JP3041559B2 - Manufacturing method of electro-optical device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-optical device,
At least one substrate having a structure in which an electronic circuit element layer using a simple matrix method or an active matrix method such as a TFT or MIM for the structure is transferred and adhered to a flat plate of a transparent substrate via a layer of an adhesive or the like. The present invention relates to a method for manufacturing a panel of an electro-optical device such as a liquid crystal included in the present invention.

[0002]

2. Description of the Related Art In a conventional method of manufacturing an electro-optical device , FIG.
As shown in structural cross-sectional view of a conventional panel crimping apparatus 4,
In the bonding process (compression bonding process) of the electro-optical element ,
The press plate 2 is pressurized with a hydraulic pressure 6 (or a mechanical screwing method or the like) to a strong pressure of about 100 kg / cm ² to 2 t / cm ^2.
Press with pressure, press panel 7 to oppose a pair
While controlling the cell gap by the spacer material bonded to the substrate, to be added to 180 ℃ or more of high fever
Ri had done the adhesion between the substrates.

[0003] schematic diagram of a conventional spacer spraying steps in FIG. 2
Is shown. Thus, according to the conventional spacer dispersing method ,
If, regardless of the display element driving circuit and the wiring portion 3 and the other portion, the gas mixture, or a liquid mixed with space <br/> Sir 5 he had done spray spraying 9 to the substrate 8a entire surface.

[0004]

When the conventional method for manufacturing a panel of an electro-optical device such as a liquid crystal is used, the following problems mainly occur in the manufacturing process. However, production with a low defect rate was impossible.

(1) A thin film forming a display element driving circuit and a wiring portion 3 provided on a substrate 8a is formed by a manufacturing process shown in a manufacturing process diagram of the present invention in FIG. (N) The liquid crystal encapsulation is separated from the substrate during the flow process. (2) The thin film forming the display element driving circuit and the wiring portion 3 provided on the substrate 8a is manufactured by the manufacturing process shown in the manufacturing process diagram of the present invention in FIG.
During the manufacturing process of (M) pressure bonding and curing, (N) liquid crystal encapsulation, the spacers are deformed or broken into irregularities by the pressing of the spacer, and the elements of the electric circuit are disconnected or the characteristics are changed, which adversely affects the display quality of the display device. give.

[0006]

In order to solve the above-mentioned problems, the present invention has changed the manufacturing method in the following steps . That is, in the crimping step, as shown in FIG.
By using the crimping device cross-sectional structure, a temperature 100 ° C. approximately, press
Lamination was performed at a pressure of 30 kg / cm ² . this
Bonding substrates at low temperature and low pressing force
Is now possible.

In the spacer spraying step , as shown in FIG. 1, which schematically shows the spacer spraying step of the present invention,
By disposing a display element driving circuit and a mask plate 4 for masking the wiring portion 3 on the spacer dispersion substrate 8a .
As a result , a manufacturing method in which only the display portion 10 is sprayed even when the spacers are sprayed is realized .

[0008]

Since the spacer does not cover the display element driving circuit and the wiring portion, the circuit and the wiring are not damaged by the pressing force. Further, in order to press the panel 7 to be pressed by the airbag 1, the pressing force is applied not only to the upper surface 11 of the panel 7 to be pressed, but also to the side surface 12. In addition, by adjusting the injection pressure 13 of the inert gas such as nitrogen, the fine adjustment of the pressing force can be easily performed, so that the gap can be accurately controlled, and the display panel having good display quality can be efficiently produced. Can be manufactured.

[0009]

FIG. 5 is an overall view of a manufacturing process of a liquid crystal display panel using the present invention. Hereinafter, the manufacturing process will be described with reference to the drawings. For the transfer substrate and the counter substrate on which the thin-film electric circuit is formed, (A) receiving and cleaning steps,
(B) an alignment film application pretreatment step, (C) an alignment film application step,
(D) Preliminary baking of alignment film, (E) Main baking of alignment film,
(J) printing of a sealing material on the opposing substrate, until (F) an alignment film treatment step, and (G) a cleaning step for removing rubbing generated dust
(K) The common material printing process is the same as the conventional manufacturing method. Therefore, description of the content is omitted.

A feature of the manufacturing method of the present invention is (H) the pretreatment of the transfer substrate with the spacer dispersing step.
This is a (M) pressure-bonding curing step following the mask processing step and (L) the step of bonding both substrates. Hereinafter, the present invention will be described with reference to FIGS.

