KR101146683B1 - An insert for semiconductor package - Google Patents

Abstract

A body portion having a pocket for containing a semiconductor package to be tested; A latch unit disposed symmetrically on both sides with a pocket interposed therebetween, and including a latch unit configured to prevent detachment of the contained semiconductor package, wherein the latch unit includes: a button having a pair interposed between the pockets so as to be movable up and down; One end is rotatably connected by a button and a movable shaft, and the other end is movable to a clamping position for preventing the detachment of the contained semiconductor package from being exposed to the pocket and to a release position for allowing the semiconductor package to move away from the pocket. A latch having a guide groove which is cam guided along a guide pin installed in the body to rotate about the movable shaft during a lowering operation of the button; And an elastic member providing a return force so that the button is exposed to the outside of the body portion. The latch is rotated to a release position in a state where the button is pressed, so that the semiconductor package can be stored and removed in a pocket. Toggle inserts are disclosed.

Description

Stop toggle insert for semiconductor package {An insert for semiconductor package}

The present invention relates to a stop toggle insert for a semiconductor package, and more particularly, to a stop toggle insert for a semiconductor package in which a semiconductor package to be tested can be mounted in a pocket.

In general, a semiconductor package manufactured by a semiconductor package manufacturing process undergoes reliability tests such as electrical property test and function test before shipment. A handler is mainly used to transfer the manufactured semiconductor package to a test apparatus and to transfer the semiconductor package to classify the tested semiconductor package.

The handler carries a plurality of semiconductor packages into a test apparatus, and conducts a test process by electrically contacting each semiconductor package to a test head through a test socket. Each semiconductor package after the test is completed is taken out from the test head and classified according to the test result.

In this case, the handler may test the semiconductor package by transferring a plurality of test trays containing inserts, each containing individual semiconductor packages, into the test chamber.

In other words, inserts for semiconductor packages are mounted on the test tray.

Referring to a process for mounting a semiconductor package on each of a plurality of inserts for a semiconductor package mounted on the test tray, the process was conventionally performed in three steps.

In other words, in order to clamp the semiconductor package on the carrier tray, the robot moves on the carrier tray and moves on the Z axis (up and down direction) to grasp the package, and the robot holding the package is arranged in advance before mounting the semiconductor package on the insert on the test tray. Go to the Precise position and arrange the packages. The robot then moves the aligned package from the precise position to the test tray position and mounts it on the insert for receiving the semiconductor package. By repeating this process a plurality of times (eg, a total of eight times), it is possible to mount all the semiconductor packages to the test tray. However, there are problems in that physical and time damages occur because tens of thousands of package rocks are generated during the loading process of the semiconductor package.

In other words, when the robot grabs the semiconductor package from the carrier tray and immediately mounts the semiconductor package to the insert for storing the semiconductor package, the semiconductor package is not aligned, and thus the robot package cannot be properly seated on the carrier insert. There is a problem. Due to such a loading process problem, productivity is drastically reduced.

In the case of a conventional insert for storing a semiconductor package, the latch is exposed to the pocket in a state where the semiconductor package is stored in the pocket to prevent the semiconductor package from being separated from the pocket by the latch. The semiconductor package is configured to be rotated in conjunction with the pressing operation of a button provided to be lifted up and down from the upper portion of the semiconductor package storage insert, and when the semiconductor package is bent by any external force, the latch is also latched by the bent operation of the semiconductor package. Is configured to be lifted (rotated) to move, so that it is impossible to keep the semiconductor package in a stable clamped state, and the semiconductor package is inverted when the insert is inserted or when a force is applied to the semiconductor package during the test. Latch lifts by bouncing force So there is a problem in that an error, such as mounting state of the pocket of the semiconductor package is to be changed or release occurs.

SUMMARY OF THE INVENTION The present invention was made in view of the above, and an object thereof is to provide a stop toggle insert for a semiconductor package which is improved to be stably seated on an insert without undergoing a package alignment process at a pre-sequence position. There is this.

In addition, the present invention provides an improved stop toggle insert for a semiconductor package to fundamentally prevent the latch and the button holding the semiconductor package from being moved by an arbitrary force from the outside while the semiconductor package is seated inside the pocket. Its purpose is to.

