KR20140131421A - Apparatus for contacting semiconductor device in a test handler - Google Patents

Apparatus for contacting semiconductor device in a test handler Download PDF

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Publication number
KR20140131421A
KR20140131421A KR1020130049540A KR20130049540A KR20140131421A KR 20140131421 A KR20140131421 A KR 20140131421A KR 1020130049540 A KR1020130049540 A KR 1020130049540A KR 20130049540 A KR20130049540 A KR 20130049540A KR 20140131421 A KR20140131421 A KR 20140131421A
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KR
South Korea
Prior art keywords
test
contact
pushing
plate
test tray
Prior art date
Application number
KR1020130049540A
Other languages
Korean (ko)
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KR102037925B1 (en
Inventor
이준석
이창택
최정태
Original Assignee
세메스 주식회사
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Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020130049540A priority Critical patent/KR102037925B1/en
Publication of KR20140131421A publication Critical patent/KR20140131421A/en
Application granted granted Critical
Publication of KR102037925B1 publication Critical patent/KR102037925B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Abstract

A test handler of the test handler has a contact pusher for pushing each of the semiconductor elements received in the test tray toward the test socket of the test board to electrically contact the semiconductor elements accommodated in the test tray with the test socket of the test board A handler connecting apparatus comprising: a first plate having a first through-hole disposed below a test tray and through which the contact piercer is inserted to support the contact pier; A second plate having a second through hole communicating with the first through hole to support the contact pawl, the second plate being disposed above the test tray and not facing the test tray; An alignment unit provided on the first plate to match the test tray to align the contact pins and the test tray when pushing each of the semiconductor elements using the contact pins; A first pushing portion provided between the first plate and the second plate to provide a pushing force for alignment to the test tray when the aligner is used to align the contact pins and the test tray; And a second pushing portion provided at an end of the contact pawl positioned on the second plate side to provide a pushing force for the pushing toward the semiconductor element when each of the semiconductor elements is pushed using the contact pawl have.

Description

[0001] The present invention relates to a connecting device for a test handler,

The present invention relates to a connection device for a test handler, which pushes each of the semiconductor elements accommodated in the test tray toward a test socket of the test board so as to electrically contact the semiconductor elements accommodated in the test tray with the test socket of the test board To a test handler having a contact fuser.

In the manufacture of electronic components such as integrated circuit devices, inspection is performed on packaged integrated circuit devices (hereinafter referred to as "semiconductor devices") such as electrical performance, thermal stress, and the like. In particular, a test handler is an example of an apparatus for electrically testing the semiconductor device mentioned above. And inspection of a semiconductor device using a test handler can be achieved mainly by electrically connecting semiconductor elements accommodated in a test tray to a test socket of a test board. An example of the above-mentioned test handler is Korean Patent Application No. 10-2009-0090991.

When the semiconductor device is connected to the test socket by using the test handler mentioned above, the connection force between the semiconductor device and the test socket is mainly controlled by using the compression spring provided in each of the contact pins. That is, according to a driving member such as a motor, a contact press provides a pushing force to a contact fuser, thereby making a connection between the semiconductor element and the test socket. By the above-mentioned compression spring, .

In the inspection of a semiconductor device using a recent test handler, the number of contact fingers is increased so as to inspect a larger number of semiconductor elements at a time, and as a result, the size of a match plate in which contact fingers are arranged is increasing . In addition, in recent semiconductor devices, since they are manufactured to have a fine pitch, the number of balls connected to the test handler using the test handler is also increasing.

As mentioned above, when the area of the match plate is large, some of the contact fingers of the entire contact fusers are connected first, so alignment between the contact fusers and the test tray is not easy, And if the number of balls for connection increases, it is necessary to increase the connection force between the semiconductor element and the test socket, which may result in a situation in which the test socket is deformed.

As described above, in the case of the conventional test handler, since the connecting force between the semiconductor element and the test socket is controlled by mainly using the compression springs provided in each of the contact fusers when the semiconductor element is connected to the test socket, There is a problem that it is not suitable for inspection of recent semiconductor devices in which the area becomes large and the number of balls for connection increases.

