TWI436067B - Insert for test handler and apparatus for operating the same - Google Patents

Description

Insert for testing the sorter and equipment for operating the insert

The present invention relates to an insert for loading and transporting a semiconductor device in a test sorter and an apparatus for operating the insert to prepare it for loading a semiconductor device on an insert.

For testing semiconductor devices, there is a need for a tester for testing an electrically connected semiconductor device and a test sorter for electrically connecting the semiconductor device to the tester.

To increase the test capacity, the test sorter uses a carrier (also referred to as a "test tray" tray) to simultaneously load a plurality of semiconductor devices including an operating device and pick and place devices for loading the semiconductor device on the carrier.

The carrier board includes a board frame and a plurality of inserts mounted in a matrix form in the board frame.

The insert as schematically illustrated in the cross-sectional view of the first figure includes a pair of latching means 121 and 122 for preventing the semiconductor device D loaded in the loading slot 111 of the insert 100 from being separated.

The operating device 200 as illustrated in the second diagram A includes an operating panel 210 that is raised and lowered by a cylinder 220.

The operation panel 210 includes a plurality of pairs of operation pins 211 and 212. When the operation panel 210 is lifted, the pair of operation pins 211 and 212 move the locking devices 121 and 122 of the insert 100 to release the insert 100 so that the insert is opened ("open" refers to allowing loading The insert of the semiconductor device is loosened, as shown in Figure B.

The pick and place device 300 for transporting a semiconductor device as shown in the third figure includes a plurality of pickers 310 that are provided in a matrix form and used to pick up semiconductor devices.

The loading of the semiconductor device into the interposer 100 is sequential, wherein the semiconductor device loaded on a separate loading component, such as a user tray, is picked up by the pick and place device 300, transferred over the insert 100, and then removed from the pick and place device The 300 is released such that it is loaded on the insert 100 that is opened by the operating device 200.

Typically, 10 to 15 carrier plates are used in a test handler capable of testing 512 semiconductor devices simultaneously. Since a single semiconductor device is typically loaded in a single interposer, the number of interposers required is between about 2,560 and 3,840.

However, since the semiconductor devices have different sizes, when the semiconductor device to be tested is changed, the carrier board and the operating device need to be replaced accordingly. For replacement, this creates a waste of unwanted resources and time. Therefore, there is a need for a technique of loading different semiconductor devices in the same interposer. One of the technologies developed in the above requirements is the Korean Patent Application Publication No. 10-2009-0084007 entitled "Insert for carrier board of test handler" (under In the text, it is called "Related Technology 1").

In the related art 1, the main body of the insert (defined as "insert main body" in Related Art 1) is reused, and only the insertion pocket is replaced so that the capital can be obtained. High reusability of the source.

Related Art 1 yields economic benefits in consideration of reuse of the insert body. However, a test for detecting whether the insertion pocket is well connected to the main body must be performed, and it takes a lot of time to replace the insertion pocket.

On the other hand, when the semiconductor device is not well loaded in the interposer, the semiconductor device may be damaged or dropped when the carrier is transferred. In addition, the tester can be damaged due to poor mechanical or electrical contact with the semiconductor device. Therefore, there is a need to continuously research and develop a technique for accurately loading a semiconductor device into an insert.

The Korean Patent Application Publication No. 10-2009-0102167 is entitled "A unit for opening an insert for testing a test tray and a method for mounting a semiconductor device using the unit" (Unit for opening insert for test tray and method of mounting semiconductor device using The same) (hereinafter referred to as "Related Art 2") is one of technical examples in which a semiconductor device is appropriately loaded into a loading slot of an insert.

Based on the above, the present invention provides a technique for accurately loading semiconductor devices of different sizes in the same insert.

According to an aspect of the present invention, an insert for testing a sorting machine is provided, comprising: a body including a loading slot in which a semiconductor device is housed; and a pair of locking devices for maintaining Loading both ends of the semiconductor device in the loading slot, Wherein the bottom of the loading slot has an exposed hole for downwardly exposing an end of the loaded semiconductor device, and a plurality of access holes for passing the pair of locks The operation of the shutdown device directs the loading of the semiconductor device.

