JP5487045B2 - Socket for electrical parts - Google Patents

Description

  The present invention relates to a socket for an electric component that is disposed on a wiring board and accommodates the electric component in order to test an electric component such as a semiconductor device (hereinafter referred to as “IC package”).

  Conventionally, as this type of “electrical component socket”, there is an IC socket that detachably houses an “electrical component” IC package.

  As the IC package, for example, there is one having a rectangular package main body (electrical component main body) and terminals projecting to the side of the package main body.

  On the other hand, the IC socket is configured such that an IC package is accommodated in the socket body, and a cover member is provided in the socket body so as to be freely opened and closed. With the cover member closed, the IC package is pressed. At the same time, the terminals of the IC package are brought into contact with the contact pins, and the IC package terminals are configured so as to be in a so-called Kelvin contact that is sandwiched from above and below by the contact pins provided at the top and bottom. There is something.

  However, in the case where the IC package terminal is sandwiched from above and below by the contact pin, especially when the protruding amount of the terminal from the package body is short, the molding error of the IC package, the IC package terminal and the contact pin It is difficult to hold the IC package terminal from above and below due to the positional deviation of the above.

  Therefore, a method for positioning the IC package at a predetermined position is conceivable.

  Therefore, there is a structure described in Patent Document 1 as a structure for positioning the IC package.

  According to claim 1 of Patent Document 1, “a base member, a cover member that is rotatably attached to the base member via a hinge portion, and a plurality of contacts, each contact being connected to the base member. Each of the contacts is fixed and has an elastic deformation portion between one end and the other end, and the positioning member is movable on the base member in conjunction with the rotation of the cover member, When the cover member is in an open state with respect to the base member, the positioning member is in a first position biased by a first spring member, and the cover member is in a closed state with respect to the base member. The positioning member has the positioning member in a second position against the first spring member, and when the cover member is closed with respect to the base member, -Decided Me member positions the electronic device placed on the base member, the socket "is described.

JP 2008-300303 A.

  However, in such a device described in Patent Document 1, the electronic device to be positioned is a so-called BGA package, which has solder balls as terminals on the lower surface, and is located on the side of the electric component body. Since the terminal does not protrude and the terminal is not sandwiched from above and below by the contact pin, the positioning structure of Patent Document 1 cannot be applied.

  Therefore, the present invention provides a socket for an electrical component in which a terminal projects from the side of the electrical component body and the terminal is clamped from above and below by a contact pin, and the electrical component is positioned and the terminal can be securely clamped from above and below. It is an issue to provide.

  In order to achieve the above object, the present invention provides an electrical component socket which is disposed on a wiring board and accommodates an electrical component having a plurality of protruding terminals on the side, and is disposed on the wiring board. A socket body provided; a floating plate that can be lowered obliquely in a state of being urged upward by the socket body; and that is provided in the socket body, and is provided with the electrical component terminal. A first contact pin that contacts and electrically connects to the lower surface of the socket, and a cover that is openably and closably attached to the socket body and that presses the housed electrical component and presses the floating plate downward when closed. A member, a guide member for guiding the floating plate to move obliquely downward when the cover member is closed, and a cover member provided on the cover member. And when the cover member is closed, when the floating plate is moved obliquely downward, it is in contact with and positioned on the side wall of the electrical component, and is in contact with and electrically connected to the upper surface of the electrical component terminal. The electrical component socket has a second contact pin that sandwiches the electrical component terminal together with the first contact pin.

  In another aspect of the invention, the guide member is a leaf spring provided in the socket body, and is configured to slide as the floating plate descends to guide the floating plate obliquely downward. Features.

  In another aspect of the invention, the cover member is provided so as to be movable to the cover member body, the cover member body being attached to the socket body so as to be openable and closable, and pressing the electrical component when the cover member is closed And a biasing member that biases the pressing member toward the electrical component when the cover member is closed.

  According to the present invention, even if the terminal protruding to the side of the electrical component is short, the floating plate is moved obliquely downward, and the second contact pin is attached to the side wall of the package body along with this operation. Since the positioning is performed by abutting, the electric component terminal can be securely held between the second contact pin and the first contact pin.

