TWI613869B - Socket device for testing a semiconductor device - Google Patents

Abstract

Provided is a socket device for inspection of a semiconductor device in which the handle has a handle protrusion and the latch has a long hole portion to have a correct handle ratio, thereby reducing the coverage force (Cover Force) periodically.

The present invention relates to a socket device for inspection of a semiconductor device, and particularly relates to a reduction in coverage force (Cover Force) by forming a correct shank ratio, and a stopper on a latch plate to prevent a shaft A semiconductor device inspection socket device that disengages and increases the opening amount of the latch plate.

The invention is a socket for inspecting a semiconductor package, which has: a base at the lower end of the socket in a quadrangular shape with four legs, which fixes a shaft that can rotatably fix a latch; and is located above the base by The four cover springs are elastically pressurized to fix the cover for fixing the shaft of the handle; inside the cover, there is a latch assembly that is fixed on the base and the cover with the shaft to rotate; Tenon shafts are formed at the two front end portions of the latch, and the holes of the latch plate are inserted into the tenon shaft in a rotatable manner. A fixed latch plate; and a semiconductor package inspection socket having a semiconductor package mounting portion put into the semiconductor package, the handle is formed with a protrusion and a recess, the protrusion is connected with the cover The shafts are in contact with each other and move along the periphery of the protrusion.

Description

Semiconductor device inspection socket device

The present invention relates to a socket device for inspection of a semiconductor device, in particular, to form a correct shank-to-rod ratio to reduce the coverage force (Cover Force) periodically, and to form a stopper on the latch plate to prevent the shaft from coming off , And a semiconductor device inspection socket device that increases the opening amount of the latch plate.

Generally speaking, semiconductor devices are electronic circuits that are fabricated on a circuit board with high density. The semiconductor devices shown above are made of LGA (Land Grid Array) and BGA (Ball Grid Array). , CSP (Chip Sized Package, wafer level package) type, etc., after manufacturing the semiconductor device, and before assembling into a product, will pass the inspection process to check whether the semiconductor package is operating correctly.

The inspection work shown above is carried out by putting the semiconductor package into the inspection socket device. The socket device is provided with a plurality of contact pins that are in contact with the semiconductor package, and the semiconductor package terminals are contacted with the contact probes. Turn on the power and use the inspection device to inspect the semiconductor package.

Due to the rapid technological development of small, thin-walled IT equipment, half The miniaturization and thinning of the conductor package have been accelerated, and along with this, pitch has become increasingly finer, and 0.3mm pitch devices have been commercialized. However, in order to inspect the fine-pitch components shown above in a stable manner, strict tolerance management of the semiconductor package and socket must be performed. However, due to the characteristics of the semiconductor manufacturing process, due to the limits of package tolerances and shape management, the Compared with the fine pitch semiconductor package of 0.5mm or more, not only is it difficult to reduce the ratio, but due to the minute environmental changes, the electrical characteristics required also show a more sensitive response. The function of the socket used for inspection is the electrical connection path between the external terminals (balls of the package) constituting the semiconductor package and the system. In order to inspect a plurality of semiconductor packages at a time, a certain amount of The sockets are arranged in a matrix on the main board, and this is put into the inspection system to select the defective device of the semiconductor package.

If the cover of the socket is pushed, the latch assembly is opened. At this time, the semiconductor package is vertically inserted into the socket. After that, the cover rises and the latch assembly presses the upper surface of the semiconductor package, so that A contact load occurs between the ball of the package and the socket pin to make an electrical connection.

The pressure source of the semiconductor package is generated by using the elastic force caused by the cover spring. The more applicable pins, the more the load of the cover spring increases in proportion to it. For example, when the contact load of each pin is 10gf on average, if it is 200 pins, it must be pushed by 2kgf on the package, if it is 500 pins, it must be pushed by 5kgf. Therefore, when the latch assembly is opened to put the semiconductor package in the socket, it is necessary to push the cover with equipment. Therefore, there is a need for more pins and a higher load for pushing with the equipment.

At present, in terms of equipment characteristics of semiconductor manufacturing companies, there is an upper limit for pressing the cover, and the continuous increase in the demand for multi-socket sockets is the actual situation.

