CN102407626A - Pressing technology of aluminum base copper-clad plate - Google Patents
Pressing technology of aluminum base copper-clad plate Download PDFInfo
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- CN102407626A CN102407626A CN2011102651342A CN201110265134A CN102407626A CN 102407626 A CN102407626 A CN 102407626A CN 2011102651342 A CN2011102651342 A CN 2011102651342A CN 201110265134 A CN201110265134 A CN 201110265134A CN 102407626 A CN102407626 A CN 102407626A
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Abstract
The invention discloses a pressing technology of aluminum base copper-clad plate. The plate stacking mode used by the pressing technology is that a pressing steel plate, a copper foil, an aluminum base plate, an aluminum base plate, a copper foil and a pressing steel plate are combined into a hot press plate set, structurally the plates are stacked in a manner that the aluminum plates are close to each other and the copper foils are close to the steel plates, and two aluminum base copper-clad plates with copper foils clad on single faces can be pressed between the two pressing steel plates. Production capacity is effectively improved, the use of PET film is cancelled, resources are saved and environment pollution is reduced.
Description
Technical field
The present invention relates to a kind of production technology, relate in particular to a kind of pressing process of aluminium base copper-clad plate.
Background technology
At present, the manufacturing process of aluminium base copper-clad plate mainly may further comprise the steps: handle aluminium base, coat heat conductive insulating layer and oven dry, place Copper Foil, vacuum hotpressing.Fig. 1 carries out vacuum hotpressing for aluminium base copper-clad plate at the pressing machine situation; The structure of heating platen group 1 is as shown in Figure 2 among Fig. 1; Fig. 2 covers traditional lamination mode of the heating platen group 1 of Copper Foil for single face; Heating platen group 1 from top to bottom has 5 layers, comprises pressing steel plate, Copper Foil, the aluminium base that scribbles the heat conductive insulating layer, PET film, pressing steel plate respectively, only suppresses the aluminium base copper-clad plate that a single face covers Copper Foil between two blocks of pressing steel plates; Because aluminium base and pressing steel plate all are that rigid metallic plate scratches wearing and tearing easily, and one deck PET film also is set between aluminium base and the pressing steel plate.Traditional pressing process production capacity of this aluminium base copper-clad plate is lower, and pressing time is long, and energy consumption is big, and also can produce PET film waste material after the pressing, has both wasted resource, also contaminated environment.
In the pressing process of copper-clad plate,, make the production capacity of every stove can't lean on being provided with of change equipment to promote because the openings of sizes of pressing machine is fixed.Therefore need a kind of pressing process of improved aluminium base copper-clad plate,, cut down the consumption of energy to improve production capacity.
Summary of the invention
In order to overcome the deficiency of prior art, the present invention provides a kind of pressing process of improved aluminium base copper-clad plate, improves production capacity, cuts down the consumption of energy.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of pressing process of aluminium base copper-clad plate comprises following processing step:
A. aluminium base is cleaned, Passivation Treatment, dried is removed the impurity and the rusty stain on aluminium base surface;
Coated with thermally conductive insulating cement on the surface of the aluminium base clean dry that b. in step a, obtains; Can adopt a kind of method or several different methods in spraying, silk screen process, the roller coating to be used in combination; Solve the THICKNESS CONTROL problem of heat conductive insulating layer; Form the uniform heat conductive insulating layer of a layer thickness, the thickness range of heat conductive insulating layer is at 60 ~ 210 μ m, and thickness can be regulated and control as required;
C. the aluminium base that has applied the heat conductive insulating layer is carried out heat and roll preparatory combination, make the heat conductive insulating layer be the semi-solid preparation shape and aluminium base fits tightly;
D. cover aluminium base to Copper Foil and scribble the thermal conductive insulation glue one side, be combined to form the heating platen group through improved superimposed mode, under the condition of high temperature, vacuum and High Voltage, suppressed 50 ~ 80 minutes, process aluminium base copper-clad plate with the pressing steel plate;
Among the above-mentioned steps d, said improved superimposed mode is meant that the sequential combination by pressing steel plate, Copper Foil, aluminium base, aluminium base, Copper Foil, pressing steel plate forms the heating platen group, structurally is exactly that aluminium sheet leans on aluminium sheet; Copper Foil leans on the mode lamination of steel plate; Can suppress the aluminium base copper-clad plate that two single faces cover Copper Foil between two blocks of pressing steel plates, effectively improve production capacity, and cancel the use of PET film; Save resource, also reduced pollution environment.