  In addition, the second contact pin provided on the cover member for making the Kelvin contact allows the electrical component to be positioned, so that the positioning can be performed more effectively without increasing the number of components. It can be performed.

  According to another aspect of the invention, the guide member is a leaf spring, so that variations in molding of the floating plate and the like can be absorbed.

  According to another invention, since the pressing member of the cover member is provided so as to be movable with respect to the cover member main body, it can be moved following the movement of the floating plate obliquely downward. The electrical component can be favorably pressed by the pressing member.

It is a top view in the state where the cover member of the IC socket concerning an embodiment of this invention was opened. It is sectional drawing of the IC socket which concerns on the same embodiment. It is sectional drawing which follows the AA line of FIG. 2 which concerns on the embodiment. It is sectional drawing in the socket main body side of the IC socket which concerns on the embodiment. It is sectional drawing which shows the state which is supporting the support shaft of the IC socket which concerns on the embodiment with the head of a screw. It is a figure which shows the IC package which concerns on the same embodiment, (a) is a top view, (b) is a front view, (c) is a bottom view. It is sectional drawing which shows the state in the middle of closing the cover member of the IC socket which concerns on the embodiment. It is sectional drawing which shows the state which closed the cover member of the IC socket which concerns on the embodiment further than FIG. It is sectional drawing which shows the state which closed the cover member of the IC socket which concerns on the embodiment further than FIG. It is sectional drawing which shows the state which closed the cover member of the IC socket which concerns on the same embodiment completely.

  Embodiments of the present invention will be described below.

  1 to 10 show an embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in the figure is an IC socket as an “electrical component socket”, and this IC socket 11 is arranged on a wiring board (not shown). In order to perform a burn-in test or the like of the IC package 12 or the like, the terminal 12b of the IC package 12 and its wiring board are electrically connected.

  As shown in FIG. 6, the IC package 12 has a rectangular package body 12a in a plan view, and a plurality of terminals 12b and 12c are formed to protrude laterally from opposite side walls of the package body 12a. ing. The protruding amount of the terminals 12b and 12c is as short as about 0.1 mm.

  The terminals 12b on one side are formed in a protruding manner at a total of four locations, and the terminals 12c on the other side on the opposite side are formed at a total of four locations, but the bottom view shown in FIG. So that they are connected. Of course, the number of the terminals 12b is not limited to four.

  On the other hand, as shown in FIGS. 1, 2, 3, and 7, the IC socket 11 is lowered obliquely downward while being urged upward by the socket body 14 fixed on the wiring board. A floating plate 15 that can be provided and accommodates the IC package 12, a first contact pin 16 that is provided on the socket body 14 and is in contact with and electrically connected to the lower surface of the IC package terminal 12b, and the IC package terminal The contact pin 17 is in contact with and electrically connected to the lower surface of 12c.

  More specifically, as shown in FIGS. 1 and 3, the floating plate 15 moves obliquely downward (right obliquely downward in FIG. 2) while being biased upward by springs 24 provided in a total of four locations. It is provided as possible. In the center of the upper surface of the floating rate 15, there is provided an accommodation recess 15a that is recessed downward and accommodates the IC package 12, as shown in FIG. 4, etc. The side wall of the accommodation recess 15a is inclined obliquely. Thus, a guide wall 15b for guiding the IC package 12 to a predetermined position is formed.

  Further, a bottom surface portion 15c in which the IC package 12 is accommodated is formed in the accommodation recess 15a. As shown in FIG. 7 and the like, an opening 15d is formed in the bottom surface portion 15c, and the contact pins 16 and 17 are inserted through the opening 15d, so that the terminals 12b and 12c are inserted. It is in contact with the lower surface and is electrically connected. Further, the bottom surface portion 15c is provided with an interposition portion 15e interposed between the first contact pin 16 and a second contact pin 30 described later, as shown in FIG. In a state in which the first contact pin 16 and the second contact pin 30 are not in contact with each other, the first contact pin 16 and the second contact pin 30 are not in direct contact by the interposition part 15e.

