JPH0373930A - Manufacture of liquid crystal display panel - Google Patents

Manufacture of liquid crystal display panel

Info

Publication number
JPH0373930A
JPH0373930A JP21039589A JP21039589A JPH0373930A JP H0373930 A JPH0373930 A JP H0373930A JP 21039589 A JP21039589 A JP 21039589A JP 21039589 A JP21039589 A JP 21039589A JP H0373930 A JPH0373930 A JP H0373930A
Authority
JP
Japan
Prior art keywords
substrate
substrates
pressure
liquid crystal
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21039589A
Other languages
Japanese (ja)
Other versions
JP2806986B2 (en
Inventor
Osamu Yamada
修 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP1210395A priority Critical patent/JP2806986B2/en
Publication of JPH0373930A publication Critical patent/JPH0373930A/en
Application granted granted Critical
Publication of JP2806986B2 publication Critical patent/JP2806986B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)

Abstract

PURPOSE:To seal a 1st and a 2nd substrates over the entire surface with a sealing material while a specific gap is left and to enable safe operation and easy manufacture by sealing the 1st and 12nd substrates with the sealing material while pressing them by an air bag which uses air pressure. CONSTITUTION:The air bag 103 is arranged on a base material 101 and a reference flat plate 105 is arranged thereupon; and the two 1st and 2nd substrates 17 and 108 which are stuck together are placed on the flat plate 105 and a thin plate 196 is placed on the substrate 108. Further, the same air bag 104 as the air bag 103 is arranged thereupon, covered with an upper base material 102, and fixed with a stopper 111. Then compressed air is injected into the air bags 103 and 104 to apply pressure to the 1st substrate 107 and 2nd substrate 108 and the pressure is adjusted to constant pressure. Consequently,the two substrates can be sealed uniformly with the sealing material over the entire surface while the specific gap is left, and the safe operation and easy manufacture are realized.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、液晶表示パネルのシール材による封止をする
組立て工程での、封止方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for sealing a liquid crystal display panel with a sealant during an assembly process.

〔従来の技術〕[Conventional technology]

従来、液晶表示パネルにおけるシール材による封止をす
る組立て工程では第3図に示す方法が行われている。第
3図(a)は単板による重りを使用した例で、第3図(
b)は複数の重りを使用した例で、第3図(c)は弾性
部材のバネ圧で加重した例を示す断面図である。
Conventionally, the method shown in FIG. 3 has been used in the assembly process of sealing a liquid crystal display panel with a sealant. Figure 3 (a) is an example of using a veneer weight;
b) is an example in which a plurality of weights are used, and FIG. 3(c) is a sectional view showing an example in which the weight is applied by the spring pressure of an elastic member.