In accordance with another aspect of the present invention, there is provided an operating device for use with an insert, wherein the insert has a pair of latching devices configured to hold a semiconductor loaded thereon The operation device includes: an operation panel for enabling the semiconductor device to be loaded on the insert; and a lifting device for lifting and lowering the operation panel, wherein the operation panel includes: a plurality of An operating pin and a plurality of guiding pins, each of the plurality of operating pins forming a group to operate the pair of locking devices of the insert, at least two of the plurality of guiding pins forming a group A semiconductor device is guided to be loaded in the insert.

100‧‧‧ inserts

111‧‧‧Loading trough

121‧‧‧Locking device

122‧‧‧Locking device

D‧‧‧Semiconductor device

200‧‧‧Operating equipment

210‧‧‧Operator panel

211‧‧‧Operational sales

212‧‧‧Operational sales

220‧‧‧Cylinder

300‧‧‧ pick and place device

310‧‧‧ Picker

400‧‧‧ Inserts

410‧‧‧ Subject

411‧‧‧Loading trough

412‧‧‧Exposing holes

413a‧‧‧ access hole

413b‧‧‧ access hole

413c‧‧‧ access hole

413d‧‧‧ access hole

413e‧‧‧ access hole

413f‧‧‧ access hole

414‧‧‧Reinforcement ribs

415a‧‧‧ positioning notch

415b‧‧‧ positioning notch

421‧‧‧Locking device

421a‧‧‧Locking parts

421b‧‧ ‧ spring

422‧‧‧Locking device

422a‧‧‧Locking parts

422b‧‧ ‧ spring

C‧‧‧ Center

D1‧‧‧Semiconductor device

L1‧‧‧ bisector

L2‧‧‧ bisector

S1‧‧‧Width

S2‧‧‧Width

600‧‧‧Operating equipment

610‧‧‧Operator

611a‧‧‧Operational sales

611b‧‧‧ operation pin

612a‧‧‧Guidance pin

612b‧‧‧Guidance pin

612c‧‧‧Guidance pin

612d‧‧‧ Guide pin

612e‧‧‧Guidance pin

612f‧‧‧Guidance pin

620‧‧‧ lifting device

B‧‧‧ distance

S‧‧‧Width

T‧‧‧ distance

900‧‧‧ pick and place device

910‧‧‧ Picker

911‧‧ Inhalation pad

912a‧‧ Locating pin

912b‧‧‧Locating pin

913‧‧‧blocker

920‧‧‧ Subject

930‧‧‧Fixed strip

940‧‧ ‧ spring

413a’‧‧‧ access hole

413b’‧‧‧ access hole

413c’‧‧‧ access hole

413d’‧‧‧ access hole

413e’‧‧‧ access hole

413f’‧‧‧ access hole

612a’‧‧‧ Guide pin

612b’‧‧‧ Guide pin

612c’‧‧‧ Guide pin

612d’‧‧‧ Guide pin

612e’‧‧‧ Guide pin

612f’‧‧‧ Guide pin

The first figure is a schematic cross-sectional view of a conventional insert; the second A is a schematic view showing a perspective view of a conventional operating device; and the second B is an operating device shown in the second A showing the opening of the insert A cross-sectional view of the operation; a third is a schematic perspective view of a conventional pick-and-place device; a fourth view is a schematic plan view of the insert in accordance with an embodiment of the present invention; fifth and fifth B are a reference top view of the insert shown in the four figures; a sixth view is a schematic perspective view of the operating device in accordance with an embodiment of the present invention; 7 and 8 are reference views for describing the operating device shown in the sixth drawing; the ninth drawing is a partially schematic perspective view of the pick-and-place device suitable for the insert shown in the fourth figure; Tenth to fourteenth drawings are reference views for describing a loading operation of a semiconductor device, the loading operation of which is performed by the insert shown in the fourth figure, the operating device shown in the sixth figure, and The pick-and-place device shown in the ninth figure is executed; and the fifteenth A and fifteenth Bth drawings are reference views to be referred to in the description regarding the dimensional change of the semiconductor device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings which form a part of this invention. With respect to the above embodiments, like elements are designated by like element symbols, and the description of these elements is omitted herein.

(Example of an insert)

The fourth figure is a schematic top view of an insert 400 in accordance with an embodiment of the present invention.

