KR20060109583A - An insert apparatus with sliding latch for semiconductor test handler - Google Patents

Abstract

An insert having a sliding latch member is provided to perform a test of a semiconductor device having solder balls arranged on an utmost region thereof by employing a slide guiding hole coupled to one or more supporting pins. An insert(100) is comprised of an insert housing(200), a spring member(300), a toggle member(400), and a sliding latch member(500). The sliding latch member couples a mounting unit(220) of the insert housing to the toggle member, thereby allowing loading/unloading of a semiconductor device(110). The sliding latch member includes a sliding movement hole(531) and a sliding guiding hole(532). The sliding movement hole is tilted with a predetermined angle in a cross direction. The sliding guiding hole is coupled to one ore more supporting pins that are fixed on the insert housing.

Description

Insert with slide latch member {AN INSERT APPARATUS WITH SLIDING LATCH FOR SEMICONDUCTOR TEST HANDLER}

1 is a cross-sectional view schematically showing a test tray insert for a conventional handler

2 is a cross-sectional view showing an open state of the latch member of FIG.

3 and 4 are schematic cross-sectional views for explaining the problem of the latch member of the test tray insert for a conventional handler.

5 is an exploded perspective view schematically showing a partially cut insert having a slide latch member according to the present invention

6 is a cross-sectional view showing an insert provided with a slide latch member according to the present invention.

7 is a cross-sectional view showing an open state of the latch member of FIG.

8A, 8B, and 8C are cross-sectional views illustrating a state in which an abnormally loaded semiconductor device is normally coupled to an insert provided with a slide latch member according to the present invention.

9 is a perspective view showing an insert provided with a slide latch member according to another embodiment of the present invention

FIG. 10 is a bottom perspective view of a state in which a semiconductor device is loaded in FIG. 9; FIG.

FIG. 11 is a perspective view illustrating an internal structure by cutting along line II ′ of FIG. 10;

Explanation of symbols on the main parts of the drawings

100. Insert 110. Semiconductor device

112. Breakaway support surface 120. Pusher assembly

200. Insert housing 210. Loading part

220. Mounting part 221. Latch guide surface

230. Guide pin insertion hole 300. Spring member

400. Toggle member 429. Lift shaft pin

500. Slide latch member 531. Slide movement hole

532. Slide Guide Ball 536. Tip

537. Semiconductor element guide surface 539. Support pin

900. Insert 910. Insert housing

911. Latch guide surface 921. Loading part

940. Spring member 950. Toggle member

959. Lifting shaft pin 960. Slide latch member

961. Slide Moving Hole 962. Slide Guide Hole

966. Tip 969. Support Pin

970. Semiconductor Devices

The present invention relates to an insert having a slide latch member. More specifically, the present invention is used to transport and install a semiconductor device in a test tray for testing a semiconductor device on a handler. The latch member which allows loading / unloading of the element and is fixed so as not to be detached is slid and the semiconductor element is not abnormally loaded on the upper surface of the latch member tip, and the semiconductor element is abnormally loaded on the upper surface of the latch member tip. Even if the present invention relates to an insert provided with a slide latch member so that the test is normally performed.

In general, to test a semiconductor device in a handler (commonly referred to as a semiconductor device test equipment), the untested semiconductor device loaded in the customer tray is loaded into the insert of the test tray as a pre-test step, that is, the semiconductor device loading on the loading unit. A test preparation process of a semiconductor device is performed in which an adsorption head of a picker, which is an unloading device, loads a semiconductor device and loads it into an insert of a test tray.

At this time, while the adsorption head having the adsorption pad on which one end of the semiconductor element is adsorbed is coupled to the test tray, the pusher protruding from one side of the adsorption head pushes the lever plate disposed on the pressing surface or the upper surface of the pressing surface. While opening, the suction head loads (or unloads) the semiconductor device through the device stack of the insert.

In the semiconductor device test process on the test chamber to test the semiconductor device loaded on the test tray insert as described above, the electrical properties are tested by contacting the contact pins of the test sockets provided on the test head with the semiconductor device solder balls. In conjunction with this, the pusher block of the match plate is pushed downward from the upper side in contact with the test socket to check whether the semiconductor device loaded on the insert is normal.

