KR101266380B1

KR101266380B1 - Pocket assembly for semiconductor having center aligning function and compatibility

Info

Publication number: KR101266380B1
Application number: KR1020120076716A
Authority: KR
Inventors: 이홍하
Original assignee: (주)엘텍솔루션
Priority date: 2012-07-13
Filing date: 2012-07-13
Publication date: 2013-06-07

Abstract

PURPOSE: A pocket assembly for a semiconductor test is provided to increase reliability of a test by accurately arranging the position of a semiconductor package and to prevent damage to the semiconductor package by being stably supplied to a seating surface. CONSTITUTION: A pocket assembly(10) for a semiconductor test includes a pocket(100) in which a semiconductor package is accommodated for a test; a cover(200) which is combined with the upper area of the pocket; a semiconductor package guide(400) which is combined to be rotatable inside of the pocket, receives the semiconductor package which is supplied to the inside of the pocket, and has a first seating surface; and multiple position alignment units(500) which are combined with the edge area of the pocket to be rotatable, have a corner seating surface on which the corner of the semiconductor package is settled, and arrange the position of the semiconductor package by pressurizing the semiconductor package in the central direction when settling the semiconductor package. The position alignment unit includes a position alignment guide which has the corner seating surface; a guide support axis which supports the position alignment guide to be rotatable; a pressurizing button which makes the position alignment guide rotate around the center of the guide support axis by being pressurized when the semiconductor package is put into the inside of the pocket; and a support elastic member which elastically supports the position alignment guide.

Description

POCKET ASSEMBLY FOR SEMICONDUCTOR HAVING CENTER ALIGNING FUNCTION AND COMPATIBILITY

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pocket assembly, and more particularly, to a pocket test for semiconductor test capable of mounting a semiconductor package to be tested.

In general, semiconductor packages manufactured by the semiconductor package manufacturing process undergo reliability tests such as electrical property checks and functional tests before shipment.

Here, the semiconductor package is in contact with the test head through the test socket in a state seated inside the pocket assembly is a test process. Korean Patent Publication No. 10-2006-0109583 discloses a semiconductor device test equipment.

1A-1D are schematic diagrams schematically showing the planar structure of conventional pocket assemblies.

First, in the conventional pocket assembly 1a illustrated in FIG. 1A, the seating surface 2 on which the semiconductor is seated is formed in the shape of a grate on the surface of the pocket body 3. At this time, since the allowable width of the seating surface 2 is only 0.5 mm to 0.6 mm, there is no margin, so that the seating surface 2 in the shape of a grate is easy to fall when supplying the semiconductor into the pocket body 3. There was a broken problem.

On the other hand, the conventional pocket assembly (1b) shown in Figure 1b is provided with a seating surface 4 in the form of a ball on the surface of the pocket body (3). Ball-shaped seating surface (4) also had a disadvantage that the narrow enough to secure the seating margin as narrow as 0.4mm ~ 0.5mm marginal width as described above grate-shaped seating surface (2).

On the other hand, the conventional pocket assembly 1c shown in Figure 1c is provided with a seating surface 5 in the form of EML over the entire area of the surface of the pocket body (3). In this case, the area of the seating surface 5 is wide, and thus, the effect of preventing rockfall during semiconductor supply is superior to the two cases described above.

On the other hand, the conventional pocket assembly 1d shown in FIG. 1D is provided with a seating surface 6 as a socket insert type. In this case, the seating surface is provided with the entire area of the bottom surface, so that the seating surface is secured and the fall prevention is excellent, but there is a problem in that an error occurs by sensitively reacting to some foreign matters during assembly.

In addition, in all four cases described above, since the semiconductor directly hits and contacts the hard seating surface, the semiconductor surface is damaged or the seating surface is damaged and foreign matters are generated.

In addition, in all four cases described above, when the seat is seated on the seating surface, the position is not aligned so that the center of the pocket fits correctly. At this time, there is a problem that the test socket is not exactly matched with the semiconductor and the test is not performed correctly.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pocket assembly that can improve the reliability of the test by accurately aligning the position of the semiconductor package to solve the above problems.

This provides a pocket assembly that can be used in common regardless of the inner ball pitch and pattern shape when the outer size is the same.

In particular, it provides a pocket assembly that can also test a no-margin type semiconductor package.

