CN106994445B

CN106994445B - Test sorting machine

Info

Publication number: CN106994445B
Application number: CN201710363247.3A
Authority: CN
Inventors: 李秀晶; 金南亨
Original assignee: Techwing Co Ltd
Current assignee: Techwing Co Ltd
Priority date: 2013-10-08
Filing date: 2014-10-08
Publication date: 2020-04-07
Anticipated expiration: 2034-10-08
Also published as: CN104511431A; TW201514515A; CN104511431B; KR102053081B1; TWI512307B; CN106994445A; KR20150041682A

Abstract

The invention relates to a test handler. The test handler according to the present invention may allow a loading surface of a customer tray to be inserted into or pass through a loading hole and an unloading hole of a substrate. Therefore, the lifting distance of the loading device or the unloading device can be shortened, and the effect of shortening the time consumption of the loading operation or the unloading operation can be obtained.

Description

Test sorting machine

The present application is a divisional application of chinese patent application No. 201410524365.4 filed on 8/10/2014.

Technical Field

The present invention relates to a test handler for testing semiconductor devices.

Background

The test handler is a device that sorts semiconductor devices according to test results tested in a tester to which the semiconductor devices manufactured by a predetermined manufacturing process are electrically connected.

The test handler has been disclosed through a number of patent documents, for example, korean patent publication No. 10-2007-0021357 (hereinafter referred to as prior art) entitled "test handler" TEST HANDLER.

The test handler supports the semiconductor devices to be tested in the following manner: the semiconductor devices are moved from the customer tray to the test tray, and then the semiconductor devices loaded on the test tray are electrically connected to the tester to ensure the progress of the test. The semiconductor devices that completed testing are moved back to the empty user tray.

Fig. 1 is a plan view of a conventional test handler 100. Referring to fig. 1, the test handler 100 is configured to include a test tray 110, a loading device 120, a soak chamber 130, a test chamber 140, a pusher 150, a desoak chamber 160, and an unloading device 170.

As shown in fig. 2, a plurality of inserts 111 are seated in the test tray 110 such that the semiconductor devices (D) are safely placed. The test tray 110 is circulated along a predetermined path (C) by a plurality of conveyors (not shown).

Semiconductor devices to be tested are loaded from a Customer Tray (CT) to the test tray 110 placed in the loading position by the loading device 120. As shown in fig. 3, a Customer Tray (CT) is placed on a loading plate 191 located at the lower side of the base plate 180. In the base plate 180, loading holes 181 are formed to enable the semiconductor devices to be moved to the test tray 110 by the loading device 120. A plurality of loading plates 191 and loading holes 181 may be provided.

The soak chamber 130 is provided to subject the semiconductor devices loaded on the test tray 110 transferred from the Loading Position (LP) to pre-heating or pre-cooling according to a test environment condition before testing. That is, the test tray 110 loaded with the semiconductor devices is received in the soak chamber 130, and thus the semiconductor devices will be assimilated to a temperature required for the test.

The test chamber 140 receives the test tray 110 transferred from the soak chamber 130 to a Test Position (TP) and is configured to test semiconductor devices loaded on the received test tray 110.

The semiconductor devices loaded on the test tray 110 received in the test chamber 140 are pushed to the side of the tester by the pushing device 150 to electrically connect the semiconductor devices to the tester.

The de-soak chamber 160 is provided to assimilate the semiconductor devices loaded on the test tray 110 transferred from the test chamber 140 to a temperature (e.g., a standard temperature) required for unloading.

The unloading device 170 sorts the semiconductor devices loaded on the test tray 110 transferred from the desoak chamber 160 to an Unloading Position (UP) according to test grades, and unloads the sorted semiconductor devices on an empty user tray (CT) positioned on the unloading plate 192. As shown in fig. 3, a discharge plate 192 is placed on the lower side of the substrate 180. In the base plate 180, an unloading hole 182 is formed to enable the semiconductor devices on the unloading plate 192 to be moved to a Customer Tray (CT) by the unloading apparatus 170. If it is necessary to sort the semiconductor devices subjected to the test according to the grade from the test results, the unloading plate 192 and the unloading holes 182 may be provided in plural.