In the case of equipment stamping, basically, the socket cover is pushed four at a time and eight at a time. However, in general, the upper limit of stamping is about 30 kgf.

A conventional example of checking sockets as shown above has been proposed in Korean Patent No. 10-1245837 (Patent Document 1). The aforementioned patent includes: a fixed body part, a cover part, an adapter, a latch, a contact pin, an actuation body part, and actuation together with the downward movement of the semiconductor package pressurized by the latch The upper part of the main body moves, the contact pin is pressed in the lateral direction, and contact between the contact pin and the solder ball of the semiconductor package is made.

As another example, Korean Patent No. 10-1259264 (Patent Document 2) has been proposed, including: a base, a slider, an adapter, a cover, a stopper, and a handle, the lower end of each handle It is rotatably mounted on the base and includes a pressure lever unit that increases the external force input from the outside through the cover and transmits it to the slider. However, the inspection sockets obtained by the conventional technology of the above two examples are covered by the current new requirements for increasing the number of pins, and the coverage is high, which does not match the equipment characteristics of the current semiconductor manufacturing company, and there is no way to respond The problem of the actual situation where the multi-socket socket needs to continuously increase.

For the reasons shown above, I am interested in the coverage. From the standpoint of the socket manufacturing company, reducing the coverage can improve the competitiveness of products.

Mass production of mobile devices based on semiconductor packages, the need for narrow-pitch, multi-pin accommodation continues to increase. For narrow-pitch semiconductor packages The existing BGA socket is currently impossible to achieve. For the reasons shown above, it is a state corresponding to the LGA socket. However, due to the characteristics of the LGA socket, there is a problem of high coverage. On the user side, in order to improve the effectiveness of equipment, it is desirable to continuously reduce the coverage. As shown in the previous description, if the equipment is pressed on the user side, the load that can be pushed at one time is about 30kgf. The higher the coverage of the socket, the more the amount of pushing can be reduced by one push. This is related to The increase in production time for inspection of semiconductor packages increases the problem of direct connection, so it becomes the main reason for the unit price increase of production.

Due to the problem shown above, the coverage force problem is rising. In the shank concept so far, in order to reduce the coverage force has its limit state, but it must be formed by the correct shank ratio of the new concept of the shank The necessity to reduce the coverage power periodically.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Korean Patent Publication No. 10-1245837

[Patent Document 2] Korean Patent No. 10-1259264

The purpose of the present invention is to solve the above-mentioned problems, and the inventors provide a handle with a handle protrusion, and a latch with a long hole, thereby having a correct handle ratio, so that the covering force ( Cover Force) Socket device for inspection of semiconductor devices that has been periodically reduced.

Another object of the present invention is to provide a semiconductor device inspection socket device that prevents a shaft from coming off by forming a stopper on a latch plate.

Still another object of the present invention is to provide an increased opening amount of the latch plate to easily perform vertical insertion of the semiconductor package, thereby improving a socket device for inspection of a semiconductor device that is incorrectly mounted.

In order to achieve the aforementioned object of the invention, the present invention is achieved by the following: a socket for inspection of a semiconductor package, which has: a quadrangular shape at the lower end of the socket, with four legs, fixed in a rotatable manner The base for fixing the shaft of the latch; is located above the base and is elastically pressurized by four cover springs to fix the cover for fixing the shaft of the handle; inside the cover is provided with: a shaft A latch fixed to the base and the cover for revolving; a shaft that can be rotated together with the latch to be fixed to the latch, and a shaft to be fixed to the handle of the base; at the foregoing Tenon shafts are formed at both front end portions of the latch, a latch board is inserted into the hole of the latch board and fixed rotatably in the tenon shaft; In a socket for package inspection, the handle is formed with a protrusion and a recess, and one end of the latch is formed with a long hole. The protrusion contacts the shaft and moves along the periphery of the protrusion The shaft is configured to move in the aforementioned long hole. It is characterized in that stoppers are formed at both ends of the latch plate to prevent the shaft from coming off.

It is characterized in that it is configured to maintain the space between the latch plates Narrow, when the latch is upright with the handle, the protective cover is formed with a storage portion that can be accommodated, when the cover is opened, the latch and the handle can be upright, thereby the latch The opening amount is maximized to prevent loading errors when loading the semiconductor package.

