JP2003223966A - Socket for electric parts and moving plate used for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for electric parts in which deformation of a moving plate can be suppressed, and provide the moving plate after an insertion hole or the like within the range of the arrangement of a contact pin can be secured with high precision. <P>SOLUTION: In the socket main body in which the electric parts are housed, a plurality of contact pins capable being connected/disconnected with the terminal of the electric parts are arranged, and a slide plate 17 as a 'moving plate' against the socket main body is movably installed. In the socket for electric parts of which, an elastic piece of the contact pin is elastically deformed by moving this slide plate 17, and a contact part of the elastic piece is connected/ disconnected with the terminal of the electric parts, the slide plate 17 has a lattice-shaped insulation wall part 40b by arranging a plurality of insertion holes into lattice shapes through which, a plurality of contact pins are inserted, and the rigidity of the surrounding part of this lattice-shaped insulation wall part 40b is improved by the lattice-shaped insulation wall part 40b. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component socket for removably holding an electric component such as a semiconductor device (hereinafter referred to as "IC package"), and more particularly, a contact pin which is elastically attached to and detached from the electric component. The present invention relates to improvement of a moving plate that is deformed.

[0002]

2. Description of the Related Art Conventionally, as this type of "electrical component socket", there is an IC socket that detachably holds an "electrical component" IC package.

This IC socket has an I on the socket body.
A C package is accommodated, contact pins are arranged on the socket body, and a slide plate as a "moving plate" that slides horizontally is arranged on the socket body.

This slide plate is provided with a lattice-shaped partition wall portion, which is composed of a pressing wall portion which presses the contact pin and a holding wall portion which is orthogonal to the pressing wall portion, in the central portion, and the partition wall portion is surrounded by the partition wall portion. Has a frame-shaped support frame portion that supports the pressing wall portion and the holding wall portion. The lattice-shaped partition wall portion and the support frame portion are integrally formed of a synthetic resin material.
In addition, an insertion hole is formed in the center of the slide plate so that the contact pin is inserted so as to be partitioned by the grid-shaped partition wall. When the slide plate is moved in the horizontal direction (lateral direction), the pressing wall portion is formed. Presses the contact pin, and the contact pin is elastically deformed.

Further, an operating member is provided so as to be vertically movable with respect to the socket body.

By lowering the operating member, the slide plate is slid horizontally through the link mechanism to elastically deform the contact pin, and the contact portion formed at the upper end of the contact pin is moved to the IC. Evacuate from the package terminal insertion range. After that, by placing the IC package on the socket body and raising the operation member, the slide plate returns to the original position,
The pressing force on the contact pin is released. As a result, the contact pin tries to return to the initial position by the elastic force, so that the contact portion of the contact pin comes into contact with the terminal of the IC package and is electrically connected.

[0007]

However, when the above-described conventional socket is used for an IC package having a large number of terminals (multi-pin), the number of contact pins must be increased in accordance with the number of terminals. Therefore, when the slide plate is moved to elastically deform the contact pin,
The reaction force acts on the support frame portion of the slide plate, particularly the support frame portion in the direction orthogonal to the moving direction of the slide plate,
This support frame portion may be deformed (bend in an arc shape in the moving direction).

Due to the deformation of the supporting frame portion, the pressing wall portion parallel to the supporting frame portion is also deformed, and even if the slide plate is moved by a predetermined amount, the pressing wall portion does not move by a predetermined amount. There is a problem that the IC package cannot be mounted in the socket because the contact pin cannot be opened by a predetermined amount.

Here, in order to suppress the deformation of the support frame portion, the width of the support frame portion may be increased or the height thereof may be increased to increase the rigidity of the support frame portion. The outer shape of the plate becomes large and the socket becomes large.

Therefore, according to the present invention, the rigidity of the support frame portion can be improved without increasing the outer shape of the slide plate, and even when a large number of contact pins are elastically deformed, they are deformed by the reaction force thereof. It is an object of the present invention to provide a movable plate that does not operate and a socket for electric parts using the movable plate.

