TW202138828A - Socket for inspection of semiconductor devices - Google Patents

Abstract

The present invention relates to a socket for testing semiconductor devices, the socket comprising: a base disposed below the socket; a contact pin which is disposed on the base and is shifted in the longitudinal direction so as to contact a semiconductor package located there above; a positioning base, located above the socket, for controlling the position of the contact pin; a guide for housing the semiconductor package above the positioning base; a cover which is located above the socket and which can move up and down; and a latch assembly connected to the cover which pivotally moves up and down therein, wherein the positioning base moves the contact pin in the transverse direction such that the upper portion of the contact pin can move to a desired position.

Description

Socket for semiconductor device inspection

The present invention relates to a socket device for semiconductor device inspection (hereinafter referred to as a "socket"), and particularly relates to a bow-shape LGA (Land Grid Array) socket and BGA (Ball Grid Array) socket without using a separator , By specifically realizing the method of directly inserting the contact pin into the socket base, it brings an epoch-making effect in reducing the production cost of the socket than the conventional socket manufacturing method that uses a partition plate, and the existing socket manufacturing method that does not use a partition plate It can be applied to a narrower and narrower pitch, so that the range of pitches that can be applied to reduce the cost of socket production can be applied to both narrow and wide pitch semiconductor device inspection sockets.

Generally, semiconductor devices are manufactured by high-density integration of electronic circuits on a circuit board. After the semiconductor device is manufactured, the semiconductor package undergoes an inspection process to check whether the semiconductor package operates correctly before being assembled into a product. Such inspection work is carried out by putting the semiconductor package into the inspection socket device. The socket device is provided with a large number of contacts that contact the semiconductor package, and the contacts of the semiconductor package terminals and contact pins are in contact with each other to form electrical current. Device to inspect semiconductor packages. The task of the socket used for inspection is to form an electrical connection path between the external terminals of the semiconductor package and the system. In order to inspect multiple semiconductor packages at a time, a certain interval and a certain number of arrays are mounted in a matrix on the main substrate and put into use. Check the system to identify the defective device of the semiconductor package. Once the cover of the inspection socket is pressed, the latch will be opened. At this time, the semiconductor package will be vertically inserted into the socket. Then, while the cover will rise, the latch will press the upper surface of the semiconductor package to make The contact load between the package ball and the contactor is generated, and the electrical connection is performed for inspection. The pressing source of the semiconductor package is generated by the elastic force of the cover spring, and the wire task for the contact between the package ball and the contactor and the reception of the accompanying electrical signal is established by the contact pin. In the power generation process of semiconductor packages, packages with equal pitches of 1.0mm and 0.8mm (wide pitch) have been the mainstream in the past. However, due to the acceleration of the miniaturization and thinning of semiconductor packages, the pitch of semiconductor packages is also higher than the previous ones. When the pitch is more than a certain size (the bending state of the contact pin is wider than the pitch), when the contact pin is inserted into the socket base, it will be Neighboring contact pins interfere or conflict, which causes problems such as defects or a state that cannot be automatically inserted. Therefore, an automated device cannot be used for a pitch of a certain size (for example, 0.8 mm) or less. Therefore, there are cases where one by one contact pins are inserted into the socket base by hand while accepting some or a certain degree of conflict. In addition, in the past, wide or narrow pitches were used to directly insert contact pins into the socket base by automatic or manual insertion. In the case of spacers, the contact pins were first inserted into the spacer and then A method in which the inserted spacers are mounted on the base of the socket and assembled. Figures 14 to 16 are methods of inserting the contact pin (11) into the base (17) of the prior art, as shown in A and B of Figure 14, when it is directly inserted into the base (17) , When the contact pin (11) is inserted, the amount of conflict and interference with the adjacent pin is large, and the deformation of the contact pin (11) is caused. In the case of large spacing (wide spacing), it can be automated or manually inserted, but in the spacing ratio When the gap distance of the contact pin spring (12) is smaller (narrow pitch), the automatic or direct insertion method may cause problems. That is, in the conventional method, in order to solve the problem of the conflict of the narrow pitch shown in A of FIG. 14, when the pitch is narrow, it is impossible to directly insert the contact pin (11) into the base hole. Therefore, as a countermeasure against this, the method of using the spacer (15) shown in FIG. 15 will be used. Also, as shown in B of Fig. 14, even in the past, when the contact pin (11) is inserted, if the pitch is not affected by interference with the contact pin (11), or the interference is a slightly wide pitch , There will be no major problem in inserting the contact pin (11) into the base hole. However, with the development of semiconductor packaging, and according to the needs of users, the pitch will gradually be narrowed, and various conventional methods corresponding to the narrow pitch are established. In this case, as shown in Figures 15 and 16, after inserting the contact pin (11) in the partition (15), the partitions (15) inserted into the contact pins (11) are stacked and assembled on the base The socket (17) method will be used, and now the socket is made in this way with a narrow pitch. Although it is possible to correspond to the narrow pitch in this way, the number of spacers that enter a socket through the ball matrix of the semiconductor package (50) will mostly increase, and the work process will also increase, becoming the original price as the manufacturing cost rises. The main reason for the rise is nothing but a structure that becomes a burden on customers. That is, in the conventional method of using spacers (15) in a narrow pitch, tens of spacers (15) are required for one inspection socket, so it cannot correspond to the reduction in unit price of sockets of semiconductor manufacturing companies that are sensitive to manufacturing costs. The limit point of the requirements of the socket manufacturer, and the price competitiveness of socket manufacturing companies has also become a big burden. For this reason, in the manufacture of sockets for semiconductor device inspection, efforts to ensure competitiveness by reducing the number of applicable parts and reducing the manufacturing unit price are a real situation. In addition, the current type of semiconductor package is a group of fine and narrow pitch products such as mobile devices. The demand for such a group of products is continuously increasing. As a socket manufacturing method that utilizes conventional spacers, it cannot correspond to the price of parts. To reduce the requirements, the conventional manufacturing method of directly inserting contact pins into such a socket base has a problem that it is impossible to respond to fine and narrow pitches.

