JP2004228042A - Socket for electric component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an electric component having a structure to make a ground pin elastically contact with a ground surface for grounding disposed on the bottom surface of an electric component in a state that the electrical component is securely connected to the socket. <P>SOLUTION: A ground pin 28, having a tip 31 elastically contacting with a ground surface 27 for grounding arranged on the bottom surface of an IC package 4, is arranged at the neighboring part of a central part of a socket body 2 having an IC package mounting part on its upper surface, on which, a plurality of contact pins connected to a lead 5 of the IC package 4 mounted on the mounting part are mounted. An operation bar 33, pushing down the ground pin 28 in conjunction with the declination of a socket cover 3 coupled to the upper surface side of the socket body 2 in a vertically movable manner, and operating so as to make the tip 31 of the ground pin 28 contact with the ground surface 27 of the IC package 4 after the socket cover 3 is connected to the lead 5 of the IC package 4 by the contact pins when the socket cover 3 moves upward, is provided. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrical component socket for detachably holding an electrical component such as an IC package and connecting it to another electrical circuit device. More specifically, the present invention relates to a socket provided on the bottom surface of the electrical component in a state where the electrical component is securely connected and fixed. The present invention relates to an electrical component socket for elastically bringing a ground pin into contact with a ground surface provided for grounding.
[0002]
[Prior art]
A conventional electrical component socket of this type, particularly an open-top type electrical component socket, has a mounting portion for an electrical component on an upper surface and connects to a lead of the electrical component mounted on the mounting portion. A socket body having contact pins attached thereto, and a lead of an electrical component mounted on a mounting portion of the socket body, which is vertically movably mounted on an upper surface side of the socket body. And a socket cover operable to pinch and fix the connection.
[0003]
A conventional IC package as an electric component connected and fixed with an open-top type electric component socket has a large number of leads aligned and protruding on both side portions of the package body, or a side edge of the entire circumference of the package body. A number of leads are aligned and protruded from the portion. In order to connect and fix such an IC package to the electrical component socket, a socket cover, which is vertically movably mounted on the upper surface side of the socket body, is pressed down and provided around the mounting portion of the socket body. Then, the contact pins are opened, and in this state, the leads of the IC package are placed on the placement section. Thereafter, when the depression of the socket cover is released, the socket cover is raised with respect to the socket body, the contact pins are closed, and the lead of the IC package placed on the placement portion is sandwiched with a predetermined pressing force. An IC package is connected and fixed to an electrical component socket (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP 2000-182738 A (pages 4 to 5, FIGS. 1 to 4)
[0005]
[Problems to be solved by the invention]
However, recent IC packages have been provided with a ground surface made of a metal piece on the bottom surface of the package in addition to ordinary contact pins for heat radiation and grounding. In addition, there is a demand for an electrical component socket having a ground pin for contacting a ground surface on the bottom surface of the package and grounding in accordance with such an IC package. However, in response to this demand, there has not yet been provided an electrical component socket for bringing a ground pin into contact with a grounding ground surface provided on the bottom surface of the electrical component in a state where the electrical component is securely connected and fixed.
[0006]
Here, for an IC package having a ground surface on the bottom surface of the package, the ground pin will protrude upward near the center of the socket body. Open the contact pins provided on the periphery, place the IC package leads on the mounting section, and close the contact pins when releasing the socket cover and lifting it up against the socket body. Unless the leads of the IC package mounted on the portion are sandwiched and fixed, the bottom surface of the IC package is pushed up by the ground pin, and the IC package cannot be connected and fixed to the electrical component socket.
[0007]
Therefore, the socket structure must be such that the tip of the ground pin comes into contact with the ground surface of the IC package after the contact pin sandwiches and fixes the lead of the IC package mounted on the mounting portion, for example. For SOP (Small Outline Package) electrical component socket with contact pins provided on two opposing sides, or for QFP (Quad Flat Package) electrical components with contact pins provided on all four sides In a socket, the structure for controlling the operation of the ground pin has been difficult to incorporate due to the presence of a large number of contact pins.
