CN102407626B - Pressing technology of aluminum base copper-clad plate - Google Patents
Pressing technology of aluminum base copper-clad plate Download PDFInfo
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- CN102407626B CN102407626B CN201110265134.2A CN201110265134A CN102407626B CN 102407626 B CN102407626 B CN 102407626B CN 201110265134 A CN201110265134 A CN 201110265134A CN 102407626 B CN102407626 B CN 102407626B
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Abstract
The invention discloses a pressing technology of aluminum base copper-clad plate. The plate stacking mode used by the pressing technology is that a pressing steel plate, a copper foil, an aluminum base plate, an aluminum base plate, a copper foil and a pressing steel plate are combined into a hot press plate set, structurally the plates are stacked in a manner that the aluminum plates are close to each other and the copper foils are close to the steel plates, and two aluminum base copper-clad plates with copper foils clad on single faces can be pressed between the two pressing steel plates. Production capacity is effectively improved, the use of PET film is cancelled, resources are saved and environment pollution is reduced.
Description
Technical field
The present invention relates to a kind of production technology, particularly relate to a kind of pressing process of aluminum-based copper-clad plate.
Background technology
At present, the manufacturing process of aluminum-based copper-clad plate mainly comprises the following steps: process aluminium base, coat thermally conductive insulating layer and dry, place Copper Foil, vacuum hotpressing.Fig. 1 is that aluminum-based copper-clad plate carries out the situation of vacuum hotpressing at pressing machine, in Fig. 1, the structure of heating platen group 1 as shown in Figure 2, Fig. 2 is traditional lamination mode of the heating platen group 1 of single sided copper clad, heating platen group 1 is from top to bottom of five storeys altogether, comprise pressing steel plate, Copper Foil, the aluminium base scribbling thermally conductive insulating layer, PET film, pressing steel plate respectively, the aluminum-based copper-clad plate of one piece of single sided copper clad is only suppressed between two blocks of pressing steel plates, because aluminium base and pressing steel plate are all that rigid metallic plate easily scratches wearing and tearing, between aluminium base and pressing steel plate, one deck PET film is also set.Traditional pressing process production capacity of this aluminum-based copper-clad plate is lower, and pressing time is long, and energy consumption is large, and also can produce PET film waste material after pressing, both wastes resource, also contaminated environment.
In the pressing process of copper-clad plate, the openings of sizes due to pressing machine is fixing, make the production capacity of every stove cannot lean on change equipment arrange promote.Therefore need a kind of pressing process of aluminum-based copper-clad plate of improvement, to improve production capacity, reduce energy consumption.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of pressing process of aluminum-based copper-clad plate of improvement, improving production capacity, reduce energy consumption.
The technical solution adopted for the present invention to solve the technical problems is:
A pressing process for aluminum-based copper-clad plate, comprises following processing step:
A. aluminium base is cleaned, Passivation Treatment, dry process, remove impurity and the rusty stain on aluminium base surface;
B. the aluminium base obtained in step a cleans coated with thermally conductive insulating cement on dry surface, a kind of method in spraying, silk screen process, roller coating or multiple methods combining can be adopted to use, solve the thickness control problem of thermally conductive insulating layer, form the uniform thermally conductive insulating layer of a layer thickness, the thickness range of thermally conductive insulating layer is at 60 ~ 210 μm, and thickness can regulate and control as required;
C. heat is carried out to the aluminium base being coated with thermally conductive insulating layer and roll pre-assembled, make thermally conductive insulating layer be semi-solid preparation shape and aluminium base fits tightly;
D. Copper Foil is covered aluminium base and scribble thermal conductive insulation glue one side, undertaken being combined to form heating platen group by the congruent manner improved with pressing steel plate, the high temperature of 160 ~ 200 DEG C, vacuum be 740Hg/mm, pressure carries out compacting 50 ~ 80 minutes under being the condition of 250 ~ 500psi, makes aluminum-based copper-clad plate;
In above-mentioned steps d, the congruent manner of described improvement refers to the sequential combination formation heating platen group by pressing steel plate, Copper Foil, aluminium base, aluminium base, Copper Foil, pressing steel plate, be exactly structurally that aluminium sheet is by aluminium sheet, Copper Foil is by the mode lamination of steel plate, the aluminum-based copper-clad plate of two pieces of single sided copper clad can be suppressed between two blocks of pressing steel plates, effectively improve production capacity, and eliminate the use of PET film, saving resource, decreases the pollution to environment.
The invention has the beneficial effects as follows: process of the present invention is changed the lamination mode that compacting aluminum-based copper-clad plate is, make the aluminum-based copper-clad plate suppressing two pieces of single sided copper clad between every two blocks of pressing steel plates, eliminate the use of PET film simultaneously, contrast traditional handicraft, when identical device configures, improve production capacity, reduce costs, decrease the pollution to environment simultaneously.