Meanwhile, as mentioned in the related art, the user tray (CT) is transferred from the stocker to the loading plate 191 or the unloading plate 192 or from the loading plate 191 or the unloading plate 192 to the stocker by a conveyor. In order to smoothly move the user tray (CT) by the conveyor, the loading plate 191 and the unloading plate 192 are configured to be able to be lifted.

The user trays (CT) placed on the loading plate 191 and the unloading plate 192 must be fixed so as not to be disturbed by an impact from the loading operation or the unloading operation. To explain the technique of fixing the user disk (CT), first, the structure of the user disk (CT) is explained.

As shown in the plan view of fig. 4A, the user tray (CT) has a plurality of loading portions (Lp). The semiconductor device is loaded on the upper surface of the loading portion (Lp). In this embodiment, a face including a plurality of loading portions (Lp) and a tip end boundary (Tb) surrounding the loading portions (Lp) is defined as a loading face (Lf).

Further, as shown in the front view of fig. 4B, a plurality of side jaws (Sj) are formed at positions lower than the loading surface (Lf). Therefore, the outer gap (S1) between the side jaws (Sj) facing each other is larger than the width (S2) of the loading surface (Lf).

In order for the position of the Customer Tray (CT) having the above-described structure not to be changed when the loading operation is performed, and also for a picker (not shown) to ensure that the semiconductor device is always clamped at the same height and to prevent deterioration of flatness caused by bending of the plastic Customer Tray (CT), the Customer Tray (CT) must be fixed. Accordingly, when the loading plate 191 is completely lifted, as shown in fig. 5, the top end boundary (Tb) of the loading surface (Lf) contacts the bottom surface (Bf) of the substrate 180 to chuck the Customer Tray (CT) between the substrate 180 and the loading plate 191. Since the case of the unloading operation is the same as that of the loading operation, the description of the unloading operation is omitted.

However, in the case of the related art fixing technique described above, since a user tray (CT) whose position is fixed for a loading operation or an unloading operation is placed on the lower side of the substrate 180, a transfer distance of the loading device 120 and the unloading device 170 may be considerably long. The reason for the longer distance is: in the case of the loading device 120, the loading device 120 must be moved to a Customer Tray (CT) positioned lower than the substrate 180 through the loading hole 181 to clamp the semiconductor devices loaded on the Customer Tray (CT); and in the case of the unloading apparatus 170, after clamping the semiconductor devices completed testing, the unloading apparatus 170 must be moved to a Customer Tray (CT) positioned lower than the substrate 180 through the unloading hole 182. Since the loading device 120 or the unloading device 170 is generally moved as many as several hundreds to several thousands times to perform a test of a large batch of semiconductor devices, the time required for the loading operation and the unloading operation becomes very long in the conventional fixing technique of the Customer Tray (CT). This may also be a cause of longer test times and inefficient test operations.

Disclosure of Invention

In view of the above, the present invention provides a technique of reducing the conveying distance of the loading device and the unloading device.

According to an embodiment of the present invention, there is provided a test handler including: a substrate formed with at least one loading hole and at least one unloading hole; at least one loading plate on which a customer tray loaded with semiconductor devices to be tested is placed, the at least one loading plate being configured to be capable of being elevated at a position corresponding to the at least one loading hole; at least one unloading plate on which a user tray loaded with semiconductor devices subjected to a test is placed, the at least one unloading plate being configured to be capable of being lifted at a position corresponding to the at least one unloading hole; a loading device for transferring the semiconductor devices loaded on the customer tray placed on the at least one loading plate to the test tray placed at the loading position; a test chamber for testing a semiconductor device; and an unloading device for transferring the semiconductor devices loaded on the test tray placed at the unloading position to the user tray placed on the at least one unloading plate, wherein a planar area of the at least one loading hole or the at least one unloading hole is larger than an area of a loading surface of the user tray to enable the loading surface of the user tray to be inserted into or enter the loading hole or the unloading hole; and wherein the horizontal and vertical widths of the at least one loading aperture or the at least one unloading aperture are smaller than the lateral gaps of the mutually opposite side jaws, which are provided to the user disc and are placed below the loading surface.

According to another embodiment of the present invention, there is provided a test handler including: a substrate formed with at least one loading hole and at least one unloading hole; at least one loading plate on which a customer tray loaded with semiconductor devices to be tested is placed, the at least one loading plate being configured to be capable of being elevated at a position corresponding to the at least one loading hole; at least one unloading plate on which a user tray loaded with semiconductor devices subjected to a test is placed, the at least one unloading plate being configured to be capable of being lifted at a position corresponding to the at least one unloading hole; a loading device for transferring the semiconductor devices loaded on the customer tray placed on the at least one loading plate to the test tray placed at the loading position; a test chamber for testing a semiconductor device; and an unloading device for transferring the semiconductor devices loaded on the test tray placed at the unloading position to the user tray placed on the at least one unloading plate, wherein a planar area of the at least one loading hole or the at least one unloading hole is larger than an area of a loading surface of the user tray to enable the loading surface of the user tray to be inserted into or enter the loading hole or the unloading hole; and wherein the base plate is provided with a locking portion on which mutually opposed side jaws can be caught, the side jaws being provided to the user disc and being placed lower than the loading surface.

Further, the locking portion may be a locking bracket provided on an upper surface of the substrate.

Further, a recess having a size larger than an area of the loading hole is formed by a recess on an upper surface of the substrate, and a locking bracket may be coupled to the recess, wherein, at a center of the locking bracket, a hole having a size smaller than horizontal and vertical widths of the loading hole is formed.

Further, the thickness of the locking bracket may be equal to or less than the recess depth of the recess.

According to the present invention, the transfer distance of the loading device and the unloading device can be reduced to achieve the effect of reducing the number of times required for the loading operation and the unloading operation.

Drawings

Fig. 1 is a plan view showing a conventional test handler.

Fig. 2 to 5 show reference diagrams of the prior art.

Fig. 6 is a plan view illustrating a test handler according to an embodiment of the present invention.

Fig. 7 to 10 are reference diagrams showing characteristics of the test handler of fig. 6.

Fig. 11 and 12 are reference diagrams illustrating characteristics of a test handler according to another embodiment of the present invention.

Fig. 13 and 14 are reference diagrams illustrating characteristics of a test handler according to still another embodiment of the present invention.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, but what has been described in relation to the prior art will be omitted or compressively described in the specification.

The test handler 600 according to the present embodiment may include a test tray 610, a loading device 620, a soak chamber 630, a test chamber 640, a pusher 650, a desoak chamber 660, and an unloading device 670. The test tray 610, the loading device 620, the soak chamber 630, the test chamber 640, the pushing device 650, the desoak chamber 660, and the unloading device 670 have been described in the background section, and thus their descriptions will be omitted.

As shown in detail in fig. 7 according to the present embodiment, the base plate 680 may be formed with two loading holes 681 and four unloading holes 682. Further, on the lower side of the base plate 680, two loading plates 691 may be provided to be able to be lifted and lowered at positions corresponding to the two loading holes 681, respectively, and four unloading plates 692 may also be provided to be able to be lifted and lowered at positions corresponding to the four unloading holes 682, respectively. The plane areas of the loading and unloading

holes

681 and 682 may be larger than the area of the loading surface of the user tray (CT) to allow the loading surface of the user tray (CT) to be inserted into or enter the loading and unloading

holes

681 and 682. That is, as shown in detail in fig. 8, the horizontal width (L1) of the loading hole 681 and the unloading hole 682 may be wider than the horizontal width of the loading surface, but may be narrower than the outer gap (L3) of the side jaws (Sj) facing each other in the user tray (CT) (the same is the case of the vertical width). Accordingly, as shown in fig. 9, when the loading plate 691 or the unloading plate 692 completes the elevation, the loading surface (Lf) of the user tray (CT) may be inserted (according to practice, it may pass) into the loading hole 681 or the unloading hole 682, resulting in that the loading surface (Lf) of the user tray (CT) is located at a higher position than the bottom surface (Bf) of the substrate 680 and the side jaw (Sj) may contact the bottom surface (Bf) of the substrate 680. Thus, the user disk (CT) can be fixed in the following state: the side jaws (Sj) are tightly caught between the bottom surface (Bf) of the base plate 680 and the loading plate 691, and between the bottom surface (Bf) of the base plate 680 and the unloading plate 692.