[0011]

In order to achieve the above object, the invention as set forth in claim 1 has a socket body in which an electric component is housed, and a contact pin which can be connected to and detached from a terminal of the electric component is arranged. A movable plate is movably provided with respect to the socket body, and by moving the movable plate, the contact pin is pressed to elastically deform the contact pin, and the terminal of the electric component is In the socket for electric parts, in which the contact portions of the contact pins are separated from each other, the moving plate is formed in a lattice shape, and a partition wall portion having a pressing portion that presses the contact pins,
A supporting frame portion for supporting the partition wall portion, and the supporting frame portion is a socket for electrical parts using a material having an elastic coefficient larger than that of the material of the lattice-shaped partition wall portion. And

According to a second aspect of the present invention, in addition to the structure of the first aspect, the lattice-shaped partition wall portion of the moving plate is made of synthetic resin, and the support frame portion includes the lattice-shaped partition wall portion. It is characterized in that a material having an elastic coefficient larger than that of the synthetic resin forming the is used.

The invention described in claim 3 is the invention according to claim 1 or 2.
In addition to the described structure, the support frame portion of the moving plate has a metal frame portion having an elastic coefficient larger than that of the material of the lattice-shaped partition wall portion.

The invention according to claim 4 is the invention according to claim 1 or 2.
In addition to the described structure, the support frame portion of the moving plate is formed of a synthetic resin material having an elastic coefficient larger than that of the material of the lattice-shaped partition wall portion.

The invention according to a fifth aspect is the first to the fourth aspects.
In addition to the configuration described in any one of 1 above, by vertically moving the operation member is disposed in the socket body, by moving the operation member up and down, by moving the moving plate via a moving mechanism. The elastic piece of the contact pin is elastically deformed.

According to a sixth aspect of the present invention, the socket body for accommodating the electric parts is movably provided, and by being moved, the contact pin disposed on the socket body is elastically deformed, and The contact part of the contact pin
In a moving plate to be brought into contact with or separated from a terminal of an electric component housed in the socket body, the moving plate is formed in a lattice shape,
It has a partition wall portion having a pressing portion that presses the contact pin, and a support frame portion that supports this partition wall portion, and this support frame portion has an elastic coefficient that is larger than the elastic coefficient of the material of the lattice-shaped partition wall portion. The moving plate is made of the above material.

According to a seventh aspect of the present invention, the socket body in which the electric component is housed is provided with a contact pin that can be connected to and detached from the terminal of the electric component, and the movable plate is movable with respect to the socket body. An electric component, which is provided in the electric component, moves the moving plate to press the contact pin to elastically deform the contact pin so that the contact portion of the contact pin contacts and separates from the terminal of the electric component. In the socket, the moving plate includes a pressing portion that presses the contact pin, a holding portion that holds the pressing portion, and a support frame portion that supports the holding portion. A material having an elastic coefficient larger than that of the material of the pressing portion and the holding portion is used.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 12 show a first embodiment of the present invention.

First, the structure will be described.
The IC socket 11 is an “electrical component socket”, and the IC socket 11 is used to perform a performance test of the IC package 12 which is an “electrical component”.
The solder balls 12b as "terminals" 2 and the printed wiring board (not shown) of the measuring device (tester) are electrically connected.

The IC package 12 is of a so-called BGA (Ball Grid Array) type as shown in FIG. 4, for example, and has a square package body 1 for example.
A large number of substantially spherical solder balls 12b project on the lower surface of 2a and are arranged in a matrix.

On the other hand, the IC socket 11 is roughly
As shown in FIGS. 1 to 3, there is a socket body 13 to be mounted on a printed wiring board, and the socket body 13 has contact pins 1 which are brought into contact with and separated from each solder ball 12b.
5, a preload plate 16 through which the contact pin 15 is inserted, a slide plate 17 as a “moving plate”, and a top plate 18 are sequentially stacked on the upper side of the socket body 13. It is set up. Further, an operation member 19 for sliding the slide plate 17 in the lateral direction is arranged above the top plate 18.