A stop toggle insert for a semiconductor package according to the present invention for achieving the above object includes a body portion having a pocket for containing a semiconductor package to be tested; And a latch unit disposed symmetrically on both sides with the pocket interposed therebetween, wherein the latch unit prevents the detached semiconductor package from being separated. The latch unit includes a pair between the pockets so that the pair is movable upward and downward. A button; One end is rotatably connected by the button and the movable shaft, and the other end is moved to a clamping position for preventing detachment of the semiconductor package housed by being exposed to the pocket and to a release position for allowing movement of the semiconductor package away from the pocket. A latch having a guide groove cam-guided along a guide pin installed in the body portion to rotate about the movable shaft when the button is moved up and down; And an elastic member providing a return force so that the button is exposed to the outside of the body portion, wherein the latch is rotated to the release position while the button is pressed to accommodate and remove the semiconductor package into the pocket. It is done.

Here, the guide groove, the straight section formed in a straight line to guide the rotation of the latch while moving along the guide pin; And a curved groove formed at the end of the straight section so as to allow the guide pin to be seated so that the latch is stably positioned at the clamping position.

In addition, the straight section is located in a direction parallel to the Z axis in the state where the latch is located in the clamping position, it is preferably formed to be positioned in a posture orthogonal to the Z axis in the state where the latch is located in the release position.

The pocket may include a short width inner surface corresponding to the short width of the semiconductor package; A long width inner surface corresponding to the long width of the semiconductor package; And a mounting rib formed at the lowermost end of each of the short width and long width inner surfaces to be seated and supported by the semiconductor package.

In addition, the short width inner surface has a short width first vertical surface, a short width inclined surface and a short width second vertical surface formed step by step from the upper leading portion of the pocket to the seating rib, wherein the short width first vertical surface is the upper and lower thickness of the body portion It is good to be formed with a height of 1/3 or more to less than 1/2 on the basis of.

In addition, the long width inner surface has a long width first inclined surface, a long width second inclined surface and a long width vertical surface formed step by step from the upper leading portion of the body portion to the seating rib, the long width first slope is the inlet portion of the pocket It is preferably formed to extend from the bottom to the depth of 2/3 or more of the upper and lower thickness of the body portion.

In addition, the long width second inclined surface may be formed to have a greater inter-angle angle based on the Z axis than the long width first inclined surface.

In addition, the long width first inclined surface is formed so that the angle between the Z-axis is 11 to 13 degrees, the long width second inclined surface is preferably formed so that the angle between the Z-axis and 28 to 32 degrees. .

 The guide groove is formed in a straight line, the center of the arc and the center of the movable shaft of both ends of the guide groove is arranged to form a vertex of the triangle,

In addition, one end of the guide groove may be formed to be as close to the movable shaft as possible and the other end is spaced apart from the movable shaft as much as possible.

Further, the movable shaft is located at a position lower than the guide pin in the state that the latch is located in the release position, the movable shaft is formed at a position higher than the guide pin in the state of clamping position,

The guide groove may be formed in a straight line shape, positioned in a horizontal direction perpendicular to the vertical axis (Z axis) at the release position, and formed to maintain an angle of 45 degrees or less with respect to the vertical axis (Z axis) at the clamping position. .

In addition, when an external force is applied in a direction in which the latch is positioned at the clamping position and lifted from the other end of the latch, an outer inner surface of the lifting hole in which the latch is movable to be lifted and lowered while the button connected to the latch is inclined; In contact with the inner inner surface, it is preferable that the gap is maintained between the button and the inner surface of the lifting hole so that the button can be tilted so that the lowering operation of the button is suppressed by the frictional force caused by the contact.

According to the stop toggle insert for a semiconductor package of the present invention, even if the semiconductor package is freely dropped into the insert's pocket in an unaligned state, it can be stored in the pocket without interfering with the latch, and the width and width of the pocket are lowered while descending toward the seating rib. Guided by the inner surfaces can be properly aligned and centered to be seated.

In this way, even a stop toggle insert for a semiconductor package can be aligned and accommodated in a non-aligned, loaded and dropped semiconductor package, so that the semiconductor package can be moved to a pre-positioned position during the loading process of loading the test package into a test tray for testing. The step of aligning can be omitted.

Therefore, by simplifying and shortening the loading process of the semiconductor package it is possible to significantly reduce the number of falling of the semiconductor package in the loading process.

In addition, the loading process of the semiconductor package can be shortened, thereby reducing the number of facilities and obtaining the maximum efficiency with the minimum equipment. Therefore, the test efficiency as well as the overall semiconductor package has the advantage of increasing the productivity.