Another object of the present invention is to provide a pocket assembly that can ensure a sufficient space of the seating surface can exert an effect in preventing rockfall.

In addition, another object of the present invention is to provide a pocket assembly that can be supplied to the mounting surface more stably when the semiconductor package is provided therein, thereby preventing damage to the semiconductor package.

The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention by those skilled in the art.

The object of the present invention can be achieved by a pocket assembly for semiconductor testing for testing a semiconductor package using a test socket. The pocket assembly of the present invention comprises: a pocket in which the semiconductor package is received for testing; A cover coupled to the upper region of the pocket; A semiconductor package guide rotatably coupled to the inside of the pocket and having a primary seating surface receiving and supporting the semiconductor package supplied to the inside of the pocket; It is rotatably coupled to the corner region of the pocket, has a corner seating surface on which the corner of the semiconductor package is seated, and when the semiconductor package is seated by pressing the semiconductor package toward the center direction to align the position of the semiconductor package It characterized in that it comprises a plurality of position alignment.

According to one embodiment, the alignment portion, the alignment guide having the corner seating surface; A guide support shaft for rotatably supporting the alignment guide; A pressing button pressurized when the semiconductor package enters into the pocket to rotate the alignment guide about the guide support shaft; It characterized in that it comprises a support elastic member for elastically supporting the alignment guide.

According to one embodiment, when the semiconductor package is entered into the pocket by the picker, the cover is pressed by the picker, the pressing button is pressed in conjunction with the pressing of the picker and the alignment guide is It rotates toward the center of the pocket and supports the semiconductor package.

According to one embodiment, the primary seating surface is formed with a width of 1mm ~ 2mm range.

The pocket test for semiconductor test according to the present invention has a positioning guide in four corner regions so that the semiconductor package is aligned in the center direction. As a result, the reliability of the test can be further improved.

In addition, since the alignment guide stably supports the edges of the semiconductor package, a no-margin semiconductor can be used interchangeably without additional configuration.

In addition, a relatively large primary seating surface may be provided in the semiconductor package guide that takes over the semiconductor package supplied from the picker to prevent damage due to falling and impact of the semiconductor package.

In addition, a cushion member may be provided on one side of the semiconductor package guide to absorb and alleviate an impact generated when the semiconductor package is in contact with the semiconductor package, thereby preventing damage to the semiconductor package.

As a result, since the semiconductor package guide and the alignment guide can stably support the semiconductor package, the semiconductor package guide and the alignment guide can be used universally regardless of the internal shape and pattern of the semiconductor package when the outer size is the same.

In this case, the test apparatus around the pocket assembly such as the pusher and the socket may be used without any structural change.

1A to 1D are plan views each showing a planar configuration of a conventional pocket assembly,
2 is a perspective view showing the structure of a pocket assembly according to the present invention;
3 is an exploded perspective view showing an exploded structure of the pocket assembly according to the present invention;
4A and 4B are a perspective view and a side view illustrating the configuration of a semiconductor package guide of a pocket assembly according to the present invention;
5 is an enlarged perspective view showing the configuration of the alignment portion of the pocket assembly according to the present invention;
6 is an exemplary view showing a state in which the pocket assembly according to the present invention supports the semiconductor guide,
7 is an enlarged view of a main portion of a pocket assembly according to the present invention;
8A to 8C are exemplary views illustrating a semiconductor test process of a pocket assembly according to the present invention.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The embodiments of the present invention may be modified into various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the elements in the drawings can be exaggeratedly expressed to emphasize a clearer description. It should be noted that in the drawings, the same members are denoted by the same reference numerals. Detailed descriptions of well-known functions and constructions which may be unnecessarily obscured by the gist of the present invention are omitted.

Figure 2 is a perspective view showing the assembled state of the pocket assembly 10 according to the present invention, Figure 3 is a perspective view showing an exploded configuration of the pocket assembly 10 according to the present invention.

As shown, the pocket assembly 10 according to the present invention includes a pocket 100 for accommodating the semiconductor package A, a cover 200 for covering the top surface of the pocket 100, and a pocket 100 during a test process. The latch member 300 is rotatably coupled to the inside to allow the semiconductor package to be mounted and detached in the pocket 100, and the semiconductor is rotatably provided in the pocket 100 and supplied into the pocket 100. When the semiconductor package is primarily supported by the semiconductor package guide 400 and the semiconductor package guide 400, the pocket 100 is pressed by pressing the edge of the semiconductor package toward the center thereof. Position alignment unit 500 to align the center of the.

