JP2003217769A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily properly use two kinds of IC packages by changing a pressing quantity by operation of a handle mounted on an IC socket in a press of the two kinds of IC packages different in the thickness of the IC packages. <P>SOLUTION: This IC socket has a socket body, a cover member having a latch mechanism rotatably pivoted on one side of the socket body, and engaging with the socket body on the other side, and having a pressing member in a central part, and a contact for installing the IC packages. The pressing member is movably arranged to the cover member, and a pressing quantity of the pressing member is changed by the handle operation. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket in which a semiconductor device such as an IC package is used, and in particular, pressing of IC packages having different thicknesses can be selectively used by changing the pressing amount by operating a handle. The present invention relates to a possible IC socket.

[0002]

2. Description of the Related Art Conventionally, there is known an IC socket in which an IC package or the like as an electric component is mounted on a socket body of an IC socket and is pressed and held by a pressing mechanism.

[0003]

However, in the conventional IC socket in which the IC package or the like as such an electric component is mounted, ICs having different thicknesses are used.
When a package is used, the pressing plate as a pressing mechanism including the latch means and the IC package pressing member itself such as the movable pressing member must be replaced and used. Therefore, the pressing member must be replaced every time the IC package has a different thickness, etc., and it is troublesome and troublesome to replace the pressing member and the cost is increased.

Therefore, the object of the present invention is to solve the problems in the prior art by using two types of IC packages having different thicknesses by pressing the IC package to the IC socket. An object of the present invention is to provide an IC socket in which two types of IC packages can be easily used by changing the pressing amount by operating the handle.

[0005]

In order to achieve the above object, an IC socket of the present invention comprises a socket body and a socket body pivotally supported on one side of the socket body and on the other side. In an IC socket having a cover member having a latching mechanism to be engaged and having a pressing member in the central portion, and a contact to which an IC package is mounted, the pressing member is movable with respect to the cover member. It is provided that the pressing amount of the pressing member is changed by operating the handle.

Further, in the IC socket of the present invention, a handle for changing the pressing amount of the pressing member is pivotally supported so that the pressing member is attached to the cover member, and the handle is engaged with the pressing member. The mating portion is eccentrically attached to the pressing member.

Further, in the IC socket of the present invention, the handle is rotatably supported by the cover member, and an engaging portion between the handle and the pressing member is an eccentric portion of the handle. .

Furthermore, the IC socket of the present invention is characterized in that the eccentric amount of the eccentric portion of the handle corresponds to the pressing amount of the pressing member.

The IC socket of the present invention is characterized in that the handle is eccentrically mounted by a recess formed in the shaft of the handle.

Other objects, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the present invention shown in the accompanying drawings.

[0011]

(Embodiment) FIGS. 1 to 10 are views showing an embodiment of an IC socket of the present invention. FIG. 1 is an IC socket of the present invention when a thick IC package is mounted. 2 is a central longitudinal sectional view of an IC socket of the present invention similar to FIG. 1 when a thin IC package is mounted, and FIGS. 3 to 6 show a thick IC package. FIG. 3 is a plan view of the cover member when the thick IC package is mounted, FIG. 4 is a side view of the cover member of FIG. 3, and FIG. 5 is a line V-V of FIG. 6 is a central longitudinal sectional view of the cover member along the line, FIG. 6 is a central lateral sectional view of the cover member taken along line VI-VI of FIG. 3, and FIGS. 7 to 10 are views when a thin IC package is mounted. FIG. 7 is a plan view of the cover member when a thin IC package is mounted, and FIG. 8 is the cover portion of FIG. A side view of FIG. 9 is a central longitudinal cross-sectional view taken along line IX-IX of the cover member of FIG. 8, FIG. 10 is a central transverse cross-sectional view taken along line X-X in FIG.

As shown in FIGS. 1 and 2, an IC socket 1 of the present invention includes a fixed-side socket body 2 and a cover member 3 rotatably supported on one side of the socket body 2.
A pressing member 4 provided in the center of the cover member 3, a plurality of contacts 5 provided in the socket body 2,
A latch mechanism 6 provided on the other side of the cover member 3 so as to releasably engage the cover member 3 with the socket body 2;
The cover member 3 has a handle 7 that is operated to switch between the thick and thin IC packages 10. The socket body 2, the cover member 3, the pressing member 4, the latch mechanism 6 and the like are preferably made of a suitable electrically insulating synthetic resin material, for example.