[Technical issues] The purpose of the present invention is to solve the above-mentioned problems, and to provide a socket that can be installed by directly inserting contact pins into the socket base without using conventional spacers even for fine and narrow pitches, thereby forming The lower manufacturing cost brings the productivity improvement of fine and narrow pitch inspection sockets and the effect of reducing the original price of the semiconductor package inspection socket device. [Technical solution] In order to achieve the above-mentioned object, the present invention includes a socket for semiconductor device inspection: The base, which is located below the socket; A contact pin, which is installed in a base hole provided on the inner side of the base, is displaced in the longitudinal direction, and contacts the semiconductor package located above; and The position table, which is located above the socket, restricts the position of the upper part of the contact pin, The position table system moves the contact pin in the horizontal direction, and can move the upper part of the contact pin to a target position. In the above configuration, after the position table moves the upper part of the contact pin, the position of the upper part of the contact pin is located on or close to the line (C) of the lower position of the contact pin. Also, in the above structure, The contact pin system has one or more bent contact pin springs that can be displaced in the longitudinal direction, and The shape of the contact pin spring before the position table moves the upper part of the contact pin is such that the contact pin is installed and inserted into the base hole without interference with the adjacent contact pin, or does not interfere with the installation, After the position table moves the upper part of the contact pin, the spring shape of the contact pin is formed into a shape that interferes with the adjacent contact pins during the process of installing the contact pin to the base hole and hinders assembly. In addition, in the above configuration, a pressing portion that can be pressed from above is provided on the lower side of the contact pin. In addition, in the above configuration, a semiconductor package mounting portion for accommodating the semiconductor package is provided above the position stage, and When the semiconductor package is pressed from above, the semiconductor package mounting portion is lowered together with the semiconductor package, and the semiconductor package is guided to the semiconductor package mounting portion while contacting the upper surface of the position stage to enable the semiconductor package and the semiconductor The lowering of the package mounting part stops at the target position. In the above configuration, when the semiconductor package is lowered and the semiconductor package is in contact with the upper part of the contact pin, the contact pin is tilted from one side of the position stage to the other by a load (stroke), and after the contact is completed After being restored to the original position, there is almost no vertical load on the position table, so the friction force is also eliminated, and the repulsive force of the contact pin is completely transmitted to the package ball. In addition, the above configuration includes a hook for fixing the position table at the final target position when the position table is moved to the target position, and the contact pin system is arranged to match the electrode arrangement of the semiconductor package. In addition, the present invention is a socket for semiconductor device inspection, which includes: The base, which is located below the socket; A contact pin, which is installed in a base hole provided on the inner side of the base, is displaced in the longitudinal direction, and contacts the semiconductor package located above; and The position table, which is located above the socket, restricts the position of the upper part of the contact pin, have: A semiconductor package mounting portion, which accommodates the semiconductor package above the position table; The cover is located above the socket and can be moved up and down; and The lock assembly is connected to the cover, and the cover is moved up and down to rotate, The position table is provided with a configuration in which the upper part of the contact pin can be moved to a target position by moving the contact pin in a horizontal direction. [Effects of the invention] In the present invention, by directly inserting the contact pin into the socket base, compared with the conventional socket manufacturing method using a partition, it has the effect of reducing the manufacturing unit cost. In addition, in other conventional methods that do not use spacers, in the case of a narrow pitch, interference between adjacent pins occurs during the assembly of the contact pins to cause deformation of the contact pins, so it is applicable only when the pitch is wide, but In the case of the present invention, even with a narrow pitch, the contact pins can be directly inserted into the socket base, and the original price can be reduced while being automated, which has a great effect on the increase in production. In particular, the present invention can also insert the contact pins by automation even in narrow pitches. Therefore, when compared with the method of directly inserting the contact pins into the socket base by hand or the process of using partitions, the productivity is improved and the partitions are omitted. , It can achieve the effect of better price competitiveness with the decrease of the socket manufacturing unit price.