The tie rod of the present invention has a handle protruding portion, and the latch has a long hole portion, thereby having a correct handle-to-rod ratio. Compared with the prior art, the cover force (Cover Force) is periodically reduced. The equipment of the manufacturing company can be used as it is while checking the effects of a large number of semiconductor devices at a time.

In addition, the current equipment of the semiconductor manufacturing company is used as it is, thereby having the effect of not increasing the unit price of production, improving productivity and reducing costs.

By forming a stopper on the latch plate of the inspection socket of the present invention, the shaft is prevented from coming off in a simple way, which has the effect of saving the unit price of production, and reduces the reliability of the inspection socket due to defects caused by shaft separation The effect of promotion.

It has the effect of increasing the opening amount of the latch plate of the inspection socket of the present invention, and when the semiconductor package is put vertically, it can improve the effect of loading errors and improve the inspection efficiency.

10‧‧‧Socket

20‧‧‧ base

30‧‧‧Cover

31‧‧‧ Containment Department

40‧‧‧Latch assembly

41‧‧‧Latch

42‧‧‧Groove

43‧‧‧hole

44, 44a, 44b, 44c ‧‧‧ axis

45‧‧‧handle

46‧‧‧ tenon shaft

47‧‧‧Latch plate

48‧‧‧stop

50‧‧‧Semiconductor package

51‧‧‧Semiconductor package loading section

301‧‧‧Projection

411‧‧‧Long hole

450‧‧‧Protrusion

451‧‧‧Depression

FIG. 1 is a diagram showing a general semiconductor device inspection socket.

FIG. 2 is an exploded view of the latch, latch plate, handle and shaft of the socket of FIG. 1.

FIG. 3 is a diagram illustrating the actuation relationship between the handle and the latch of FIG. 2.

4 is a diagram illustrating the actuation relationship between the handle and the latch of FIG. 2.

FIG. 5 is a diagram illustrating the actuation relationship between the handle of FIG. 2 and the latch.

6 is a diagram illustrating the actuation relationship between the handle and the latch of FIG. 2.

7 is an exploded view of the handle, latch, latch plate, and shaft of the present invention.

FIG. 8 is a diagram illustrating the actuation relationship between the handle and the latch of the present invention.

9 is a diagram illustrating the actuation relationship between the handle and the latch of the present invention.

FIG. 10 is a diagram showing the operating state of the latch assembly having the handle of the present invention.

11 is a diagram showing the movement relationship of the shaft in the long hole of the latch when the latch plate of the present invention presses the semiconductor package.

12 is a diagram showing the movement relationship of the shaft in the long hole of the latch when the latch plate of the present invention presses the semiconductor package.

FIG. 13 is a diagram showing the ratio of the handle of FIGS. 8 and 9 to the handle of the latch.

Fig. 14 is a view showing a state where a stopper is formed on the latch plate of the present invention.

FIG. 15 is a view showing a state where the conventional latch is in contact with the protrusion at the upper end of the cover, and the latch is only opened to the protrusion.

16 is a view showing a state where the upper end portion of the cover of the present invention does not have a protrusion, and the latch is slightly inclined and opened from the inside of the cover toward the outside.

The present invention will be described in detail below with reference to the accompanying drawings.

The present invention can be modified in various ways, and can have various embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to a specific embodiment, but should be understood to include all changes, equivalents, or substitutes included in the idea and technical scope of the present invention. While describing the respective drawings, the same component elements will be described using the same symbol.

FIG. 1 is a diagram illustrating a general semiconductor device inspection socket 10 including: a base 20 at the lower end of the socket 10 having a quadrangular shape and having four legs inserted into a shaft that fixes the lower end of the handle; and A cover 30 that is elastically pressurized by four cover springs and located above the base 20 is provided inside the cover 30: respectively fixed to the base 20 and the cover 30 with shafts for rotation The latch assembly 40; and the semiconductor package mounting portion 60 for input into the semiconductor package 50. When the protective cover 30 is pushed, the protective cover spring is pushed down while the protective cover spring is pushed downward, and the latch assembly 40 is opened when it contacts the base 20. As shown above, with the latch assembly 40 in the open state, the semiconductor package 50 is vertically dropped (dropped) into the semiconductor package mounting portion 60. If the protective cover 30 is released, the latch plate 47 of the latch assembly 40 is pushed After pressing the semiconductor package 50, the ball legs of the semiconductor package 50 are in contact with the pins of the socket 10, and after making electrical connection, various inspections are performed.