[0008]
In view of the above, the present invention has a structure in which a ground pin is elastically contacted with a grounding ground surface provided on a bottom surface of the electric component in a state where the electric component is securely connected and fixed. It is an object of the present invention to provide an electrical component socket having:
[0009]
[Means for Solving the Problems]
In order to achieve the above object, an electrical component socket according to the present invention has a mounting portion for an electrical component and has a plurality of contact pins connected to leads of the electrical component mounted on the mounting portion. A socket body, and a socket cover that is vertically movably assembled to the socket body, and that operates to connect the leads of the electrical components mounted on the mounting portion of the socket body by the vertical movement by the contact pins. A socket for an electrical component having a ground pin whose tip portion elastically contacts a grounding ground surface provided on the bottom surface of the electrical component on the socket body. In conjunction with this, the ground pin of the socket body is pushed down, and when this socket cover is raised, the contact pin of the socket body After connecting to the component leads, it is provided with a working bar which operates to contact the distal end of the ground pin to ground plane of the electrical component.
[0010]
With such a configuration, the operating bar that moves up and down according to the vertical movement of the socket cover pushes down the ground pin of the socket body in conjunction with the lowering of the socket cover, and when the socket cover rises, the contact pin of the socket body rises. After connecting to the lead of the electric component, the tip of the ground pin provided on the socket body is elastically brought into contact with the ground surface on the bottom surface of the electric component. Thus, the ground pin can be elastically brought into contact with the grounding ground surface provided on the bottom surface of the electrical component while the electrical component is securely connected by the contact pin of the socket body.
[0011]
The ground pin has a shape in which it is elastically deformed by contacting a part of the operation bar and its tip is lowered. Thus, the ground pin of the socket body can be pushed down in conjunction with the lowering of the socket cover.
Further, one or more ground pins are provided.
[0012]
The operating bar is formed of a member which is stretched between diagonally opposite corners of the socket main body and is movable up and down.
Further, the operation bar is formed of a member which is stretched between diagonally opposite corners of the socket body and slidable in the horizontal direction.
Furthermore, the operating bar is formed of a lever that extends from one corner to the vicinity of the center on a diagonal line of the socket body and is rotatable around an intermediate fulcrum.
As a result, even when a large number of contact pins are present in the socket body, an operation bar for controlling the operation of the ground pin can be incorporated without being affected by them.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a front view of an electric component socket according to an embodiment of the present invention in a half cross-sectional state, and FIG. 2 is a plan view showing the electric component socket. The electrical component socket 1 holds an electrical component such as an IC package in a detachable manner, and is connected to another electrical circuit device (test device) in a burn-in test, an electrical continuity test, or the like for removing an initial failure of the IC package or the like. As shown in FIG. 1, it has a socket body 2 and a socket cover 3.
[0014]
The IC package 4 as an electric component is provided with a plurality of leads 5, 5,... On a rectangular package body enclosing a device, and a plurality of leads 5, 5,. Some of them are aligned and protruded, and others are formed by aligning and protruding a plurality of leads 5, 5,. Here, a QFP type IC package having a large number of leads 5, 5,... Protruding from the entire periphery of the package body will be described as an example. The IC package 4 has a ground surface 27 made of a metal piece on the bottom surface of the package, in addition to the normal contact pins, for heat radiation and grounding.
[0015]
The socket body 2 is for mounting and positioning the IC package 4, and has a mounting portion for the IC package 4 on the upper surface and is mounted on the mounting portion by a conventionally known structure shown in FIG. A plurality of contact pins 6, 6,... Connected to the leads 5 of the IC package 4 are attached. The bases 7 of these contact pins 6 are inserted into pin mounting grooves 8 of the socket body 2. Each of the contact pins 6 is partitioned by a rib 9 formed on the socket body 2 so as not to contact another adjacent contact pin 6 and is insulated. In FIG. 1, reference numeral 10 denotes a connection arm projecting downward from the base 7 of the contact pin 6, and the connection arm 10 is connected to an electric circuit device (not shown). I have.