The contact pin 15 is made of a plate material having a spring property and excellent in conductivity and formed into a shape as shown in FIGS. 5 and 6 by pressing.

Specifically, the contact pin 15 has a fixed side elastic piece 15h and a movable side elastic piece 15i (a pair of elastic pieces) formed on the upper side, and one solder tail portion 15b formed on the lower side. There is. Each elastic piece 15h, 1
5i are formed to face each other by bending the base portion 15c on the lower end side into a substantially U shape. In addition, a contact portion 15d that comes into contact with and separates from the side surface portion of the solder ball 12b of the IC package 12 is formed at the upper end portions (tip portions) of the elastic pieces 15h and 15i.
The solder balls 12b are sandwiched between.

The elastic piece 15h of the contact pin 15
Each of the intermediate portions 15i is bent in a direction in which the two intermediate portions are separated from each other to form bent portions 15e, and the apexes of the bent portions 15e are pressed by the preload plate 16. Then, when no external force is applied, as shown in FIG. 6A, the width H1 between the vertices of the bent portions 15e is equal to the width H of the contact portions 15d.
It is formed wider than 2.

The solder tail portion 15b and the base portion 15c of the contact pin 15 are attached to the socket body 13
It is press-fitted into the press-fitting hole 13a formed in. And
The solder tail portion 15b protruding downward from the socket body 13 is provided with the locate board 21 as shown in FIGS.
It is further projected downward through the through-hole and inserted into each through hole of a printed wiring board (not shown) and soldered to be connected.

Further, the preload plate 16 is detachably arranged on the socket body 13, and the preload plate 16 is formed with a preload hole 16a into which the elastic pieces 15h and 15i of the contact pin 15 are inserted. With the elastic pieces 15h and 15i inserted in the preload hole 16a, the elastic piece 1
The width of the preload hole 16a is set so as to press 5h and 15i in a direction in which both contact portions 15d are narrowed and elastically deform.

Here, as described above, the contact pin 1
The bent portion 15e is formed on the pair of elastic pieces 15h and 15i of No. 5, and the apex of the bent portion 15e is the preload hole 16a.
It is adapted to be pressed by the inner wall of (see FIG. 6 (b)).

On the other hand, the slide plate 17 slides in the left-right direction (horizontal direction) in FIG. 2 through the X-shaped link 22 as the “slide mechanism” shown in FIGS. 2 and 9 by moving the operating member 19 up and down. By sliding the slide plate 17, the movable elastic piece 15i of the contact pin 15 arranged in the socket body 13 is elastically deformed and displaced.

Specifically, this slide plate 17 is
It is composed of a slide plate main body 40 made of synthetic resin and a frame-shaped portion 41 made of metal.

The slide plate body 40 is made of a synthetic resin material having high fluidity by injection molding.
As shown in FIG. 13, a pressing wall portion 4 to be described later is provided in the central portion.
0d and the retaining wall portion 40h form a partition wall portion 40b and a peripheral edge portion 40c that is formed around the partition wall portion 40b and supports the partition wall portion 40b in the grid shape integrally. There is. Further, the elastic piece 15 of the contact pin 15 is divided so as to be partitioned by the partition wall 40b in a grid shape.
An insertion hole 40a through which h and 15i are inserted is formed.

As shown in FIG. 12, the lattice-shaped partition wall portion 40b includes a pressing wall portion 40d that presses the movable elastic piece 15i of the contact pin 15 and a holding wall portion 40h that is orthogonal to the pressing wall portion 40d. It is configured. This holding wall 4
0h has a function of connecting and holding the adjacent pressing wall portions 40d and a function of connecting the pressing wall portion 40d and the peripheral edge portion 40c.