In addition, according to the present invention, even if the latch is subjected to force by its own weight or external force, it is possible to fundamentally suppress the rotation before the button is pressed, thereby preventing the semiconductor package stored at the time of operation from being detached, thereby improving the reliability of the operation. It can increase. That is, except for the operation of rotating the latch by pressing a button, the latch has a connection structure between the latch and the button even when a semiconductor package mounted in a pocket is generated by any external force, even if a force is generated by the semiconductor package. And the button movement is blocked by the frictional force due to the contact between the two points symmetrical between the button and the lifting hole can be prevented from rotating the latch in the end, and can prevent the separation of the semiconductor package to increase the reliability of the operation. There is an advantage to that.

Hereinafter, a stop toggle insert for a semiconductor package according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1, 2, 3, 4, and 5, a stop toggle insert for a semiconductor package according to an embodiment of the present invention includes a pocket 110 in which a semiconductor package 10 is inserted and mounted in a central portion thereof. The body part 100 is formed, and the latch part 200 is installed on both sides of the pocket 110 to prevent separation of the semiconductor package 10 stored in the pocket 110.

In the body part 100, one pocket 110 on which the semiconductor package 10 is mounted is formed at a central portion thereof, and is formed to penetrate up and down.

The pocket 110 is formed in an approximately quadrangular frame shape. A bottom rib of the pocket 110 is formed with a seating rib 140 on which the edge of the semiconductor package 10 introduced through the top of the pocket 110 is seated and supported.

As shown, the pocket 110 is formed to have a long width and a short width, and has a pair of short width inner surfaces 120 corresponding to the short width and a pair of long width inner surfaces 130 corresponding to the long width.

The short width inner side surface 120 is divided into a top width of the pocket 110, that is, the first width 121, the short width inclined surface 122, and the short width second vertical surface 123 from the inlet to the seating rib 140. Has An interval between the pair of short width first vertical surfaces 121 facing each other is greater than the width of the semiconductor package 10.

In addition, the gap between the short width slopes 122 may be larger than the short width of the semiconductor package 10. However, the interval between the short width slopes 122 gradually decreases toward the short width second vertical surface 123. Therefore, when the semiconductor package 10 is introduced from the upper lead portion of the pocket 110, the semiconductor package 10 may be easily entered into the pocket 110 without interfering with the short vertical first surface 121, and after entering, the short width inclined surfaces 122. The attitude is lowered while being guided by), so that the posture is naturally aligned so as to be positioned at the center portion of the pocket 110, and when it is seated on the seating rib 140, the semiconductor package 10 is shortened by the second vertical surfaces 123. ), The short width side edge is supported and stored in a stable alignment.

Here, the short width first vertical surface 121 is formed at a height of 1/3 or more to less than 1/2 on the basis of the vertical height of the body portion 100, that is, the vertical thickness. Therefore, even if the semiconductor package 10 is moved to the clamped state without being properly aligned with the robot and freely falls into the pocket 110, the short width first vertical surface 121 is formed with a sufficient depth and width, The semiconductor package 10 may enter the inside of the pocket 110 without interfering with the inner side surfaces of the pocket 110. As will be described in detail later, since the inside of the pocket 110 is not interfered with the latch 210 while the semiconductor package 10 is entered, the semiconductor package 10 is stably aligned with the pocket 110 while preventing the detachment of the semiconductor package 10. I can receive it.

The short width second vertical surface 123 is formed at a lower end of the short width inclined surface 122 in a vertical direction, and preferably has a height smaller than the thickness of the semiconductor package 10. Therefore, the semiconductor package 10 may be guided along the short width inclined surface 122 to be stably seated on the mounting rib 140. Therefore, the gap between the short width second vertical surfaces 123 is formed at an interval corresponding to the short width of the semiconductor package 10.

The long width inner side surface 130 corresponds to the long width of the semiconductor package 10, and has a long width first inclined surface 131, a long width second inclined surface 132, and a long width vertical surface in the upper portion of the pocket 110. 133). The long width first inclined surface 131 is formed to extend to a depth of 2/3 or more of the height of the body portion 100 from the inlet portion to the lower portion of the pocket 110. The long width second inclined surface 132 is formed over a short interval so as to connect between the long width first inclined surface 131 and the long width vertical surface 133, and the semiconductor package is aligned along the long width first inclined surface 131. 10) is formed at an inclination smaller than the long width first inclined surface 131 so as to be accurately guided to the long width vertical surface 133 so as to be accurately received. The long width vertical surface 133 is formed at the same height as the short width second vertical surface 123 and serves to stably support the edge of the semiconductor package 10 seated on the mounting rib 140. More preferably, the long width first inclined surface 131 may be formed to have an angle θ1 between 11 and 13 degrees with respect to the Z axis, and the long width second inclined surface 132 may be in between the Z axis. It is preferable that the angle θ2 is between 28 and 32 degrees.