  Further, the first contact pin 16 and the contact pin 17 are formed of a plate material having conductivity and elasticity, and press-fit portions 16a and 17a to be press-fitted into the socket body 14 are formed, and downward from the press-fit portions 16a and 17a. Extended lead portions 16b and 17b are formed, and the lead portions 16b and 17b are inserted into insertion holes of a wiring board (not shown) and soldered and fixed.

  Further, spring portions 16c and 17c extending in a substantially horizontal direction are formed above the press-fit portions 16a and 17a, and terminal-side contact portions 16d and 17d extending upward from the tip portions of the spring portions 16c and 17c are formed. Has been. These terminal side contact portions 16d and 17d are brought into contact with and electrically connected to the lower surfaces of the respective terminals 12b and 12c of the IC package 12.

  On the other hand, as shown in FIGS. 1, 2, 3, 7 and the like, the IC socket 11 is attached to the socket body 14 so as to be openable and closable. A cover member 19 is provided to press the button downward.

  The cover member 19 is provided with a cover member main body 20 so as to be rotatable with respect to the socket main body 14 via a rotation shaft 21, and a distal end portion of the cover member main body 20 is shown in FIGS. As described above, the hook member 22 that is engaged with and disengaged from the locked portion 14a of the socket main body 14 is rotatably provided.

  Further, the cover member 19 is provided with a pressing member 23 which is provided so as to be movable on the cover member main body 20 and presses the IC package 12 when the cover member 19 is closed.

  The pressing member 23 is provided with a pressing convex portion 23a. When the cover member 19 is closed, the pressing convex portion 23a is inserted into the accommodating concave portion 15a of the floating plate 15, and the upper surface of the IC package 12 accommodated therein. Is pressed by the pressing convex portion 23a.

  As shown in FIGS. 1, 2, 3, 5, and 7, the pressing member 23 is inserted with a support shaft 26 extending in the horizontal direction, and both ends of the support shaft 26 are inserted into the rectangular shape of the cover member body 20. As shown in FIGS. 1, 3, and 5, both ends of the support shaft 26 are inserted into the groove 20 a, and the head 27 a of the screw 27 screwed into the cover member body 20, as shown in FIGS. The support shaft 26 is supported by the cover member main body 20. Specifically, as shown in FIG. 5, the gap H between the end of the head 27 a and one side wall of the insertion groove 20 a is larger than the radius R of the support shaft 26 and smaller than the diameter D. As a result, as shown in FIG. 5, a part 26a of the support shaft 26 falls from the gap between the end of the head portion 27a and one side wall of the insertion groove 20a.

  Further, as shown in FIG. 3, the support shaft 26 is pressed downward by a spring 28 as an “urging member”, and the distal end portion side of the pressing member 23 is spring 29 as shown in FIG. Therefore, it is pressed downward. The pressing members 23 are biased toward the IC package 12 by the springs 28 and 29 when the cover member 19 is closed.

  Further, as shown in FIGS. 2 and 7, the second contact pin 30 is disposed on the cover member 19 closer to the rotation shaft 21 than the support shaft 26. The second contact pin 30 is formed of a plate material having conductivity and elasticity, and is attached to the cover member main body 20 by a fixing portion 30a, and the terminal side contact portion 30c is connected from the fixing portion 30a via a spring portion 30b. The terminal-side contact portion 30c is in contact with and electrically connected to the upper surface of the IC package terminal 12b, and the terminal 12b is sandwiched between the terminal-side contact portion 16d of the first contact pin 16 and provided. It is supposed to be.

  Further, a contact portion 30e is formed on the second contact pin 30 via a spring portion 30d, and the contact portion 30e is separated from and connected to a connection member 31 disposed on the socket body 14. . The connecting member 31 is made of a plate material having conductivity and elasticity, and a contact portion 31a that is in contact with and electrically connected to the contact portion 30e of the second contact pin 30 is formed on the upper end portion, and leads. The part 31b extends downward from the socket body 14 and is inserted into a through-hole of a wiring board (not shown) and soldered.