[0016]
A socket cover 3 is mounted on the upper surface side of the socket body 2 so as to be vertically movable. The socket cover 3 is operated so that the lead 5 of the IC package 4 mounted on the mounting portion of the socket main body 2 is sandwiched by the contact pins 6 and fixedly connected by the vertical movement.
[0017]
Specifically, in FIG. 1, cover guide grooves 11 are formed on both sides of the socket body 2, for example, at two locations in the vertical direction, and slide guides 12 slidably engaged with these cover guide grooves 11 are provided with the cover guides. The socket cover 3 is formed downward on the outer surface corresponding to the groove 11. By the engagement between the cover guide groove 11 and the slide guide 12, the socket cover 3 is guided by the cover guide groove 11 of the socket body 2 and moves up and down. The socket body 2 and the socket cover 3 are formed of an insulating resin material.
[0018]
Between the socket body 2 and the socket cover 3, a total of four cover springs 13 are arranged, one at each corner. That is, as shown in FIG. 1, a spring mounting hole 14 is formed in the socket body 2, a spring support shaft 15 projects downward from the socket cover 3, and the cover spring 13 is wound around the spring support shaft 15. It is inserted into the spring mounting hole 14. Here, the socket cover 3 is assembled to the socket body 2 so as to compress the cover spring 13 by a predetermined amount, and is constantly urged upward by the cover spring 13 to rise, and its upper position is fixed by stopper means 16. It is supposed to be.
[0019]
Next, the detailed structure and operation of the contact pin 6 actuated by the socket cover 3 that moves up and down on the upper surface side of the socket body 2 will be described with reference to FIG. The contact pin 6 is made of a material having excellent conductivity and elasticity, such as beryllium copper, and is formed on the base 7 shown in FIG. 1 via a first spring 17 shown in FIG. One contact portion 18 and a second contact portion 20 also formed on the base 7 via a second spring portion 19.
[0020]
Among these, the first spring portion 17 and the first contact portion 18 are elastically deformed from a position inclined toward the center of the socket body 2 to an upright position in FIG. To be engaged. Then, the rear end surface 22 of the first contact portion 18 is pressed against the side surface of the pin support portion 21 by the elastic force of the first spring portion 17. As a result, the first contact portion 18 is positioned so as not to shift in the left-right direction in FIG. Further, even if the first contact portion 18 pinches the lead 5 of the IC package 4 in cooperation with the second contact portion 20 in FIG. In addition, due to the rigidity of the first spring portion 17, the lead 5 of the IC package 4 is sandwiched with a desired contact pressure without being easily shifted in the vertical direction in FIG.
[0021]
At the upper end of the second spring portion 19, as shown in FIG. 3, an arm 23 extends upward in the figure. When the socket cover 3 is pressed down against the spring force of the cover spring 13, the arm 23 is pressed by an arcuate or linear pressing portion slope 24 formed inside the socket cover 3, and as shown in FIG. Displaced from the position of the solid line to the position of the two-dot chain line.
[0022]
At this time, the second spring portion 19 is elastically deformed in the counterclockwise direction in FIG. As a result, the second contact portion 20 retreats by opening the upper end surface 25 of the first contact portion 18, and the upper end surface 25 of the first contact portion 18 is released. In this state, the IC package 4 is inserted into the socket cover 3 from the package insertion window 26 (see FIG. 1) formed in the socket cover 3 as shown by an arrow A, and the leads 5 of the IC package 4 It is placed on the upper end surface 25 of the contact portion 18.
[0023]
Thereafter, when the pressing force acting on the socket cover 3 is released, the socket cover 3 is raised to the original position by the spring force of the cover spring 13. As a result, the second spring portion 19 is elastically restored in the clockwise direction from the position indicated by the two-dot chain line to the position indicated by the solid line in FIG. 3, and the second contact portion 20 is moved by the elastic force of the second spring portion 19. The lead 5 of the IC package 4 is pressed against the upper end face 25 of the first contact portion 18. Therefore, the leads 5 of the IC package 4 are sandwiched between the first contact portion 18 and the second contact portion 20 with a predetermined contact pressure, and are securely connected and fixed. Then, in this state, an electric circuit device (not shown) and the IC package 4 are electrically connected via the contact pins 6, and a required electric test is performed.
