CN106739392B - The method for cleaning hot press - Google Patents
The method for cleaning hot press Download PDFInfo
- Publication number
- CN106739392B CN106739392B CN201611121996.7A CN201611121996A CN106739392B CN 106739392 B CN106739392 B CN 106739392B CN 201611121996 A CN201611121996 A CN 201611121996A CN 106739392 B CN106739392 B CN 106739392B
- Authority
- CN
- China
- Prior art keywords
- plate
- metal plate
- impurity
- heating plate
- hot press
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
The present invention discloses a kind of method for cleaning hot press, comprising: metal plate is placed between the heating plate for being attached with impurity, wherein the thermal expansion coefficient of the metal plate is greater than the thermal expansion coefficient of the heating plate；Start hot press, hot pressing is carried out to metal plate；Metal plate is taken out.The present invention provides a kind of method for cleaning hot press, can fast and effeciently remove the residual impurity in the heating plate of hot press.
Description
Technical field
The present invention relates to hot press production and processing technical field more particularly to a kind of methods for cleaning hot press.
Background technique
Hot press is mainly used for heating, pressurization prepreg and copper foil, and prepreg and copper foil is made to be shaped to copper-clad plate.?
During hot briquetting, the small molecule of prepreg can be evaporated, and the small molecule partially evaporated can be adhered to hot pressing
In the heating plate of machine, referred to as impurity.It accumulates over a long period, the small molecule of adherency is more and more.And due to often in high temperature height
In the state of pressure, some can be carbonized these impurity, be adhere strongly in the heating plate of hot press, form hot pressing high pressure
Area will affect thickness of compressive plate and substrate mass when serious.
The method of current cleaning impurity is mainly manually scalped the small-molecule substance of adherency or carbon slag using perching knife,
But manual work, not only inefficiency, and also it is ineffective.Furthermore heating plate is easily damaged using perching knife.
Summary of the invention
It is an object of the present invention to: a kind of method cleaning hot press is provided, hot press is fast and effeciently removed
Residual impurity in heating plate.
To achieve this purpose, the present invention adopts the following technical scheme:
A method of cleaning hot press, including,
S10: metal plate is placed between the heating plate for being attached with impurity, wherein the thermal expansion coefficient of the metal plate is big
In the thermal expansion coefficient of the heating plate；
S20: starting hot press carries out hot pressing to metal plate；
S30: metal plate is taken out.
Specifically, when start hot press to metal plate carry out hot pressing when, it is microcosmic on, the original on the surface of heating plate and metal plate
It is big when sub- gap is compared with room temperature.Close to heating plate side impurity some can enter heating plate heating after atom gap
In, close to metal plate side impurity some can enter metal plate heating after atom gap in.When heating plate and gold
After the temperature decline for belonging to plate, the atom gap on the surface of heating plate and metal plate reduces, and enters the surface of heating plate originally
Atom gap in impurity heat up board clamping, enter the impurity in the atom gap on the surface of metal plate just by metal
Board clamping.Since the thermal expansion coefficient of metal plate is greater than the thermal expansion coefficient of heating plate, so after heating between the atom of metal plate
Gap is larger, and the impurity entered in metal plate is more, after temperature decline, the firmness that is combined between metal plate and impurity
It is greater than the firmness combined between heating plate and impurity.So metal plate can be impurity together when metal plate is taken out
It takes away, realizes the separation of impurity and heating plate.
Further, in S10: the thickness of metal plate is more than or equal to the thickness of impurity.
Specifically, in order to allow metal plate atom between can produce enough gaps to accommodate impurity, and in order to meet heat
The operating condition of press guarantees the hot pressing effect to metal plate, so the thickness of metal plate should be more than or equal to impurity
Thickness.It is designed in this way the elimination effect that can effectively improve metal plate to impurity.
Further, the S20 specifically: starting hot press heats heating plate and metal plate, when heating plate and
After the temperature of metal plate reaches set temperature, pressed.
Specifically, after heating plate and metal plate are heated to set temperature, the surface of heating plate and metal plate is generated
Biggish atom gap, is pressed at this time, can make close to heating plate side impurity some enter heating plate liter
In gap after temperature, can also make close to metal plate side impurity some enter metal plate heating after gap in.
Further, the set temperature is less than the carburizing temperature of impurity.
Specifically, if set temperature is higher than the carburizing temperature of impurity, impurity will be carbonized, and generate exhaust gas, and impurity can also
Become excessively loose due to carbonization, be easy tomography division, is difficult to make impurity and heating by the thermal expansion and cold contraction effect of metal plate
Plate is detached from.
Further, between the S20 and S30 further include:
S21: cooling heating plate and metal plate.
