JP6660683B2 - Socket for electrical components - Google Patents

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for an electric component which is disposed on a wiring board and accommodates the electric component such as a semiconductor device (hereinafter referred to as an "IC package") for testing the same.

  Conventionally, as this type of “electric component socket”, there is an IC socket that detachably accommodates an IC package that is an “electric component” (see Patent Document 1).

  The IC package has, for example, a rectangular package body, and terminals are provided on the package body.

  On the other hand, in the IC socket, an IC package is accommodated in a socket body, and a cover member is provided on the socket body so as to be openable and closable, and the IC package is pressed with the cover member closed. In addition, the terminals of the IC package are brought into contact with the contact pins.

  The cover member has a frame rotatably attached to the socket body, and a pressing member supported inside the frame and pressing the IC package.

Japanese Patent No. 5584072.

  However, in the related art, the height relationship between the housing portion and the pressing member when the cover member is closed is predetermined in accordance with a specific IC package that is predetermined to be stored. Therefore, one IC socket cannot accommodate another IC package having a different thickness. Therefore, in order to test a plurality of types of IC packages having different thicknesses, it is necessary to separately prepare and attach an adjusting part for adjusting the thickness or to change the IC socket itself, which makes the handling complicated. However, there has been a problem that the cost increases.

  Accordingly, an object of the present invention is to provide an electrical component socket capable of accommodating electrical components of various thicknesses in one electrical component socket.

In order to achieve the object, an invention according to claim 1 is an electrical component socket provided on a wiring board and accommodating an electrical component, the electrical component socket being provided on the wiring board, a socket body having a housing with parts housed is provided rotatably with respect to the socket body, and a cover member for opening and closing the housing part, the cover member is rotated in said socket body A frame rotatably provided via a shaft, and a pressing member supported by the frame , formed into a rectangular shape in plan view , and pressing the electric component housed in the housing when the cover member is closed. The socket body has a latch member that is locked to the frame body and closes the cover member. When the cover member is closed , the height of the pressing member with respect to the housing portion is increased. Higher and lower And a pair of cam members, which are rotatably provided on the frame via a shaft and press on both sides of the pressing member, are formed in a U-shape. A lever member having both ends connected to the pair of cam members for simultaneously rotating the pair of cam members; and rotating the lever member to one side to move the pair of cam members to a second position. While holding at one position, the lever member is rotated to the other side to hold the pair of cam members at a second position, and the pair of cam members is held at the first position or the second position . By holding the pressing member at one of the positions, the pressing member is configured to be at the high position or the low position, and the lever in a substantially horizontal state when the pair of cam members is held at the first position. The U-shaped middle part of the member It is located between one side surface of the rectangular pressing member and a portion of the frame body where the latch member is locked, and is in a substantially horizontal state when the pair of cam members are held at the second position. An electric component configured such that a U-shaped intermediate portion of the lever member is located between the other side surface of the rectangular pressing member and a portion of the frame body provided with the rotation shaft. It is characterized in that it is used as a socket.

According to the first aspect of the present invention, when the cover member is closed, the adjusting mechanism for adjusting the height position of the pressing member of the cover member with respect to the housing portion of the socket body has one adjusting mechanism. A plurality of types of electrical components having different thicknesses can be accommodated in the socket, and the electrical components having the respective thicknesses can be held at an appropriate contact pressure. As a result, when accommodating a plurality of types of electrical components having different thicknesses, it is not necessary to change the electrical component socket or attach a special adjustment component, so that the electrical component socket can be easily handled. In addition, costs can be reduced.
According to the first aspect of the present invention, since the adjusting mechanism has the first position and the second position at which the height position of the pressing member can be changed, the pressing member can be reliably moved to the predetermined height position. Can be changed.
According to the first aspect of the present invention, the adjusting mechanism has a pair of cam members provided on the shaft and a lever member for rotating the cam members. Since the height position is changed, the pressing member can be reliably changed to the predetermined height position with a simple structure.
According to the first aspect of the present invention, when the lever member is rotated to one side or the other side so as to be in a substantially horizontal state, each of the lever members is configured to be accommodated in the frame, so that the lever member is located outside the cover member. No longer protrude. As a result, the overall size of the IC socket can be reduced.

