JP4963085B2 - BGA socket - Google Patents

Description

  The present invention relates to a semiconductor package socket in which terminals are two-dimensionally arranged, and more particularly, to a measurement socket for a BGA (Ball Grid Array) or LGA (Land Grid Array) package.

  There are generally two types of BGA sockets: an open top type socket that reciprocates the cover member in the vertical direction and a clamshell type socket that rotates the cover member. An open top type socket is disclosed in Patent Document 1, for example. Patent Document 1 provides a socket capable of appropriately attaching and detaching an electronic device including a surface mount type semiconductor device such as a BGA or a CSP. According to Patent Document 1, the socket includes a base member, a cover member, a plurality of contacts, and an adapter that can move in a direction approaching or separating from the base member and provides a BGA mounting surface. And a latch member rotatably attached to the base member, and a positioning mechanism movable in conjunction with the movement of the cover member. The positioning portion of the positioning mechanism is movable in a diagonal direction on the mounting surface of the adapter, and positions and holds the mounted BGA. Then, with the BGA package held by the positioning mechanism, the solder ball is pulled away from the other end of the contact, and the BGA package is prevented from jumping on the mounting surface, thereby automatically mounting the BGA package in the socket. Improved efficiency.

Japanese Patent No. 3737078

  As the solder balls become smaller as the pitch of the BGA package becomes narrower, positioning accuracy of the BGA package is required. In particular, when there are variations in solder balls and external dimensions, accurate positioning cannot be performed.

  Since the cover member rotates in the clamshell socket, it is not easy to position the BGA package in conjunction with the cover member, and a mechanism for accurately positioning the BGA package with a simple configuration has not been provided.

  Accordingly, an object of the present invention is to solve the above-described conventional problems and to provide a socket capable of positioning an electronic device in conjunction with a rotation operation of a cover member.

  The socket according to the present invention includes a base member, a cover member rotatably attached to the base member via a hinge part, and a plurality of contacts, each contact being fixed to the base member, and each The contact has an elastic deformation portion between one end and the other end, and is a positioning member that can move on the base member in conjunction with rotation of the cover member, and the cover member When the positioning member is in an open state with respect to the base member, the positioning member is in a first position biased by a first spring member, and when the cover member is in a closed state with respect to the base member, The positioning member has the positioning member in a second position against the first spring member, and the position when the cover member is closed with respect to the base member Because member positions the electronic device placed on the base member.

  Preferably, the cover member includes a wedge member protruding from a bottom surface, and the wedge member contacts the end portion of the positioning member to horizontally move the positioning member to the second position. The wedge member is biased by a second spring member, and when the wedge member contacts the positioning member, the wedge member is displaced against the second spring member. The elastic force of the second spring member is greater than the elastic force of the first spring member.

  Preferably, the positioning member moves substantially diagonally with respect to the base member. The socket further includes a mounting member for providing a mounting surface of the electronic device on the base member, and the mounting member has a groove substantially parallel to a diagonal line of the mounting surface, and the socket is in the groove. The positioning member is slidably accommodated.

  Preferably, the mounting member can move in a direction approaching or separating from the base member, and a plurality of through holes are formed on the mounting surface at positions corresponding to the plurality of contacts. When the mounting member is moved toward the base member, one end of each contact protrudes from each through hole of the mounting member, and the mounting member is moved away from the base member One end of each contact is accommodated in each through hole.

  Preferably, the electronic device is a surface mounting semiconductor device in which a plurality of terminals are two-dimensionally arranged on one surface. In addition, the cover member includes a pusher member protruding from a bottom surface, and when the cover member is closed with respect to the base member, the pressing surface of the pusher portion is in contact with the upper surface of the electronic device in a plane, The electronic device and the mounting member are pressed in the vertical direction.

  According to the socket of the present invention, the electronic device can be positioned with an appropriate contact pressure via the positioning member that is interlocked with the rotation operation of the cover member. Thereby, operability is improved.

  The socket according to the present invention is preferably implemented as a measurement socket. Hereinafter, it will be described in detail with reference to the drawings.

  1A is a top view of a BGA socket according to an embodiment of the present invention, FIG. 1B is a front view, FIG. 2 is a sectional view taken along line AA in FIG. 1, and FIG. 3 is a BGA package. FIG. As shown in FIG. 3, the BGA package 1 has ball-shaped terminals (solder balls) 3 arranged two-dimensionally on the bottom surface 2 thereof. The solder balls 3 are aligned, for example, in 4 rows of 0.5 mm pitch on the outer periphery. Projecting about 0.25 millimeters from the bottom of the package, the overall height of the package is about 0.9 millimeters.