The long width inner surface 130 is formed with a slit 150 for guiding the movement of the latch unit 200 and guiding the latch unit 200 to be protruded into and out of the pocket 110.

The latch unit 200 includes a latch 210, a button 220, and an elastic member 230.

The latch 210 is rotatably installed in the body portion 100, and the other end 212 protrudes into the pocket 110 according to the rotational position, thereby leaving the semiconductor package 10 seated on the seating rib 140. Clamping position (A) to prevent the, and the other end is rotatably installed so as to be a completely hidden release position (B) inside the slit 150 so as not to be exposed to the pocket (110). One end of the latch 210 is rotatably connected by the button 220 and the movable shaft 240. In addition, the latch 210 has a guide groove 213 which is guided and interlocked along the guide pin 250 fixed to the body part 100 to enable the rotation operation. That is, when the latch 210 moves up and down of the button 220, the position of the movable shaft 240 is changed up and down, and the guide groove 213 is cam guided by the guide pin 250, and eventually the other end ( 212 may be moved to the clamping position (A) and the release position (B) described above.

At this time, the latch 210 is rotated while the position of the center of rotation of the latch 210 is changed up and down by the up and down operation of the button 220, so that the deformation angle of the latch 210 can be largely secured. Therefore, when the latch 210 is moved to the release position B for accommodating the semiconductor package 10, as shown in FIG. 3, the latch 210 is moved to the upper portion of the pocket 110 to the pocket 110. It is possible to completely hide the slit 150 so as not to protrude. In the clamping position B, the other end 212 of the latch 210 sufficiently protrudes into the pocket 110, thereby sufficiently interfering with the semiconductor package 10, thereby making it possible to reliably prevent its separation.

In addition, most of the guide groove 213 formed in the latch 210 is formed in a straight section, and has a structure in which a short section is formed in a curved shape so that the guide pin 250 is stably positioned at the clamping position (A). . That is, when the guide groove 213 is divided into a straight section 213a and a curved groove section 213b, in the straight section, the latch 210 is naturally rotated at a sufficiently large rotation angle by guiding the rotation operation of the latch 210. It can be guided to be rotated, the other end of the latch 210 is shaken in the curved groove section 213b by suppressing the latch 210 is easily lifted while the latch 210 is completely moved to the clamping position (A). The semiconductor package 10 can be stably supported without being moved or moved. The curved groove section 213b is preferably formed so as to deviate from the straight section 213a by a distance corresponding to the radius of the guide pin 250 at the end of the straight section 213a, thereby stably guiding the guide pin 250. When the external force is not settled, it provides a frictional force so that the guide pin 250 does not easily escape, and the guide pin 250 easily moves away from the curved groove section 213b to the external force by the pressing action of the button 220. You can do that. Therefore, in the state as shown in FIG. 3, since the guide pin 250 is positioned in the straight section 213a, the friction force is minimized when the button 220 returns, and the movable shaft 240 is also moved to a position so that the button 220 is moved. It is possible to minimize the occurrence of a failure in the return operation of. That is, the semiconductor package 10 enters the pocket 110 while the latch 210 protrudes into the pocket 110 by minimizing the return failure of the button 220. Can be prevented.

The button 220 is installed in the body portion 100 to move up and down, usually by taking a posture in which a part (upper end) is projected to the upper portion of the body portion 100 by the elastic member 230. The latch 210 installed to be interlocked by the movable shaft 240 connected to the 220 may maintain the clamping position A as shown in FIG. 2. The button 220 is a pair is respectively installed on both sides around the pocket (110). One side of the lower end of the button 220 is connected to the latch 210 by the movable shaft 240.

The elastic member 230 is installed in the body portion 100 to provide an elastic force to maintain the button 220 in the upper direction, that is, as shown in FIG. The elastic member 230 includes a coil spring, it is preferable that a pair is connected to both sides of the button 220 to provide a balanced elastic force to the button 220, respectively.