It is an object of the present invention to provide a pushing force for alignment between a contact fuser and a test tray and a pushing force for pushing each of the semiconductor elements during inspection of a recent semiconductor device in which the area of the match plate is increased, So that the pushing force can be easily controlled.

According to an aspect of the present invention, there is provided a test handler connecting apparatus for connecting semiconductor devices accommodated in a test tray to a test socket of a test board, The contact handler of claim 1, further comprising: a first through hole, which is located below the test tray and is inserted into the contact fuser to support the contact fuser, ; A second plate having a second through hole communicating with the first through hole to support the contact pawl, the second plate being disposed above the test tray and not facing the test tray; An alignment unit provided on the first plate to match the test tray to align the contact pins and the test tray when pushing each of the semiconductor elements using the contact pins; A first pushing portion provided between the first plate and the second plate to provide a pushing force for alignment to the test tray when the aligner is used to align the contact pins and the test tray; And a second pushing portion provided at an end of the contact pawl positioned on the second plate side to provide a pushing force for the pushing toward the semiconductor element when each of the semiconductor elements is pushed using the contact pawl have.

In the connecting device for a test handler according to an embodiment of the present invention, each of the first pushing portion and the second pushing portion includes a spring, and the second pushing portion may be replaceable according to the pushing force .

The connecting device of the test handler according to the present invention has a first pushing portion for providing a pushing force for alignment toward the test tray and a second pushing portion for providing pushing force for pushing toward the semiconductor element.

Therefore, in the inspection of the semiconductor device using the connecting device of the test handler of the present invention, the pushing force for alignment between the contact fuser and the test tray and the pushing force for pushing each of the semiconductor devices can be more easily controlled .

Therefore, the connecting device of the test handler of the present invention can be more easily applied to the inspection of recent semiconductor devices in which the area of the match plate is increased and the number of balls for connection is increased.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration diagram schematically showing a connection device of a test handler according to an embodiment of the present invention; FIG.

While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Example

First, a test of a semiconductor device using a test handler of the present invention, although not shown, will be briefly described below.

The aforementioned test handler has a function of connecting a semiconductor device for inspection to a test apparatus having a different configuration for inspecting semiconductor devices and classifying the tested semiconductor devices according to the test results by the test apparatus mentioned above.

The test handler performs a loading process, an unloading process, and an inspection process using a test tray having a plurality of carrier modules each capable of accommodating semiconductor devices.

In the above-mentioned loading process, each of the semiconductor elements is picked up from a customer tray accommodating the semiconductor element for inspection and accommodated in a test tray. At this time, in the loading step, it can be achieved by using a picker or the like having a nozzle capable of adsorbing semiconductor elements. In the aforementioned unloading step, the tested semiconductor elements are separated from the test tray, and the separated semiconductor elements are accommodated in the customer trays which are positioned differently according to the inspection results. At this time, this can also be achieved by using a picker having nozzles capable of adsorbing the semiconductor elements mentioned in the unloading step.

In the inspection process mentioned, a semiconductor device for testing housed in a test tray is connected to a test apparatus. The test apparatus may include a test board on which a test socket to which a semiconductor device is connected is disposed. In addition, the test handler may include a test chamber that provides space for connecting the semiconductor devices to the test apparatus while accommodating the semiconductor elements therein, and a connection apparatus for connecting the semiconductor elements to the test apparatus within the test chamber.

The connecting device of the test handler mentioned here has a contact pawl for pushing each of the semiconductor elements accommodated in the test tray toward the test socket of the test board so as to electrically connect the semiconductor elements accommodated in the test tray to the test socket of the test board can do. Here, the connection device of the test handler may further include a driving member for providing a plurality of contact fingers on the match plate disposed to face the test tray, and for advancing the match plate toward the test tray .

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration diagram schematically showing a connection device of a test handler according to an embodiment of the present invention; FIG.