1 is a perspective view of an IC socket according to an embodiment of the present invention. FIG. 3 is a plan view of the IC socket according to the embodiment. FIG. 2 is a perspective view of the IC socket according to the embodiment with a cover member opened. FIG. 3 is a perspective view of the IC socket according to the embodiment in a state where a cover member is closed and a lock mechanism is not locked. FIG. 6 is a cross-sectional view of the IC socket according to the embodiment, taken along line BB of FIG. 4, showing a state where the lever member is located at a first position. FIG. 5 is a cross-sectional view of the IC socket according to the embodiment, taken along line BB of FIG. 4, showing a state where the lever member is located at a second position. FIG. 3 is a cross-sectional view of the IC socket according to the embodiment, taken along line AA of FIG. 2, in which (a) a lever member is located at a first position to accommodate a first IC package, and (b) a lever. FIG. 11 is a diagram comparing a state where a member is located at a second position and accommodates a second IC package. FIG. 3 is an enlarged cross-sectional view showing movement near a contact pin in the IC socket according to the embodiment. FIG. 2 is a front view showing a first IC package according to the embodiment. FIG. 3 is a front view showing a second IC package according to the embodiment.

  Hereinafter, embodiments of the present invention will be described.

  1 to 10 show an embodiment of the present invention.

  First, the configuration will be described. An IC socket 10 as an “electric component socket” according to the present embodiment is arranged on a wiring board 1 as shown in FIG. Also, the first IC package 3 (see FIG. 9) or the second IC package 6 (see FIG. 10) as an “electric component” is accommodated therein, and the electrodes (not shown) of the wiring board 1 and the first IC The spherical terminals (solder balls) 5 of the package 3 or the spherical terminals (solder balls) 8 of the second IC package 6 are electrically connected. For example, it is used for a burn-in test or the like of the first IC package 3 or the second IC package 6.

  The first IC package 3 of this embodiment has a square shape in plan view, and has a package body 4 having a predetermined thickness H1, as shown in FIG. A plurality of spherical terminals 5 are formed so as to protrude in a matrix.

  As shown in FIG. 10, the second IC package 6 is formed such that the thickness H2 of the package body 7 is smaller than the thickness H1 of the package body 4 of the first IC package 3. A spherical terminal 8 is provided on the lower surface of 7.

  On the other hand, the IC socket 10 is fixed on the wiring board 1 as shown in FIGS. 5 to 7, and as shown in FIGS. 1, 3, 5 to 7, etc., the first IC package 3 or the And a socket body 20 for accommodating the second IC package 6, and a pivot plate provided on the socket body 20 to open and close a floating plate 55, which will be described later, to press the first IC package 3 or the second IC package 6. And a lock mechanism 40 that locks when the cover member 30 is closed.

  More specifically, as shown in FIG. 5 and the like, the socket body 20 is provided with a frame member 21 fixed on the wiring board 1 and formed in a frame shape, and a contact pin provided inside the frame member 21. And a unit 50. As shown in FIG. 8, the contact pin arrangement unit 50 includes an upper plate 51, a lower plate 53, and the first IC package 3 or the second IC package 3 urged upward with respect to the upper plate 51. And a floating plate 55 as an “accommodating portion” for accommodating the IC package 6.

  As shown in FIG. 8, a plurality of upper through holes 52 provided in the upper plate 51, a plurality of lower through holes 54 provided in the lower plate 53, and a plurality of through holes provided in the floating plate 55. The contact pins 60 are inserted and held in 57, whereby a plurality of contact pins 60 are arranged in a matrix. The contact pins 60 contact the lower surfaces of the spherical terminals 5 of the first IC package 3 or the spherical terminals 8 of the second IC package 6 and are electrically connected to the electrodes of the wiring board 1. Has become.

  As shown in FIG. 8, each contact pin 60 includes an upper contact member 61 made of a conductive metal material that contacts the spherical terminal 5 of the first IC package 3 or the terminal 8 of the second IC package 6, and a wiring. A lower contact member 62 made of a conductive metal material that contacts an electrode of the substrate 1 is elastically combined with the lower contact member 62, and a coil spring 63 is disposed between the upper contact member 61 and the lower contact member 62. It is urged to extend.