The pocket 100 includes a pocket body 110 through which a through part 100a for accommodating a semiconductor package to be tested is formed, and a pair of latch coupling holes 120 formed on an inner surface of the pocket body 110. , A semiconductor guide coupling groove 130 formed on an inner surface of the latch coupling hole 120 in a direction perpendicular to the latch coupling hole 120, to which the semiconductor package guide 400 is coupled, and a cover support member 140 that elastically supports the cover 200. ).

The pocket body 110 has a penetrating portion 100a penetrating up and down. The semiconductor package A enters through the through part 100a of the pocket body 110 and may be seated on the primary seating surface 421 of the semiconductor package guide 400.

The latch member 300 is rotatably coupled to the latch coupling hole 120 by the latch rotation shaft 311. The semiconductor guide coupling groove 130 is formed on both side walls perpendicular to the latch coupling hole 120 to receive the rotation shaft 440 and the semiconductor package guide 400 in a rotatable manner.

The cover support member 140 is disposed between the pocket body 110 and the cover 200 to elastically support the cover 200.

The cover 200 is installed to cover the upper region of the pocket body 110 and is elastically supported by the cover support member 140.

The latch member 300 is rotated by the latch rotation shaft 311 coupled to the latch coupling hole 120 to allow the semiconductor package A to enter or be separated into the outside through the through part 100a. Since the configuration of the latch member 300 is the same as in the prior art, detailed description thereof will be omitted.

4A and 4B are a perspective view and a side view showing the configuration of a semiconductor package guide 400 according to the present invention. The semiconductor package guide 400 according to the present invention first receives the semiconductor package A entered into the pocket body 110 through the through part 100a and elastically supports it.

To this end, the semiconductor package guide 400 includes a pivoting lever 410 pivoting inside the pocket body 110 and a predetermined area extending in the pocket body 110 in the lower region of the pivoting lever 410. A first seating bar 420 to take over and support A), a support hook 430 provided at the rear of the first seating bar 420 to support movement of the pivoting lever 410, and a pivoting lever. Rotation shaft 440 for rotatably coupling the 410 to the semiconductor guide coupling groove 130, and a cushion member 450 for elastically supporting the rotation lever 410 to the pocket body (110).

In addition, the semiconductor package guide 400 includes a guide press member 460 for pressing the pivot lever 410 to rotate the pivot lever 410, and a support member 470 for elastically supporting the guide press member 460. ).

The rotation lever 410 is provided in a rod shape having a predetermined length to rotate the inside of the pocket body 110. In the upper region of the rotation lever 410, a shaft receiving hole 413 having a predetermined length is formed through. The bearing hole 413 allows the rotation lever 410 to move upward when the socket support 40 enters the upper direction in a state in which the semiconductor package A is seated in the position alignment unit 500. That is, when the socket support 40 enters in the upward direction, the position of the pivoting lever 410 is fixed to collide with the socket support 40 so as not to block the entry of the socket support 40. The pivoting lever 410 may move upward in association with the socket support 40 entering the upward direction by the length of the bearing hole 413.

The first seating bar 420 extends a predetermined area from the rotation lever 410 toward the inside of the pocket body 110 and takes over the semiconductor package A supplied by the picker 20. The first seating surface 421 is formed on the upper surface of the first seating bar 420, so that the semiconductor package A is primarily seated.

The first seating surface 421 is formed to have a width of 1 mm to 2 mm so that the semiconductor package A can be stably seated. As a result, the falling of the semiconductor package A can be effectively prevented.

The support hook 430 is formed in the rear region of the first seating bar 420 to limit the rotation angle of the first seating bar 420 and support the position.

The rotating shaft 440 is coupled to the semiconductor guide coupling groove 130 of the pocket body 110 while being inserted into the shaft receiving hole 413 of the rotation lever 410. The rotation lever 410 is rotated about the rotation shaft 440 by the pressure of the pusher 30, and moves up and down along the rotation shaft 440 when the socket support 40 moves up and down.