FIG . 3 is a schematic cross-sectional view of a crimping device used for a crimping step of a liquid crystal display panel . In FIG.
The crimped panel 7 set on 14 is filled with an inert gas.
The airbag 1 swelled by the gas flowing from the port 16
And is pressed through the buffer paperboard 15. Reference numeral 17 denotes a pressing pressure and its direction , 5 denotes a spacer, and 18 denotes a sealing material. Here, the description of the same reference numerals as in FIG. 4 is omitted.

The flat plate 14 accommodates the pressure-bonded panel 7 having a controlled distance between the transfer substrate 8a and the substrate 8 with the spacer 5 interposed therebetween. Above the crimped panel 7, a cushioning paperboard 15 is placed as a cushioning material, and the airbag 1 is placed thereon. A press plate (not shown) is fixedly arranged on the airbag 1.

The air bag 1 has an inert gas inlet 16.
Is provided, from which an inert gas is injected. The airbag 1 is inflated by the injection pressure 13, and the inflation pressure presses the panel 7 to be pressed from the upper part 11 via the buffer paperboard 15, and a part of the airbag 1 is formed on the side surface 1.
2, the sealing material 18 is also pressed from the side surface 12.

As a result, the pressure-bonded panel 7 receives pressure under the same conditions not only from the upper portion 11 but also from the side surface 12, so that the pressure can be applied uniformly over the entire surface of the panel. On top of that, if the injection pressure 13 is adjusted,
Since the pressure applied between a and 8 can be finely adjusted, a predetermined gap control can be accurately performed.

At this time, the pressing force 17 is 30 kg / cm ²
If, the heating temperature of 100 ° C.. The sealing member 18 using a low temperature curing resin. FIG. 1 is a view schematically showing a step of spraying a spacer 5 according to the present invention. 3 is a display element driving circuit and wiring, 10 is a display portion, 9 is a spray mist in which a spacer is mixed with a gas or liquid. Is shown. Reference numeral 4 denotes a mask plate having a window portion 20a formed at a position corresponding to the display portion 10 of the substrate 8a, which is a non-shielding portion of the spacer.

As shown in FIG . 1 , the mask plate 4 is placed on the transfer substrate 8a on which the display element driving circuit and the wiring portion 3 are formed, and spray mist 9 is sprayed. By this operation, the spacers 5 are evenly distributed only on the display portion 10. Thereafter, the mask 6 is removed, the opposing substrate 8 on which the sealing material 18 is printed is placed, and the process enters a pressing and pressing step.

[0017]

The present invention relates to an electro-optical device, in particular, an electronic circuit using a simple matrix system or an active matrix system such as a TFT or MIM on a flat plate of a transparent substrate 8 through a layer of an adhesive or the like. When manufacturing an electro-optical device with respect to a method for manufacturing a panel of an electro-optical device such as a liquid crystal having at least one transfer substrate 8a having a structure in which an element layer is transferred and adhered, during the manufacturing process, “mask processing”, “spraying of spacers” are performed. The process change and addition of "change of sealing material contents" and "pressure hardening", particularly, pressure hardening using the pressure bonding device shown in the sectional view of the panel pressure bonding device structure of the present invention in FIG. Because it has a uniform shape, even pressing can be applied to the panel upper surface 11 and the side surface 12,
In principle, since the in-plane pressure can be evenly compressed, an accurate gap can be set.

Further, since the spacer does not cover the display element driving circuit and the wiring portion 3, it is possible to avoid adverse effects on the driving section. This significantly reduces changes in electrical characteristics and disconnection of the electric circuit elements and other lead wiring during the manufacturing process, and enables high-volume production of electro-optical devices that were not mass-producible due to a high defect rate. did.

[Brief description of the drawings]

FIG. 1 schematically shows a spacer spraying step according to the present invention.
It is to figure.

FIG. 2 is a view schematically showing a conventional spacer spraying process .

FIG. 3 is a sectional view showing the structure of the panel crimping apparatus of the present invention.

FIG. 4 is a view showing a cross section of the structure of a conventional panel crimping apparatus .

FIG. 5 is a view showing a manufacturing process diagram of the present invention.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G02F 1/13 101 G02F 1/1333 500 G02F 1/1339 500

Claims (1)

(57) [Claims] 1. A method for manufacturing an electro-optical device, comprising: bonding a first substrate having an electrode structure to a counter substrate facing the first substrate, wherein the first substrate is connected to the first substrate via a sealant. Opposite the opposing substrate
The process of forming the panel and the inflation pressure of the inflated airbag injected with gas
Pressing the panel and heating the sealing material
By doing so, the gap is adjusted according to the inflation pressure.
A method of manufacturing an electro-optical device , comprising: a step of fixing a tunnel; and a step of enclosing liquid crystal in the gap .