Above-mentioned steps d is that 740Hg/mm, pressure are the condition pressed of 250 ~ 500psi 160 ~ 200 ℃ high temperature, vacuum.
The invention has the beneficial effects as follows: process of the present invention is changed the lamination mode of suppressing aluminium base copper-clad plate and being; Make between per two blocks of pressing steel plates and can suppress the aluminium base copper-clad plate that two single faces cover Copper Foil, cancelled the use of PET film simultaneously, the contrast traditional handicraft; Under the situation of identical device configuration; Improved production capacity, reduced cost, reduced pollution simultaneously environment.
As the further improvement of such scheme, the constituent of said thermal conductive insulation glue comprises modification high temperature phenolic resins 20 ~ 30%, aluminium oxide AL
2O
3Account for 50 ~ 60%, boron nitride BN accounts for 5 ~ 10%, also comprises a spot of plasticizer and curing agent, the kinetic viscosity of mixing the common synthetic resin of the kinetic viscosity contrast of the thermal conductive insulation glue that obtains by said ratio obviously increases; The kinetic viscosity of thermal conductive insulation glue and pressing programming have direct relation; Kinetic viscosity is big more, and thermal conductive insulation glue is not prone to the phenomenon of gummosis more in the process of pressing, then can intensification, pressing time be shifted to an earlier date; Thereby realize the pressing of fast pressure mode, reduce pressing time.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 is the sketch map that aluminium base copper-clad plate is suppressed at the pressing machine;
Lamination sketch map when Fig. 2 is traditional aluminum base copper-clad plate compacting;
Lamination sketch map when Fig. 3 is aluminium base copper-clad plate compacting of the present invention.
Shown by reference numeral is: 1, heating platen group, 2, the pressing machine frame, 3, upper plate, 4, lower roof plate, 5, oil cylinder, 6, petroleum pipeline, 11, aluminium base, 12, Copper Foil, 13, the pressing steel plate, 14, the PET film.
The specific embodiment
With reference to Fig. 1, Fig. 3, the pressing process of a kind of aluminium base copper-clad plate of the present invention comprises that following processing step: a. cleans aluminium base 11, Passivation Treatment, and dried is removed the impurity and the rusty stain on aluminium base 11 surfaces; Coated with thermally conductive insulating cement on the surface of aluminium base 11 clean dry that b. in step a, obtain; Can adopt a kind of method or several different methods in spraying, silk screen process, the roller coating to be used in combination; Solve the THICKNESS CONTROL problem of heat conductive insulating layer; Form the uniform heat conductive insulating layer of a layer thickness, the thickness range of heat conductive insulating layer is at 60 ~ 210 μ m, and thickness can be regulated and control as required; C. the aluminium base 11 that has applied the heat conductive insulating layer is carried out heat and roll preparatory combination, make the heat conductive insulating layer be the semi-solid preparation shape and aluminium base 11 fits tightly; D. cover aluminium base 11 to Copper Foil 12 and scribble the thermal conductive insulation glue one side; Aluminium base 11, Copper Foil 12 click order stack with pressing steel plate 13 and set up into the heating platen group jointly: pressing steel plate 13, Copper Foil 12, aluminium base 11, aluminium base 11, Copper Foil 12, pressing steel plate 13; Polydisc heating platen group is carried out pressing simultaneously in the pressing machine; In 160 ~ 200 ℃ high temperature, vacuum is that 740Hg/mm, pressure are the condition pressed 50 ~ 80 minutes of 250 ~ 500psi, processes aluminium base copper-clad plate.