透明電極を有する第1の基板301にシール材603を
所定位置に配設し、透明電極を有する第2の基板602
に所定間隙を出すためのスペーサー材304を配設する
。このスペーサー材604としてはガラスピーズ、グラ
スチックビーズ等が使用される。次に第1の基板301
と第2の基板302とを所定の位置に貼り合わせた後第
3図(掲に示す治具に配置し、単板306により加重を
加えながらシール材306による封止を行う。加重をか
げながらシール材303による封止を行うのは、第1の
基板601と、第2の基板602とがうねり、反り、基
板の部分的1.板厚の差(以後、偏肉と呼ぶ)等を持っ
ているため、第1の基板601と第2の基板602とを
貼り合わせただけでは、第1の基板601と第2の基板
602との全面にわたり、所定の間隙を得ることができ
ないためである。第3図(a)に示す単板606による
封止治具を説明すると、ベース材605は鉄系の材料で
形成しベース材305の第2の基板602の接する面は
、研磨加工をほどこし、平坦度を良くしである。単板6
06は鉄系の材料で作られ、単板606の第1の基板3
01に接する面は、研磨加工をほどこし平坦度を良くし
ている。第1の基板601と、第2の基板602とを貼
り合わせ、ベース材605と、単板606との間に配置
し単板6060重量を使用して第1の基板601を第2
の基板602に加圧し第1の基板601と第2の基板6
02との反り、うねり、偏肉な矯正1−、スペーサー6
04を基準に、第1の基板601と第2の基板602と
を所定間隙隔ててシール材306で封止しようとするも
のである。第3図(b)は、第3図(a)に示す単板6
06に代わりに、複数の重り608により第1の基板6
01を第2の基板602に加圧し第1の基板601と第
2の基板3020反り、うねり、偏肉を矯正し、スペー
サー604を基準にして、第1の基板601と第2の基
板602とを所定間隙隔てて、シール材606で封止1
−ようとするものである。第3図(C)は弾性部材の復
元力で加圧しながらシール材606による封止を行うも
ので、貼り合わされた第1の基板601と第2の基板6
02とをベース材610上に配置し薄板611を介して
弾性部材612を配置し、上ベース材616を利用して
圧力を印加l−弾性部材612を圧縮させた状態でスト
ッパー314にて上ベース材616を固定I−て使用す
る。
A sealing material 603 is provided at a predetermined position on a first substrate 301 having a transparent electrode, and a second substrate 602 having a transparent electrode is provided.
A spacer material 304 is provided to provide a predetermined gap. As this spacer material 604, glass beads, glass beads, etc. are used. Next, the first substrate 301
After bonding the first and second substrates 302 together in a predetermined position, they are placed in the jig shown in FIG. Sealing with the sealing material 303 is performed when the first substrate 601 and the second substrate 602 have undulations, warpage, or differences in partial thickness of the substrates (hereinafter referred to as uneven thickness). Therefore, it is not possible to obtain a predetermined gap over the entire surface of the first substrate 601 and the second substrate 602 by simply bonding the first substrate 601 and the second substrate 602 together. To explain the sealing jig using a single plate 606 shown in FIG. , improves flatness.Single plate 6
06 is made of iron-based material and is a first substrate 3 of a single plate 606.
The surface in contact with 01 is polished to improve its flatness. A first substrate 601 and a second substrate 602 are bonded together, placed between a base material 605 and a veneer 606, and using the weight of the veneer 6060, the first substrate 601 is attached to a second substrate.
Pressure is applied to the substrate 602 of the first substrate 601 and the second substrate 6.
Correcting warpage, waviness, uneven thickness with 02 1-, spacer 6
04, a first substrate 601 and a second substrate 602 are separated by a predetermined gap and are sealed with a sealing material 306. FIG. 3(b) shows the veneer 6 shown in FIG. 3(a).
06 instead of the first substrate 6 by a plurality of weights 608.
01 is applied to the second substrate 602 to correct the warpage, waviness, and uneven thickness of the first substrate 601 and the second substrate 3020. are separated by a predetermined gap and sealed with a sealing material 606 1
-It is something that is intended to be done. In FIG. 3(C), sealing is performed using a sealing material 606 while applying pressure using the restoring force of an elastic member, and the bonded first substrate 601 and second substrate 6 are sealed together.
02 is placed on the base material 610, and the elastic member 612 is placed through the thin plate 611, and pressure is applied using the upper base material 616.1- With the elastic member 612 compressed, the upper base is pressed by the stopper 314. The material 616 is used as a fixed I-.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記に示すように種々のシール材の封止治具が使用され
ているが、第1の基板601と第2の基板302の所定
間隙を、第1の基板301と第2の基板302との全面
に渡って得ることが出来ないばかりか、以下に記載する
種々の課題を持っており液晶表示パネルの量産において
歩留り低下をまねいている。
As shown above, sealing jigs with various sealing materials are used. Not only can it not be obtained over the entire surface, but it also has various problems described below, leading to a decrease in yield in mass production of liquid crystal display panels.

第3図(a)に示す単板606による加圧方式の場合ベ
ース材605、単板606ともそれぞれ第1の基板60
1と第2の基板602とに接する面は平面に仕上げられ
ているが、第1の基板301と第2の基板602εが偏
肉な持っているために、第1の基板601と第2の基板
602とを全面にわたり均一に押して付けることができ
ない。また単板6060重量だけで加圧するため、単板
306の重量が大きくなってしまう。現在、第1の基板
601と第2の基板602とのシール材606の封止工
程では、単位面積当たりの加重とシテ、0.5 ’yi
/CIaカラI IKII/c+aヲ必要トt ルが、
基板の大きさを30Cffl角とした場合単板6060
重量は450に&から900に9が必要となってしまう
。これだけの重量の単板606を操作するためには大掛
かりな装置を必要とし、かつ作業も危険なものとなる。
In the case of the pressurizing method using the veneer 606 shown in FIG.
The surfaces in contact with the first substrate 301 and the second substrate 602 are finished flat, but because the first substrate 301 and the second substrate 602ε have uneven thickness, the first substrate 601 and the second substrate 602 have uneven thickness. It is not possible to uniformly press and attach the substrate 602 over the entire surface. Further, since the pressure is applied only by the weight of the veneer 6060, the weight of the veneer 306 becomes large. Currently, in the sealing process of the sealant 606 between the first substrate 601 and the second substrate 602, the weight and shite per unit area are 0.5'yi
/CIa Kara I IKII/c+a is required.
Single board 6060 when the board size is 30Cffl square
The weight will need 9 from 450 to 900. In order to manipulate such a heavy veneer 606, large-scale equipment is required, and the work is also dangerous.