The cushion member 450 mitigates shock when the semiconductor package A is dropped by the picker 20 and seated on the first seating surface 421, thereby preventing damage to the semiconductor package A. Cushion member 450 is provided with a spring, one end is coupled to the pocket body 110, the other end is coupled to the lower region of the rotation lever 410. As a result, when the semiconductor package A is supplied in the upward direction and supported by the first seating surface 421, the pivoting lever 410 may be moved up and down elastically by the cushion member 450 to mitigate the impact.

The alignment unit 500 supports the edges of the semiconductor package A to be aligned in the center direction when the semiconductor package A is supplied to the semiconductor package guide 400 by the picker 20. The edge of the semiconductor package A is supported during the test. 5 is an enlarged perspective view illustrating a configuration of the alignment unit 500.

As illustrated, the alignment unit 500 includes a positioning guide 510 rotatably coupled to the pocket body 110, a guide support shaft 520 rotatably supporting the alignment guide 510, and It includes a pressing button 530 for applying a pressing force so that the alignment guide 510 is rotated, and an elastic support member 540 for elastically returning the pressing button 530.

Positioning guide 510 is a horizontal connecting portion 511 is coupled to the pocket body 110, the inclined portion 513 formed to be inclined downward from the horizontal connecting portion 511 and the corner seating formed between the inclined portion 513 Face 515.

The horizontal connecting portion 511 is connected to the guide support shaft 520 and the pressing shaft 531, respectively. The inclined portion 513 is rotated to the center region of the pocket body 110 by the rotation of the guide support shaft 520 and the pressing shaft 531 or to the outer region of the pocket body 110. The semiconductor package A is seated on the edge seating surface 515 in the closing state rotated toward the center region. The test is performed by the test socket with the semiconductor package A seated on the edge seating surface 515.

The pressing button 530 is rotated in conjunction with the pressing of the cover 200, the alignment guide 510. The pressing button 530 is elastically supported by the pocket body 110 by the elastic support member 540 coupled to the bottom. The pressing button 530 moves the picker 20 downward and presses the cover 200. The pressing button 530 is pressed by the cover 200 and moved downward. When the pressing of the cover 200 is released, the elastic support member 540 Is returned to the initial position.

The pressing button 530 is connected to the position alignment guide 510 by the pressing shaft 531. As a result, when the pressing button 530 is pressed in the downward direction, the pressing shaft 531 is interlocked to rotate.

A process of testing the semiconductor package A using the semiconductor assembly pocket assembly 10 according to the present invention having such a configuration will be described with reference to FIGS. 6 to 8C.

Prior to the description, the picker 20 is a member that absorbs the semiconductor package A and supplies the inside to the pocket body 110, and the pusher 30 pressurizes the semiconductor package A seated on the first seating surface 421. And a member supporting the position of the semiconductor package A during the test progress period. The socket support 40 is a member supporting the position of the socket B electrically connected to the semiconductor package A. FIG.

When the test is not performed, as shown in FIG. 4, the latch member 300 is rotated inwardly in the pocket body 110 and the semiconductor package guide 400 is maintained inwardly rotated. The cushion member 450 applies an elastic force to maintain the semiconductor package guide 400 inward.

Since the position alignment unit 500 is not pressed by the cover 200, the edge seating surface 151 is maintained in an open state rotated to the outer side of the pocket body 110. When the test proceeds in this state, the latch member 300 is opened as shown in FIG. 8A. When the latch member 300 is opened, the picker 20 enters through the penetrating portion 100a of the pocket body 110. The picker 20 enters a state in which the semiconductor package A is adsorbed to the lower region. The picker 20 drops the semiconductor package A by canceling the adsorption state when the picker 20 descends by a certain height.

At this time, as the cover 200 is pressed by the picker 20, the pressing button 530 is pressed, and the pressing shaft 531 is pressed by the pressing button 530. As the pressure shaft 531 is pressed, the alignment guide 510 is rotated in a state of being closed about the pressure shaft 531. The semiconductor package A dropped by the picker 20 falls on the first seating surface 421 of the semiconductor package guide 400 in a state of being rotated into the pocket body 110 as illustrated in FIG. 8B.

The lever body 411 is elastically moved up and down by the cushion member 450 by the falling speed and the weight of the semiconductor package (A) to mitigate contact impact with the semiconductor package (A).