At the peripheral portion 40c, as shown in FIG.
Through holes 40g into which fixed pins 42 described later are press-fitted are formed at a predetermined pitch. Further, the upper surface of the peripheral edge portion 40c is formed to be one step lower than the upper surface of the lattice-shaped partition wall portion 40b.

The frame-shaped portion 41 is the slide plate body 40.
It is made of a metal material that is more difficult to bend (greater than the elastic coefficient of the partition wall portion 40b) in a frame shape, and is fitted to the raised partition wall portion 40b of the slide plate body 40 as shown in FIGS. 11 to 13. The opening 41a is formed, and the slide plate body 40 is formed along the opening 41a.
The through holes 41b are formed at the same pitch as the through holes 40g provided in.

As for the slide plate body 40 and the frame-shaped portion 41, the opening 41a of the frame-shaped portion 41 has the slide plate body 4
It is fitted along the outer edge of the lattice-shaped partition wall portion 40b of 0, and is fixed by press-fitting the fixing pin 42 into the through hole 41b of the frame-shaped portion 41 and the through hole 40g of the slide plate body 40.

The peripheral portion 4 of the slide plate body 40
0c and the frame-shaped portion 41 constitute a support frame portion 43 that supports the partition wall portion 40b of the slide plate body 40.

As described above, in the slide plate 17, the support frame portion 43 is made of a material (metal frame-shaped portion 41) having an elastic coefficient larger than that of the material of the lattice-shaped partition wall portion 40b.

The X-shaped link 22 is shown in FIGS.
As shown in FIG. 5, the rectangular slide plate 17 is arranged corresponding to both side surface portions along the sliding direction and constitutes a toggle joint.

Specifically, as shown in FIGS. 2 and 9, the X-shaped link 22 has a first link member 2 of the same length.
3 and a second link member 25, which are rotatably connected by a central connecting pin 27.

The lower end 23a of the first link member 23 is rotatably connected to the socket body 13 by the lower end connecting pin 29, while the lower end 25a of the second link member 25 is connected to the slide plate 17. The lower end connecting pin 30 is inserted into a connecting hole 40e formed in the side surface portion along the sliding direction and is rotatably connected. The lower end connecting pin 29 is loosely inserted in the long hole 40f of the slide plate body 40 shown in FIG. 10 so that the slide plate 17 can be slid. Further, the upper end portions 23b and 25b of the first and second link members 23 and 25 are rotatably connected to the operation member 19 by upper end connection pins 33 and 34. An elongated hole 23c is provided in the upper end portion 23b of the first link member 23, and the first link member 23 is operated by the upper end connecting pin 33 through the elongated hole 23c.
It is connected to 7.

The top plate 18 has a mounting surface portion 18a on which the IC package 12 is mounted, and a guide portion 18b for positioning the IC package 12 at a predetermined position, as shown in FIG. 12
It is provided corresponding to each corner of a. Further, as shown in FIGS. 7 and 8, the top plate 18 is provided with a positioning portion 18c to be inserted between the pair of contact portions 15d of each contact pin 15, and the contact pin 15 is formed.
In a state where the solder balls 12b of the IC package 12 are not inserted between both contact portions 15d (the both contact portions 15d are closed), the positioning portion 18c has the both elastic pieces 15d.
It is sandwiched by h and 15i. (Figure 7,
(See FIG. 8).

Further, as shown in FIGS. 1 and 2, the operating member 19 has an opening 19a having a size into which the IC package 12 can be inserted, and the IC package 12 is inserted through this opening 19a. The top plate 18 is mounted at a predetermined position on the mounting surface portion 18a.
Further, the operating member 19 is arranged so as to be movable up and down with respect to the socket body 13 (see FIG. 3), is biased upward by the spring 36, and has an operating convex portion 19 b for rotating the latch 38. (See FIG. 2).

This latch 38, as shown in FIG.
It is attached to the socket body 13 so as to be rotatable about a shaft 38a, is urged clockwise by a spring 39 in FIG. 2, and is configured to press the peripheral portion of the IC package 12 by a holding portion 38b provided at the tip. Has been done.