FIG. 2 is an exploded perspective view of the latch assembly 40 of FIG. 1, the latch assembly 40 is formed with: a latch 41, and the aforementioned latch 41, a handle 45 two channels 42 that can be rotated. In the groove 42, the shaft 44 a is pivoted so that the shaft 44 a can be inserted into the hole 43 formed in the body of the latch 41 to rotate around the shaft 44 a.

Tenon shafts 46 are formed at both front end portions of the latch 41, the tenon shaft 46 is inserted into the hole of the latch plate 47, and is fixed in such a manner that the latch plate 47 can rotate. The aforementioned latch plate 47 presses the upper surface of the semiconductor package 50. FIGS. 3 to 6 are diagrams showing the actuation relationship between the conventional latch 41 and the handle 45. The handle 45 is fixed to the base 20, and the assembly relationship between the latch 41 and the handle 45, the latch 41 and the handle 45 is rotated by the shaft 44a, so in the initial development, it is determined that the shaft 44a is used as the reference axis to form a lever ratio of L1: L2. However, after the actual socket is manufactured, the inspection result is determined to be that the movement of the shaft 44a occurs as shown in FIG. 5 and the lever ratio of L1: L2 is not realized. In order to achieve an ideal shank-to-rod ratio, the rotation axis of the shaft 44a is fixed at a certain point in time. At present, for other socket companies, most adopt this method to set the coverage to a higher state. According to the actual measurement results, if the pressure of the package must be 5kgf, the covering force must also be about 5kgf. In other words, the structure is completely unrealized.

7 is a perspective view showing an exploded view of a latch assembly 40 having a handle 45 of the present invention. The latch assembly 40 is provided with a latch 41, which is pivoted by a shaft 44a on the left and right sides of the latch 41 The shank 45 is fixed in a manner such that a tenon shaft 46 is formed at the front end of the latch 41, and the tenon shaft 46 is inserted into the hole of the latch plate 47 to fix the latch plate 47 in a rotatable manner . Stops are formed on both ends of the aforementioned latch plate 47 Piece 48. The stopper 48 has a function of preventing the shaft 44a from coming off.

8 and 9 are diagrams showing a state in which the handle 45 and the latch 41 of the present invention are combined to operate. The handle 45 includes a handle protrusion 450 and a recess 451. The latch 41 is formed with a long hole 411 at its lower end. In the case of the long hole portion 411 of the latch 41, the handle 45 is fixed to the base 20 at a certain height. Therefore, in order to cause height displacement of the semiconductor package, the long hole portion 411 is required. The shaft 44b is provided so as to be movable across the upper and lower ends of the long hole 411.

The handle 45 is formed with a protruding portion 450 and a recessed portion 451, an elongated hole portion 411 is formed at one end of the latch 41, the protruding portion 450 is in contact with the shaft 44b, and extends along the protruding portion The periphery of 450 moves, and the shaft 44b moves within the aforementioned long hole portion 411.

As shown in FIGS. 8 and 9, when the cover 30 is pressed, the protrusion 450 of the lever 45 moves downward while contacting the shaft 44 b, and the shaft 44 b of the long hole 411 of the latch 41 moves The position is located at the lowermost end of the long hole portion 411 when the latch 41 is fully opened, and is located at the center of the long hole portion 411 when it is closed in the middle, and is located at the uppermost end of the long hole portion 411 when fully closed.