  Then, the contact pins 60 composed of these are inserted into the upper through-hole 52 and the lower through-hole 54 along the vertical direction. In addition, the upper contact member 61 moves up and down mainly in the upper through hole 52, and the lower contact member 62 moves up and down mainly in the lower through hole 54.

  The floating plate 55 is formed with a large number of through holes 57 (see FIG. 8) through which the contact pins 60 are inserted by being urged upward by a spring (not shown) or the like, as shown in FIGS. As described above, the guide portion 56 that guides each corner of the first IC package 3 or the second IC package 6 is formed.

  The cover member 30 has a frame 31 and a pressing member 32, as shown in FIGS. The frame body 31 is a substantially rectangular member rotatably provided with respect to the socket body 20. One end (the right end in FIG. 5) of the frame body 31 is a frame of the socket body 20. It is rotatably attached to the member 21 via a rotation shaft 34 provided substantially in the horizontal direction.

  The pressing member 32 is a member supported in the frame 31 as shown in FIGS. 2 and 5, and is substantially the same as the rotation shaft 34 at the center of the frame 31 (the center in FIG. 5). It is rotatably supported by a predetermined amount on a shaft 35 provided along the horizontal direction. Further, an insertion hole (not shown) on the side of the pressing member 32 through which the shaft 35 is inserted is formed in a long hole whose longitudinal direction is the vertical direction so that the pressing member 32 can move up and down by a predetermined amount with respect to the shaft 35. ing.

  As shown in FIGS. 5 and 6, the pressing member 32 is pressed downward so as to press the first IC package 3 or the second IC package 6 housed in the floating plate 55 when the cover member 30 is closed. The pressing portion 33 has a substantially rectangular shape in plan view.

  As shown in FIGS. 5 and 6, the pressing member 32 has a fin-shaped heat sink 36 integrally provided above the pressing portion 33. Then, the heat of the first IC package 3 or the second IC package 6 is radiated from the heat sink section 36 via the pressed section 33 which is in contact with the first IC package 3 or the second IC package 6. Here, the heat sink portion 36 is formed in a shape having a greater width and width than the pressing portion 33.

  As shown in FIGS. 5 to 7, the cover member 30 has an adjustment mechanism 37 for adjusting the height position of the pressing member 32 with respect to the floating plate 55 when the cover member 30 is closed. In the adjusting mechanism 37 of this embodiment, as shown in FIG. 2, a pair of cam members 38 are provided on both sides of the pressing member 32 so as to be rotatable about a shaft 35. The pair of cam members 38 are connected by a substantially U-shaped lever member 39, and the pair of cam members 38 are simultaneously rotated by the lever member 39.

  The adjusting mechanism 37 includes a first position where the cam member 38 is held such that the lever member 39 is at the left side position shown in FIGS. The cam member 38 is held at two positions of the second position where the cam member 38 is held so as to be at the right position shown in b). Further, the cam member 38 has a contact portion between the shaft 35 at the second position shown in FIG. 6 and the pressing portion 33 because of the length L1 from the shaft 35 at the first position shown in FIG. It is formed in an eccentric cam shape so that the length L2 to the contact position is longer. As shown in FIGS. 5 to 7, the cam member 38 comes into contact with the pressing portion 33 of the pressing member 32 from above.

  By rotating the lever member 39 by 180 ° from the first position to the second position, the second position is longer than the first position by the length L shown in FIG. 7 (length L2−length L1). The cam member 38 can be changed so as to protrude downward with respect to the shaft 35 by an amount corresponding to (a). As a result, the height position of the pressing member 32 can be displaced downward by the length L shown in FIG. In this embodiment, "length L (see FIG. 7) = thickness H1 of package body 4 of first IC package 3 (see FIG. 9) -thickness of package body 7 of second IC package 6" H2 (see FIG. 10).

  Further, as shown in FIGS. 3 to 5, the lock mechanism 40 includes a latch member 41 that is locked to the other end (the left end in FIG. 5) of the frame body 31 and a cam mechanism ( And a lock lever 42 for moving the latch member 41 downward via a not shown). 4 and 5, the lock lever 42 is pivoted in the direction of arrow E in FIG. 4 to fall down to a substantially horizontal state, whereby the latch member 41 is moved downward, and as shown in FIGS. 7A and 7B, the first IC package 3 or the second IC package 6 is pressed by the pressing member 32. At the same time, the lock lever 42 is configured to come into contact with the protruding pins 35a protruding from both sides of the shaft 35 from above and to ride on the protruding pins 35a.