The latch 38 has an operating member 19
2 is formed, and when the operating member 19 is lowered, the operating convex portion 19b presses the pressed portion 38c, and the latch 38 moves counterclockwise in FIG. The pressing portion 38b is rotated around and retracted from the IC package 12 mounting position.

Next, the operation of the IC socket 11 thus constructed will be described.

To set the IC package 12 in the IC socket 11, the operation member 19 is pushed downward. Then, the slide plate 17 is inserted through the X-shaped link 22.
Is slid to the right as shown by the chain double-dashed line in FIG.
As shown in FIGS. 7B and 8B, the movable side elastic piece 15i of the contact pin 15 is pressed and elastically deformed by the pressing wall portion 40d of each insertion hole 40a of the slide plate 17. The other fixed elastic piece 15h is held at a predetermined position by the positioning portion 18c of the top plate 18.

Now, the contact pin 15 is moved to the position shown in FIG.
From the state shown in (a) and FIG. 8 (a), to FIG.
The state is changed to the state shown in (b), and the pair of contact portions 15d of the contact pin 15 are opened.

At the same time, the actuating projection 19b of the operating member 19 pushes the pressed portion 38c of the latch 38, which rotates counterclockwise in FIG. 2 against the biasing force of the spring 39. The holding portion 38b is displaced to the retracted position.

In this state, the IC package 12 is placed on the placing surface portion 18a of the top plate 18 at a predetermined position guided by the guide portion 18b, and the IC package 12 is placed.
The solder balls 12b are inserted in a non-contact state between the pair of open contact portions 15d of the contact pins 15.

Thereafter, when the downward pressing force of the operating member 19 is released, the operating member 19 is lifted by the urging force of the spring 36, so that the slide plate 17 is moved through the X-shaped link 22 in FIG. While being slid to the left, the latch 38 is rotated clockwise in FIG. 2 by the urging force of the spring 39.

When the slide plate 17 is slid to the left in FIG. 7, the movable elastic piece 1 of the contact pin 15 is moved.
The pressing force on 5i is released, and the movable side elastic piece 15
i returns to the original position, and this movable side elastic piece 15i
The solder ball 12b is sandwiched by the contact portion 15d of the fixed side elastic piece 15h and the contact portion 15d of the fixed side elastic piece 15h ((c) of FIG. 7).
reference).

As a result, the solder balls 12b of the IC package 12 and the printed wiring board contact the contact pins 15.
It will be electrically connected via.

On the other hand, in order to take out the IC package 12 from the mounted state, the operating member 19 is likewise lowered to separate the pair of contact portions 15d from the solder ball 12b of the IC package 12, whereby the solder ball 1
The IC package 12 can be easily removed with a weaker force than when the 2b is pulled out from the state of being sandwiched by the pair of contact portions 15d.

In such a structure, when the number of the contact pins 15 increases due to the increase in the number of pins of the IC package 12, when the contact pins 15 are pressed by the slide plate 17 and elastically deformed, the slide plate 15 is used. A large reaction force acts on 17.

However, since the slide plate 17 has the frame-shaped portion 41 having a larger elastic coefficient than the lattice-shaped partition wall portion 40b around the lattice-shaped partition wall portion 40b.
Since the rigidity of the support frame portion 43 is improved, the support frame portion 43 is less likely to be deformed, and the lattice-shaped partition wall portion 40b is formed.
It is possible to reduce the deformation amount of. Therefore, the displacement amount of the contact pin movable side elastic piece 15i pressed by the pressing portion 40d of the lattice-shaped partition wall portion 40b, that is, the opening amount of both contact portions 15d can be secured.

Moreover, since the lattice-shaped partition wall portion 40b is formed of a material having a relatively high fluidity, a large number of insertion holes 40a with a narrow pitch can be accurately formed.