A plurality of inserts 400 are mounted in a matrix form on a carrier (not shown), and as shown in the fourth figure, the insert 400 includes a body 410 and a pair of latching devices 421 and 422.

The body 410 has a loading slot 411 in which a semiconductor device is loaded, wherein the bottom of the loading slot 411 includes an exposure hole 412 and a plurality of access holes, for example, six access holes 413a to 413f.

The exposure hole 412 is formed to expose the electrical contact end of the loaded semiconductor device downward. The fourth figure exemplarily shows that a BGA (Ball Grid Array) semiconductor device can be mounted thereon Insert.

The six access holes 413a to 413f are formed to allow the guide pin to pass therethrough. The guide pin will be described later in connection with the operating device.

As shown in FIGS. 5A and 5B, the six access holes 413a to 413f are longitudinally formed in the direction along the center line C passing through the loading groove 411 and equally dividing the bisectors L1 and L2 of the loading groove 411, So that the vertical opening portions of the bottom portion can be located on the sides of the semiconductor devices D1 and D2 regardless of the widths S1 and S2 (S1 < S2) of the semiconductor devices D1 and D2.

Among the six access holes 413a to 413f, the four access holes 413a to 413d are longitudinal holes formed in the direction along the bisector L2, and reinforcing ribs 414 for reinforcing the strength of the bottom are formed in the four access holes 413a to 413d and the exposed hole 412, as shown in the fourth figure. However, it is also possible that the reinforcing ribs 414 are not required, and the four access holes 413a to 413d and the exposure holes 412 communicate with each other.

A pair of positioning recesses 415a and 415b are formed diagonally symmetrically at the upper corner of the body 410. The pair of positioning recesses 415a and 415b are used to precisely define the relationship with the pickup of the pick and place device.

The pair of locking devices 421 and 422 are provided to hold both ends of the loaded semiconductor device in the loading slot 411, and include rotatable locking members 421a and 422a and elastic return to the locking members 421a and 422a Forced springs 421b and 422b. Since the locking devices 421 and 422 are well known in the art, their detailed description will be omitted.

(Example of operating device)

The sixth drawing is a schematic perspective view of the operating device 600 in accordance with an embodiment of the present invention.

As shown in the sixth figure, the operation device 600 includes an operation panel 610 and a lifting device 620.

The operation panel 610 is a thin square plate and has operation pins 611a and 611b and guide pins 612a to 612f.

The two operating pins 611a and 611b form a group and are used to operate the locking device pairs 421 and 422 of the insert 400.

The six guide pins 612a to 612f are grouped together and disposed between the pair of operation pins 611a and 611b. When the operation panel 610 is raised, the group of the six guide pins 612a to 612f is raised and inserted into the six entrance holes 413a to 413f, so as to be ready to guide the semiconductor device to be accurately loaded into the insert 400.

The set of guide pins 612a to 612f have three pairs facing each other, one of which (612e, 612f) is disposed parallel to the pair of operation pins 611a and 611b, and the remaining two pairs (612a, 612b) and (612c, 612d) are It is disposed to face each other in the directions of P1 and P2 perpendicular to the direction in which the pair of operation pins 611a and 611b face each other. As shown in the seventh diagram, the distance between the guide pins 612a to 612f is defined such that the semiconductor device D can be accommodated in a rectangular area defined by the guide pins 612a to 612f.

Further, as shown in the eighth diagram, each of the guide pins 612a to 612f has an upper portion in which the diameter of the upper portion is gradually increased as going to the lower portion of the guide pin, so that the semiconductor device D can be mounted during loading of the semiconductor device Being accurately guided. In addition, a pair facing each other among the guide pins 612a to 612f, for example, 612a and 612b, the distance T between the tip tops thereof is larger than the width S of the semiconductor device D, and the distance B between the bottoms of the pair of guide pins is equal to The width S of the semiconductor device D. Among the guide pins 612a to 612f, the distance B between the pair of guide pin faces facing each other may have a positive The tolerance is such that the semiconductor device D can smoothly slide down into the inner rectangular area defined by the guide pins 612a to 612f.