1 is a cross-sectional view showing a test tray insert for a handler of the prior art, Figure 2 is a cross-sectional view showing an open state of the latch member of FIG.

As shown in FIG. 1, the insert 10 of the prior art has an insert housing 20 and a lever plate 11 on the upper surface.

The insert housing 20 has a loading portion 22 having a guide surface 23 on which a semiconductor element 12 is loaded / unloaded at a central portion thereof, and a semiconductor surface 12 is inserted into and removed from an inner wall thereof. Mounting parts 26 are formed on both sides of the part 22, and at both ends, several guide pin insertion holes 19 are formed to guide the insert 10 to the test socket so that the contact is accurate.

The mounting part 22 of the housing contacts the lever plate 11 to the mounting part 22 of the insert housing 20, and a spring 30 internally supported to be supported by the supporting jaw 24 inside the mounting part. The inner side of the upper pressurizing surface 41 which is operated to be touched by the upper end of the spring 30, and the pressurizing surface 41 is hooked on the latching jaw 28 of the housing so as not to be pulled upward. Toggle to return downward by the elastic force of the springs 13 and 30 together with the lever plate 11 when the external force is approached below the mounting portion 26 by the external force applied to the pressing surface 41 and then there is no external force. 40 and a hinge pin 51 inserted into the through hole of the insert housing mounting portion 26 so that the lower end is rotatably fixed and fixed to the toggle hole in the guide hole 53 formed on the arm 52 on the other side. Lift pin 42 is connected to the insert mounting portion The value 50 is provided.

As described above, when the toggle 40 and the latch 50 of the conventional insert 10 do not have an external force, the toggle portion 40 and the latch 50 of the conventional insert 10 are inserted into the mounting portion 26 of the housing by the elastic force of the spring 30 fixed to the upper side of the toggle 40. It is supported, and the latch tip portion 54 protrudes past the semiconductor element guide surface 23 of the mounting portion and is fixed to prevent the semiconductor element 12 from being separated.

The fixed state of the semiconductor device 12 is when the test tray (not shown) in which the insert 10 is installed moves in a handler (not shown) and the test tray is lowered to a test head (not shown) which is a semiconductor device inspection device. The semiconductor device 12 of the insert 10 loading part 22 contacts the test socket (not shown), and the connection terminal of the semiconductor device (hereinafter referred to as “solder ball”) 14, that is, a solder ball is connected to the contact pin. Maintained at contact time.

2 is a cross-sectional view illustrating an open state of the latch member of FIG. 1.

As shown in FIG. 2, when an external force is applied to the pressing surface 41 of the toggle through the lever plate 11, the toggle 40 is moved downward while the spring 30 is compressed. As the lifting pin 42 of the toggle moves downward, the guide hole 53 formed in the arm 52 of the latch is rotated downward by a predetermined rotation radius about the hinge pin of the other side along the lifting pin.

At this time, the latch tip portion 54 extends out of the semiconductor device guide surface 23 of the mounting portion 22, that is, is rotated upward by a predetermined rotation radius and spaced inward so as to be inserted into the mounting portion 26.

In this open state, an adsorption head of a picker (not shown), which is a semiconductor device loading / unloading device, on the loading unit in the handler loads the semiconductor device 12 to insert the insert 20 of the test tray (not shown). The test preparation process of the semiconductor device 12 loaded in is performed.

At this time, the adsorption head having the adsorption pad on which the semiconductor element 12 is adsorbed is coupled to the test tray, and the pusher protruding from one side of the adsorption head has the pressing surface 41 or the upper surface of the pressing surface on one side of the toggle 40 of the insert. After opening the latch 50 by pushing the lever plate 11 disposed in the suction head, the suction head loads (or unloads) the semiconductor element 12 through the semiconductor element loading part 22 of the insert 10.

3 and 4 are schematic cross-sectional views for explaining the problem of the latch member of the test tray insert for a conventional handler.