The specific content for implementing the invention will be described in detail with reference to the following drawings. The present invention can be modified in many ways, and when there may be a plurality of embodiments, it is desired to display specific embodiments and the like on the drawing to explain the detailed description in detail. However, this is not intended to limit the specific embodiment of the present invention, and it must be understood to include all changes, equivalents, and substitutes included in the idea and technical scope of the present invention. [Example] Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 13 of the present invention. Fig. 1 is a perspective view of a semiconductor device inspection socket of the present invention, showing a general semiconductor device inspection socket (10), including: A base (20), which is located at the lower section of the socket (10), has four supporting legs forming a quadrangular shape, and clamps the shaft to which the lower section of the rod is fixed; and The cover (30), which is located above the base (20), is elastically pressed by 4 cover springs, The inside of the cover (30) is provided with: a latch assembly (40) that is fixed to the base (20) and the cover (30) by a shaft and rotates, and is put into a semiconductor package (50). ) The semiconductor package mounting part (60). Once the cover (30) is pressed down, one cover spring will be pressed down, and the cover (30) will be lowered on the other side. Once it contacts the base (20), the lock assembly (40) will be opened. With the lock assembly (40) opened in this way, the semiconductor package (50) is vertically dropped (inserted) onto the semiconductor package mounting portion (60). Once the cover (30) is placed, the lock assembly (40) will be pressed In the semiconductor package (50), the ball (55) located under the semiconductor package (50) is in contact with the upper part (72; refer to FIG. 13) of the contact pin of the socket (10) to be electrically connected, and various inspections are performed. When the ball (55) with the upper part (72) of the contact pin contacting the inspection pad at the lower part of the package as described above is provided, the semiconductor package mounting portion (60) of the semiconductor package (50) is housed above the position table (80), When the semiconductor package (50) is pressed upward, the semiconductor package mounting portion will drop together with the semiconductor package (50). The semiconductor package (50) is provided with a stop position surface, and the stop position surface is guided to the semiconductor The package mounting part is in contact with the upper part of the contact pin (72) on the position table (80; see FIG. 13) to stop the lowering of the semiconductor package and the semiconductor package mounting part at a certain (target) position. The above-mentioned stop position surface means that when the semiconductor package mounting portion (60) and the semiconductor package (50) are lowered together, the package ball (55) under the semiconductor package mounting portion is in contact with the upper surface of the position table, that is, the upper part of the contact pin (72) The rear stop surface is configured to control the deformation of the contact pin (70) that deforms after the contact pin (70) contacts the package ball (55) according to the vertical distance from the start of the movement of the semiconductor package mounting portion to the stop. In order to maintain a state most suitable for the contact load between the contact pin and the package ball (55), a stop position surface is provided. Thereby, the contact pin (70) receives the most suitable load, prevents the deformation of the contact pin (70), and when the package ball (55) located under the semiconductor package is in contact with the upper part of the contact pin (72), it can maintain the most Good contact relationship, and by using the deformation of the contact pin to form a certain way to accept the load of the purpose, it can maintain a balanced pressing, so that the most suitable contact of the inspection socket can be obtained, and the contact pin (70 ) Deformation such as damage. Thereby, the lowering of the semiconductor package mounting portion is stopped at a desired point. Also, if FIG. 13 is described first, as shown in FIG. 1 above, the semiconductor package (50) will be lowered and the semiconductor package ball (55) located at the bottom of the semiconductor package (50) will be in contact with the upper part of the contact pin (72) When the contact pin (70) on the right side of the position table (80) tilts to the left by the load (stroke), there is almost no vertical load at the position table (80), so the friction force disappears, and the contact pin (70) The repulsive force of) is completely transmitted to the package ball (55), and is configured to be restored to the right side of the original position after the above-mentioned contact is completed. At the same time, the contact pin (70) pulls or pushes the position table (80) to move the position table (80) to a position where the movement for inspection (returned after tilting) can be performed as described above. In this embodiment, the initial original position of the contact pin (70) is on the right side, but it can also be located on the left side to make contact on the right side. The contact ends and the package ball (55) moves from the upper part of the