As the further improvement of such scheme, the constituent of described thermal conductive insulation glue comprises modification high temperature phenolic resins 20 ~ 30%, aluminium oxide AL
2o
3account for 50 ~ 60%, boron nitride BN accounts for 5 ~ 10%, also comprise a small amount of plasticizer and curing agent, the kinetic viscosity that the kinetic viscosity of the thermal conductive insulation glue be mixed to get by said ratio contrasts common synthetic resin obviously increases, kinetic viscosity and the pressing programming of thermal conductive insulation glue have direct relation, kinetic viscosity is larger, and the phenomenon of gummosis more not easily appears in thermal conductive insulation glue in the process of pressing, then intensification, pressing time can be shifted to an earlier date, thus realize the pressing of fast pressure mode, reduce pressing time.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the schematic diagram that aluminum-based copper-clad plate carries out at pressing machine suppressing;
Lamination schematic diagram when Fig. 2 is traditional aluminum-based copper-clad plate compacting;
Lamination schematic diagram when Fig. 3 is aluminum-based copper-clad plate of the present invention compacting.
Shown by reference numeral is: 1, heating platen group, 2, pressing machine framework, 3, upper plate, 4, lower roof plate, 5, oil cylinder, 6, petroleum pipeline, 11, aluminium base, 12, Copper Foil, 13, pressing steel plate, 14, PET film.
Detailed description of the invention
With reference to Fig. 1, Fig. 3, the pressing process of a kind of aluminum-based copper-clad plate of the present invention, comprises following processing step: a. cleans aluminium base 11, Passivation Treatment, dry process, removes impurity and the rusty stain on aluminium base 11 surface; B. coated with thermally conductive insulating cement on the clean dry surface of aluminium base 11 obtained in step a, a kind of method in spraying, silk screen process, roller coating or multiple methods combining can be adopted to use, solve the thickness control problem of thermally conductive insulating layer, form the uniform thermally conductive insulating layer of a layer thickness, the thickness range of thermally conductive insulating layer is at 60 ~ 210 μm, and thickness can regulate and control as required; C. heat is carried out to the aluminium base 11 being coated with thermally conductive insulating layer and roll pre-assembled, make thermally conductive insulating layer be semi-solid preparation shape and aluminium base 11 fits tightly; D. Copper Foil 12 is covered aluminium base 11 and scribble thermal conductive insulation glue one side, aluminium base 11, Copper Foil 12 and pressing steel plate 13 click the superimposed composition heating platen group of order: pressing steel plate 13, Copper Foil 12, aluminium base 11, aluminium base 11, Copper Foil 12, pressing steel plate 13, polydisc heating platen group carries out pressing simultaneously in pressing machine, the high temperature of 160 ~ 200 DEG C, vacuum be 740Hg/mm, pressure be the condition of 250 ~ 500psi under compacting 50 ~ 80 minutes, make aluminum-based copper-clad plate.
Further, the constituent of described thermal conductive insulation glue comprises modification high temperature phenolic resins 20 ~ 30%, aluminium oxide AL
2o
3account for 50 ~ 60%, boron nitride BN accounts for 5 ~ 10%, also comprise a small amount of plasticizer and curing agent, the kinetic viscosity of the thermal conductive insulation glue be mixed to get by said ratio can reach 3000 ~ 5000Pa.s, kinetic viscosity 500 ~ the 1000Pa.s contrasting common synthetic resin obviously increases, and the kinetic viscosity of thermal conductive insulation glue and pressing programming have direct relation, kinetic viscosity is larger, the phenomenon of gummosis is more not easily there is in thermal conductive insulation glue in the process of pressing, then can will heat up, pressing time in advance, heating rate is accelerated, pressurization also 10 ~ 30 minutes in advance, thus realize the pressing of fast pressure mode, reduce pressing time.
Under identical material and appointed condition, the pressing process of traditional lamination mode is adopted to be calculated as in production capacity: 10 X 1 layer/dish X 10 coils=and 100 layers, energy consumption aspect: every square meter need use oily 0.7KG, electricity consumption 12.1 degree, 4 hours consuming time; And adopt the pressing process of lamination mode of the present invention to be calculated as in production capacity: 8 X 2 layers/dish X 10 coils=and 160 layers, energy consumption aspect: every square meter need reduce 0.3KG/M with oily 0.4KG(
2), electricity consumption 7.1 degree (reduces by 5 degree/M
2), fast pressure mode shortens 20 minutes on pressure formula slow before change is between reality, and before separately improving, every pressing one stove plate can produce 127 square meter pet wastes, eliminates the use of PET film 14, thus decrease the pollution to environment after improvement.
As can be seen from the above data, aluminum-based copper-clad plate pressing process of the present invention contrasts traditional aluminum-based copper-clad plate pressing process, when identical device configures, improve production capacity, reduce energy consumption, saving resource, decreases the pollution to environment simultaneously, there is significantly progressive meaning, can widely popularize.
The foregoing is only preferred embodiments of the present invention, as long as the technical scheme realizing the object of the invention with basic same approach all belongs within protection scope of the present invention.