Referring to FIG. 1, the first plate 13, the second plate 11, the aligning portion 15, and the contact fingers 17, as a connection device 100 of a test handler, A first pushing portion 21, a second pushing portion 19, and the like.

Specifically, the first plate 13 may have a first through-hole through which the contact pawl 17 is inserted to support the contact pawl 17 while being disposed below the test tray. The second plate 11 may have a second through hole communicating with the first through hole so as to support the contact pawl 17 while being disposed above the test tray. Accordingly, the contact fusers 17 may be supported by the first plate 13 and the second plate 11 by being fitted to the first through holes and the second through holes. In addition, the first plate 13 and the second plate 11 may be spaced apart from each other.

The aligner 15 may be provided on the first plate 13 to match the test tray to align the contact pawl 17 with the test tray when pushing each of the semiconductor elements using the contact pawl 17. [ have. The alignment unit 15 may be provided with a protruding structure protruding from the first plate 13 mainly toward the test tray. At this time, the test tray may have a receiving portion having a groove structure into which the aligning portion 15 having the above-mentioned protruding structure can be inserted. Thus, alignment can be achieved by inserting the protruding structure of the alignment section 15 mentioned above into the groove structure of the test tray. Here, since the accurate connection between the semiconductor element and the test socket is not achieved unless the alignment between the contact fingers 17 and the test tray is made, To perform the alignment between the trays.

In addition, the connection device 100 of the test handler of the present invention provides a pushing force for alignment to the test tray when aligning between the contact pawl 17 and the test tray using the alignment section 15, as mentioned There is a need. The provision of the first pushing portion 21 allows the pushing force for alignment to be provided by using the first pushing portion 21 mentioned above when the aligning portion 15 is not located at a predetermined position and is slightly out of position, This is to hold it in position. Therefore, the first pushing portion 21 needs to be provided at a position where the pushing force of the contact pawl 17 is not provided. That is, when the first pushing portion 21 is provided to provide the pushing force to the contact pawl 17, since it can affect the connection with the test socket by pressing the contact pawl 17 itself, And is provided at a position where the pushing force is not provided to the contact pawl 17. Accordingly, the first pushing portion 21 according to the present invention may be provided between the first plate 13 and the second plate 11. That is, the first pushing portion 21 may be provided between the first plate 13 and the second plate 11 so as to be spaced from each other.

In addition, the connection device 100 of the test handler of the present invention is provided with a contact (not shown) located on the side of the second plate 11 so as to provide pushing force for pushing toward the semiconductor element, And a second pushing portion 19 may be provided at the end of the pawl 17. Thus, in the test using the test handler of the present invention, the second pushing portion 19 is used to provide a pushing force to the contact pins 17 to press each of the semiconductor elements toward the test tray, thereby achieving the connection between the semiconductor element and the test socket can do.

The first pushing portion 21 and the second pushing portion 19 mentioned above may include a spring capable of providing an elastic force, particularly a compression spring. In the case of the second pushing portion 19, the second pushing portion 19 can be provided to be replaceable according to the pushing force.

In addition, the contact fingers 17, on which the second pushing portion 19 is disposed, may be provided to have a structure in which a plurality of contact fingers 17 are disposed on the match plate.

Further, the match plate provided with the contact fusers 17 mentioned above can be advanced to the test tray by driving a driving member such as a motor, and the pressing of the contact pawl 17 for connection with the test socket can be performed Motor, or the like, or alternatively may be accomplished by a pressure member that provides a pressure, such as hydraulic or pneumatic, or the like.

As mentioned, the connecting device 100 of the test handler according to the invention comprises a first pushing portion 21 for providing a pushing force for alignment towards the test tray, and a second pushing portion 21 for providing pushing force for pushing towards the semiconductor element. A pushing portion 19 may be separately provided. Accordingly, the connecting device 100 of the test handler of the present invention can separately provide the pushing force for alignment and the pushing force for connection, respectively.