[0024]
Here, in the present invention, as shown in FIG. 4, near the central portion of the socket body 2, the distal end portion elastically contacts a grounding ground surface 27 provided on the bottom surface of the IC package 4. A ground pin 28 is provided. That is, an insertion hole is formed near the center of the socket body 2, and a mounting pin 30 protruding downward from the base 29 of the ground pin 28 is inserted into the insertion hole and attached. The ground pin 28 is grounded by the tip 31 of the ground pin 27 contacting the ground surface 27 on the bottom surface of the IC package 4, and is formed of metal and elastically deforms by contacting a part of an operation bar 33 described later. The tip portion 31 is shaped to descend. Specifically, an elastic portion 32 curved in a substantially C shape is formed in a portion extending upward from the base portion 29 on one side, and the upper portion of the ground pin 28 is elastically deformed by the elastic portion 32 so that the distal end portion 31 moves up and down. It is moving.
[0025]
An operation bar 33 is provided above the ground pin 28, as shown in FIG. The operation bar 33 pushes down the ground pin 28 of the socket main body 2 in conjunction with the lowering of the socket cover 3, and when the socket cover 3 moves up, the contact pins 6 of the socket main body 2 (see FIG. 3) make the IC package. After the leads 5 of the IC package 4 are connected and fixed, the tip 31 of the ground pin 28 operates to contact the ground surface 27 of the IC package 4.
[0026]
Specifically, as shown in FIGS. 5 and 6, the operation bar 33 is formed of a member that is stretched between diagonally opposite corners 2 a and 2 b of the socket body 2 and that can move up and down. Then, holes formed in both end portions 33a and 33b of the operation bar 33 are inserted into spring support shafts 15 provided at the corners of the socket cover 3 as shown in FIG. Is mounted, and the entire operation bar 33 is pressed and held against the step at the upper end of the spring support shaft 15 by the upward urging force of the cover spring 13. Further, a pin hole 34 is formed in an intermediate portion of the operation bar 33 so that the tip portion 31 of the ground pin 28 can penetrate upward from below.
[0027]
In this state, in FIG. 4, the socket cover 3 is at the highest position by the upward biasing force of the cover spring 13, and the operating bar 33 is similarly moved by the upward biasing force of the cover spring 13. It is held by the step at the upper end, and the elastic portion 32 in the middle of the ground pin 28 is in contact with the lower surface of the operation bar 33. Therefore, when the socket cover 3 is pushed down in the direction of arrow C, the operating bar 33 is also pushed down, and at the same time, the ground pin 28 which is in contact with the lower surface of the operating bar 33 is also pushed down, so that the tip end 31 descends. When the socket cover 3 is raised in the direction of the arrow D, the operating bar 33 is also raised, and the distal end 31 of the ground pin 28 protrudes upward from the pin hole 34 of the operating bar 33.
[0028]
In FIG. 5, the operating bar 33 is stretched between a pair of opposite corners 2a and 2b on a diagonal line of the socket body 2, but the present invention is not limited to this, and FIG. As shown, a cross-shaped operation bar 33 may be stretched between two pairs of opposing corners 2a, 2b; 2c, 2d on a diagonal line of the socket body 2. The number of ground pins 28 provided near the center of the socket main body 2 is not limited to one, and two (28a, 28b) or more ground pins may be provided as shown in FIG. Providing a plurality of ground pins 28 is suitable when the electric capacity of the IC package 4 is large.
[0029]
Next, the operation of the thus configured electrical component socket 1 will be described. First, in FIG. 1, before the IC package 4 is inserted, the socket cover 3 is held at a raised position. In this state, the socket cover 3 is pushed down in the direction of arrow C in FIG. Then, the socket cover 3 descends against the upward urging force of the cover spring 13 shown in FIG. 1 or FIG. 4, and the arm 23 of the contact pin 6 is pushed down by the pressing portion slope 24 shown in FIG. As a result, the second spring portion 19 of the contact pin 6 is elastically deformed, and the second contact portion 20 retreats by opening the upper end surface 25 of the first contact portion 18, and the first contact portion 18 is retracted. Is released.