  Instead of providing the connection member 31, the wiring may be directly extended from the second contact pin 30 and connected to an inspection apparatus or the like.

  Further, the socket body 14 is provided with a guide member 32 for moving the floating plate 15 obliquely downward when the cover member 19 is closed.

  This guide member 32 is a metal leaf spring, and as shown in FIGS. 1, 2, and 3, is provided at a total of four locations, the lower portion 32a is attached to the socket body 14, and the upper portion 32b is curved to form a floating plate. 15 is in sliding contact.

  The guide member 32 is configured such that the upper part 32b slides as the floating plate 15 descends and the floating plate 15 is guided obliquely downward (right obliquely downward in FIG. 7).

  When the cover member 19 is closed, when the floating plate 15 is moved obliquely downward, the terminal-side contact portion 30c of the second contact pin 30 is in contact with the side wall of the package body 12a and positioned, and the IC package The IC package terminal 12b is sandwiched together with the first contact pins 16 by being in contact with and electrically connected to the upper surface side of the terminal 12b (see FIG. 10).

  Next, how to use the IC socket 11 will be described.

  First, as shown in FIG. 1, the IC package 12 is accommodated in the accommodating recess 15 a of the floating plate 15 with the cover member 19 of the IC socket 11 being opened. At the time of the accommodation, the IC package 12 is guided by the inclined guide wall 15b of the accommodation recess 15a and is accommodated in the bottom surface portion 15c. In this accommodated state, the IC package 12 moves somewhat in the accommodating recess 15a.

  In this case, the floating plate 15 is biased by the spring 24 and is in the highest position.

  When the cover member 19 is closed from this state, first, as shown in FIG. 7, the pressing convex portion 23a comes into contact with the upper surface portion of the package body 12a. In this state, since the floating plate 15 is not yet pressed downward and moved, the first contact pin 16 and the lower surfaces of the terminal side contact portions 16d and 17d of the contact pin 17 are in a separated state.

  If the cover member 19 is further closed from this state, as shown in FIG. 8, the floating plate 15 is pressed downward by the pressing member 23, and the upper portion 32b of the guide member 32 is moved during the downward movement. By sliding the floating plate 15, the floating plate 15 is moved diagonally downward to the right in FIG.

  Thereby, the terminal side contact part 30c of the 2nd contact pin 30 contact | abuts to the side wall of the package main body 12a, as shown in FIG.

  When the cover member 19 is further closed from this state, as shown in FIG. 9, the floating plate 15 is pressed downward by the pressing member 23, and the upper portion 32b of the guide member 32 is moved when moving downward. By sliding the floating plate 15, the floating plate 15 is further moved diagonally downward to the right in FIG. 9.

  As a result, the terminal side contact portion 30c of the second contact pin 30 is in contact with the side wall of the package body 12a as shown in FIG. 9, and the terminal side contact portion 30c is caused by the elastic force of the spring portion 30b. The IC package terminal 12b is pressed against the upper surface. Further, the contact portion 30 e of the second contact pin 30 is lowered, and this contact portion 30 e comes into contact with the contact portion 31 a of the connection member 31 of the socket body 14.

  In this state, the terminal side contact portions 16d and 17d of the contact pins 16 and 17 are in contact with the lower surfaces of the IC package terminals 12b and 12c.

  If the cover member 19 is further closed from this state, as shown in FIG. 10, the floating plate 15 is pressed downward by the pressing member 23, and the upper portion 32b of the guide member 32 is moved during the downward movement. By sliding the floating plate 15, the floating plate 15 is further moved diagonally downward to the right in FIG. 10, and the cover member 19 is completely closed.

  As a result, the terminal side contact portion 30c of the second contact pin 30 is in contact with the side wall of the package body 12a as shown in FIG. 10, and the terminal side contact portion 30c is caused by the elastic force of the spring portion 30b. The IC package terminal 12b is pressed against the upper surface with a stronger force than the state shown in FIG. Further, the terminal side contact portions 16d and 17d of the first contact pin 16 and the contact pin 17 are in contact with the lower surface of the IC package terminal 12b with a force stronger than the state shown in FIG. The contact portion 30e of the second contact pin 30 also abuts on the contact portion 31a of the connection member 31 of the socket body 14 with a stronger force than the state shown in FIG.