第3図(b)に示す複数の重りを使用した従来例では、
第3図(a)に比較して第1の基板601と第2の基板
602との偏肉には強くなり2枚の貼り合わせた第1の
基板601と第2の基板302に均一に加圧することは
できるが、数多くの重り608を乗せなげればならず、
作業が面倒である。
In the conventional example using multiple weights shown in Fig. 3(b),
Compared to FIG. 3(a), it is more resistant to uneven thickness between the first substrate 601 and the second substrate 602, and can be applied uniformly to the two bonded first and second substrates 601 and 302. Although it is possible to apply pressure, a large number of weights 608 must be placed on it.
The work is troublesome.

第3図(e)に示す弾性部材を用いる従来例では、バネ
圧を使用するため、単板に上るもの、複数の重りによる
ものに比較し均一にかつ、大きな力で加圧することがで
きるが、治具の構造上ベース材610に反りを生じてし
まい、シール材封止後の2枚の貼り合わせた第1の基板
601および第2の基板602が反ってしまい、以降の
工程を流すことができkくなってしまう。
In the conventional example using an elastic member shown in Fig. 3(e), since spring pressure is used, it is possible to apply pressure more uniformly and with a larger force compared to those mounted on a single plate or those using multiple weights. , Due to the structure of the jig, the base material 610 is warped, and the two bonded first and second substrates 601 and 602 are warped after being sealed with the sealant, and the subsequent steps cannot be carried out. It becomes difficult to do so.

本発明の目的は、上記課題を解決し、第1の基板と第2
の基板の全面にわたり、均一に加圧することで全面にわ
たり所定の間隙を隔ててシール材による封止をするとと
もに、作業も安全で、手軽な製造方法を提供することに
ある。
An object of the present invention is to solve the above-mentioned problems and provide a first substrate and a second substrate.
It is an object of the present invention to provide a manufacturing method that is safe and easy, in which the entire surface of a substrate is sealed with a sealing material at a predetermined gap by applying pressure uniformly over the entire surface of the substrate.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するため本発明の液晶表示パネルの製造
方法は下記記載の方法を用いる。
In order to achieve the above object, the method for manufacturing a liquid crystal display panel of the present invention uses the method described below.

透明電極を有する第1の基板と、透明電極を有する第2
の基板とを、透明電極の配設された面で、所定間隙隔て
て対向させ、周辺をシール材にて封止した後、液晶を封
入してなる液晶表示パネルの製造方法における′第1の
基板と第2の基板とを所定間隙隔ててシール材で封止す
る組立て工程において、空気圧を使用したエアーバック
で押し付けながらシール材で第1の基板と第2の基板と
を封止する。
a first substrate having a transparent electrode; a second substrate having a transparent electrode;
A first method of manufacturing a liquid crystal display panel in which the transparent electrodes are placed facing each other with a predetermined gap between the two substrates, the periphery of which is sealed with a sealing material, and then liquid crystal is sealed. In an assembly process of sealing a substrate and a second substrate with a sealant with a predetermined gap between them, the first substrate and the second substrate are sealed with the sealant while being pressed with an airbag using air pressure.

〔実施例〕〔Example〕

以下、本発明の実施例を図面を参照しつつ詳細に説明す
る。
Embodiments of the present invention will be described in detail below with reference to the drawings.

第2図に示す液晶表示パネルを次のように作成する。透
明電極206を有する第1の基板201と透明電極20
4を有する第2の基板202上に、それぞれ配向膜20
5.206を形成し、この配向膜205.206を形成
した第1の基板201と第2の基板202とにラビング
処理をほどこす。
The liquid crystal display panel shown in FIG. 2 is prepared as follows. First substrate 201 having transparent electrode 206 and transparent electrode 20
alignment films 20 on second substrates 202 having
5.206 is formed, and a rubbing process is performed on the first substrate 201 and the second substrate 202 on which the alignment films 205.206 are formed.