  The socket 10 according to the present embodiment has been developed for a BGA package, and enables the use of a BGA package of either a lead-free type solder ball or a eutectic type solder ball. The composition of the lead-free solder balls is Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Au), Su-Ag-Cu-Ni, Sn-Ag-Cu- For example, Sn (tin): Ag (silver): Cu (copper) = 96.5: 3: 0.5.

  The socket 10 includes a base member 20, a cover member 30 that rotates around one end of the base member 20, and a plurality of contacts 40 that are implanted in the base member 20. The base member 20 and the cover member 30 are formed, for example, by injection molding a high heat resistant resin polyethersulfone (PES). Besides PES, polyphenylene sulfide resin (PPS), liquid crystal polymer (LCP), polysulfone resin (PSF), polyarylate resin (PAR), and the like can be used.

  At approximately the center of the base member 20, contacts 40 arranged in a row and sheet-like separators 22 made of an insulating material are alternately arranged in parallel with the direction of the line AA in FIG. Each row of contacts 40, that is, the Y direction, is electrically insulated by the separator 22. In this way, the contact 40 and the separator 22 are laminated to form the contact unit 25 in which the contact 40 is positioned and electrically insulated in the X and Y directions, and the contacts 40 are two-dimensionally arranged in a matrix array.

  The contact unit 25 is accommodated from below the base member 20 and is firmly fixed by a shaft member or the like. At this time, the lower surface of the contact unit 25 coincides with the bottom surface of the base member 20, and the lower end of the contact 40 protrudes therefrom. It should be noted that the separator 22 can be changed to other sizes depending on the number of terminals of the BGA package 1 to be mounted and the terminal pitch.

  The contact 40 is formed by punching or etching a plate-like metal plate such as beryllium copper. The lower end of the contact 40 protrudes from the bottom surface of the base member 20 and is connected to a conductive contact of a circuit board (not shown) by solder or the like. The upper end of the contact 40 is electrically connected to the solder ball 3 of the BGA package 1. A curved elastic deformation portion is formed between the upper end and the lower end of the contact 40. When the upper end of the contact 40 comes into contact with the solder ball 3 and a buckling load is applied in the axial direction of the contact 40, the elastic deformation portion generates an elastic force to resist the upper end of the contact 40 and the solder ball 3. The necessary contact pressure is generated during

  A hinge part 32 connected to the base member 20 is formed at one end of the cover member 30, and the cover member 30 rotates around the hinge part 32 (see FIG. 2). Thereby, the socket 10 can open and close the cover member 30, and the BGA package 1 can be attached to and detached from the base member 20.

  The cover member 30 includes a pusher portion 34 that holds the BGA package 1 from the upper surface, a hook portion 36 that fixes the cover member 30 to the base member 20 at the other end facing the hinge portion 32, and a wedge portion 38 that protrudes from the bottom surface. Is included.

  The pusher portion 34 is positioned substantially at the center of the cover member 30, and when the cover member 30 is closed and the hook portion 36 is coupled to the cover member 20, the upper surface of the BGA package 1 is pressed flat and the entire upper surface of the BGA package is pressed. A constant pressurization can be applied. For this reason, damage to the BGA package can be prevented without concentrating the pressurization on one point on the upper surface. The hook portion 36 has a latch portion 36 a, and when the cover member 30 is coupled to the base member 20, the coupling can be released and the cover member 30 can be opened by pressing the latch portion 36 a.

  FIG. 4 is a top view of the adapter (floating member). The adapter 60 is disposed on the contact unit 25 of the base member 20 and includes a placement surface 61 for placing the BGA package 1 and a guide portion 62 provided at each corner portion of the placement surface 61. A plurality of through holes 65 corresponding to the positions of the contacts 40 are formed in the mounting surface 61.

  The plurality of through-holes 65 guide the contact 40 when the adapter 60 moves in the vertical direction in accordance with the opening / closing operation of the cover member 30. The positioning mechanism 100 is attached to one guide portion 62 (the upper right guide portion in FIG. 4) among the four guide portions 62. And the positioning member 110 of the positioning mechanism 100 is accommodated in the groove | channel 66 so that sliding is possible. The mounting surface 61 is a substantially square surface, the groove 66 extends in parallel with one diagonal direction of the mounting surface 61, and the cross section thereof is substantially rectangular.

  The adapter 60 is movable in the vertical direction, and when the cover member 30 is in the open state, the adapter 60 stops when the locking portion 68 formed on the adapter 60 is locked to the base member 20, and the coil spring ( In this case, the urging force is always applied in the direction away from the contact unit 25.