contact pin (72). ) When detached, it is restored to the left side of the original position. In addition, if the drop does not stop when the load is below or above the intended load as described above, poor contact may appear or the amount of deformation of the contact pin may not be constant. Therefore, it may also affect the quality of the socket or A situation that affects the durability of the contact pin. Furthermore, in the case of the above-mentioned stop position surface structure, in the case of the cap elasticity, the production batch and the elastic force itself vary to a certain extent, and the contact load of the contact pin on the package ball also varies. Therefore, if the cap elastic force (above the buckle) Pressing force)> force per pin × number of applicable pins. By setting the upper pressing force to be greater than the pressing force of pressing the package, a structure that can always stop at the same position will result in the deformation of the contact pin. It is often formed to be constant, so the pin force is often formed to be constant, and the socket performance has an effect. Fig. 2 is a perspective view of the base (20) mounted with the contact pin (70) shown in Fig. 3 for contact with the semiconductor package (50). The base hole (20) is located on the lower side of the base (20) 22) When the contact pins (70) are assembled, the contact pins (70) are installed in a large number of base holes (22) arranged in a certain matrix form inside the base (20) as shown in FIG. 3. That is, as shown in FIG. 3, the contact pins (70) are sequentially inserted into the base holes provided on the inner side of the base (20) for installation. At this time, the contact pins (70) are inserted in the order of contact pins. When (70) is inserted, the contact spring (71) of the contact pin (70) will not cause interference with the upper part of the contact pin (72). When the interference occurs, there is a small amount of adjacent contact pins (70) that does not affect the degree of assembly. In the state of interference, they are sequentially inserted into the base (20) and installed, or a plurality of them are installed at the same time. The contact pin (70) is installed in the base hole (22), and it is also installed by automatic insertion or manual insertion. Furthermore, the upper contact pin upper part (72) of the upper part of the contact pin (70) of the present invention is arranged outside (in the direction of the adjacent contact pin (70)) than the straight line (vertical line) of the contact pin lower part (73), And the upper part of the contact pin is inclined. The above-mentioned inclination is based on the straight line (C) of the lower part of the contact pin (73), and the inclination is in the range of about 0.1°~45°. Depending on the situation when the contact pin (70) is installed in the base hole, etc., The tilt can be adjusted within the range of 45 degrees or more and 90 degrees or less. Or, in addition to the above-mentioned configuration in which the upper part of the contact pin (72) is provided outside the straight line (C) of the lower part (73) of the contact pin, the upper part (72) of the contact pin may not be inclined, and the lower part of the contact pin (73) The straight lines of) do not match, but form a vertical configuration in which the straight lines on the outside separated by a certain distance are parallel to each other. In addition, the contact spring (71) of the contact pin (70) has one or more bending portions, and in this embodiment, it has three or four bending portions. Fig. 4 is a cross-sectional view showing a plurality of contact pins (70) used in the present invention. A plurality of curved shapes or forms other than the above-mentioned figure can be formed, and the number of curved portions may be 3 or less or 5 or more. In addition, the contact pin is provided on the lower part (73) side of the contact pin, that is, on the upper side of the lower part, a pressing portion (74) is provided. The pressing portion (74) is used to perform a task to prevent the deformation of the contact pin (70) by pressing the pressing portion (74) from above or the like when the contact pin (70) is installed in the base hole (22) . Figures 5 and 6 respectively show the state where the contact pin (70) of Figure 3 is installed in the base hole (22) located at the inner lower part of the base (20), respectively. In the above-mentioned FIGS. 5 and 6, the arrangement of the contact pins (70) is different according to the semiconductor package for inspection, and various applications are applied. In this embodiment, the arrangement state of FIG. 6 is taken as an example for description. Fig. 7 is a state in which a plurality of contact pins (70) are arranged in a square shape with a space arranged inside as in Fig. 6, and the upper part (72) of the contact pin is penetrated and installed on the position table (80). A large number of holes (hereinafter referred to as the position table hole (82)) to install the position table (80) and cover the state, the upper part of the contact pin (72) in this case is as shown in Figure 3 with a straight line (C) below the contact pin When viewed as a reference, the display is tilted to one side. When the position table (80) with many position table holes (82) is viewed horizontally while covering the position table hole (82), it is exposed in the position table hole The upper part (72) of the contact pin on the (82) is not