In such an IC socket 1 of the present invention, the socket body 2 has a box shape having a bottom portion 11, and an IC for mounting and mounting the IC package 10 thereon.
A plurality of contacts 5 are arranged in alignment in the socket body 2 so as to form the package mounting portion 8 in the central portion, and the terminal portions 5a of these contacts 5 serve as a supporting surface for supporting the IC package 10. They are arranged so as to form the package mounting portion 8. Further, the contact 5 arranged in such a socket body 2 is
A terminal portion 5a is formed in a substantially U-shaped curved shape so that the C package 10 can be elastically supported, and the IC package 10 is mounted and supported on the tip portion of one leg.
A curved portion 5b that is elastically deformable and is formed in a substantially U shape;
It has a terminal pin portion 5c as a terminal pin on the other leg that is fixedly supported by the socket body 2 and protrudes downward to be inserted into a terminal hole of a printed circuit board, a test board, or the like, and has good conductivity. Made from various metallic materials. In the illustrated contact 5, the terminal pin portion 5c, which is a fixed portion with respect to the socket body 2, is formed so that the terminal pin portions of adjacent contacts and projecting mounting positions are displaced from each other. If the terminal pin portion 5c of the contact 5 is formed such that the mounting position thereof is displaced, the strength of the mounting portion of the socket body 2 can be sufficiently maintained, which is preferable.

A bracket portion 12 for pivotally supporting the cover member 3 is provided on one side of the socket body 2, and the cover member 3 is pivoted on the socket body 2 by, for example, a pin 14. A latch projection 13 for the latch mechanism 6 is provided on the other side of the socket body 2 while being movably supported. Further, the latch projection 13 for the latch mechanism 6 is provided so that the claw 16 of the latch lever 15 of the latch mechanism 6 is locked. Such a latch mechanism 6 is provided in the latch lever 1
5 and the operation lever portion 17 are formed, and the operation lever portion 17 is formed so that the claw portion 16 of the latch lever 15 can be locked to the protrusion 13 of the socket body 2. There is. Furthermore, the latch lever 15 of such a latch mechanism 6 is integrally formed with the operation lever portion 17, is rotatably attached to the bracket portion 19 of the cover member 3 by the pin 20, and has a torsion spring. It is preferable that the claw portion 16 is elastically biased in a direction in which it is locked to the latching protrusion 13 of the socket body 2 by an appropriate spring member (not shown) such as the above.

The cover member 3 includes a bracket portion 18 on one side.
At, the pin 14 is rotatably connected to the bracket portion 12 of the socket body 2. Further, a substantially quadrangular opening 21 is provided in the central portion of the cover member 3, and the pressing member 4 has the handle 7 inside the opening 21.
Is installed by. As shown in the figure, such a pressing member 4 is fitted in the opening 21 of the cover member 3 so as to be mounted with a slight gap, and has a pressing portion 22 below, and the IC package 10 is provided. Is pressed from above, and the handle 7 is passed through a hole 23 provided in the upper portion and having a substantially quadrangular cross section, and the pressing member 4 causes the pressing member 4 to pass through.
Installed on.

That is, the cover member 3 has a handle 7
There are provided bearings 24, 25 having circular holes, in which the rotating shafts 34, 35 of the bearing are rotatably supported.
Rotating shafts 34 and 35 of the handle 7 are rotatably fitted in the shafts 4 and 25, respectively. Further, on one side of the cover member 3, an operating portion 32 of the handle 7 is arranged and provided with a recess 26 for operating so as to be rotatable, and this recess 26 is a stopper of the operating portion 32. Can also act as. That is, this depression 26
Depending on whether the IC package 10 is thick or thin, it serves as a stopper surface for tilting the operating portion 32 of the handle 7 to the left or right to engage and position it.

As shown in FIGS. 1, 2, and 11 to 13, the handle 7 has an L-shape with one end bent substantially at a right angle, and one leg 31 of the L-shape is long.
The other short leg portion forms the operation portion 32. In particular, the long leg 31 of the handle 7 is provided with a recess 33 formed by cutting a part of the peripheral surface flat along the leg 31.
The hollow portion 33 of the leg portion 31 is passed through the hole portion 23 of the pressing member 4, and the handle 7 is attached to the cover member 3 by the rotating shaft portions 34 and 35 at both ends of the longer leg portion 31.
It is rotatably pivoted to.

Therefore, the rotating shaft portions 34 and 35 of the handle 7 are circular in cross section, so that the handle 7 can be rotatably favorably pivoted with respect to the cover member 3. Therefore, the handle 7 is rotatably supported by the rotating shafts 34 and 35 with respect to the cover member 3, and the recessed portion 33 formed in the longer leg 31 serves as an eccentric portion of the handle 4. The pressing amount of the pressing member 4 depends on whether the outer peripheral surface of the handle 7 or the concave surface of the concave portion 33 comes into contact with the lower surface of the hole 23 of the pressing member 4 due to the rotation of the handle 7. Since it can be switched so as to be changed, it can be used depending on whether the IC package 10, 10 'used is thick or thin.