  In this way, the terminal 12b on one side of the IC package 12 is sandwiched from above and below by the terminal side contact portions 16d and 30c of the contact pins 16 and 30 (so-called Kelvin contact), and the terminal 12c on the other side is only on the lower surface. The terminal side contact portion 17d of the contact pin 17 is brought into contact.

  In this state, a current is passed through the IC package 2 to perform a burn-in test or the like.

  In such a case, the floating plate 15 is moved obliquely downward even if the IC package terminal 12b has a short side protrusion, and the second contact pin is moved along with this operation. Since the terminal side contact portion 30c of 30 is brought into contact with the side wall of the package body 12a and positioned, the terminal side contact portion 30c of the second contact pin 30 and the terminal side contact portion 16d of the first contact pin 16 Thus, the IC package terminal 12b can be securely held.

  Moreover, since the IC package 12 is positioned by the second contact pin 30 provided on the cover member 19 side for making the Kelvin contact, it is possible to increase the number of parts without causing an increase in the number of parts. Positioning can be performed effectively.

  Further, since the guide member 32 is elastically deformed as a leaf spring, variations in molding of the floating plate 15 and the like can be absorbed.

  Furthermore, since the pressing member 23 of the cover member 19 is provided so as to be movable with respect to the cover member main body 20, the pressing member 23 can be moved following the movement of the floating plate 15 obliquely downward. The IC package 12 can be favorably pressed by the member 23.

  In the above-described embodiment, the present invention is applied to the IC socket 11 as the “socket for electrical parts”. However, the present invention is not limited to this and can be applied to other devices. In addition, the “guide member” of the present invention is not limited to the leaf spring provided on the socket body side as in the above-described embodiment, but may be of any other structure as long as it can guide the floating plate to move obliquely downward. Of course it is good. Further, as long as the floating plate can be moved obliquely downward, it may not be diagonally downward to the right in FIG. 7 as in the above embodiment, but may be diagonally downward to the left, or may be in another direction. However, even in this case, it is needless to say that the second contact pin needs to abut against the side wall when the electrical component accommodated in the floating plate moves.

11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a Package body (Electric component body)
12b terminal
14 Socket body
15 Floating plate
15a Housing recess
16 First contact pin
16d Contact part on the terminal side
19 Cover member
23 Pressing member
28 Spring (biasing member)
30 2nd contact pin
30c Contact part on the terminal side
32 Guide member

Claims (3)

An electrical component socket disposed on a wiring board and containing an electrical component having a plurality of protruding terminals on a side,
A socket body disposed on the wiring board;
In a state of being biased upward in the socket body, provided so as to be able to descend obliquely downward, and a floating plate that accommodates the electrical components;
A first contact pin provided on the socket body and in contact with and electrically connected to the lower surface of the electrical component terminal;
A cover member that is attached to the socket body so as to be freely opened and closed, and when closed, presses the housed electrical component and presses the floating plate downward,
A guide member for guiding the floating plate to move obliquely downward when the cover member is closed;
Provided in the cover member, when the cover member is closed, when the floating plate is moved obliquely downward, it contacts and positions the side wall of the electrical component and contacts the upper surface of the electrical component terminal. An electrical component socket, comprising: a second contact pin that is electrically connected and sandwiches the electrical component terminal together with the first contact pin. The said guide member is a leaf | plate spring provided in the said socket main body, It is comprised so that it may slide as the floating plate descend | falls and it guides this floating plate diagonally downward. The socket for electrical components according to 1. The cover member includes a cover member main body that is attached to the socket main body so as to be freely opened and closed, a pressing member that is provided so as to be movable to the cover member main body, and that presses the electrical component when the cover member is closed, and the pressing member The electrical component socket according to claim 1, further comprising a biasing member that biases the member toward the electrical component when the cover member is closed.

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