[0030]
At the same time, in FIG. 4, in conjunction with the lowering of the socket cover 3 in the direction of arrow C, the operating bar 33 is lowered and the ground pin 28 in contact with the lower surface thereof is also pushed down, and the elastic portion 32 of the intermediate portion is elastically deformed. As a result, the tip 31 descends from the pin hole 34. As a result, the mounting portion of the IC package 4 is in a package receiving state inside the electrical component socket 1.
[0031]
In this state, in FIG. 1, the IC package 4 is inserted into the socket cover 3 from the package insertion window 26 formed in the socket cover 3 as shown by an arrow A, and as shown in FIG. The lead 5 is placed on the upper end surface 25 of the first contact portion 18 of the contact pin 6. After confirming that all the leads 5 of the IC package 4 have been placed on the upper end surface 25 of the first contact portion 18 in this way, the pressing force applied to the socket cover 3 is released.
[0032]
Then, in FIG. 4, the socket cover 3 is raised by the spring force of the cover spring 13 as shown by the arrow D. At this time, in FIG. 3, since the pressing portion slope 24 of the socket cover 3 does not push down the contact pin 6 against the arm 23, the second spring portion 19 of the contact pin 6 is elastically moved from the position indicated by the two-dot chain line to the position indicated by the solid line. The second contact portion 20 presses the lead 5 of the IC package 4 against the upper end surface 25 of the first contact portion 18 by the elastic force of the second spring portion 19. Accordingly, the leads 5 of the IC package 4 are sandwiched between the first contact portion 18 and the second contact portion 20 at a predetermined contact pressure, and are securely connected and fixed.
[0033]
As the socket cover 3 moves up in the direction of arrow D, the operation bar 33 also rises, and the ground pin 28 is elastically deformed upward. However, the second contact of the contact pin 6 is accelerated by the thickness of the lead 5 of the IC package 4. The part 20 presses the lead 5 against the upper end face 25 of the first contact part 18. Therefore, after connecting and fixing the leads 5 of the IC package 4 with the contact pins 6, the ground pins 28 are elastically deformed upward, and the tips 31 project upward from the pin holes 34 of the operation bar 33. Then, as shown in FIG. 4, the tip 31 of the ground pin 28 elastically contacts the ground surface 27 on the bottom surface of the IC package 4 to ground. Thus, it is possible to connect and fix the IC package 4 to the electrical component socket 1 without pushing up the bottom surface of the IC package 4 with the ground pin 28.
[0034]
Then, in this state, an electric circuit device (not shown) and the IC package 4 are electrically connected via the contact pins 6, and a required electric test is performed.
[0035]
FIG. 8 is a cross-sectional view of a principal part similar to FIG. 4 showing a second embodiment of the socket for electric components according to the present invention. In this embodiment, the shape of the ground pin 28 is slightly changed so that the trigger portion 35 projects from a part of the substantially C-shaped elastic portion 32 extending upward from the base portion 29 on one side. The operating bar 33 is formed of a lever (lever) that extends from one corner to the vicinity of the center on the diagonal line of the socket body 2 and is rotatable around an intermediate fulcrum 36. Are engaged with the trigger portion 35. An operating rod 37 hangs down from the socket cover 3, and the distal end of the operating rod 37 is in contact with the base end of the operating bar 33.
[0036]
With such a structure, when the socket cover 3 is raised by the spring force of the cover spring 13 as shown by the arrow D, the operating bar 33 engaged with the trigger portion 35 of the elastic portion 32 of the ground pin 28 Due to the elastic force of the above, it is urged clockwise around the intermediate fulcrum 36 to be in a substantially horizontal state, and the base end thereof is held in contact with the distal end of the operating rod 37 of the socket cover 3.