In this embodiment, the slide plate body 40 and the frame-shaped portion 41 are fixed by using the fixing pin 42, but the present invention is not limited to this and may be fixed by adhesion or the like.

[Second Embodiment of the Invention] FIG. 13 shows a second embodiment of the present invention.

In the first embodiment, the metal frame-shaped portion 4 is used.
1 is fixed to the upper surface of the slide plate body 40, but in the second embodiment of the present invention, the metal frame-shaped portion 41 is arranged around the lattice-shaped portion 40b of the slide plate body 40 by insert molding. ing.

In this way, the frame-shaped portion 41 is formed by insert molding.
Since the frame-shaped portion 41 can be embedded in the slide plate body 40 by disposing, the rigidity of the slide plate 17 can be further improved.

Other configurations and operations are similar to those of the first embodiment.

[Third Embodiment of the Invention] This third embodiment
Can also be configured by forming the lattice-shaped partition wall portion 40b with a synthetic resin material having a high fluidity and surrounding the periphery with a synthetic resin material having an elastic coefficient larger than that of the lattice-shaped partition wall portion 40b.

Even in this case, the same effect as that of the first embodiment can be obtained.

Although the present invention is applied to the IC socket 11 as the "socket for electric parts" in the above-described first embodiment and the like, the present invention is not limited to this and can be applied to other devices. Further, although the present invention is applied to the IC socket for the BGA type IC package, the present invention is not limited to this, and the present invention can be applied to the IC socket for the PGA (Pin Grid Array) type IC package. Further, although the moving plate (slide plate 17) is moved in the lateral direction in the above-described embodiment, the invention is also applied to a case in which the elastic piece of the contact pin is elastically deformed by moving it in the vertical direction. Applicable. Furthermore, in each of the above embodiments, the top plate 18 having the mounting surface portion 18a is provided on the socket body 13, but the invention is not limited to this, and the top plate 18 may be formed integrally with the socket body 13. You can also Moreover, although the frame-shaped portion has a flat plate shape in each of the above-described embodiments, the frame-shaped portion is not limited to this and may be fixed, for example, by covering the slide plate body with a U-shaped cross section.

[0065]

As described above, according to the invention described in each of the claims, the moving plate has the elasticity larger than the elastic coefficient of the material of the partition wall in the support frame portion around the partition wall in the lattice shape. Since the material of the coefficient is used, the rigidity of the support frame portion can be improved, so that the deformation amount of the lattice-shaped partition wall portion can be reduced even when the number of contact pins is large.
It is possible to secure the displacement amount of the contact pin pressed by the pressing portion that elastically deforms the contact pin, that is, the opening amount of the contact portion of the contact pin. Moreover,
Since the lattice-shaped part can be formed of a material with relatively high fluidity,
Narrow pitch insertion holes can be formed with high precision.

According to the second aspect of the present invention, the strength of the moving plate can be easily improved only by providing the frame-shaped portion having a higher strength than the synthetic resin around the lattice-shaped portion.

According to the third aspect of the invention, since the frame-shaped portion is made of a metal plate material, a thin and high-strength one can be used, so that the strength can be improved without increasing the size of the moving plate. be able to.

[Brief description of drawings]

FIG. 1 is a plan view of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1 according to the first embodiment.

FIG. 3 is a sectional view taken along line BB of FIG. 1 according to the first embodiment.

4A and 4B are diagrams showing an IC package according to the first embodiment, wherein FIG. 4A is a front view and FIG. 4B is a bottom view.

FIG. 5 is a perspective view of the contact pin according to the first embodiment.

6A and 6B are diagrams showing a contact pin according to the first embodiment, wherein FIG. 6A is a front view showing a state before arrangement, and FIG. 6B is a sectional view showing an arrangement state of the contact pin.

FIG. 7 is a cross-sectional view showing the operation according to the first embodiment,
(A) shows a state in which a pair of contact portions of the contact pin are closed,
(B) shows a state in which a pair of contact portions of the contact pin are opened,
(C) is a sectional view of a state in which a solder ball is sandwiched between a pair of contact portions of a contact pin.