As shown in FIG. 3, the insert 10 according to the related art has a semiconductor in which the pusher assembly 16 descends in a state where an abnormal loading of the semiconductor element 12 occurs on the upper surface of the latch 50. There was a problem that the element 12 is broken or the contact point with the contact pin of the test socket is shifted.

The reason why the above phenomenon occurs in the semiconductor device loading / unloading process is caused by the lifting movement of the toggle 40 so that the latch tip portion 54 is spaced apart from the semiconductor device guide surface 23 on the inner wall surface of the loading part. Since the operation speed at which the semiconductor element 12 is loaded / unloaded by the picker is accelerated before it is inserted into the mounting portion 26 and the loading portion 22 is opened, the semiconductor element 12 is moved to the latch 50. An abnormally tilted loading on the top surface occurs.

That is, since the insert 10 according to the related art has a structure allowing the loading / unloading of the semiconductor device 12 by the latch 50 rotated at a predetermined rotation radius, the latch 50 is formed as described above. Even when the toggle 40 is lowered in the state protruding from the semiconductor device guide surface 23 and the picker head of the picker is lowered before the latch 50 is spaced apart, the latch 50 is not rotated downward when the external force is applied. There was a problem that the element 12 is abnormally loaded on the latch upper surface.

In addition, the insert 10 according to the related art has a latch 50 pivoted at a predetermined rotation radius, which is connected to the latch, that is, fixed to one side of the toggle 40 to support the toggle 30 and the latch 30. When the semiconductor device 10 is supported by an elastic force to fix the semiconductor device 10 so as not to be separated, a rising external force stronger than the elastic force of the spring 30 fixed to one side of the toggle 40 to support the toggle and the latch is applied. The latch 50 is rotated by an external force from below to above.

Therefore, as shown in FIG. 4, the test socket (not shown) pushes the semiconductor element 100 in the mounting portion 210 of the insert 10 downward while the pusher block 16 of the match plate (not shown) moves downward. The semiconductor device 12 is strongly adhered to the pusher assembly 16 in the semiconductor device test process of contacting and testing, and the semiconductor device is raised together with the pusher block 16 after the test is completed. In this case, there is a problem that the semiconductor device 12, which is in close contact with the pusher block 16 and lifts up, is pushed up by the latch 50.

In addition, the insert 10 according to the related art has a latch 50 pivoted at a predetermined rotation radius, which is connected to the latch, that is, fixed to one side of the toggle 40 to support the toggle 30 and the latch 30. Since the semiconductor device 12 is fixed by the elastic force to prevent the semiconductor device from being separated, when the spring 30 becomes loose due to long use and the elastic force is weakened, the rotation of the latch 50 is loosened. When the distance from the support surface is increased and the processor is loaded on the test tray and moved, the shock is transmitted to the semiconductor device 12 according to the flow of the semiconductor device 12, so that the durability of the fixing of the semiconductor device by the latch 50 is maintained. There was a problem falling.

In the insert 10 according to the related art, when the semiconductor device 12 having various widths is loaded into the loading part 26 of the housing while using the same insert housing 20, that is, the loading part 22 is used. In the case where a semiconductor device having a small width is mounted, the length of the latch tip portion 54 protruding to the guide surface 23 of the mounting portion 22 should be long. At this time, the radius of rotation of the latch 50 is increased to provide the upper portion. Interfering with the toggle 40 and the spring 30, the protruding length of the latch tip portion 54 cannot be extended, so that the semiconductor device 12 of various widths cannot be loaded in the same insert 10.

In addition, when loading the semiconductor device 11 having the solder ball 14 on the outermost surface, as much as the support ball 24 formed on the inner end of the bottom surface of the mounting portion 22 to which the semiconductor device is loaded Occurs when a test socket (not shown) is not in contact with the test socket.

In this case, since the support member 24 of the mounting portion 22 is removed, the semiconductor device 12 can be tested as described above, so that the latch 50 is projected to the bottom to support the semiconductor device 1. When the test socket is in contact with the test socket, the latch 50 protruding from the mounting part 22 is spaced apart from the mounting part 26 so that the entire test surface of the semiconductor device 11 contacts the test socket (not shown). Should do it.