[0037]
Then, when the socket cover 3 is pushed down in the direction of arrow C in such a state, the operating bar 33 is pushed by the operating rod 37 to rotate in the direction of arrow E around the intermediate fulcrum 36, and the distal end of the operating bar 33 is moved. The elastic portion 32 is elastically deformed by the engagement of the ground pin 28 with the trigger portion 35, and the distal end portion 31 rotates in the direction of arrow F and descends. Thus, in FIG. 1, when the IC package 4 is inserted into the socket cover 3 as shown by the arrow A, the bottom of the IC package 4 is not pushed up by the tip 31 of the ground pin 28, and the electrical component socket 1 is not pushed up. Can be connected and fixed. In this case, by changing the length of the lever on both sides about the intermediate fulcrum 36 of the operation bar 33, the timing of the vertical movement of the tip 31 of the ground pin 28 can be adjusted.
[0038]
FIG. 9 is a component exploded perspective view showing a third embodiment of the electrical component socket according to the present invention. In this embodiment, the shape of the ground pin 28 is slightly changed from that of the embodiment shown in FIG. The operating bar 33 is formed of a member that is stretched between diagonally opposite corners 2a and 2b of the socket body 2 and that can slide in the horizontal direction. In FIG. 9, reference numeral 40 denotes a sheeting member serving as a mounting portion of the IC package 4.
[0039]
Specifically, the distal end of the operation rod 37 hanging down from the socket cover 3 comes into contact with the base end of the operation bar 33. A first tapered surface 38 inclined rightward in FIG. 9 is formed at the end of the operation bar 33 on the side of the operation rod 37, and the other end of the operation bar 33 is connected to the trigger portion 35 of the ground pin 28. At the corresponding end, a second tapered surface 39 inclined leftward in FIG. 9 is formed. In this state, the tip of the operating rod 37 of the socket cover 3 is engaged with the first tapered surface 38 of the operating bar 33 which is stretched horizontally, and the ground pin is engaged with the second tapered surface 39. 28 trigger portions 35 are engaged. The operating bar 33 is always biased toward the first taper surface 38 by an elastic member such as a spring (not shown).
[0040]
With such a structure, the operation bar 33 slides toward the first tapered surface 38 in a state where the socket cover 3 is raised by the spring force of the cover spring 13 shown in FIG. The tip of the operating rod 37 of the socket cover 3 is engaged with the first tapered surface 38 of the operating bar 33, and the trigger portion 35 of the ground pin 28 is engaged with the second tapered surface 39. , The tip 31 is raised.
[0041]
Then, when the socket cover 3 is pushed down in the direction of arrow C in such a state, the operation bar 33 is pushed by the operation rod 37 and slides in the direction of arrow G, and the second taper surface 39 is slid by the movement of the operation bar 33. The trigger portion 35 of the ground pin 28 that engages with the ascending portion rises in the direction of arrow H, and the distal end portion 31 rotates downward due to elastic deformation of the elastic portion 32 in the direction of arrow J. Thus, in FIG. 1, when the IC package 4 is inserted into the socket cover 3 as shown by the arrow A, the bottom of the IC package 4 is not pushed up by the tip 31 of the ground pin 28, and the electrical component socket 1 is not pushed up. Can be connected and fixed.
[0042]
The shapes of the ground pin 28 and the operation bar 33, and the structure of assembling them are not limited to those shown in FIGS. 4 to 9. When the lead 3 rises, the lead 5 of the IC package 4 is connected and fixed by the contact pin 6 of the socket body 2, and then the tip 31 of the ground pin 28 is brought into contact with the ground surface 27 of the IC package 4. Any shape and structure may be used. Further, the IC package 4 is not limited to the one in which the leads 5 protrude from the side, and may be one having connection terminals and a ground surface 27 on the lower surface of the package body. it can.