  Next, the operation of the IC socket 10 having such a configuration will be described.

  First, as shown in FIG. 3, when the cover member 30 of the IC socket 10 is opened, the floating plate 55 is urged upward by a spring, and the upper contact member of the contact pin 60 as shown in FIG. The tip of 61 is in the through hole 57 of the floating plate 55. Next, the first IC package 3 or the second IC package 6 is housed on the floating plate 55 by an automatic machine or the like. At the time of this accommodation, the first IC package 3 or the second IC package 6 is guided by the guide portion 56 of the floating plate 55.

  Thereafter, as shown in FIG. 4, the cover member 30 is closed, and the latch member 41 is engaged with the other end (the left end in FIG. 5) of the frame body 31. Here, when the IC package housed in the floating plate 55 is the first IC package 3 in which the thickness H1 of the package body 4 is large, the lever member 39 of the adjusting mechanism 37 is moved to the first position (as shown in FIG. 5). (When the lever member 39 is at the second position (the right position as shown in FIG. 6), the lever member 39 is rotated by 180 ° in the direction of arrow D in FIG. 6), and the cam member 38 is projected downward. However, due to the eccentric shape, the height position of the pressing member 32 is set to be higher than the second position by the length L in FIG.

  When the IC package housed in the floating plate 55 is the second IC package 6 having a small thickness H2 of the package body 7, the lever member 39 of the adjusting mechanism 37 is moved to the second position (right side as shown in FIG. 6). (When the lever member 39 is at the first position (the left side position as shown in FIG. 5), the lever member 39 is turned by 180 ° in the direction of arrow C in FIG. 5), and the amount of downward projection of the cam member 38 is reduced. Due to the eccentric shape, the height position of the pressing member 32 is set to be lower than the first position by the length L in FIG. 7.

  Thereafter, the lock lever 42 is changed from the open state as shown in FIGS. 4 and 5 (or FIG. 6) to the closed state as shown in FIGS. 1, 2 and 7 (a) (or 7 (b)). By moving the latch member 41 downward, the first IC package 3 or the second IC package 6 is pressed by the pressing member 32, and the lock lever 42 is formed so as to protrude from both outer sides of the shaft 35. The protruding pin 35a is brought into contact with the protruding pin 35a from above and rides on the protruding pin 35a.

  Here, since the height position of the pressing member 32 is adjusted by the adjusting mechanism 37, there is no gap between the IC packages 3, 6 and the pressing member 32, and the IC packages 3, 6 are pressed by the same contact pressure. You can do it.

  As a result, the first IC package 3 or the second IC package 6 is pressed downward by the pressing member 32, and as shown in FIG. 8B, the floating plate 55 is pressed against the urging force of the spring. The first IC package 3 or the second IC package 6 is held with an appropriate contact pressure while the upper contact member 61 is pressed down against the urging force of the coil spring 63. The Rukoto.

  In addition, before the cover mechanism 30 is locked by the lock mechanism 40, the setting can be changed to the IC packages 3 and 6 having different thicknesses, so that the change operation can be performed with a light load. The height adjustment by the adjusting mechanism 37 may be performed in advance before the IC packages 3 and 6 are accommodated, in accordance with the IC packages 3 and 6 to be accommodated.

  In this state, a current is applied to the first IC package 3 or the second IC package 6 to perform a burn-in test or the like.

  After the burn-in test or the like is performed, the lock lever 42 is moved from the position shown in FIG. 1 to the position shown in FIG. 4 to open the lock mechanism 40, and the cover is moved from the position shown in FIG. 4 to the position shown in FIG. After the member 30 is moved to open the cover member 30, the first IC package 3 or the second IC package 6 is taken out of the floating plate 55 by an automatic machine or the like.