However, since the test tray insert for a conventional handler is a rotation method around the hinge shaft 51 where the latch 50 requires a predetermined radius of rotation, the insert 10 loaded with the semiconductor device is inserted into the test socket. When the latch 50 is spaced apart from each other in contact with the contact hole, the solder ball 14 portions of the upper portion of the support ball 24 are interfered with the upper semiconductor element 11 and the lower test socket by the rotation radius due to the rotation of the latch. There was a problem that could not be tested in contact with the test socket (not shown).

SUMMARY OF THE INVENTION The present invention is to overcome the above-mentioned conventional problems, and an object of the present invention is to select a semiconductor device of a picker before the toggle latch is lowered and the slide latch member is spaced apart while the tip of the slide latch member protrudes from the semiconductor device guide surface. The sucked suction head is lowered on the inclined surface of the slide latch member or the pusher assembly of the match plate is lowered while the semiconductor element is abnormally loaded on the inclined surface of the slide latch member. When an external force is applied, a pressure input against a spring member held on one side of the toggle member is transmitted in an opposite direction to provide an insert having a slide latch member for loading / contacting a semiconductor element to a normal position.

In addition, the present invention provides an insert having a slide latch member having an extended service life since the gap between the slide latch member and the upper surface of the semiconductor device does not change even when the spring member is loosened due to long use.

This object of the present invention is installed in the mounting portion of the insert to allow the loading / unloading of the semiconductor element, and the lifting shaft pin fixed to the toggle member in the slide movement hole formed on one side is fixed to the toggle member to be lifted and coupled The slide guide hole formed on one side is coupled to the support pin fixed to the insert housing to allow the slide movement. An inclined surface is formed on the upper surface of the tip portion in the direction of the loading portion in which the semiconductor element is loaded / unloaded, and the slide portion moves. It is achieved by an insert provided with a slide latch member according to the invention comprising a structure projecting / spaced apart on the semiconductor device guide surface.

Still another object of the present invention is a slide capable of testing a semiconductor device (outermost ball semiconductor device) in which solder balls are disposed on the outermost surface of the insert, which is not in contact with the test socket, because there is no bottom support of the semiconductor device on the bottom surface of the insert. It is to provide an insert provided with a latch member.

The object of the present invention is a housing formed with a through-hole semiconductor element mounting portion is formed in the center portion and the mounting portion of the shape is opened downward on both sides of the bottom surface of the loading portion;

A spring member inserted into the mounting portion of the housing; One side is mounted on the mounting portion of the housing so as to be supported by the spring member, and is moved upward by a pressing force against the spring force of the spring member, and when the pressing force is released, the spring member is moved downward by the spring force of the spring member. A toggle member; One side of the mounting portion of the housing is connected to the toggle member, and one side of the bottom surface is installed to be supported by the latch guide surface of the housing, and the loading / loading portion in which the semiconductor element is loaded and contacted by the approach / return of the toggle member is opened / locked. It is achieved by an insert provided with a slide latch member according to the present invention comprising a latch member that is slidingly moved.

As an example of an insert provided with a slide latch member according to the present invention for achieving the above object of the present invention, it will be described in detail in the following configuration and effects.

Hereinafter, an insert with a slide latch member according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

5 to 8, there is shown an insert provided with a slide latch member according to an embodiment of the present invention.

5 is an exploded perspective view schematically showing a part of the insert having a slide latch member according to the present invention, FIG. 6 is a cross-sectional view illustrating an insert having a slide latch member according to the present invention, and FIG. 7 is a latch of FIG. 6. It is sectional drawing which shows the open state of a member.

5 to 7, the insert 100 having the slide latch member according to the present invention includes an insert housing 200, a spring member 300, a toggle member 400, and a slide latch member 500. It consists of.

The insert housing 200 has a loading part 210 having a guide surface 214 for loading / unloading the semiconductor device 110 in the center and inserting and removing the semiconductor device on an inner wall thereof, and the loading part 210. Mounting portions 220 are formed on both sides of the guide portion insertion holes 230 are formed at both ends.