10 to 12 are diagrams showing the operating state of the latch assembly 40 having the handle 45 of the present invention. FIG. 10 is a view showing the state in which the cover 41 is pushed and the latch 41 is opened to stand upright. It can be seen that the shaft 44b is located at the lowermost end of the long hole portion 411. Figure 11 shows the latch 41 closed in the middle In the state diagram, the shaft 44b is located in the middle of the long hole 411. In FIG. 12, the shaft 44 b is located at the uppermost end of the long hole 411. The movement of the handle 45 and the latch 41 is at a certain height, and the latch plate 47 starts to pressurize the upper surface of the semiconductor package 50. From this point on, the shaft 45 will not be pushed to the rear. 44b pushes the handle protrusion 450 to play the role of a supporting table, and achieves the correct handle-to-rod ratio.

13 is a diagram showing the lever ratio of the lever of the present invention. As the cover 30 rises, the latch plate 47 presses the upper surface of the semiconductor package 50 at a certain point in time. At this time, the axis 44b is in contact with the protrusion 450 of the stem 45 to start preventing the stem 45 from being pushed back, the semiconductor package 50 is lowered to a certain level, and the shaft is completely in contact with the protrusion 450 of the stem 45 to prevent The lever 45 is pushed back more than this. At the end of the rise of the cover 30, the shaft is moved to the side along the long hole 411 of the latch 41, and the up / down displacement of the semiconductor package 50 is maximized. In this way, the position of the shaft does not change with the lever ratio of the latch 41 and the lever 45. Therefore, the reference shaft system of the lever ratio becomes the shaft 44a, and theoretically, the lever ratio of L1: L2 is established. Through the process shown above, it is possible to exert the effect of reducing the covering power of the socket and increasing the pressing force on the semiconductor package 50.

14 is a diagram of an embodiment in which a stopper 48 is additionally formed on the latch plate 47 of the present invention. When the latch 41 and the handle 45 are assembled, the assembly is completed by the shaft 44a. However, if the shaft 44a is In order to prevent detachment after assembly, if it is an existing situation, an E-ring or a forced push method is used, but if it is the case of this embodiment, it is attached to both ends of the latch plate 47 After the additional stopper 48 is assembled, the shaft is prevented from coming off. If it is an E-ring assembly, in the manufacturing process, there will be an increase in the unit price due to the addition of the project, an increase in the cost of parts accompanying the additional processing of the shaft, the cost of the E-ring itself, etc., but if this is the embodiment The situation can be ruled out. If it is a forced push, it is very sensitive to the conditions caused by the latch mounting groove and the outer diameter of the shaft 44a. If it is the shaft 44a, it is a processed product. If it is a latch In the case of buckle 41, for injection products, there are measures for overlapping of various conditions, too difficult to insert and cause cracks, or too loose to fall off, etc., but in the case of this embodiment, the above mentioned risks can be swept away consider. FIG. 15 is a diagram showing the open state of the latch assembly 40 of the socket 10 of the prior art, showing the state where the handle 45 and the latch 41 are upright, that is, the open state. As shown in the figure, the handle 45 and the latch 41 are formed by bending their middle portions at a certain angle. The protective cover 30 of the socket 10 is formed with a protrusion 301 formed at the same angle as the angle at which the handle 45 and the latch 41 are bent, and the handle 45 and the latch 41 are formed The way of peace arrived. As described above, since the handle 45 and the latch 41 are formed by bending the protrusion 301 of the base 20 at a certain angle, the latch 41 and the latch plate 47 are not completely opened, so the area to be opened is small, when the semiconductor When the package is put vertically, a loading error may occur.

FIG. 16 is a diagram showing an embodiment in which the latch 41, the handle 45, and the base 20 of the present invention are formed in a linear shape. In the case of the latch plate 47, the larger the opening amount when opening, the more sufficient the gap for preventing the semiconductor package from being caught (dropped) in the mounting portion of the semiconductor package to the latch plate 47 can be ensured. Buckle 41, handle 45, and base 20 are linear Implementation form. In this embodiment, the latch plate 47 is opened so as to tilt slightly backward from the vertical, so when it is put into the semiconductor package 50, it is smoothly guided, and the semiconductor package 50 is safely placed on the semiconductor package Loader 60. In order to maintain a narrow interval between the latch plates 47, when the latch 41 and the handle 45 are upright, the accommodating portion 31 is formed in the protective cover 30, when the aforesaid When the latch plate 47 is opened, the latch 41 and the handle 45 can stand upright, thereby maximizing the opening amount of the latch 41 and preventing loading errors when loading the semiconductor package 50.