Further, the constituent of said thermal conductive insulation glue comprises modification high temperature phenolic resins 20 ~ 30%, aluminium oxide AL
2O
3Account for 50 ~ 60%, boron nitride BN accounts for 5 ~ 10%, also comprises a spot of plasticizer and curing agent, the kinetic viscosity of mixing the thermal conductive insulation glue that obtains by said ratio can reach 3000 ~ 5000Pa.s; Kinetic viscosity 500 ~ the 1000Pa.s that contrasts common synthetic resin obviously increases, and the kinetic viscosity of thermal conductive insulation glue and pressing programming have direct relation, and kinetic viscosity is big more; Thermal conductive insulation glue is not prone to the phenomenon of gummosis more in the process of pressing; Then can intensification, pressing time be shifted to an earlier date, heating rate is accelerated, pressurization also 10 ~ 30 minutes in advance; Thereby realize the pressing of fast pressure mode, reduce pressing time.
Under identical materials and appointed condition, adopt the pressing process of traditional lamination mode aspect production capacity, to be calculated as :=100 layers on 1 layer/dish of 10 X X, 10 dishes, the energy consumption aspect: every square meter need be used oily 0.7KG, electricity consumption 12.1 degree, 4 hours consuming time; And adopting the pressing process of lamination mode of the present invention aspect production capacity, to be calculated as :=160 layers on 2 layers/dish of 8 X X, 10 dishes, the energy consumption aspect: every square meter need use oily 0.4KG (to reduce 0.3KG/M
2), electricity consumption 7.1 degree (reduce by 5 degree/M
2), the mode of pressing soon presses formula between reality, to shorten 20 minutes before changing slowly, and every pressing one stove plate can produce 127 square meter pet wastes before improving in addition, has cancelled the use of PET film 14 after the improvement, thereby has reduced the pollution to environment.
Can find out that by above-mentioned data aluminium base copper-clad plate pressing process contrast traditional aluminum base copper-clad plate pressing process of the present invention is under the situation of identical device configuration; Improved production capacity; Cut down the consumption of energy, save resource, reduced pollution simultaneously environment; Have tangible progressive meaning, can widely popularize.
The above is merely preferential embodiment of the present invention, as long as realize that with basic identical means the technical scheme of the object of the invention all belongs within protection scope of the present invention.
Claims (5)
1. the pressing process of an aluminium base copper-clad plate is characterized in that comprising following processing step:
A. aluminium base is cleaned Passivation Treatment, dried;
B. coated with thermally conductive insulating cement on the aluminium base surface that in step a, obtains forms one deck heat conductive insulating layer;
C. the aluminium base that has applied the heat conductive insulating layer is carried out heat and roll preparatory combination;
D. cover aluminium base to Copper Foil and scribble the thermal conductive insulation glue one side, be combined to form the heating platen group through improved superimposed mode, under the condition of high temperature, vacuum and High Voltage, suppressed 50 ~ 80 minutes, process aluminium base copper-clad plate with the pressing steel plate;
Among the above-mentioned steps d, said improved superimposed mode is the sequential combination formation heating platen group by pressing steel plate, Copper Foil, aluminium base, aluminium base, Copper Foil, pressing steel plate.
2. the pressing process of a kind of aluminium base copper-clad plate according to claim 1, it is characterized in that: said steps d is that 740Hg/mm, pressure are the condition pressed of 250 ~ 500psi 160 ~ 200 ℃ high temperature, vacuum.
3. the pressing process of a kind of aluminium base copper-clad plate according to claim 1, it is characterized in that: the constituent of said thermal conductive insulation glue comprises modification high temperature phenolic resins 20 ~ 30%, aluminium oxide AL
2O
3Account for 50 ~ 60%, boron nitride BN accounts for 5 ~ 10%.
4. the pressing process of a kind of aluminium base copper-clad plate according to claim 3 is characterized in that: also comprise a spot of plasticizer and curing agent in the said thermal conductive insulation glue.
5. the pressing process of a kind of aluminium base copper-clad plate according to claim 1, it is characterized in that: the thickness range of said heat conductive insulating layer is at 60 ~ 210 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110265134.2A CN102407626B (en) | 2011-09-08 | 2011-09-08 | Pressing technology of aluminum base copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110265134.2A CN102407626B (en) | 2011-09-08 | 2011-09-08 | Pressing technology of aluminum base copper-clad plate |
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| CN102407626A true CN102407626A (en) | 2012-04-11 |
| CN102407626B CN102407626B (en) | 2015-07-15 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106113803A (en) * | 2016-06-16 | 2016-11-16 | 常州市超顺电子技术有限公司 | A kind of aluminum-based copper-clad plate and application thereof and preparation method |
| CN106548815A (en) * | 2016-10-14 | 2017-03-29 | 东莞理工学院 | A kind of large radius end plane angle is 45 degree of neutron-absorbing laminate manufacture craft |
| CN106739392A (en) * | 2016-12-08 | 2017-05-31 | 广东生益科技股份有限公司 | The method for cleaning hot press |
| CN107757061A (en) * | 2017-10-13 | 2018-03-06 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminium base vacuum hot-pressing process |
| CN112040659A (en) * | 2020-09-03 | 2020-12-04 | 陕西卫宁电子材料有限公司 | Preparation method of hole-plugging aluminum-based copper-clad plate and hole-plugging aluminum-based copper-clad plate |
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| CN1363460A (en) * | 2001-01-09 | 2002-08-14 | 中山市海粤科技发展总公司 | Copper foil covered Al-base plate and its making method |
| CN1970667A (en) * | 2006-11-09 | 2007-05-30 | 上海大学 | Preparation method of Al2O3/BN composite powder heat-conductive filler for heat-conductive adhesive |
| CN101068452A (en) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | Aluminium-based copper foil clad laminated board and producing technology |
| CN101418937A (en) * | 2007-10-23 | 2009-04-29 | 周广永 | A kind of LED illumination high heat radiation aluminium-based copper foil coated laminated plate and manufacturing process thereof |
-
2011
- 2011-09-08 CN CN201110265134.2A patent/CN102407626B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1363460A (en) * | 2001-01-09 | 2002-08-14 | 中山市海粤科技发展总公司 | Copper foil covered Al-base plate and its making method |
| CN1970667A (en) * | 2006-11-09 | 2007-05-30 | 上海大学 | Preparation method of Al2O3/BN composite powder heat-conductive filler for heat-conductive adhesive |
| CN101068452A (en) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | Aluminium-based copper foil clad laminated board and producing technology |
| CN101418937A (en) * | 2007-10-23 | 2009-04-29 | 周广永 | A kind of LED illumination high heat radiation aluminium-based copper foil coated laminated plate and manufacturing process thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106113803A (en) * | 2016-06-16 | 2016-11-16 | 常州市超顺电子技术有限公司 | A kind of aluminum-based copper-clad plate and application thereof and preparation method |
| CN106548815A (en) * | 2016-10-14 | 2017-03-29 | 东莞理工学院 | A kind of large radius end plane angle is 45 degree of neutron-absorbing laminate manufacture craft |
| CN106548815B (en) * | 2016-10-14 | 2017-12-26 | 东莞理工学院 | A kind of large radius end plane angle is 45 degree of neutron-absorbing laminate manufacture craft |
| CN106739392A (en) * | 2016-12-08 | 2017-05-31 | 广东生益科技股份有限公司 | The method for cleaning hot press |
| CN106739392B (en) * | 2016-12-08 | 2019-03-19 | 广东生益科技股份有限公司 | The method for cleaning hot press |
| CN107757061A (en) * | 2017-10-13 | 2018-03-06 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminium base vacuum hot-pressing process |
| CN107757061B (en) * | 2017-10-13 | 2018-11-27 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminum substrate vacuum hot-pressing process |
| CN112040659A (en) * | 2020-09-03 | 2020-12-04 | 陕西卫宁电子材料有限公司 | Preparation method of hole-plugging aluminum-based copper-clad plate and hole-plugging aluminum-based copper-clad plate |
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| Publication number | Publication date |
|---|---|
| CN102407626B (en) | 2015-07-15 |
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Effective date of registration: 20161122 Address after: Yonghe Economic Zone cloth Ling Road 510530 in Guangdong province Guangzhou City Economic and Technological Development Zone No. 135 building four floor Patentee after: Guangzhou Guiyu Photoelectric Material Science and Technology Co., Ltd Address before: 529700 Jiangmen, Guangdong province Taoyuan Zhen Zhen Peach Industrial Zone Patentee before: Heshan Dongli Electronic Technology Co.,Ltd. |