6, both sides of the semiconductor package A are seated on the first seating surface 421, and four corners of the semiconductor package A are seated on the corner seating surface 151 of the alignment guide 510. Then, the position is aligned toward the center by the alignment guide 510. At this time, since the width of the first seating surface 421 is sufficiently large, 1 mm to 2 mm, the semiconductor package A is stably loaded.

In this state, the pusher 30 enters into the pocket body 110. At this time, the lower region 31 of the pusher 30 formed to be rounded as shown in FIG. 8B is in contact with the curved section of the lever body 411, and the lever body 411 is caused by the lowering pressure of the pusher 30. Is rotated in the outward direction of the pocket body (110).

The pressure of the pusher 30 causes the lever body 411 to rotate, the first seating bar 420 to retreat backwards, and the semiconductor package A, which was supported on the first seating surface 421, is pushed by the pusher 30. Is pressurized. The semiconductor package A is positioned with four corners mounted on the edge seating surface 151.

When the position of the semiconductor package A is fixed, the socket support 40 enters upward. When the socket support 40 enters upward, the upper surface of the socket support 40 comes into contact with the bottom surface of the semiconductor package guide 400. When the socket support 40 continuously moves upward in this state, as shown in FIG. 8C, the lever main body 411 has a shaft receiving hole 413 which is rotated by the feed force of the socket support 40. Will move upward. Therefore, the semiconductor package guide 400 does not interfere with the entry of the socket support 40.

The movement of the socket support 40 is completed, and a test is performed with the socket B connected with the semiconductor package A. FIG. When the test is completed, the process proceeds in the reverse order described above, and the semiconductor package A is separated to the outside.

As described above, the semiconductor test pocket assembly according to the present invention includes a position alignment guide in four corner regions so that the semiconductor package is aligned in the center direction. This can increase the reliability of the test.

In addition, the semiconductor package supplied from the picker may be provided with a relatively large primary seating surface in the semiconductor package guide that is first handed over before being seated as the final seating surface, thereby preventing damage due to falling and impact of the semiconductor package.

The pocket assembly for testing a semiconductor of the present invention described above is merely exemplary, and it will be appreciated by those skilled in the art that various modifications and equivalent other embodiments are possible. There will be. Therefore, it is to be understood that the present invention is not limited to the above-described embodiments. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

10: pocket assembly for semiconductor test 100: pocket
110: pocket body 120: latching holes
130: semiconductor guide coupling groove 140: cover support member
150: support jaw 151: final seating surface
200: cover 300: latch member
310: return member 320: latch rotation shaft
400: semiconductor package guide 410: rotation lever
413: bearing hole 420: first seating bar
421: first seating surface 423: coupling bar
430: support hook 440: rotation axis
450: cushion member 460: guide pressure member
470: support member 500: position alignment
510: alignment guide 520: guide support shaft
530: pressing button 531: pressing shaft
540: elastic support member
20: picker
30: pusher
40: socket support

Claims

In a pocket assembly for semiconductor testing, on which a semiconductor package to be tested can be mounted,
A pocket in which the semiconductor package is received for testing;
A cover coupled to the upper region of the pocket;
A semiconductor package guide rotatably coupled to the inside of the pocket and having a primary seating surface receiving and supporting the semiconductor package supplied to the inside of the pocket;
It is rotatably coupled to the corner region of the pocket, has a corner seating surface on which the corner of the semiconductor package is seated, and when the semiconductor package is seated by pressing the semiconductor package toward the center direction to align the position of the semiconductor package Including a plurality of alignment parts,
The position alignment unit,
A positioning guide having the corner seating surface;
A guide support shaft for rotatably supporting the alignment guide;
A pressing button which is pressed when the semiconductor package enters into the pocket so that the alignment guide is rotated about the guide support shaft;
And a support elastic member for elastically supporting the alignment guide.

delete

The method of claim 1,
When the semiconductor package is entered into the pocket by the picker, the cover is pressed by the picker, the pressing button is pressed in conjunction with the pressing of the picker, and the alignment guide is directed toward the center of the pocket. Pocket assembly for semiconductor testing, characterized in that it rotates and supports the semiconductor package.

The method according to claim 1 or 3,
The first seating surface is a semiconductor assembly pocket assembly, characterized in that formed in the range of 1mm ~ 2mm.