FIG. 8 is a plan view of a pair of contact portions and the like showing an operation according to the first embodiment, (a) showing a state in which the pair of contact portions of the contact pin are closed, and (b) showing a pair of contact portions of the contact pin. It is a top view of the state which opened the part.

FIG. 9 is an explanatory diagram showing an operation of the X-shaped link according to the first embodiment.

FIG. 10 is a perspective view of a slide plate of the IC socket according to the first embodiment.

FIG. 11 is an exploded perspective view of a slide plate of the IC socket according to the first embodiment.

FIG. 12 is an enlarged view showing the insertion hole of the slide plate of the IC socket according to the first embodiment.

FIG. 13 is a perspective view corresponding to FIG. 10 according to the second embodiment of the present invention.

[Explanation of symbols]

11 IC socket (socket for electric parts) 12 IC package (electrical parts) 12a package body 12b Solder ball (terminal) 13 Socket body 15 contact pins 17 Slide plate (moving plate) 18 top plate 19 Control members 22 X-shaped link (slide mechanism) 40 Slide plate body 40a insertion hole 40b bulkhead 40d pressing wall 41 frame 41a opening 43 Support frame

Claims (7)

[Claims] 1. A socket body in which electrical parts are housed,
A contact pin that can be connected to and detached from a terminal of the electric component is disposed, and a movable plate is movably provided with respect to the socket body. By moving the movable plate, the contact pin is pressed to contact the contact. In a socket for electric parts, in which a pin is elastically deformed so that a contact portion of the contact pin is brought into contact with and separated from a terminal of the electric part, the moving plate is formed in a grid pattern, and is pressed by the contact pin. And a support frame portion that supports the partition wall portion, and a material having an elastic coefficient larger than that of the lattice-shaped partition wall material is used for the support frame portion. Characteristic socket for electrical parts. 2. The lattice-shaped partition wall portion of the moving plate is made of synthetic resin, and the support frame portion is made of a material having an elastic coefficient larger than that of the synthetic resin forming the lattice-shaped partition wall portion. The socket for electric parts according to claim 1, wherein the socket is for electric parts. 3. The support frame portion of the movable plate has a metal frame portion having an elastic coefficient larger than that of a material of the lattice-shaped partition wall portion.
The socket for electrical parts described in. 4. The support frame portion of the movable plate is formed of a synthetic resin material having an elastic coefficient larger than that of the material of the lattice-shaped partition wall portion. The socket for the described electrical component. 5. An operation member is provided on the socket body so as to be vertically movable, and the operation member is moved up and down.
By moving the moving plate via the moving mechanism,
The socket for electric parts according to any one of claims 1 to 4, wherein the elastic piece of the contact pin is elastically deformed. 6. A socket main body accommodating an electrical component is movably provided, and by being moved, a contact pin disposed on the socket main body is elastically deformed,
A moving plate for separating and contacting a contact part of the contact pin with a terminal of an electric component housed in the socket body, wherein the moving plate is formed in a lattice shape and has a pressing part for pressing the contact pin. And a supporting frame portion for supporting the partition wall portion, and a material having an elastic coefficient larger than that of the material of the lattice-like partition wall portion is used for the supporting frame portion. . 7. A socket body in which electrical parts are housed,
A contact pin that can be connected to and detached from a terminal of the electric component is disposed, and a movable plate is movably provided with respect to the socket body. By moving the movable plate, the contact pin is pressed to contact the contact. In a socket for electric parts, in which a pin is elastically deformed so that a contact part of the contact pin contacts and separates from a terminal of the electric part, the moving plate includes a pressing part that presses the contact pin, and the pressing part. And a supporting frame portion that supports the holding portion, and a material having an elastic coefficient larger than that of the material of the pressing portion and the holding portion is used for the supporting frame portion. Characteristic socket for electrical parts.