  As shown in FIG. 4, the positioning mechanism 100 includes a positioning member 110 that can project in a diagonal direction toward the center of the adapter 60. When the cover member 30 is in the open state, the positioning member 110 is always urged by the coil spring 112 in the direction indicated by the arrow P so as to be retracted diagonally from the center of the placement surface 61. The biased positioning member 110 is locked by a stopper 69, and the biasing position is restricted. On the other hand, when the cover member 30 is in the closed state, the positioning member 110 protrudes diagonally toward the center of the mounting surface 61 against the coil spring 112 to position the BGA package 1.

  5 is a cross-sectional view of the positioning mechanism shown in FIG. When the cover member 30 is in the open state, as shown in FIG. 5A, the positioning member 110 is retracted from the placement surface 61 in the diagonal direction indicated by the arrow W by the coil spring 112. The cover member 30 has a wedge part 38 that can move in the horizontal direction, and the wedge part 38 is urged by the coil spring 114 in the direction of the placement surface 61 indicated by the arrow X. The urged wedge part 38 is locked by a stopper and its protruding amount is restricted.

  When the cover member 30 is in the closed state, as shown in FIG. 5B, the end portion 38a of the wedge portion 38 inserted in the vertical direction comes into contact with the end portion 110a of the positioning member and resists the coil spring 112. Then, it is pushed out in the direction of the mounting surface 61 indicated by the arrow Y.

  Here, since the coil spring 114 that urges the wedge portion 38 has a stronger drag than the coil spring 112 that urges the positioning member 110, the coil spring 112 contracts preferentially, and the positioning member 110 becomes BGA with an appropriate contact pressure. The package 1 is positioned.

Even when the size of the BGA package 1 is large, the coil spring 114 that urges the wedge portion 38 simultaneously with the coil spring 112 is contracted,
The wedge part 38 moves horizontally, and the positioning member 110 can position the BGA package 1 with a constant contact pressure. At this time, the wedge part 38 can move in the direction opposite to the mounting surface 61 direction indicated by the arrow Z only in the space 118 width. By using the movable wedge part 38, the variation width of the dimensions of the BGA package 1 that can be accommodated can be afforded, and the socket 10 positions the BGA package 1 without damaging the BGA package 1 or the wedge part 38. The cover member 30 can be closed.

  Next, the operation of the socket of this embodiment will be described. Before the BGA package 1 is mounted, when the cover member 30 is open, the positioning member 110 of the positioning mechanism 100 mounted on the adapter 60 is in a state of being retracted diagonally from the mounting surface 61 by the coil spring 112. Since the positioning member 110 is accommodated in the groove 66 from the guide surface 62, the mounting surface 61 is ready to receive the BGA package 1. This state is shown in FIG. 4 and FIG.

  With the cover member 30 open, the BGA package is mounted on the exposed mounting surface 61. At this time, the adapter 60 is lifted upward, and the upper end of the contact 40 does not protrude from the placement surface 61 and remains in the through hole 65. Therefore, even if the BGA package 1 is seated on the mounting surface 61 of the adapter 60, the upper end of the contact 40 does not contact the solder ball 3. This state is shown in the right part (open state) of FIG.

After the BGA package 1 is mounted, when the cover member 30 is gradually closed with the hinge portion 32 as an axis, the positioning member 110 in which the wedge portion 38 of the cover member 30 is accommodated in the groove 66 as the cover member 30 moves. It contacts the end portion 110a. The wedge member 38 is inserted so as to push the positioning member 110 to the placement surface 61.

  The extruded positioning member 110 moves the placed BGA package 1 and positions the BGA package 1 together with the fixed guide portion 62. At this time, the BGA package 1 is positioned and held at an appropriate contact pressure by the coil springs 112 and 114. Through the series of operations, the socket 10 can position the BGA package 1 in conjunction with the closing operation of the cover member 30.

  Further, as the cover member 30 moves, the pressing surface of the pusher portion 34 abuts perpendicularly to the upper surface of the BGA package 1. Further, when the cover member 30 is rotated and the cover member 30 is coupled to the base member 20 by the hook portion 36, the pusher portion 34 further pushes down the BGA package 1. As a result, the adapter 60 is pushed down and the solder ball 3 comes into contact with the upper end of the contact 40.

  The contact 40 is bent according to the force pushed down by the pusher portion 34 or the amount pushed down, thereby generating contact pressure and being electrically connected to the solder ball 3. At this time, the stopper 42 of the contact 40 is separated from the groove 23. This state is shown in the left part of FIG. 6 (closed state).