The stop toggle insert for a semiconductor package according to the exemplary embodiment of the present invention described above is configured by each of the short width inner surface 120 and the long width inner surface 130 of the pocket 110 and the latch portion 200. Even if the semiconductor package 10 moved by the robot is freely dropped without being aligned with the pocket 110, the semiconductor package 10 is naturally aligned and centered by the respective configurations of the short width inner surface 120 and the long width inner surface 130. The ribs 140 can be stably housed and aligned. In particular, since the return operation of the button 220 has a natural and stable operation, the latch 210 can be moved to be positioned at a position completely deviated from the pocket 110 when the semiconductor package 10 is stored. In addition, the semiconductor package 10 accommodated by the latch 210 may be prevented from interfering with each other and may not be stored in the correct posture or be separated from the pocket 110.

In particular, even if the semiconductor package 10, which is moved by the robot and freely falls into the pocket 110, is moved and dropped in a non-aligned state, the short width inner surface 120 and the long width inner surface 130 of the pocket 110 are dropped. By the configuration, the alignment is naturally induced to be settled.

Therefore, the three-step loading process (carrier tray-> precise position-> test tray) for the testing of the semiconductor package as in the prior art omits the loading process at the precise position, and the robot grabs the semiconductor package from the carrier tray. It can be moved directly to the test tray and stored in the insert. By shortening the loading process as described above, the number of rockfalls of the semiconductor package in the loading process (traditionally 5 to 60,000: the present invention is about 3,000) can be significantly reduced, and the productivity can be improved by simplifying the loading process. Of course, the equipment can be reduced and the efficiency can be increased.

6 to 8B, a stop toggle insert for a semiconductor package according to another embodiment of the present invention may include a body portion 100 ′ having a pair of pockets 110 for storing a semiconductor package to be tested. And a pair of latch parts 300 installed symmetrically to face each other at an intermediate position of the pockets 110 to prevent the semiconductor package from being separated.

The latch unit 300 is a button 320 which is installed to be moved up and down on both upper ends of the body portion 100 'to be located at the boundary of the pair of pockets 110, and the top and bottom of the button 320 A pair of latches 310 installed to interlock with each other during the movement operation, and an elastic member 330 to provide a return force so that the button 320 is exposed to the upper portion of the body portion (100 ').

The button 320 and the latch 310 are connected to interlock with each other by the movable shaft 340. In the body portion 100 ′, a lifting hole 101 that accommodates the button 320 to move up and down is formed to penetrate up and down.

One end of the latch 310 is rotatably connected by the button 320 and the movable shaft 340, and the other end of the latch 310 has a clamping rod 311 extending to the pocket 110 to prevent the semiconductor package from being separated. Is formed. The latch 310 has a guide groove 313 connected to the guide pin 350 fixed to the body portion 100 'when the movable shaft 340 moves up and down to be rotated up and down. The latch 310 has a clamping position (first drawing of FIG. 8A) and a pocket 110 to prevent the clamping rod 311 from being disposed toward the lower portion of the pocket 110 according to a rotational position to prevent the semiconductor package from being separated. Is moved between the release position (the last figure in FIG. 8B) to allow movement of the semiconductor package away from. That is, by pressing the latch 310 while the movable shaft 340 is lowered while the button 320 is pressed, the latch 310 is rotated while the guide groove 313 is guided by the guide pin 350. And it is rotated in the upward direction as shown in Figure 8b in sequence to move to the release position.

Here, the movable shaft 340 is positioned at a lower position than the guide pin 350 when the latch 310 is located at the release position, and the movable shaft 340 is positioned at the clamping position. It is formed to be positioned at a position higher than the guide pin 350.

And the guide groove 313 is formed in a straight line, located in the horizontal direction perpendicular to the vertical axis (Z axis) in the release position, the angle between the angle of 45 degrees or less with respect to the vertical axis (Z axis) in the clamping position (θ) It is formed to hold. In addition, circular arc centers C2 and C3 at both ends of the guide groove 313 and the center C1 of the movable shaft 340 are arranged to form a vertex of an imaginary triangle, and one end of the guide groove 313 is It is as close as possible to the movable shaft 340 and the other end is formed to be spaced apart from the movable shaft 340 as much as possible.

In addition, the button 320 is installed to have a constant gap with the button 320 for each of the outer inner surface 101a and the inner inner surface 101b of the elevating hole 101 which is accommodated in the lifting movement. Specifically, when the button 320 receives the moment in the direction rotated by the force applied to the latch 310, the button 320 is inclined at least a certain angle, so that each of the lower end and the upper end is lifted 101 There is a minimum gap between the button 320 and the inner surfaces to allow the button 320 to tilt so that it can be brought into contact with each of the inner surfaces 101a and 101b and subjected to frictional forces to prevent it from falling by the frictional forces. It is configured to be formed between 101a and 101b.

Hereinafter, the operation and effect of the stop toggle insert for a semiconductor package according to another exemplary embodiment having the above configuration will be described in detail.

First, as illustrated in FIG. 8A, when the button 320 is pressed at an initial clamping position, the latch 310 is interlocked in sequence according to the pressed degree (depth) of the button 320. Rotate in the direction away from ().

Finally, as shown in the last view of FIG. 8B, when the button 320 is fully pressed, the latch 310 is rotated in the vertical direction so that the semiconductor package is not interfered with the latch 310 by the pocket 110. It can be stored or removed. In this operation of the latch 310, the end of the latch 310 is moved up and down as the position of the movable shaft 340 is changed by the movement of the button 320 is raised and lowered, the guide groove 313 is guided It is possible by being guided by the pin 350.

In addition, in the clamping position as shown in the first drawing of FIG. 8A, the semiconductor package may be latched by gravity or external force even if the body portion 100 ′ is inverted or changed posture before the latch 310 is rotated by pressing the button 320. Since the force is to push up the 310, even if the occurrence of the latch 310 is not rotated to maintain the clamping position. That is, even if the moment M1 acts by an external force that lifts the latch 310 from the other end of the other end connected to the movable shaft 340 of the latch 310, the guide pin 350 is lower than the movable shaft 340. Since the guide pin 350 is located at the lower end of the guide groove 313, the reaction moment M2 is generated at the contact portion between the guide groove 313 and the guide pin 350, thereby eventually latching. 310 cannot be rotated to the release position.

In addition, at the same time the force by the moment (M1) is transmitted to the button 320, the button 320 is subjected to the inclination force, when the button 320 receives the inclination force, the button 320 is constant As the angle is inclined, friction occurs due to contact between the button 320 and the inner surfaces 101a and 101b in each of the “A” and “B” portions of FIG. 7A. The friction force acts in the directions of arrows C1 and C2, respectively, to restrain the button 320 from falling.

Therefore, even if a force due to gravity, the load of the semiconductor package, etc. is applied to the other end of the latch 310, the button 320 is restrained from being lowered, so that the latch 310 is not automatically rotated to the release position, thereby leaving the semiconductor package. And it is possible to provide a more reliable insert by preventing the twist.

On the other hand, on the contrary, when the force is applied by pressing the button 320 in the clamping position of Figure 8a, the moment acts downward from one side of the latch 310, in this case, the movable shaft 340 is a guide pin 350 Since the guide groove 313 is naturally rotated along the guide pin 350 so that the guide groove 313 can be moved to the release position.

As mentioned above, although the preferred embodiment of the present invention has been shown and described, the present invention is not limited to the above-described embodiment, and any person having ordinary skill in the art to which the present invention pertains without departing from the claims. Various modifications and variations will be possible.

1 and 2 are cross-sectional views showing a stop toggle insert for a semiconductor package according to an embodiment of the present invention.

3 is a cross-sectional view for describing an operation of the stop toggle insert for a semiconductor package illustrated in FIG. 2.

4 is a view showing an extract of the latch unit shown in FIG.

Figure 5 is a plan view showing a stop toggle insert for a semiconductor package according to an embodiment of the present invention.

6 to 8B each show a stop toggle insert for a semiconductor package according to another embodiment of the present invention.