Therefore, in the inspection of the semiconductor device using the connection device 100 of the test handler of the present invention, the pushing force for alignment between the contact fuser 17 and the test tray and the pushing force for pushing each of the semiconductor devices can be more easily controlled And as a result, the area of the match plate is increased and the number of balls for connection is increased.

As mentioned above, the connecting device of the test handler of the present invention is provided with a pushing force for alignment and a pushing force for connection, respectively, so that the area of the match plate is increased and the number of balls for connection is increased The present invention can be more readily applied to the inspection of semiconductor devices in recent years.

Accordingly, when the connecting device of the test handler of the present invention is applied to the manufacture of a semiconductor device, it is possible to improve the reliability and productivity according to the manufacture of the semiconductor device, and accordingly, the product competitiveness can be expected to be enhanced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

11: second plate 13: first plate
15: alignment part 17: pushing part
19: second pushing portion 21: first pushing portion
100: connection device

Claims (2)

A contact handler for pushing each of the semiconductor elements accommodated in the test tray toward the test socket of the test board so as to electrically contact the semiconductor elements accommodated in the test tray with the test socket of the test board, ,
A first plate disposed below the test tray and having a first through hole through which the contact piercer is inserted to support the contact piercer;
A second plate having a second through hole communicating with the first through hole to support the contact pawl, the second plate being disposed above the test tray and not facing the test tray;
An alignment unit provided on the first plate to match the test tray to align the contact pins and the test tray when pushing each of the semiconductor elements using the contact pins;
A first pushing portion provided between the first plate and the second plate to provide a pushing force for alignment to the test tray when the aligner is used to align the contact pins and the test tray; And
And a second pushing portion provided at an end of the contact pusher located on the second plate side to provide pushing force for the pushing toward the semiconductor element when each of the semiconductor elements is pushed using the contact pusher Of the test handler. The test handler of claim 1, wherein each of the first pushing portion and the second pushing portion includes a spring, and the second pushing portion is replaceable according to the pushing force.
KR1020130049540A 2013-05-02 2013-05-02 Apparatus for contacting semiconductor device in a test handler KR102037925B1 (en)

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KR1020130049540A KR102037925B1 (en) 2013-05-02 2013-05-02 Apparatus for contacting semiconductor device in a test handler

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Application Number Priority Date Filing Date Title
KR1020130049540A KR102037925B1 (en) 2013-05-02 2013-05-02 Apparatus for contacting semiconductor device in a test handler

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KR20140131421A true KR20140131421A (en) 2014-11-13
KR102037925B1 KR102037925B1 (en) 2019-10-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111375570A (en) * 2014-11-28 2020-07-07 泰克元有限公司 Test sorting machine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06249916A (en) * 1993-02-26 1994-09-09 Sony Corp Contact unit for handler
KR20000006481A (en) * 1998-06-25 2000-01-25 가부시키가이샤 어드밴티스트 IC Testing Apparatus
KR20070075756A (en) * 2006-01-16 2007-07-24 미래산업 주식회사 Apparatus for contacting devices to test sockets in semiconductor test handler
KR20070077365A (en) * 2006-01-23 2007-07-26 미래산업 주식회사 Apparatus for contacting devices to test sockets in semiconductor test handler

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06249916A (en) * 1993-02-26 1994-09-09 Sony Corp Contact unit for handler
KR20000006481A (en) * 1998-06-25 2000-01-25 가부시키가이샤 어드밴티스트 IC Testing Apparatus
KR20070075756A (en) * 2006-01-16 2007-07-24 미래산업 주식회사 Apparatus for contacting devices to test sockets in semiconductor test handler
KR20070077365A (en) * 2006-01-23 2007-07-26 미래산업 주식회사 Apparatus for contacting devices to test sockets in semiconductor test handler

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111375570A (en) * 2014-11-28 2020-07-07 泰克元有限公司 Test sorting machine
CN111375570B (en) * 2014-11-28 2022-05-24 泰克元有限公司 Test sorting machine

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