ラビング処理をした第1の基板201上に、エポキシ樹
脂をシール材208として、所定位置に配設し、温度1
00℃、時間10分間プレキ)アする。一方うピング処
理をした第2の基板202上にプラスチックビーズをス
ペーサー207として散布する。第1の基板201と第
2の基板202とを位置合せして貼り合わせ、第1図に
示す本発明の治具に配置し、加圧しながら温度160℃
、時間90分焼成しシール材208を硬化させ、封止工
程を完了させる。次に液晶注入する。
An epoxy resin is placed at a predetermined position on the rubbed first substrate 201 as a sealing material 208, and the temperature is 1.
Preheat at 00°C for 10 minutes. On the other hand, plastic beads are scattered as spacers 207 on the second substrate 202 which has been subjected to the ping treatment. The first substrate 201 and the second substrate 202 are aligned and bonded together, placed in the jig of the present invention shown in FIG. 1, and heated to 160° C. while applying pressure.
, the sealant 208 is baked for 90 minutes to harden and complete the sealing process. Next, inject the liquid crystal.

本発明の封止方法におけるシール材を硬化させるための
治具について説明する。ベース材101上にゴム製の袋
からなるエアーバック103を配し、このエアーバック
106上に基準となる平板105を配置しこの平板10
5上に第2図を用いて説明した貼り合わせた2枚の第1
の基板107と第2の基板108とを載置し、第1の基
板107と第2の基板108、上に薄板106を置き、
その上にエアーバック106と同じエアーバック104
を配置し、上ベース材102をかぶせ、ストッパー11
1で固定する。その後エアーバック106.104に圧
縮空気を注入し貼り合わせた2枚の第1の基板107と
第2の基板108に圧力を加える。エアーの圧力は通常
0.5 kg/ c+11からL O−/ eraで使
用している。又、エポキシ樹脂硬化時に、温度160℃
で焼成を行うと、エアーバック内の空気が膨脹し、エア
ーバック103.104内の圧力が上がってしまうため
、外部にレギュレーターを設置し、一定圧力になるよう
に調整している。この方式では貼り合わせた第1の基板
107と第2の基板108とは基準となる平板105に
ならい、シール材109が硬化するため焼成後の貼り合
わされた2枚の基板は平面であり、以降の工程で問題を
起こすことがない。又、エアーの圧力を利用しているた
め、貼り合わされた2枚の基板の大きさを例えば30c
m角とすると、総計450に9から900に9の力を加
えることが簡単にできる。これだけの力が加わると当然
ベース板101に反りを生ずるが、基準となる平板10
5があるために、製品となる貼り合わせた第1の基板1
07と第2の基板108とが反ることはない。
A jig for curing the sealing material in the sealing method of the present invention will be explained. An air bag 103 made of a rubber bag is placed on a base material 101, and a flat plate 105 serving as a reference is placed on this air bag 106.
5. The first of the two sheets pasted together as explained using Fig. 2 above.
A substrate 107 and a second substrate 108 are placed, and a thin plate 106 is placed on the first substrate 107 and second substrate 108.
On top of that is the same airbag 104 as the airbag 106.
, cover with the upper base material 102, and attach the stopper 11.
Fixed at 1. Thereafter, compressed air is injected into the air bags 106 and 104 to apply pressure to the two bonded first and second substrates 107 and 108. Air pressure is normally used at 0.5 kg/c+11 to L O-/era. Also, when curing the epoxy resin, the temperature is 160℃.
When firing is performed, the air inside the air bags expands and the pressure inside the air bags 103 and 104 increases, so a regulator is installed outside to adjust the pressure to a constant level. In this method, the bonded first substrate 107 and second substrate 108 follow the standard flat plate 105, and since the sealing material 109 is cured, the two bonded substrates are flat after firing, and henceforth No problems occur during the process. Also, since air pressure is used, the size of the two boards bonded together can be reduced to, for example, 30 cm.
If it is m square, it is easy to apply a force of 9 to 900 to a total of 450. Naturally, when this much force is applied, the base plate 101 will warp, but the flat plate 101 that serves as a reference
5, the first substrate 1 bonded together to become a product
07 and the second substrate 108 will not warp.