The lifting device 620 lifts and lowers the operation panel 610, and the lifting device 620 may be formed of a pneumatic cylinder, a hydraulic cylinder, or the like.

(Example of pick and place device)

The ninth diagram is a partial schematic perspective view of the pick and place device 900.

The pick and place device 900 includes a plurality of pickers 910, a main body 920 on which a plurality of pickers 910 are mounted, a fixing bar 930, and a spring 940.

Each of the pickups 910 includes a suction pad 911 for sucking up the semiconductor device, a stopper 913 for restricting the depth in which the suction pad 911 is inserted into the loading groove 411 of the insert 400, and a diagonally symmetrically disposed barrier A pair of positioning pins 912a and 912b at the bottom of the 913.

When the pickup 910 is lowered by the lowering of the pick-and-place device 900, the stopper 913 prevents the pickup 910 from falling beyond the limit required for the bottom side of the pickup 910 to contact the top side of the insert 400.

When the pickup 910 is lowered, a pair of positioning pins 912a and 912b corresponding to the positioning notches 415a and 415b are inserted into the positioning notches 415a and 415b of the insert 400, thereby accurately positioning the pickup 910 and the insert 400. To this end, the distance between the centers of the positioning pins 912a and 912b is equal to the distance between the centers of the positioning notches 415a and 415b.

The fixing bar 930 and the pickup 910 are connected to each other to fix the pickup 910 such that the pickup 910 does not rotate.

The spring 940 elastically supports the main body 920 and the pickup between the main body 920 and the pickup 910 The spring 940 can buffer the lowering of the body 920 that exceeds the lower limit after the picker 910 is prevented from descending by the stopper 913 when the pick-and-place device 900 is lowered.

(Operational Example)

Subsequently, the loading of the semiconductor device performed by the interposer 400, the operation device 600, and the pick and place device 900 will be described.

The semiconductor device is taken out of the loading and unloading device 900 from the loading member, moved over the carrier, and then stopped at the position of the inserter 910 of the pick and place device 900 corresponding to the insert 400 mounted on the carrier, as shown in FIG. .

When the operation device 600 operates to lift the operation panel 610, the operation pins 611a and 611b operate the lock devices 421 and 422 to open the insert 400, and the guide pins 612a to 612f rise and pass through the six access holes 413a to 413f, as in Figure 11 shows. The operation of the operation device 600 may be performed simultaneously with, before, or after the operation of the pick-and-place device 900 to take out and transfer the semiconductor device.

Subsequently, the pickup 910 is lowered from the state shown in Fig. 11, and then, as in the twelfth figure, the positioning pins 912a and 912b are inserted into the positioning recesses 415a and 415b to accurately position the pickup 910 and the insert 400.

When the pick-and-place device 900 releases the taken-out semiconductor device D from the state shown in the twelfth figure, the semiconductor device D falls. At the same time, the side end portions of the semiconductor device D are guided to fall while being kept in contact with the inner sides of the set of the guide pins 612a to 612f, so that the semiconductor device D can be accurately placed on the bottom of the loading groove 411 as in the thirteenth diagram.

In other words, since the upper portion of the guide pins 612a to 612f has a slope in which the diameter increases as it descends, the semiconductor device D falls to the precise loading position while its position The placement is appropriately controlled along the slope even when the semiconductor device D does not fall in the precise position in the early state. Therefore, as shown in the seventh figure, when the semiconductor device D has completely fallen, the semiconductor device D is accurately mounted in a rectangular region defined by the inner side of the guide pins 612a to 612f.

Although the twelfth figure and its related description have explained and explained that the semiconductor device D falls over the guide pins 612a to 612f, the semiconductor device D may particularly fall on the upper portion of the guide pins 612a to 612f (the diameter thereof increases as the diameter decreases) ). Therefore, the drop position of the semiconductor device D can be selected by considering the structure of the operation device 600 and the heights of the guide pins 612a to 612f.

When the operation device 600 is reversely operated from the state shown in the thirteenth diagram to lower the operation panel 610, the lock devices 421 and 422 operated by the operation pins 611a and 611b are loosened, and the lock devices 421 and 422 hold the semiconductor device D As shown in FIG. 14, the loading of the semiconductor device D is completed.