Specifically, after heating plate and the decline of the temperature of metal plate, the atom gap on the surface of heating plate and metal plate
Reduce, the impurity entered in the atom gap on the surface of heating plate originally heats up board clamping, enters metal plate
Impurity in the atom gap on surface is just by metal board clamping.
As a preferred embodiment, the difference of the thermal expansion coefficient between the heating plate and the metal plate is big
In or equal to 5.0 × 10-6/℃。
Specifically, the difference of thermal expansion coefficient between the heating plate and the metal plate is bigger, removes the effect of impurity
Fruit is better, cleans cleaner.It is proved by many experiments, when the thermal expansion system between the heating plate and the metal plate
Several differences is more than or equal to 5.0 × 10-6/ DEG C when, impurity can be substantially achieved removing, almost without residual.
Further, the difference of the thermal expansion coefficient between the heating plate and the metal plate is 11 × 10-6/℃。
Specifically, it is proved by many experiments, when the difference of the thermal expansion coefficient between the heating plate and the metal plate
Value is 11 × 10-6/ DEG C when, impurity can be removed completely, not remain.
As a preferred embodiment, the heating plate is iron plate, the metal plate is aluminium sheet.
As a preferred embodiment, the metal plate is magnesium plate it is characterized in that, the heating plate is iron plate.
As a preferred embodiment, the metal plate is cadmium plate it is characterized in that, the heating plate is manganese plate.
As a preferred embodiment, the pressing-in temp between metal plate and heating plate is room temperature to 450 DEG C.
As a preferred embodiment, the pressing pressure between metal plate and heating plate is 5kg/cm2~60kg/
cm2。
The invention has the benefit that providing a kind of method for cleaning hot press, pass through the thermal expansion coefficient using material
Difference, fast and effeciently remove hot press heating plate on residual impurity.
Detailed description of the invention
The present invention will be further described in detail below based on the drawings and embodiments.
Fig. 1 is the method block diagram that hot press is cleaned described in embodiment.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
A method of cleaning hot press comprising:
S10: metal plate is placed between the heating plate for being attached with impurity, wherein the thermal expansion coefficient of metal plate, which is greater than, to be added
The thermal expansion coefficient of hot plate, and the thickness of metal plate is more than or equal to the thickness of impurity；
S20: starting hot press heats heating plate and metal plate, sets when the temperature of heating plate and metal plate reaches
After determining temperature, pressed；
S21: cooling heating plate and metal plate；
S30: metal plate is taken out.
When start hot press to metal plate carry out hot pressing when, it is microcosmic on, the atom gap on the surface of heating plate and metal plate
It is big when compared with room temperature.Some can enter in the atom gap after heating plate heating the impurity of the side of close heating plate, close
The impurity of the side of metal plate some can enter metal plate heating after atom gap in.When the temperature of heating plate and metal plate
After degree decline, the atom gap on the surface of heating plate and metal plate reduces, and is entered between the atom on the surface of heating plate originally
Impurity in gap heats up board clamping, enters the impurity in the atom gap on the surface of metal plate just by metal board clamping.
Since the thermal expansion coefficient of metal plate is greater than the thermal expansion coefficient of heating plate, so the atom gap of metal plate is larger after heating,
The impurity entered in metal plate is more, and after temperature decline, the firmness combined between metal plate and impurity is greater than
The firmness combined between heating plate and impurity.So metal plate can take away together impurity when metal plate is taken out, it is real
The separation of existing impurity and heating plate.
In order to allow metal plate atom between can produce enough gaps to accommodate impurity, and in order to meet the work of hot press
Make condition, guarantee the hot pressing effect to metal plate, so the thickness of metal plate should be more than or equal to the thickness of impurity.So
Design can effectively improve metal plate to the elimination effect of impurity.
In S20, set temperature is less than the carburizing temperature of impurity.If set temperature is higher than the carburizing temperature of impurity, miscellaneous
Matter will be carbonized, and generate exhaust gas, and impurity can also become excessively loose due to carbonization, be easy tomography division, pass through metal plate
Thermal expansion and cold contraction effect is difficult to be detached from impurity and heating plate.
In this present embodiment, heating plate is iron plate, and thermal expansion coefficient is 12.2 × 10-6/℃；Metal plate is aluminium sheet,
Thermal expansion coefficient is 23.2 × 10-6/ DEG C, impurity can be removed completely, not remain.It is of course also possible to which heating plate is set as
Iron plate, thermal expansion coefficient are 12.2 × 10-6/℃；Metal plate is set as silver plate, thermal expansion coefficient is 19.5 × 10-6/ DEG C,
Impurity can be substantially achieved removing, almost without residual.Heating plate can also be set as iron plate, thermal expansion coefficient is 12.2 ×
10-6/℃；Metal plate is set as magnesium plate, thermal expansion coefficient is 26.0 × 10-6/ DEG C, impurity can be removed completely, not residual
It stays.Heating plate can also be set as manganese plate, thermal expansion coefficient is 23.0 × 10-6/℃；Metal plate is set as cadmium plate, heat is swollen
Swollen coefficient is 41.0 × 10-6/ DEG C, impurity can be removed completely, not remain.Heating plate can also be set as iron plate, heat
The coefficient of expansion is 12.2 × 10-6/℃；Metal plate is set as alfer plate, thermal expansion coefficient is 17.2 × 10-6/ DEG C, it is miscellaneous
Mass-energy is substantially achieved removing, almost without residual.