また薄板106を介して第1の基板107と第2の基板
108に圧力を加えているため、薄板106は必要に応
じ反りを生ずるため、第1の基板107と第2の基板1
08に均一に圧力を加えることができ、第1の基板10
7と第2の基板108の反り、うねり、を矯正し、偏肉
にも追従することが出来る。さらに又、上記構造のため
治具重量も軽減できた。
Further, since pressure is applied to the first substrate 107 and the second substrate 108 via the thin plate 106, the thin plate 106 will warp as necessary.
08 can be applied uniformly to the first substrate 10.
It is possible to correct warpage and waviness of the substrate 7 and the second substrate 108, and also to follow uneven thickness. Furthermore, the weight of the jig was also reduced due to the above structure.

以上説明したように本発明のエアーパックを使用するこ
とで2枚の基板を全面にわたり均一に所定間隙隔ててシ
ール材で封止することができる。
As explained above, by using the air pack of the present invention, two substrates can be sealed with a sealant uniformly over the entire surface with a predetermined gap between them.

なお本実施例では1組の2枚の貼り合わせた基板にて説
明したが、複数組の貼り合わせた2枚の基板を同時に治
具に載置しシール材で封止することも可能である。
Although this embodiment has been explained using one set of two bonded substrates, it is also possible to place multiple sets of two bonded substrates on a jig at the same time and seal them with a sealant. .

〔発明の効果〕〔Effect of the invention〕

本発明の製造方法においては、エアーパックを使用し2
枚の貼り合わせた基板を全面にわたり均一に加圧するこ
とで2枚の基板を全面にわたり均一に所定間隙隔ててシ
ール材で封止することで、従来の重り方式等に見られた
不均一な加圧により2枚の基板の間隙が不均一になり歩
留りを下げることがなくなり、また手軽な治具のため作
業の危険もなくなった。
In the manufacturing method of the present invention, an air pack is used.
By applying pressure uniformly over the entire surface of the two bonded substrates, the two substrates are sealed with a sealant evenly over the entire surface with a predetermined gap between them, thereby eliminating the uneven pressure found in conventional weight methods. The pressure does not cause the gap between the two substrates to become uneven, which reduces the yield, and the use of a simple jig eliminates the dangers of the work.

近年スーパーツイストモードの出現により、2枚の基板
間の間隙は、より均一にしなければならないが、本発明
は、上記要求にも答え得るものである。
With the advent of super twist mode in recent years, the gap between two substrates must be made more uniform, and the present invention can also meet the above requirements.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例における液晶表示パネルの製造
方法を示す断面図、第2図は本発明の実施例により作成
する液晶表示パネルの構成を示す断面図、第3図(a)
、(b)、(clは従来例の液晶表示パネルの製造方法
を説明するための断面図である。 103.104・・・・・・エアーバック、107・・
・・・・第1の基板、 108・・・・・・第2の基板、 109・・・・・・シール材。 第1図 第2図
FIG. 1 is a sectional view showing a method for manufacturing a liquid crystal display panel according to an embodiment of the present invention, FIG. 2 is a sectional view showing the structure of a liquid crystal display panel manufactured according to an embodiment of the present invention, and FIG. 3(a)
, (b), (cl is a cross-sectional view for explaining the manufacturing method of a conventional liquid crystal display panel. 103.104... air bag, 107...
...First substrate, 108...Second substrate, 109...Sealing material. Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] 透明電極を有する第1の基板と、透明電極を有する第2
の基板とを、前記透明電極の配設された面で、所定間隙
隔てて対向させ、周辺をシール材にて封止した後、液晶
を封入してなる液晶表示パネルの製造方法における前記
第1の基板と第2の基板とを所定間隙隔ててシール材で
封止する組立て工程において、空気圧を使用したエアー
バックで押し付けながら前記シール材で前記第1の基板
と第2の基板とを封止することを特徴とする液晶表示パ
ネルの製造方法。
a first substrate having a transparent electrode; a second substrate having a transparent electrode;
In the first method of manufacturing a liquid crystal display panel, the substrates are placed opposite each other at a predetermined gap on the surface on which the transparent electrode is disposed, and the periphery is sealed with a sealing material, and then liquid crystal is sealed. In the assembly step of sealing the substrate and the second substrate with a sealant with a predetermined gap, the first substrate and the second substrate are sealed with the sealant while being pressed with an air bag using air pressure. A method for manufacturing a liquid crystal display panel.
JP1210395A 1989-08-15 1989-08-15 Method and apparatus for manufacturing liquid crystal display panel Expired - Fee Related JP2806986B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1210395A JP2806986B2 (en) 1989-08-15 1989-08-15 Method and apparatus for manufacturing liquid crystal display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1210395A JP2806986B2 (en) 1989-08-15 1989-08-15 Method and apparatus for manufacturing liquid crystal display panel

Publications (2)

Publication Number Publication Date
JPH0373930A true JPH0373930A (en) 1991-03-28
JP2806986B2 JP2806986B2 (en) 1998-09-30

Family

ID=16588617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1210395A Expired - Fee Related JP2806986B2 (en) 1989-08-15 1989-08-15 Method and apparatus for manufacturing liquid crystal display panel

Country Status (1)

Country Link
JP (1) JP2806986B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0627474A (en) * 1992-07-09 1994-02-04 Shiyantei:Kk Glass substrate coupling device for liquid crystal
US5629787A (en) * 1992-05-25 1997-05-13 Sharp Kabushiki Kaisha Method for producing an LCD by pressing the substrates
US6879370B2 (en) * 2001-12-14 2005-04-12 International Business Machines Corporation Fixing device, method of fixing substrate and apparatus and method for manufacturing a liquid crystal display panel using the same
KR100662497B1 (en) * 2002-11-18 2007-01-02 엘지.필립스 엘시디 주식회사 substrates bonding device for manufacturing of liquid crystal display
US7963217B2 (en) 2007-07-10 2011-06-21 Sharp Kabushiki Kaisha Apparatus and method for producing display panel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629787A (en) * 1992-05-25 1997-05-13 Sharp Kabushiki Kaisha Method for producing an LCD by pressing the substrates
JPH0627474A (en) * 1992-07-09 1994-02-04 Shiyantei:Kk Glass substrate coupling device for liquid crystal
US6879370B2 (en) * 2001-12-14 2005-04-12 International Business Machines Corporation Fixing device, method of fixing substrate and apparatus and method for manufacturing a liquid crystal display panel using the same
KR100662497B1 (en) * 2002-11-18 2007-01-02 엘지.필립스 엘시디 주식회사 substrates bonding device for manufacturing of liquid crystal display
US7963217B2 (en) 2007-07-10 2011-06-21 Sharp Kabushiki Kaisha Apparatus and method for producing display panel

Also Published As

Publication number Publication date
JP2806986B2 (en) 1998-09-30

Similar Documents

Publication Publication Date Title
JPH0820627B2 (en) Liquid crystal display element manufacturing method
JPS617822A (en) Production of liquid crystal element
JPH0373930A (en) Manufacture of liquid crystal display panel
JPS61190313A (en) Manufacture of liquid-crystal panel
JP2001255540A (en) Method for manufacturing liquid crystal display panel, and device therefor
JPH10301121A (en) Production of liquid crystal display element
JPH01195421A (en) Manufacture of liquid crystal display device
JPH06337429A (en) Press and alignment device for liquid crystal cell
JPS61209419A (en) Production of liquid crystal cell
JPH10123541A (en) Production for liquid crystal display element
JPH0561051A (en) Liquid crystal display device and production thereof
JPS6132033A (en) Production of liquid crystal display panel
JPH0862557A (en) Production of liquid crystal cell
JPH02139518A (en) Production of liquid crystal panel
JPH02154228A (en) Production of liquid crystal display device
JPH11174458A (en) Press-bonding device and manufacture of liquid crystal display device using it
JPS62183427A (en) Production of liquid crystal display panel
JPH0371109A (en) Manufacture of liquid crystal display panel
JPH07301811A (en) Production of liquid crystal display panel and device therefor
JPH05113571A (en) Production of display element
JPH02310525A (en) Production of liquid crystal display device
JPH0990378A (en) Method for joining substrate and device therefor
JPH0437966B2 (en)
JPH02156220A (en) Manufacture of curved surface liquid crystal cell
JP2000075307A (en) Production of liquid crystal device and liquid crystal device

Legal Events

Date Code Title Description
S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20070724

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090724

Year of fee payment: 11

LAPS Cancellation because of no payment of annual fees