perpendicular to the horizontal line along the position table (80), and has a slightly inclined structure. The above-mentioned upper part of the contact pin (72) does not stand upright, but is slightly inclined in order to smoothly insert into the base hole (22) provided in the lower inner part of the base (20) in a narrow pitch state, and the upper part of the contact pin ( The straight line of 72) is arranged outside the straight line of the lower part (73) of the contact pin to avoid collision or interference between adjacent contact pins when installing the base hole (22). Therefore, in order to make the inclined upper part (72) of the contact pin contact the lower contact part of the semiconductor package (50), it must stand upright vertically. Therefore, the position table (80) shown in FIG. 8 needs to be in the horizontal direction. That is, the upper part (72) of the contact pin, which is inclined to the left side in the drawing, is located in the vertical position. At this time, the inclined upper part (72) of the contact pin will be in a vertical position, and the above-mentioned straight line is on the contact pin as shown in FIG. That is, in order to move the position table (80), the upper part (72) of the contact pin inserted into the position table hole (82) provided by the position table (80) is pulled or pushed by the contact spring ( The elastic force of 71) is used to correctly position vertically. The upper and lower parts (72, 73) of the contact pin will be in a straight line in a vertical state. At this time, the position of the contact pin (70) is as shown in Figure 13. Connected to one side of the position table (80) and position. In addition, the contact pin (70) does not interfere with the adjacent contact pin when inserted into the base, and can form the shape of the contact pin upper portion (72) and the contact spring (71) to the extent that it does not hinder installation. Press the position table (80) and the upper part of the contact pin (72) stands upright, and the position table hook (81) shown in Figure 9 and the base hook (21) set on the base (20) meet The upper part (72) of the contact pin is vertically fixed by being joined and fixedly established (refer to FIG. 11), and the repulsive force of the contact pin (70) can be resisted and the fixation is maintained. After the position table (80) moves the upper part (72) of the contact pin, the shape of the contact spring (71) is determined by the contact pin (70) being attached to the base hole (22) when the contact pin (70) is installed in the base hole (22). 70) Shapes that interfere with each other and hinder assembly. Fig. 9 is a diagram showing a state where the position table hook (81) is not connected with the base hook (21). As can be seen in Figs. 7 and 8 above, it shows the position table inserted into the position table (80) The upper part (72) of the contact pin fixed by the hole (82) is inclined, and shown on the left side of FIG. 9 is a state where the position table hook (80) and the base hook (21) are not connected. In the above state, if the position table (80) is moved to the left side of the figure by the operator or the driving device omitted from the figure, the upper part of the contact pin (72) will be in a vertical state as shown in Fig. 10 and Fig. 11 Next, the position table hook (81) and the base hook (21) will be concluded. 12 is a perspective view showing a state in which the position table shown in FIGS. 10 and 11 is moved horizontally and the position table hook (81) and the base hook (21) will be combined. The package ball ( 55) The semiconductor package can be inspected by contacting the upper part (72) of the contact pin of FIG. 12 as described in the configuration of FIG. 13. In other words, the invention of the present application is based on the above-mentioned structure shown in Figs. It is automatically installed in the base hole (22) of the base (20), and secondly, it covers the position table (80), and is fixed by the hooks (81, 21) provided on the position table (80) and the base. By this, the inclined upper part (72) of the contact pin can be positioned vertically and correctly, and a socket for semiconductor device inspection can be provided for the purpose of this case. Through the above-mentioned series of processes, from the standpoint of the socket manufacturing company, compared with the existing socket manufacturing method, the epoch-making cost reduction effect can reach the limit. The cost reduction effect differs depending on the semiconductor package ball matrix. Generally, spacers are often used in narrow pitches. Therefore, as long as the spacers are not used, the cost of the number of parts can be reduced. Therefore, the narrower the pitch, The greater the expected effect. The embodiment described above is an example, and as long as a person has a general knowledge in the technical field to which the present invention belongs, various corrections and modifications can be implemented without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate technical facts that are not used to limit the present invention, and the scope of the technical idea of the present invention is not limited by such embodiments. The scope of protection of the present invention is not necessarily explained by the scope of patent application described below, and all technical ideas within the same scope should be interpreted as being included in the scope of rights of the present invention.

10: Socket 15: partition 16: partition gap 17,20: Pedestal 21: Base hook 22: Base hole 30: cover 40: lock assembly 50: Semiconductor packaging 55: Semiconductor package ball 60: Semiconductor package mounting part 11, 70: contact pin 12, 71: Contact pin spring 13,72: The upper part of the contact pin 14,73: The lower part of the contact pin 74: Pressing part 80: position table 81: position table hook 82: position table hole C: The straight line touching the bottom (center line)

Fig. 1 is a perspective view of a socket for semiconductor device inspection according to the present invention. [Figure 2] is a perspective view of a base mounted with contact pins for contact with a semiconductor package. Fig. 3 is a cross-sectional view showing a cross section where the contact pin of the present invention is attached to the base. Fig. 4 is a cross-sectional view showing a plurality of contact pins used in the present invention. Fig. 5 is a perspective view showing a state in which the contact pin of the present invention is attached to the base. Fig. 6 is a perspective view showing another state in which the contact pin of the present invention is attached to the base. [Fig. 7] is a perspective view showing a state in which the position table is covered in the state shown in Fig. 6 described above. [Fig. 8] is a cross-sectional view showing the cross section of the contact pin in Fig. 7 described above. Fig. 9 is a cross-sectional view showing a state where the position table hook and the base hook are not connected. Fig. 10 is a cross-sectional view showing a cross section of the contact pin in a state where the position table of Fig. 9 described above is moved laterally. Fig. 11 is a cross-sectional view showing a state where the table hook and the base hook are joined at the position of Fig. 9. [Fig. 12] is a perspective view showing the state of Fig. 10 and Fig. 11 described above. [FIG. 13] is a cross-sectional view showing the contact and separation state of the semiconductor package ball and the contact pin in stages. [Fig. 14] is a view showing whether the contact pins collide with each other in the case of a conventional narrow pitch and a wide pitch. [FIG. 15] A is a diagram showing a conventionally used partition, and B is a diagram showing a state where the contact pin is attached to the conventionally used partition. [Fig. 16] is a diagram showing a state where contact pins are attached to many conventional separators and stacked.

10: Socket

20: Pedestal

30: cover

40: lock assembly

50: Semiconductor packaging

60: Semiconductor package mounting part

Claims (1)

A socket for semiconductor device inspection, which is characterized by: The base, which is located below the socket; The cover is located above the base and is elastically pressed by a plurality of cover springs; A contact pin, which is installed in a base hole provided on the inner side of the base, is displaced in the longitudinal direction, and contacts the semiconductor package located above; and The position table, which is located above the socket, restricts the position of the upper part of the contact pin, have: Housing the semiconductor package mounting portion of the semiconductor package above the position stage; The above-mentioned cover which is located above the above-mentioned socket and can be moved up and down; and Is connected to the cover, and the cover is a lock assembly that moves up and down and rotates, The position table is capable of moving the contact pin in the horizontal direction to move the upper part of the contact pin to a target position.

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