Difference of thermal expansion coefficient between heating plate and metal plate is bigger, and the effect for removing impurity is better, and removal of impurities is just
It is cleaner.It is proved by many experiments, when the difference of the thermal expansion coefficient between heating plate and metal plate is more than or equal to 5.0
×10-6/ DEG C when, impurity can be substantially achieved removing, almost without residual.And when the thermal expansion system between heating plate and metal plate
Several differences is 11 × 10-6/ DEG C when, impurity can be removed completely, not remain.
In this present embodiment, when heating plate and metal plate press, pressing-in temp is 400 DEG C, pressing pressure 30kg/cm2。
In other embodiments, according to the physical attribute of different metal plate and heating plate, pressing-in temp can also be in room temperature to 450 DEG C
Between selected, pressing pressure can be in 5kg/cm2~60kg/cm2Between selected.
It is to be understood that above-mentioned specific embodiment is only that presently preferred embodiments of the present invention and institute's application technology are former
Reason, within the technical scope of the present disclosure, variation that anyone skilled in the art is readily apparent that or
Replacement, should be covered by the scope of protection of the present invention.
Claims (5)
1. a kind of method for cleaning hot press, which is characterized in that
S10: placing metal plate between the heating plate for being attached with impurity, and the thickness of the metal plate is more than or equal to described miscellaneous
The thickness of matter, wherein the thermal expansion coefficient of the metal plate is greater than the thermal expansion coefficient of the heating plate, the heating plate and institute
The difference for stating the thermal expansion coefficient between metal plate is more than or equal to 5.0 × 10-6/℃；
S20: starting hot press heats the heating plate and the metal plate, when the heating plate and the metal plate
Temperature reach set temperature after, pressed, the set temperature be less than the impurity carburizing temperature；
S21: the cooling heating plate and the metal plate；
S30: the metal plate is taken out.
2. the method for cleaning hot press according to claim 1, which is characterized in that the heating plate and the metal plate it
Between thermal expansion coefficient difference be 11 × 10-6/℃。
3. the method for cleaning hot press according to claim 1, which is characterized in that the heating plate is iron plate, the gold
Category plate is aluminium sheet.
4. the method for cleaning hot press according to claim 1, which is characterized in that the heating plate is iron plate, the gold
Category plate is magnesium plate.
5. the method for cleaning hot press according to claim 1, which is characterized in that the heating plate is manganese plate, the gold
Category plate is cadmium plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611121996.7A CN106739392B (en) | 2016-12-08 | 2016-12-08 | The method for cleaning hot press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611121996.7A CN106739392B (en) | 2016-12-08 | 2016-12-08 | The method for cleaning hot press |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106739392A CN106739392A (en) | 2017-05-31 |
| CN106739392B true CN106739392B (en) | 2019-03-19 |
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ID=58881447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611121996.7A Active CN106739392B (en) | 2016-12-08 | 2016-12-08 | The method for cleaning hot press |
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| Country | Link |
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| CN (1) | CN106739392B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102407626A (en) * | 2011-09-08 | 2012-04-11 | 鹤山东力电子科技有限公司 | Pressing technology of aluminum base copper-clad plate |
| CN103429014A (en) * | 2013-07-31 | 2013-12-04 | 深圳市博敏电子有限公司 | Multilayer board lamination device |
| CN203843951U (en) * | 2014-05-19 | 2014-09-24 | 云南司珈尔木业股份有限公司 | Hot press for density boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036070A (en) * | 2012-08-08 | 2014-02-24 | Hitachi High-Tech Control Systems Corp | Minienvironment and temperature control method thereof |
-
2016
- 2016-12-08 CN CN201611121996.7A patent/CN106739392B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102407626A (en) * | 2011-09-08 | 2012-04-11 | 鹤山东力电子科技有限公司 | Pressing technology of aluminum base copper-clad plate |
| CN103429014A (en) * | 2013-07-31 | 2013-12-04 | 深圳市博敏电子有限公司 | Multilayer board lamination device |
| CN203843951U (en) * | 2014-05-19 | 2014-09-24 | 云南司珈尔木业股份有限公司 | Hot press for density boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106739392A (en) | 2017-05-31 |
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