On the other hand, the upper surface of the insert housing 200 may be provided with a lever plate (not shown) for pressing the pressing surface 426 of the toggle member 400, the description will be omitted below.

The spring member 300 is installed in the mounting portion 220 of the insert housing 200 in the present embodiment, the top surface protrudes on the upper surface and the upper side of the inner spring fixing portion 424 of the toggle member 400. The spring is supported by the inner side of the mounting portion 220 of the insert housing 200 of a larger area than the inner spring fixing portion 424 of the toggle member 400, the interview surface is supported and supported It is inserted into the groove 222.

That is, the top surface is fixed to the toggle member 400, the bottom surface is on the bottom spring bottom support jaw 225 of the spring insertion support groove 222 formed on the inner surface of the mounting portion 220 of the insert housing 200 Interview is fixed.

The mounting portion 220 of the housing is provided with a latch guide surface 221 on the slide moving surface of the slide latch member so that the bottom portion of the slide latch member 500 is supported by the interview.

The toggle member 400 is installed in one side of the mounting portion 220 of the insert housing 200 so as to be supported by the spring member 300 to one side of the mounting portion 220, that is, against the elastic force of the spring member 300. When the pressure input is approached downward or the pressure input is released, the pressure is returned upward.

The latch member 500 is installed on one side of the inserting part 220 of the insert housing so as to be connected to the toggle member 400 to allow the semiconductor device 110 to be loaded / unloaded and not to be separated.

The latch member 500, which is a characteristic part of the present invention, will be described in detail below.

The latch member 500 has a slide movement hole 531 which is inclined at a predetermined angle in one direction on one side thereof, and a lift shaft pin 429 fixed to the toggle member 400 is lifted and coupled to the lift side, and the lift on the other side thereof. A slide guide hole 532 having the same length as the shortest distance S of both ends of the slide moving hole 531 in a direction crossing the moving direction of the shaft pin 429 is formed and fixed to the housing 200. The support pin 539 is coupled to allow the slide movement.

That is, the tip portion 536 is configured to slide about the semiconductor element guide surface 214 on the side wall surface of the loading part of the housing so as to be spaced apart or protruded by the approach or return of the toggle member 400.

The slide movement hole 531 of the slide latch member 500 may have a front end portion slid protruding from the loading portion of the housing 200 corresponding to the width of the semiconductor element 110 loaded in the loading portion 210 of the housing ( 536 is formed to have an inclination angle of a predetermined angle so as to be located in place on the anti-separation support surface 112 of the semiconductor element (a portion supported by the microgap at the bottom of the protruding latch member).

That is, the sliding movement length at which the front end portion 536 of the latch member protrudes into the mounting portion 210 is variable, so that a semiconductor device having a different width (size) may be loaded into the loading portion 210 of the same insert.

Since the length of the slide movement hole 531 is the same as the lifting distance of the toggle member 400, it is difficult to change.

For example, when the size of the semiconductor device is large, when the inclination angle of the slide movement hole 531 is large, the shortest distance between both ends of the slide movement hole 531 becomes short, and thus the length of the slide guide hole 532 is short, and the support pin 539 is provided. The movement length which is supported by and slides is small.

In the case where the size of the semiconductor device is small, when the inclination angle of the slide movement hole 531 is small, the length of the slide guide hole 532 is long and the sliding movement distance is long.

In addition, the tip portion 536 of the latch member is inclined at a predetermined angle in the direction of the loading portion on the contact surface with the surface of the semiconductor device 110 loaded into the loading portion 210 of the housing 537. Is formed.

That is, an inclined surface is formed on the top surface of the tip portion 536 protruding toward the loading portion 210 of the housing so that the inclined surface is formed in the center of the loading portion so that the semiconductor device is loaded by the picker of the loading portion (not shown). The semiconductor device 110 is normally loaded without being twisted and loaded on the 536.

8A, 8B, and 8C are cross-sectional views illustrating a state in which an abnormally loaded semiconductor device is normally coupled to an insert provided with a slide latch member according to the present invention.

8A, 8B, and 8C, when a push by the pusher assembly 120 of the matchplate is performed during a contact test to a test socket (not shown), the semiconductor device 110 which is abnormally loaded is the semiconductor device guide surface ( It is allowed to move along 537 and to be normally coupled to the semiconductor device support 216.

On the other hand, since the semiconductor device 110 is strongly adhered to the pusher assembly 120 in the semiconductor device test process, when the semiconductor device is raised together with the pusher block 120 after the test is completed, the pusher block ( The semiconductor device 110, which is brought into close contact with the 120, may not be separated by pushing the latch member 500 upward.

That is, since the slide latch member 500 is a sliding method, no force is transmitted to the spring member 300 on the other side, and upward deviation does not occur (see FIGS. 8C and 4).

In addition, the front end portion 536 of the latch member is spaced apart from the semiconductor element guide surface 214 of the loading portion by a pressing force against the spring member 300 held on one side of the toggle member 400. The slide element is inserted into the loading part 210 by the elastic force of the spring member 300 in the no load state in which the semiconductor element 110 is loaded and unloaded so as to be loaded and unloaded. The slide protrudes and the semiconductor device 110 is fixed so as not to be separated.

9 to 11 illustrate an insert having a slide latch member according to another embodiment of the present invention.

9 to 11, in the insert 900 having the slide latch member according to another embodiment of the present invention, the solder ball 971 of the outermost surface 972 is located at the center of the test pin of the test head. An insert housing 910 having a through hole-shaped semiconductor element loading portion 921 formed thereon and having mounting portions having a shape open downward on both sides of a bottom surface of the loading portion; A spring member 940 inserted into the mounting portion 922 of the housing; One side is mounted on the spring member 940 in the mounting portion 922 of the housing, and is moved upward by a pressure input against the elastic force of the spring member 940, and the spring member is released when the pressure input is released. Toggle member 950 is moved back by the elastic force of the 940 and; One side of the mounting portion 922 of the housing is connected to the toggle member 950 and one side of the bottom surface is installed to be supported by the latch guide surface 911 of the housing 910, and the access / return of the toggle member 950 is performed. In this case, the semiconductor device 970 is configured to include a latch member 960 which is slidably moved to open / lock the loading part 921 on which the semiconductor device 970 is loaded and contacts.

The slide latch member 960 serves as a support for the semiconductor device and serves to allow the loading / unloading of the semiconductor device and to fix the semiconductor device as a supporting member.

In addition, a slide moving hole 961 that is inclined at a predetermined angle in one direction is formed at one side of the slide latch member 960, and the lifting shaft pin 959 fixed to the toggle member 950 is coupled to the lifting member.

On the other side, a slide guide hole 962 having the same length as the shortest distance S between both ends of the slide moving hole 961 is formed in the direction of the loading part 921 orthogonal to the moving direction of the lifting shaft pin 956. A slide movement is coupled to one or more support pins 969 fixed to the housing 910.

The semiconductor element 970 is provided with a tip 966 that slides / protrudes with respect to the sidewall surface of the loading part 921 of the housing and is loaded into the upper loading part 921 by the approach / return of the toggle member 950. It is configured to be fixed by supporting the bottom of the.

Although the technical spirit of the present invention has been described in detail according to the above preferred embodiment, it should be noted that the above embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention.

As described above, the insert provided with the slide latch member according to the present invention is a semiconductor device of the picker is adsorbed even before the slide latch member is spaced apart by the toggle as the tip of the slide latch member protrudes on the semiconductor device guide surface. When the suction head is lowered on the inclined surface of the slide latch member and an external force is applied upwards and downwards on the inclined surface of the slide latch member, the pushing force against the spring member held on one side of the toggle member is transmitted in the opposite direction. There is an effect that the semiconductor device is loaded to a normal position.

In addition, the bottom surface of the insert portion of the insert does not have a semiconductor element outer surface base jaw has the effect that it is possible to test the semiconductor device (outermost ball semiconductor device) in which the solder ball is placed on the outermost surface in contact with the test socket.

What has been described above is only one embodiment for implementing the insert with a slide latch member according to the present invention, the present invention is not limited to the above embodiment, as claimed in the following claims Without departing from the gist of the invention, anyone of ordinary skill in the art to which the present invention pertains to the technical spirit of the present invention to the extent that various changes can be made.

Claims (7)

A housing in which a semiconductor element is loaded / unloaded in a central portion, a loading portion having a guide surface on which an inner side of the semiconductor element is inserted and removed, a mounting portion is formed on both sides of the loading portion, and a plurality of guide pin insertion holes are formed at both ends; A spring member disposed in place of the insert housing, a toggle member which is installed so that one side of the insert housing is supported by the spring member is approached / returned to one side of the mounting portion, and one side of the toggle member is mounted on the insert housing; In the insert consisting of a latch member which is installed to be connected to the fixing to allow the loading / unloading of the semiconductor device and not to be separated, The latch member On one side is formed a slide movement hole inclined at a predetermined angle in one direction, the lifting shaft pin fixed to the toggle member is coupled to the lifting, The other side is formed with a slide guide hole having the same length as the shortest distance of both ends of the slide movement hole in the direction crossing the moving direction of the lifting shaft pin is coupled to allow the slide movement to one or more support pins fixed to the housing, An insert having a slide latch member, characterized in that the front end portion slides about the semiconductor element guide surface of the side wall of the loading part of the housing so as to be spaced apart / protruded by approaching / returning of the toggle member. 2. The slide latch member according to claim 1, wherein the front end portion of the latch member is formed with a semiconductor element guide surface inclined at a predetermined angle in a loading direction on a contact surface with a surface of the semiconductor element loaded into the loading portion. Inserts. The semiconductor device of claim 2, wherein the front end of the latch member is slid away from the semiconductor element guide surface of the mounting portion by a pressing force against a spring member held on one side of the toggle member to slide into the mounting portion. An insert having a slide latch member, which is open for loading and slides out to the loading portion by an elastic force of the spring member in the no load state in which the pressure input is eliminated, thereby fixing the semiconductor device not to be detached. The insert of claim 1, wherein a latch guide surface is formed on a slide moving surface of the latch member so that a bottom portion of the latch member is interviewably supported and slides. The sliding movement hole of the latch member has a tip portion slidingly protruding from the loading portion of the housing corresponding to the width of the semiconductor element loaded in the loading portion of the housing. Insert having a slide latch member, characterized in that it is formed to have an inclination angle of a predetermined angle to be located in. A housing having a through hole-shaped semiconductor element loading portion formed in a central portion thereof, and a mounting portion having a shape in which the opening portion is opened downward on both sides of the bottom surface of the loading portion; A spring member inserted into the mounting portion of the housing; One side is mounted on the mounting portion of the housing so as to be supported by the spring member, and is moved upward by a pressing force against the spring force of the spring member, and when the pressing force is released, the spring member is moved downward by the spring force of the spring member. A toggle member; One side of the mounting portion of the housing is connected to the toggle member, and one side of the bottom surface is installed to be supported by the latch guide surface of the housing, and the loading / loading portion in which the semiconductor element is loaded and contacted by the approach / return of the toggle member is opened / locked. Insert with a slide latch member characterized in that it comprises a latch member that is slidingly moved. The method of claim 7, wherein the latch member On one side is formed a slide movement hole inclined at a predetermined angle in one direction, the lifting shaft pin fixed to the toggle member is coupled to the lifting, On the other side, a slide guide hole having a length equal to the shortest distance of both ends of the slide moving hole is formed in the direction of the loading portion orthogonal to the moving direction of the lifting shaft pin so that the slide movement can be performed on at least one support pin fixed to the housing. Sum, A slide latch member having a tip end portion slide-spaced / protruded based on a side wall surface of the housing part of the housing by an approach / return of the toggle member and fixed to support the bottom surface of the semiconductor device loaded into the upper loading part Inserts.

Images