The greater the amount of the latch plate 47 covering the semiconductor package 50, the more it is possible to prevent the warpage of the semiconductor package during inspection. Therefore, it is preferable to maintain the interval between the latch plates 47 narrow. In the conventional case, if the distance between the latch plates 47 is narrowed, the opening amount of the latch when the cover is opened will be narrowed at the same time, which may cause the loading error of the semiconductor package 50, but FIG. 16 In order to solve this situation, in order to maximize the opening amount of the latch plate 47, the semiconductor package 50 and the latch plate 47 are ensured with sufficient clearance when the semiconductor package is mounted, and the latch 41 and the handle 45 , And the base 20 is applied to a linear embodiment to solve the above problems and improve loading errors.

By comparing the coverage of the semiconductor package inspection socket of the present invention manufactured as described above with the existing inspection socket of the same company and other companies, the results shown in the following table are obtained.

It can be seen from Table 1 that it is confirmed that with the same number of pins, it has a reduction effect of about 1.3 to 1.6 kgf compared with other companies. It is predicted that the more applicable sales, the greater the reduction effect. It has been confirmed that even if it is about 1100 pins, it can be contained at 5.5kgf. Therefore, if the equipment used by the current component manufacturing company is stamped, the upper limit of stamping is generally about 30kgf when pushing the socket cover, so the existing equipment can also be applied to multi-pin semiconductor packages. With the results described above, the competitiveness of products is improved.

The embodiments described above are examples, and those with ordinary knowledge in the technical field to which the present invention pertains can make various corrections and modifications without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to explain the technical idea of the present invention and are not intended to limit the scope of the technical idea of the present invention by the above-described embodiments. The scope of protection of the present invention must be interpreted by the scope of patent application, and all technical ideas within its equivalent scope must be interpreted as being included in the scope of rights of the present invention.

41‧‧‧Latch

44a, 44b, 44c ‧‧‧ axis

45‧‧‧handle

47‧‧‧Latch plate

50‧‧‧Semiconductor package

411‧‧‧Long hole

450‧‧‧Protrusion

451‧‧‧Depression

Claims (4)

A socket is provided with: a base (20), which is located under the socket (10); a protective cover (30), which is located above the base (20), can move up and down, and is supported by an elastic member ; Latch (41), which can be configured by the aforementioned cover (30) and the shaft (44a) for rotation; and the handle (45), which can be used by the aforementioned base (20) and the shaft (44c ) Is configured to rotate, and, by combining the latch (41) and the shaft (44a), it can be configured to rotate with the latch (41). The characteristics of the socket are: constituted as: When the cover (30) moves upward with respect to the base (20), the shaft (44b) configured to be movable on the long hole (411) formed in the latch (41) is used to make the handle (45) ) Against the shank protrusion (450) of the shank (45) so as to rotate inwardly and push. A socket as claimed in item 1 of the patent scope, wherein a latch plate (47) is provided at the front end of the latch (41), and a stopper (48) is formed on the latch plate (47) to prevent The aforementioned shaft (44a) is configured to be separated. A socket as claimed in item 1 of the patent application, wherein a latch plate (47) is provided at the front end of the latch (41), and when the cover (30) moves upward relative to the base (20), the latch When turning the buckle (41) downward, use the front end of the handle (45) The surface is pressed against the latch plate (47). A socket is provided with: a base (20), which is located under the socket (10); a protective cover (30), which is located above the base (20), can move up and down, and is supported by an elastic member ; Latch (41), which can be configured by the aforementioned cover (30) and the shaft (44a) for rotation; and the handle (45), which can be used by the aforementioned base (20) and the shaft (44c ) Is configured to rotate, and, by combining the latch (41) and the shaft (44a), it can be configured to rotate with the latch (41). The characteristics of the socket are: constituted as: When the cover (30) moves upward with respect to the base (20), the shaft (44b) configured to be movable on the long hole (411) formed in the latch (41) is used to make the handle (45) ) Inwardly swinging against the stem protrusion (450) of the stem (45) to push, when the latch (41) swings upward, the latch plate (47) resists It is pressed against the front end surface of the cover (30) so that the latch plate (47) is turned upward.