Claims (4)
1. a pressing process for aluminum-based copper-clad plate, is characterized in that comprising following processing step:
A. aluminium base is cleaned, Passivation Treatment, dry process;
B. the aluminium base obtained in step a is coated with thermally conductive insulating cement on the surface, forms one deck thermally conductive insulating layer;
C. heat is carried out to the aluminium base being coated with thermally conductive insulating layer and roll pre-assembled;
D. Copper Foil is covered aluminium base and scribble thermal conductive insulation glue one side, undertaken being combined to form heating platen group by the congruent manner improved with pressing steel plate, the high temperature of 160 ~ 200 DEG C, vacuum be 740Hg/mm, pressure carries out compacting 50 ~ 80 minutes under being the condition of 250 ~ 500psi, makes aluminum-based copper-clad plate;
In above-mentioned steps d, the congruent manner of described improvement forms heating platen group by the sequential combination of pressing steel plate, Copper Foil, aluminium base, aluminium base, Copper Foil, pressing steel plate.
2. the pressing process of a kind of aluminum-based copper-clad plate according to claim 1, is characterized in that: the constituent of described thermal conductive insulation glue comprises modification high temperature phenolic resins 20 ~ 30%, aluminium oxide AL
2o
3account for 50 ~ 60%, boron nitride BN accounts for 5 ~ 10%.
3. the pressing process of a kind of aluminum-based copper-clad plate according to claim 2, is characterized in that: also comprise a small amount of plasticizer and curing agent in described thermal conductive insulation glue.
4. the pressing process of a kind of aluminum-based copper-clad plate according to claim 1, is characterized in that: the thickness range of described thermally conductive insulating layer is at 60 ~ 210 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110265134.2A CN102407626B (en) | 2011-09-08 | 2011-09-08 | Pressing technology of aluminum base copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110265134.2A CN102407626B (en) | 2011-09-08 | 2011-09-08 | Pressing technology of aluminum base copper-clad plate |
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| Publication Number | Publication Date |
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| CN102407626A CN102407626A (en) | 2012-04-11 |
| CN102407626B true CN102407626B (en) | 2015-07-15 |
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| CN201110265134.2A Active CN102407626B (en) | 2011-09-08 | 2011-09-08 | Pressing technology of aluminum base copper-clad plate |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106113803A (en) * | 2016-06-16 | 2016-11-16 | 常州市超顺电子技术有限公司 | A kind of aluminum-based copper-clad plate and application thereof and preparation method |
| CN106548815B (en) * | 2016-10-14 | 2017-12-26 | 东莞理工学院 | A kind of large radius end plane angle is 45 degree of neutron-absorbing laminate manufacture craft |
| CN106739392B (en) * | 2016-12-08 | 2019-03-19 | 广东生益科技股份有限公司 | The method for cleaning hot press |
| CN107757061B (en) * | 2017-10-13 | 2018-11-27 | 乾乐欣展新材料技术（上海）有限公司 | A kind of aluminum substrate vacuum hot-pressing process |
| CN112040659A (en) * | 2020-09-03 | 2020-12-04 | 陕西卫宁电子材料有限公司 | Preparation method of hole-plugging aluminum-based copper-clad plate and hole-plugging aluminum-based copper-clad plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1363460A (en) * | 2001-01-09 | 2002-08-14 | 中山市海粤科技发展总公司 | Copper foil covered Al-base plate and its making method |
| CN1970667A (en) * | 2006-11-09 | 2007-05-30 | 上海大学 | Preparation method of Al2O3/BN composite powder heat-conductive filler for heat-conductive adhesive |
| CN101068452A (en) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | Aluminium-based copper foil clad laminated board and producing technology |
| CN101418937A (en) * | 2007-10-23 | 2009-04-29 | 周广永 | A kind of LED illumination high heat radiation aluminium-based copper foil coated laminated plate and manufacturing process thereof |
-
2011
- 2011-09-08 CN CN201110265134.2A patent/CN102407626B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1363460A (en) * | 2001-01-09 | 2002-08-14 | 中山市海粤科技发展总公司 | Copper foil covered Al-base plate and its making method |
| CN1970667A (en) * | 2006-11-09 | 2007-05-30 | 上海大学 | Preparation method of Al2O3/BN composite powder heat-conductive filler for heat-conductive adhesive |
| CN101068452A (en) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | Aluminium-based copper foil clad laminated board and producing technology |
| CN101418937A (en) * | 2007-10-23 | 2009-04-29 | 周广永 | A kind of LED illumination high heat radiation aluminium-based copper foil coated laminated plate and manufacturing process thereof |
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| CN102407626A (en) | 2012-04-11 |
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Effective date of registration: 20161122 Address after: Yonghe Economic Zone cloth Ling Road 510530 in Guangdong province Guangzhou City Economic and Technological Development Zone No. 135 building four floor Patentee after: Guangzhou Guiyu Photoelectric Material Science and Technology Co., Ltd Address before: 529700 Jiangmen, Guangdong province Taoyuan Zhen Zhen Peach Industrial Zone Patentee before: Heshan Dongli Electronic Technology Co.,Ltd. |