As shown in fig. 10A and 10B as a comparative reference, according to the present embodiment (fig. 10A), since the loading surface (Lf) of the user disc (CT) is raised and lowered by a predetermined length (T1) in addition to the related art (fig. 10B), the distance that the loading device 620 or the unloading device 670 must be lowered to reach the loading surface (Lf) becomes smaller by a predetermined length (T1), and finally the transfer distance of the loading device 620 and the unloading device 670 can be reduced.

Fig. 11 shows another embodiment of the present invention. In the embodiment as shown in fig. 11, a locking portion 783 may be provided around the loading hole 781 in the substrate 780. In this way, the lateral jaw (Sj) of the user disc (CT) is locked at the locking portion 783. Accordingly, the user disc (CT) can be fixed in a state where the side jaw (Sj) is inserted between the locking portion 783 and the loading plate 791. In this embodiment, the locking portion 783 may be integrally machined with the base plate 780 or may be otherwise provided separately. The unloading operation of the locking portion 783 is also the same as the loading operation described above.

As shown in fig. 12A and 12B as a comparative reference, according to the present embodiment (fig. 12A), since the loading surface (Lf) of the user disc (CT) is raised and lowered by a predetermined length (T2) in addition to the related art (fig. 12B), the distance that the loading device 620 or the unloading device 670 must be lowered to reach the loading surface (Lf) is reduced by the predetermined length (T2), and finally the transfer distance of the loading device 620 or the unloading device 670 can be reduced.

In yet another embodiment of the present invention as shown in fig. 13, an additional locking bracket 883 may be disposed above the substrate 880. That is, as shown in fig. 14, the present embodiment is equipped with an additional locking bracket 883 to serve as a locking part in a case where the lateral jaw (Sj) of the user disc (CT) is locked. In this regard, when a picker (not shown) for moving a semiconductor device is moved toward a planar direction, an upper surface of the locking supporter 883 may not protrude beyond an upper surface of the substrate 880 to prevent interference of the picker and the locking supporter 883. For example, in the upper surface of the substrate 880, a recess having a plane area larger than that of the loading hole or the unloading hole may be formed using a recess, and the locking bracket 883 may be placed in the recess. In this case, the thickness (height) of the locking bracket 883 may be lower than the recess depth of the recess. Further, in the center of the locking bracket 883, a hole having a size smaller than the horizontal width and the vertical width of the loading hole or the unloading hole may be formed. Thus, the loading surface (Lf) can be locked by the locking bracket 883.

As described above, although the present invention has been described in detail through the exemplary embodiments, those skilled in the art will appreciate that various modifications can be made to the exemplary embodiments without departing from the scope of the present invention. Therefore, the scope of the present invention is not limited to the described embodiments but is defined by the claims and the equivalents thereof.

Claims

1. A test handler, comprising:

a substrate formed with at least one loading hole and at least one unloading hole;

at least one loading plate on which a customer tray loaded with semiconductor devices to be tested is placed, the at least one loading plate being provided to be capable of being elevated at a position corresponding to the at least one loading hole;

at least one unloading plate on which a user tray loaded with semiconductor devices subjected to a test is placed, the at least one unloading plate being configured to be capable of being lifted at a position corresponding to the at least one unloading hole;

a loading device for transferring the semiconductor devices loaded on the customer tray placed on the at least one loading plate to a test tray placed at a loading position;

a test chamber for testing the semiconductor device; and

an unloading device for transferring the semiconductor devices loaded on the test tray placed at the unloading position to the user tray placed on the at least one unloading plate,

wherein a planar area of the at least one loading aperture or the at least one unloading aperture is larger than an area of a loading surface of the user disc to enable the loading surface of the user disc to enter the loading aperture or the unloading aperture;

wherein the base plate is provided with a locking portion on which mutually opposing side jaws can be caught, the side jaws being provided to the user disc and being placed lower than the loading face;

wherein the locking portion is a locking bracket provided on an upper surface of the substrate;

wherein the recess is formed by a recess on the upper surface of the substrate; and is

Wherein a thickness of the locking bracket is equal to a recess depth of the recess.

2. The test handler of claim 1, wherein the recess has a size larger than an area of the loading aperture or the unloading aperture, and

wherein the locking bracket is coupled to the recess, wherein, at a center of the locking bracket, a hole having a size smaller than horizontal and vertical widths of the loading or unloading hole is formed.