  The characteristics and reliability of the BGA package 1 are simply measured in the state shown in the left part of FIG. When the measurement or the like is finished and the BGA package 1 is removed from the socket 10, the cover member 30 can be opened by pressing the latch portion 36 and removing the hook portion 36 from the base member 20. By the opening operation of the cover member 30, the push-down force of the pusher portion 34 against the BGA package 1 is released, and accordingly, the BGA package 1 is pushed up by the reaction force of the contact 40. At the same time, the adapter 60 is pushed up.

  By forcibly raising the adapter 60, the upper end of the contact 40 and the solder ball 3 are dissociated. At that time, the BGA package 1 remains pressed against one side of the adapter 60 by the positioning member 110 of the positioning mechanism 100, and after the solder ball 3 is separated from the upper end of the contact 40, the positioning member 110 is separated from the BGA package 1. Like that. When the cover member 30 is further opened, the pressing surface of the pusher portion 34 is separated from the upper surface of the BGA package 1. This prevents the phenomenon that the BGA package jumps due to the upward movement of the adapter 60. The positioning mechanism 100 is separated from the BGA package 1, and the BGA package 1 is removed from the exposed placement surface 61.

  In this embodiment, the positioning mechanism is provided at one place on the guide surface of the adapter. However, the positioning mechanism is not limited to this, and the positioning mechanism may be provided at a plurality of places. Further, the present invention is not limited to the BGA package, and even a surface mount semiconductor package such as an LGA package can be positioned.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments according to the present invention, and various modifications can be made within the scope of the gist of the present invention described in the claims. Deformation / change is possible.

  The socket according to the present invention is used as a socket for a semiconductor package in which terminals are arranged two-dimensionally such as BGA and LGA.

FIG. 1A is a top view of a socket according to an embodiment of the present invention, and FIG. 1B is a front view. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 shows a BGA package. It is a top view which shows an adapter. 5A is a cross-sectional view taken along the line BB in FIG. 4 when the cover member is in an open state, and FIG. 5B is a cross-sectional view taken along the line BB in FIG. 4 when the cover member is closed. It is a figure which shows the contact of the upper end of a contact and a solder ball.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10: Socket 20: Base member 22: Separator 25: Contact unit 30: Cover member 32: Hinge part 34: Pusher part 36: Hook part 36a: Latch part 38: Wedge part 40: Contact 60: Adapter 61: Mounting surface 62 : Guide part 65: Through hole 66: Groove 68: Locking part 69: Stopper 100: Positioning mechanism 110: Positioning member 112, 114: Coil spring 118: Space

Claims (7)

A base member;
A cover member attached to the base member rotatably via a hinge part;
A plurality of contacts, each contact being fixed to the base member, and each contact having an elastic deformation part between one end and the other end;
A positioning member that can move on the base member in conjunction with rotation of the cover member, and when the cover member is in an open state with respect to the base member, the positioning member is moved by a first spring member. The positioning member is in the biased first position and the positioning member is in the second position against the first spring member when the cover member is in a closed state with respect to the base member. And having a member
When the cover member is closed relative to said base member, said positioning member positions the electronic device placed on the base member,
The cover member includes a wedge member protruding from a bottom surface, and the wedge member contacts the end of the positioning member to horizontally move the positioning member to a second position.
The wedge member is biased by a second spring member, and when the wedge member contacts the positioning member, the wedge member is displaced against the second spring member . The socket according to claim 1 , wherein an elastic force of the second spring member is larger than an elastic force of the first spring member. The positioning member is substantially moved diagonally socket according to claim 1 or 2 of the base member. The socket further includes a mounting member that provides a mounting surface of the electronic device on the base member, the mounting member having a groove substantially parallel to a diagonal of the mounting surface, and the positioning in the groove. The socket according to any one of claims 1 to 3 , wherein the member is slidably accommodated. The mounting member can move in a direction approaching or separating from the base member, and a plurality of through holes are formed in the mounting surface at positions corresponding to the plurality of contacts. When the mounting member is moved toward the base member, one end of each contact protrudes from each through-hole of the mounting member, and when the mounting member is moved away from the base member, each contact The socket of Claim 4 which accommodates one end of each in each through-hole. The socket according to any one of claims 1 to 5 , wherein the electronic device is a surface-mounting semiconductor device in which a plurality of terminals are two-dimensionally arranged on one surface. The cover member includes a pusher member protruding from the bottom surface,
When the cover member is closed with respect to the base member, the pressing surface of the pusher portion abuts the upper surface of the electronic device in a plane, and presses the electronic device and the mounting member in the vertical direction. Item 10. The socket according to any one of Items 1 to 6.

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