The set position of the handle 7 is shown in FIG.
1 to 13 are shown in a planar state, FIG. 11 is a set position in the case of a thick mold, FIG. 12 is a neutral position,
FIG. 13 shows a set position in the case of a thin type.

In the IC socket 1 of the present invention thus constructed, a thick or thin IC package 10,
Next, the state in which 10 'is attached will be described below.

First, in the case where the IC package 10 is a thick type, as shown in FIGS. 1, 3 to 6 and 11, when the cover member 3 is opened with respect to the socket body 2, the pin 14 and its surroundings are opened. Then, the cover member 3 is rotated so that the thick IC package 10 can be mounted on the IC package mounting portion 8 formed by the terminal portion 5a of the contact 5. At this time, the operating portion 32 of the handle 7 is pressed by the pressing member 4
1 is set in the recess 26, that is, in a state of being tilted leftward as shown in FIG. Therefore, in the set state of the handle 7, the recessed surface of the recessed portion 33 of the handle 7 has the recessed portion 23 of the pressing member 4.
Engages and abuts the lower surface of the.

Next, the thick IC package 10 is mounted on the IC package mounting portion 8 formed by the terminal portion 5a of the contact 5 in the socket body 2,
The external terminal on the lower surface of the IC package 10 is placed on the terminal portion 5a of the contact 5, and the external terminal of the IC package 10 is brought into contact with the contact 5 to be electrically conducted.

Thus, when the IC package 10 is mounted in the IC socket 1, the cover member 3 is pivoted around the pin 14 in the closing direction to close the cover member 3 with respect to the socket body 2. The latching claw portion 6 of 6 is engaged with the protrusion 13 of the socket body 2 and latched, and the cover member 3 is closed with respect to the socket body 2 in which the IC package 10 is mounted.

In this state, the handle 7 is shown in FIG.
As shown in FIG. 3 to FIG. 6 and FIG. 11, it is located in a state of tilting to the left, and on the lower surface of the hole portion 23 of the pressing member 4,
The surface of the recessed portion 33 of the handle 7 is in contact, and the pressing portion 22 of the pressing member 4 is brought into contact with the upper surface of the thick IC package 10 so that the IC package with respect to the terminal portion 5a of the contact 5 is packaged. 10 is pushed down, the contact 5 is pushed downward, and the IC package 10 is firmly held between the pressing portion 22 of the pressing member 4 and the contact 5 by the elastic force of the contact 5. Like At this time, the pressing amount p of the pressing member 4 is small based on the thickness T of the IC package 10, and the thick IC package 10 can be mounted on the contact 5 as shown in FIG.

When the thin IC package 10 'is mounted on the thick IC package 10 described above, the handle 7 is attached to the pressing member 4 as shown in FIG. 2, FIG. 7 to FIG. 10 and FIG. As described above, the operating portion 32 of the handle 7 is set to the right in the recess 26 in the opposite direction to that of the first embodiment, and in the state of the handle 7, the IC package mounting portion of the socket body 2 is set. Thin type for 8
The C package 10 'is mounted.

Therefore, in this state, as shown in FIGS. 2, 7 to 10 and 13, the handle 7 is located in a state of being tilted to the right, and the longer leg of the handle 7 is located. The outer peripheral surface of 31 is in contact with the lower surface of the hole 23 of the pressing member 4.

In this state, the cover member 3 is then rotated around the pin 14 in the direction in which the cover member 3 is closed with respect to the socket body 2, and the cover member 3 is firmly closed. In this case, the handle 7 is brought into the state shown in the drawing with its outer circular surface abutting the lower surface of the hole portion 23 of the pressing member 4, and the pressing portion 22 of the pressing member 4 contacts the upper surface of the thin IC package 10 '. The IC package 10 ′ is pushed down against the terminal portion 5 a of the contact 5, and the contact 5 is pushed downward and the elastic force of the contact 5 causes the IC
The package 10 ′ is firmly held between the pressing portion 22 of the pressing member 4 and the contact 5. Therefore, the pressing amount P of the pressing member 4 is large based on the thickness t of the IC package 10 'in this case, and the thin IC package 10' can be firmly attached to the contact 5 as shown in FIG. become.