[0043]
【The invention's effect】
Since the present invention is configured as described above, according to the invention according to Claims 1 to 3, the operation bar that moves up and down according to the up and down movement of the socket cover allows the ground pin of the socket main body to interlock with the lowering of the socket cover. When the socket cover is lifted down and connected to the lead of the electrical component with the contact pin of the socket body, the tip of the ground pin provided on the socket body is elastically attached to the ground surface on the bottom of the electrical component. Can be contacted. This allows the ground pin to elastically contact the grounding ground surface provided on the bottom surface of the electrical component while the electrical component is securely connected by the contact pin of the socket body. Therefore, when inserting an electric component, the electric component can be reliably connected to the electric component socket without pushing up the bottom surface of the electric component with the ground pin.
[0044]
Further, according to the invention according to claims 4 to 6, the operating bar operable to elastically contact the tip end portion of the ground pin with the ground surface of the electric component is provided on the diagonal line of the socket main body. Since there is a large number of contact pins in the socket body, such as a socket for an electrical component for an SOP type IC package or a QFP type IC package, the contact pins are not affected by them. An actuation bar for controlling the actuation of the ground pin can be incorporated.
[Brief description of the drawings]
FIG. 1 is a front view of an embodiment of an electrical component socket according to the present invention in a half cross-sectional state.
FIG. 2 is a plan view showing the electrical component socket.
FIG. 3 is an enlarged sectional view of a main part for explaining a detailed structure and operation of a contact pin mounted in a socket body.
FIG. 4 is a sectional view taken along the line BB of FIG. 2 showing a mounting structure of a ground pin and an operation bar provided near the center of the socket body.
FIG. 5 is a plan view showing a state where the operation bar is attached to the socket body.
FIG. 6 is a partial cross-sectional perspective view illustrating an attachment state of an operation bar to a socket body.
FIG. 7 is a plan view showing another example of a state in which the operation bar is attached to the socket body.
FIG. 8 is a sectional view of a principal part, similar to FIG. 4, showing a second embodiment of an electrical component socket according to the present invention.
FIG. 9 is an exploded perspective view showing a third embodiment of the electrical component socket according to the present invention.
[Explanation of symbols]
1: Socket for electrical parts
2. Socket body
3 ... Socket cover
4: IC package (electric parts)
5. Lead of IC package
6 ... Contact pin
13 ... Cover spring
15 ... Spring support shaft
18 First contact portion of contact pin
20: second contact portion of contact pin
23 ... Contact pin arm
24 Slope of pressing part of socket cover
26… Package insertion window of socket cover
27… ground plane of IC package
28… Ground pin
31 ... Ground pin tip
32 ... Ground pin elastic part
33 ... Operation bar
35: Ground pin trigger
37 ... Operation stick for socket cover
38: first tapered surface of the operating bar
39: second tapered surface of the operating bar

Claims (6)

A socket body having a mounting portion for the electrical component and having a plurality of contact pins connected to leads of the electrical component mounted on the mounting portion,
A socket cover that is vertically movably assembled to the socket body, and that operates to connect the leads of the electrical components mounted on the mounting portion of the socket body by the vertical movement by the contact pins;
An electrical component socket having:
In the socket body, a ground pin is provided in which a tip portion elastically contacts a grounding ground surface provided on the bottom surface of the electric component,
In conjunction with the lowering of the socket cover, the ground pin of the socket body is pressed down, and when the socket cover is raised, after connecting to the lead of the electrical component with the contact pin of the socket body, the tip of the ground pin is electrically connected. Provided with an operating bar that operates to contact the ground surface of the component,
A socket for an electrical component, characterized in that: 2. The electrical component socket according to claim 1, wherein the ground pin has a shape in which it is elastically deformed by contacting a part of the operation bar and its tip is lowered. 3. The electrical component socket according to claim 1, wherein one or more ground pins are provided. 2. The electrical component socket according to claim 1, wherein the operation bar is formed of a member that is stretched between diagonally opposite corners of the socket body and that can move up and down. 2. The electrical component socket according to claim 1, wherein the operation bar is formed of a member that is stretched between diagonally opposite corners of the socket body and slidable in a horizontal direction. 2. The electrical component socket according to claim 1, wherein the operating bar comprises a lever extending from one corner to a portion near the center on a diagonal line of the socket body and rotatable about an intermediate fulcrum. .

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