Description of the Related Art

10. Semiconductor package 100,100 '.

110. Pocket 120. Inside width

130. Long inner side 140. Mounting rib

200,300..Latch part 210,310..Latch

220,320 Button Button 230,330 Elastic member

Claims (11)

delete A body portion having a pocket for containing a semiconductor package to be tested; And a latch unit disposed symmetrically on both sides with the pocket interposed therebetween to prevent separation of the semiconductor package. The latch unit, A button installed in the body portion so that the pair is movable up and down with the pocket interposed therebetween; One end is rotatably connected by the button and the movable shaft, and the other end is moved to a clamping position for preventing the detachment of the semiconductor package housed by being exposed to the pocket and to a release position for allowing movement of the semiconductor package away from the pocket. A latch having a guide groove cam-guided along a guide pin installed in the body to rotate about the movable shaft during a lifting operation of the button; And And an elastic member providing a return force to expose the button to the outside of the body portion. The guide groove, A straight section formed in a straight line to guide the rotation of the latch while moving along the guide pin; And Has a curved groove formed at the end of the straight section so that the guide pin is seated so that the latch is stably positioned at the clamping position; The latch toggle insert for a semiconductor package, characterized in that the latch is rotated to the release position in the state that the button is pressed to receive and detach the semiconductor package into the pocket. The method of claim 2, wherein the straight section, A stop toggle insert for a semiconductor package, wherein the latch is positioned in a direction parallel to the Z axis when the latch is in the clamping position, and is positioned in a posture perpendicular to the Z axis when the latch is in the release position. . The method of claim 2 or 3, wherein the pocket, A short width inner surface corresponding to the short width of the semiconductor package; A long width inner surface corresponding to the long width of the semiconductor package; And And a mounting rib formed in the lowermost end of each of the short width and long width inner surfaces to receive and hold the semiconductor package. The method of claim 4, wherein the short width inner surface,  A short width first vertical surface, a short width inclined surface and a short width second vertical surface formed step by step from an upper inlet of the pocket to the seating rib, The short width first vertical surface is a stop toggle insert for a semiconductor package, characterized in that formed on the basis of the upper and lower thickness of the body portion to a height of 1/3 or more to less than 1/2. The method of claim 5, wherein the long width inner surface, It has a long width first inclined surface, a long width second inclined surface and a long width vertical surface formed step by step from the upper leading portion of the body portion to the seating rib, The long width of the first inclined surface is a stop toggle insert for a semiconductor package, characterized in that extending from the inlet to the bottom of the pocket to a depth of 2/3 of the upper and lower thickness of the body portion. The stop toggle insert for a semiconductor package according to claim 6, wherein the second wide sloped surface has a larger inter-angle angle with respect to the Z axis than the first wide sloped surface. The method of claim 7, wherein the long width first inclined surface is formed such that the angle between the Z-axis is 11 to 13 degrees, The long width second sloped surface is a toggle toggle insert for a semiconductor package, characterized in that the angle between the Z axis is formed to form an angle of 28 to 32 degrees. A body portion having a pocket for containing a semiconductor package to be tested; And a latch unit disposed symmetrically on both sides with the pocket interposed therebetween to prevent separation of the semiconductor package. The latch unit, A button installed in the body part so as to be movable up and down with the pocket interposed therebetween; One end is rotatably connected by the button and the movable shaft, and the other end is moved to a clamping position for preventing the detachment of the semiconductor package housed by being exposed to the pocket and to a release position for allowing movement of the semiconductor package away from the pocket. A latch having a guide groove cam-guided along a guide pin installed in the body to rotate about the movable shaft during a lifting operation of the button; And And an elastic member providing a return force to expose the button to the outside of the body portion. The guide groove is formed in a straight line, the arc centers of the guide grooves and the center of the movable shaft are arranged to form a vertex of a triangle, one end of the guide groove is adjacent to the movable shaft and the other end is spaced apart from the movable shaft Formed, The latch toggle insert for a semiconductor package, characterized in that the latch is rotated to the release position in the state that the button is pressed to receive and detach the semiconductor package into the pocket. The movable shaft of claim 9, wherein the movable shaft is positioned at a lower position than the guide pin when the latch is in the release position, and the movable shaft is positioned at a position higher than the guide pin in the clamping position. Formed, The guide groove is formed in a straight line, located in the horizontal direction perpendicular to the vertical axis (Z axis) in the release position, characterized in that formed in the clamping position to maintain an angle of 45 degrees with respect to the vertical axis (Z axis) Stop toggle inserts for semiconductor packages. 11. The method according to claim 9 or 10, When an external force is applied in a direction in which the latch is lifted from the other end of the latch while the latch is in the clamping position, the outer and inner inner surfaces of the lifting hole in which the latch is movable to be lifted and lowered while the button connected to the latch is inclined. A stop toggle insert for a semiconductor package, which is in contact with and is formed such that a gap is maintained between the button and the inner surfaces of the lifting hole so that the lowering operation of the button is suppressed by the frictional force caused by the contact. .

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