At the same time, in the case where the size of the semiconductor device to be tested is changed, for example, a semiconductor device of a larger size will be tested, and only the operation panel 610 of the operation device 600 needs to be replaced according to the size of the semiconductor device to be tested.

The fifteenth A and seventh figures are identical, and the size of the semiconductor device D2 to be tested shown in the fifteenth B is larger than that of the semiconductor device D1 shown in the fifteenth A. By comparison of the fifteenth A picture and the fifteenth B picture, when the test as shown in the fifteenth B picture has the semiconductor device D2 having a size larger than that of the semiconductor device D1, the operation panel is replaced by another operation panel The distance between the guide pins 612a' to 612f' of the alternative operation panel coincides with the size of the semiconductor device D2. In this case, since the access holes 413a to 413f of the insert 400 are formed longitudinally from the bisector to the outside, even when When the distance between the pair of guide pins 612a to 612f or 612a' to 612f' of each other increases, the guide pins 612a to 612f or 612a' to 612f' must also pass through the entrance holes 413a to 413f.

Thus, if the end of the semiconductor device to be exposed through the exposure hole 412 is at least standard, it is possible to support the test of semiconductor devices having different sizes by merely replacing the operation panel 610 without replacing the interposer 400. Here, the term of the normalized end portion of the semiconductor device only means that the most distal end portion of the semiconductor device can be located outside the exposed hole 412 (see the fourth figure, a plurality of grooves are formed to correspond to the most distal end portion of the semiconductor device, It is possible to insert the most distal portion into a predetermined depth thereof, instead of referring to the number of semiconductor device ends being the same.

According to the invention as described above, semiconductor devices of different sizes can be loaded in the interposer, thereby improving resource reuse.

Further, although the semiconductor device to be tested may be changed, since only the operation panel of the operation device is replaced, the time taken for replacement can be reduced, and the work efficiency of the test handler can be increased.

In addition, any semiconductor device that can be inserted into the loading slot of the insert can be accurately loaded into place.

Although the present invention has been shown and described with reference to the embodiments of the present invention, it will be understood that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

400‧‧‧ Inserts

410‧‧‧ Subject

411‧‧‧Loading trough

412‧‧‧Exposing holes

413a‧‧‧ access hole

413b‧‧‧ access hole

413c‧‧‧ access hole

413d‧‧‧ access hole

413e‧‧‧ access hole

413f‧‧‧ access hole

414‧‧‧Reinforcement ribs

415a‧‧‧ positioning notch

415b‧‧‧ positioning notch

421‧‧‧Locking device

421a‧‧‧Locking parts

421b‧‧ ‧ spring

422‧‧‧Locking device

422a‧‧‧Locking parts

422b‧‧ ‧ spring

Claims (4)

An insert for testing a sorting machine, comprising: a body including a loading slot in which a semiconductor device is loaded; and a pair of locking devices for holding the semiconductor device loaded into the loading slot Both ends of the loading slot have an exposed hole and a plurality of access holes for exposing the ends of the loaded semiconductor device downward, the access holes for locking by the pair The operation of the device is for guiding the loading of the semiconductor device, wherein at least one of the access holes is longitudinally formed in a direction from the bisector that bisects the loading slot and passes through the center of the loading slot, toward the outside of the loading slot on. The insert of claim 1, wherein a reinforcing rib is formed between at least one of the access holes and the exposed hole. An operating device for use with an insert, wherein the insert has a pair of locking devices configured to hold a semiconductor device mounted thereon, the operating device comprising: an operating panel for the semiconductor a device capable of being loaded on the insert; and a lifting device for lifting and lowering the operating panel, wherein the operating panel includes a plurality of operating pins and a plurality of guiding pins, each of the two operating pins forming a group The pair of latching devices of the insert are operated, at least two of the guide pins forming a group to guide the semiconductor device to be loaded in the insert. The operating device of claim 3, wherein the guide pin has a diameter that increases from top to bottom; Wherein in the guide pin of the constituent group, the distance between the tops of the pair of guide pins facing each other across the semiconductor device to be loaded in the insert is greater than the width of the semiconductor device, and the bottom of the pair of guide pins The distance between the two is equal to the width of the semiconductor device and has a positive tolerance so as to be able to accommodate the semiconductor device.