As described above, in the IC socket 1 of the present invention, the IC package is a thick type IC package 10.
In response to the thin IC package 10 ', the IC package 10 or 10' is set by operating the set position of the handle 7 by switching the handle 7 and operating it. It is configured to correspond to each other by changing the pressing amount of the pressing member 4 in accordance with the thickness of the IC card, and it is possible to easily and easily use two types of IC packages. There is no need to replace the holding plate, the movable holding member, etc. Moreover, such a switching operation can be achieved only by providing the recessed portion 33 in the handle 7 by a simple means. With a simple structure, it can be manufactured at low cost, and switching can be easily performed. The effect that can be operated is obtained.

[0029]

The IC socket according to claim 1 of the present invention has a socket body and a latch mechanism pivotally supported on one side of the socket body and engaged with the socket body on the other side. In addition, in an IC socket having a cover member having a pressing member in the central portion and a contact to which an IC package is mounted, the pressing member is provided so as to be movable with respect to the cover member, and the pressing member presses the pressing member. Since the amount is changed by operating the handle, it is possible to easily use the two types of IC packages by pressing the two types of IC packages having different IC package thicknesses by operating the handle mounted on the IC socket. You can

The IC socket according to claim 2 of the present invention is
A handle for changing the pressing amount of the pressing member is pivotally supported to attach the pressing member to the cover member, and an engaging portion of the handle engaged with the pressing member is eccentrically attached to the pressing member. The eccentric engagement of the handle can be easily provided, and the production can be easily performed.

The IC socket according to claim 3 of the present invention is
Since the handle is rotatably supported by the cover member and the engaging portion between the handle and the pressing member is an eccentric portion of the handle, the eccentric engaging portion can be easily manufactured.

The IC socket according to claim 4 of the present invention is
Since the eccentric amount of the eccentric portion of the handle corresponds to the pressing amount of the pressing member, it is easy to manufacture and the eccentricity and the pressing amount can be easily determined.

The IC socket according to claim 5 of the present invention is
Since the eccentric mounting of the handle is performed by the recessed portion formed on the shaft portion of the handle, processing and assembly can be performed easily and easily, and the handle can be manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a central longitudinal sectional view showing an IC socket of the present invention when a thick IC package is mounted.

FIG. 2 is a central longitudinal sectional view of an IC socket of the present invention similar to FIG. 1 when a thin IC package is mounted.

3 is a plan view of a cover member when the thick IC package of FIG. 1 is mounted.

FIG. 4 is a side view of the cover member of FIG.

5 is a central longitudinal cross-sectional view of the cover member taken along line VV of FIG.

6 is a central lateral cross-sectional view of the cover member taken along the line VI-VI of FIG.

7 is a plan view of a cover member when the thin IC package of FIG. 2 is mounted.

FIG. 8 is a side view of the cover member of FIG.

9 is a central longitudinal cross-sectional view of the cover member taken along the line IX-IX in FIG. 7.

10 is a central lateral cross-sectional view of the cover member taken along line XX of FIG.

FIG. 11 is a plan view of the handle of the IC socket of the present invention at the leftward position.

FIG. 12 is a plan view of the handle of the IC socket of the present invention shown in FIG. 11 in a central neutral position.

FIG. 13 is a plan view of the handle of the IC socket of the present invention in FIG. 11 at a rightward position.

[Explanation of symbols]

1 IC socket 2 socket body 3 Cover member 4 Pressing member 5 contacts 6 Latch mechanism 7 handle 8 IC package mounting part 10 IC package 11 bottom 12 Bracket part 13 Projection 14 pin 15 Latch lever 16 claws 17 Control lever 18 Bracket part 19 Bracket part 20 pin 21 opening 22 Pressing part 23 holes 24 Bearing part 25 Bearing part 26 hollow 31 legs 32 Operation part 33 recess 34 Rotating shaft 35 Rotating shaft

Claims (5)

[Claims] 1. A cover member having a socket main body, a latch mechanism pivotally supported on one side of the socket main body and engaged with the socket main body on the other side, and having a pressing member in a central portion. And a contact to which the IC package is mounted, wherein the pressing member is provided so as to be movable with respect to the cover member, and the pressing amount of the pressing member is changed by a handle operation. IC socket to do. 2. A handle for changing the pressing amount of the pressing member is pivotally supported so that the pressing member is attached to the cover member, and an engaging portion of the handle engaged with the pressing member is the pressing member. The IC socket according to claim 1, wherein the IC socket is mounted eccentrically. 3. The IC socket according to claim 2, wherein the handle is rotatably supported by the cover member, and an engaging portion between the handle and the pressing member is an eccentric portion of the handle. . 4. The IC socket according to claim 3, wherein the eccentric amount of the eccentric portion of the handle is formed so as to correspond to the pressing amount of the pressing member. 5. The IC socket according to claim 2, wherein the handle is eccentrically mounted by a recess formed in a shaft portion of the handle.