  As described above, the IC socket 10 of this embodiment has the adjustment mechanism 37 that adjusts the height position of the pressing member 32 of the cover member 30 with respect to the floating plate 55 of the socket body 20 when the cover member 30 is closed. In this way, a single IC socket 10 can accommodate IC packages 3 and 6 having a plurality of thicknesses, and hold the IC packages 3 and 6 having respective thicknesses with an appropriate contact pressure. Can be. Thus, when accommodating a plurality of types of IC packages 3 and 6 having different thicknesses, there is no need to change the IC socket 10 or attach a special adjustment component, so that the IC socket 10 can be easily handled. Cost can be reduced.

  Further, in the IC socket 10 of this embodiment, since the adjusting mechanism 37 has the first position and the second position where the height position of the pressing member 32 can be changed, the pressing member 32 is surely moved to the predetermined height. Can be changed to position.

  Further, in the IC socket 10 of this embodiment, the adjusting mechanism 37 has a cam member 38 provided on the shaft 35 and a lever member 39 for rotating the cam member 38. Since the height position is changed, the pressing member 32 can be reliably changed to a predetermined height position with a simple structure.

  In the above-described embodiment, the present invention is applied to the IC socket 10 as the “socket for electric components”. However, the present invention is not limited to this and can be applied to other devices.

  In the above-described embodiment, the adjusting mechanism 37 has the cam member 38 and the lever member 39 provided on the shaft 35. However, the present invention is not limited to this. The height position of the pressing member with respect to may be adjustable.

  Further, in the above-described embodiment, the adjustment mechanism 37 has the pattern held at the two positions of the first position and the second position. As a result, it is possible to cope with electric components having two types of thickness. However, the present invention is not limited to this, and the pattern may be such that the adjustment mechanism is held at three or more locations, and the adjustment mechanism may be compatible with electrical components having three or more types of thickness.

  Further, the adjusting mechanism is not limited to the configuration provided on the cover member, but may be provided on another member such as a socket body.

  Further, in the above-described embodiment, the so-called BGA in which the spherical terminals 5 are provided on the lower surface of the package body 4 is used as the IC package, and the IC socket 10 that accommodates this is described. Instead, the present invention may be applied to an IC socket that accommodates another IC package such as an IC package called a so-called LGA.

  Further, in the above-described embodiment, the description has been made using the IC packages 3 and 6 as the electric components. However, the present invention is not limited to this, and the present invention may be applied to other electric components.

1 Wiring board
3 First IC package (electrical components)
6 Second IC Package (Electrical Components)
10 IC socket (socket for electrical parts)
20 Socket body
30 Cover member
31 Frame
32 Pressing member
35 axes
37 Adjustment mechanism
38 Cam member
39 Lever member
55 Floating plate (housing)

Claims (1)

An electrical component socket disposed on the wiring board and accommodating the electrical component,
A socket body that is provided on the wiring board and has a housing portion in which the electric component is housed;
A cover member that is provided rotatably with respect to the socket main body and that opens and closes the housing section;
The cover member is provided with a frame rotatably provided on the socket main body via a rotation shaft, and is supported by the frame, is formed in a rectangular shape in plan view, and is formed in the housing portion when the cover member is closed. A pressing member for pressing the housed electric component,
The socket body has a latch member that is locked to the frame body and closes the cover member.
At the time of closing the cover member, a height of the pressing member with respect to the housing portion, a high position, having an adjustment mechanism to adjust the position lower than it,
The adjusting mechanism is provided on the frame body so as to be rotatable via a shaft and presses both sides of the pressing member. The adjusting mechanism is formed in a U-shape and both ends are connected to the pair of cam members. And a lever member for simultaneously rotating the pair of cam members,
The lever member is turned to one side to hold the pair of cam members at the first position, while the lever member is turned to the other side to hold the pair of cam members at the second position. Is configured as
By holding the pair of cam members at one of the first position or the second position , the pressing member is configured to be at the high position or the low position,
The U-shaped intermediate portion of the lever member in a substantially horizontal state when the pair of cam members is held at the first position includes one side surface of the rectangular pressing member and the latch member of the frame body. It is located between the part to be locked,
The U-shaped intermediate portion of the lever member in a substantially horizontal state when the pair of cam members is held at the second position includes the other side surface of the rectangular pressing member and the rotating shaft of the frame. A socket for an electric component, which is configured to be located between the portion and the portion provided with .

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