CN2369457Y - Improved pressed pad - Google Patents
Improved pressed pad Download PDFInfo
- Publication number
- CN2369457Y CN2369457Y CN 99201071 CN99201071U CN2369457Y CN 2369457 Y CN2369457 Y CN 2369457Y CN 99201071 CN99201071 CN 99201071 CN 99201071 U CN99201071 U CN 99201071U CN 2369457 Y CN2369457 Y CN 2369457Y
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- CN
- China
- Prior art keywords
- layer
- utility
- model
- pressing
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model relates to a pressing pad with an improved structure, particularly a pad product used for pressing a multi-layer circuit board. The effect is that the utility model is used for preventing pressed products from generating crack wrinkles and gap air bubbles. The utility model is composed of two surfaces of an inner layer respectively provided with a middle layer and an outer layer. The inner layer is a rubber layer with high temperature resistance, good recovering coefficient and uniform density distribution and the middle layer is a fiber layer of high temperature resistance. An outermost layer is a metal layer with good heat conduction performance, such as a copper foil. The utility model has the advantages that the utility model can be repeatedly used for pressing the multi-layer circuit board to display the effect of cost reduction, the utility model can obtain stable temperature rise curve to prevent explosion and the utility model is particularly suitable for the working environment of a room without dust.
Description
Employed sark when the utility model relates to the pressing multilayer circuit board refers to a kind of pressing pad especially.
The employed sark of pressing multilayer circuit board commonly used is to be overlapping in simultaneously between circuit board and the Heat sealer with tens of brown paper, though the buffering effect that can acquire a certain degree, but no all roses, still often produce bad product, and very difficult its fraction defective of further control; In addition, the brown paper after using once because of the result who is subjected to high temperature weight also changes into fragment, causes and can't utilize once more, and belongs to the working method that extremely expends cost.
The purpose of this utility model is to provide a kind of pressing pad that improves structure at deficiency of the prior art, make and use the benefit that reduces cost with performance when being enough to the pressing multilayer circuit board is provided repeatedly, and can reach stable temperature rise curve preventing explosion, and be specially adapted to the operational environment of dust free room.
In order to achieve the above object, a kind of pressing pad that improves structure of the utility model, it is characterized in that: establish intermediate layer and outer the composition respectively by the nexine two sides, wherein nexine is high temperature resistant and the good and uniform rubber layer of density distribution of recovery coefficient, the intermediate layer then is resistant to elevated temperatures fibrage, and outermost layer is to be the good metal level of heat conductivity.
Described metal level is a Copper Foil.
A kind of pressing pad that improves structure of the utility model, adhere to three layers separately according to its structural analysis, rubber layer by the innermost layer begins, promptly be special requirement its to have a recovery coefficient good, density distribution evenly reaches resistant to elevated temperatures characteristic, and the fibrolaminar effect in intermediate layer is to keep and strengthen the elasticity and the life-span of overall combination of materials, outermost metal level in addition, then be generally Copper Foil, because of its heat conductivity good, and, can guarantee the same effect of using next time that obtains easily with the oil stain and the dunghill on alcohol wipe surface.
A kind of pressing pad that improves structure of the utility model, according to its material analysis, belong to special making of specific purposes institute, therefore its thickness is even, and density is even, can use repeatedly to reduce cost, the most suitable easy to operate automated job, can reach stable temperature rise curve, can make temperature and pressure distribution even, reach environment applicable to dust free room.
A kind of pressing pad that improves structure of the utility model, use efficiency analysis according to it, can improve by the problem of pressing circuit board uneven thickness, can improve the not enough problem of Tg point (melting point), can improve the problem of plate bursting, can improve the problem of pink circle (inequality of being heated), can improve the problem of pressing fold, and can improve the problem that the paper fiber causes different spy in the plate.
For enabling to understand more structure of the present utility model and effect, conjunction with figs. is respectively described below now:
The simple declaration of accompanying drawing:
Fig. 1 is that staple is implemented illustration;
Fig. 2 is the utility model structure cutaway view.
Seeing also Fig. 1 is that staple is implemented illustration, wherein by the heat of Heat sealer coil 11 belows in advance pad cover one deck steel plate 12, follow by one deck layers of kraft paper 13, connecing next is to be commonly called as four laminates, promptly is ground floor circuit board to be laminated, wherein be to comprise Copper Foil 14, PP glue 15 (viscose glue), substrate 16, PP glue 15, Copper Foil 14, the below then is a base 17; Certainly this treats that the volt circuit plate can be simultaneously with several pieces superimposed back hot pressings, at this moment, employed sark layers of kraft paper 13 will because of hot pressing so can't be connected in again next time and to use, therefore promptly expend sizable manpower and material resources for handling this sark, very and be not handy, so should indeed be improved.
Seeing also Fig. 2 is structure cutaway view of the present utility model, as seen from the figure, the utility model is established intermediate layer and outer the composition respectively by the nexine two sides, wherein nexine is to be high temperature resistant and the good and uniform rubber layer 21 of density distribution of recovery coefficient, the intermediate layer then is resistant to elevated temperatures fibrage 22, outermost layer is for the good metal level 23 of heat conductivity, as copper foil layer; So constitute structure of the present utility model, and use the benefit that reduces cost with performance repeatedly when being enough to the pressing multilayer circuit board is provided, and can reach stable temperature rise curve preventing explosion, and be specially adapted to the operational environment of dust free room.
Claims (2)
1, a kind of pressing pad that improves structure, it is characterized in that: establish intermediate layer and outer the composition respectively by the nexine two sides, wherein nexine is high temperature resistant and the good and uniform rubber layer of density distribution of recovery coefficient, and the intermediate layer then is resistant to elevated temperatures fibrage, and outermost layer is to be the good metal level of heat conductivity.
2, the pressing pad of improvement structure according to claim 1 is characterized in that: described metal level is a Copper Foil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 99201071 CN2369457Y (en) | 1999-01-27 | 1999-01-27 | Improved pressed pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 99201071 CN2369457Y (en) | 1999-01-27 | 1999-01-27 | Improved pressed pad |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2369457Y true CN2369457Y (en) | 2000-03-15 |
Family
ID=33996927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 99201071 Expired - Fee Related CN2369457Y (en) | 1999-01-27 | 1999-01-27 | Improved pressed pad |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2369457Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102573306A (en) * | 2012-01-09 | 2012-07-11 | 苏州艾迪亚电子科技有限公司 | Method for producing outer-layer semi-pressing plate |
CN105072829A (en) * | 2015-08-21 | 2015-11-18 | 昆山大洋电路板有限公司 | Thick copper plate single-sided pressing process |
CN106113805A (en) * | 2016-08-12 | 2016-11-16 | 常州拓达绝热材料有限公司 | Copper-clad plate lamination cushion pad |
-
1999
- 1999-01-27 CN CN 99201071 patent/CN2369457Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102573306A (en) * | 2012-01-09 | 2012-07-11 | 苏州艾迪亚电子科技有限公司 | Method for producing outer-layer semi-pressing plate |
CN105072829A (en) * | 2015-08-21 | 2015-11-18 | 昆山大洋电路板有限公司 | Thick copper plate single-sided pressing process |
CN106113805A (en) * | 2016-08-12 | 2016-11-16 | 常州拓达绝热材料有限公司 | Copper-clad plate lamination cushion pad |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |