be used to change the time decreased of cost, and increased the operating efficiency of Test handler owing to only change the operation panel of operating equipment.

In addition, can be inserted into any semiconductor device in the loading chute of insert can accurately load and put in place.

Can make different changes and modification and do not depart from the scope of the present invention that is defined by the following claims though the content that the present invention has illustrated and described with reference to execution mode, it will be recognized by those skilled in the art that.

Claims

1. insert that is used for Test handler comprises:

Main body, described main body are included in the wherein loading chute of loading semiconductor device; With

2. insert as claimed in claim 1, at least one in the wherein said access hole longitudinally are formed on from the bisector of dividing described loading chute equally and passing the center of described loading chute, on the direction of the outside of described loading chute.

3. insert as claimed in claim 1, wherein reinforcing rib is formed between at least one and the described exposed hole in the described access hole.

4. operating equipment that uses with insert, wherein said insert has a pair of locking device, and described a pair of locking device is configured to keep loading semiconductor device thereon, and described operating equipment comprises:

Lifting device is used for promoting and reducing described operation panel,

Wherein said operation panel comprises a plurality of operative pins and a plurality of directing pin, per two one group of formations in described a plurality of operative pin are right with the described locking device of operating described insert, and per at least two constitute one group to guide semiconductor device to be loaded in the described insert in described a plurality of directing pin.

5. operating equipment as claimed in claim 4, wherein said directing pin have the diameter that increases from top to bottom;

Wherein in the directing pin of described formation group, across described wait to be loaded into semiconductor device in the described insert towards the width of the distance between the top of each other a pair of directing pin greater than described semiconductor device, and the distance between the bottom of described a pair of directing pin equals the width of described semiconductor device and has plus tolerance, so that can hold described semiconductor device.