CN106739392A - The method for cleaning hot press - Google Patents
The method for cleaning hot press Download PDFInfo
- Publication number
- CN106739392A CN106739392A CN201611121996.7A CN201611121996A CN106739392A CN 106739392 A CN106739392 A CN 106739392A CN 201611121996 A CN201611121996 A CN 201611121996A CN 106739392 A CN106739392 A CN 106739392A
- Authority
- CN
- China
- Prior art keywords
- plate
- metallic plate
- hot press
- impurity
- heating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
The present invention discloses a kind of method for cleaning hot press, including：Metallic plate is placed between the heating plate for being attached with impurity, wherein, the thermal coefficient of expansion of the thermal coefficient of expansion more than the heating plate of the metallic plate；Start hot press, hot pressing is carried out to metallic plate；Metallic plate is taken out.The present invention provides a kind of method for cleaning hot press, can fast and effeciently remove the residual impurity in the heating plate of hot press.
Description
Technical field
The present invention relates to hot press production and processing technical field, more particularly to a kind of method for cleaning hot press.
Background technology
Hot press is mainly used in heating, pressurizeing prepreg and Copper Foil, prepreg and Copper Foil is shaped to copper-clad plate.
During hot briquetting, the small molecule of prepreg can be evaporated, and the small molecule for partly evaporating can stick to hot pressing
In the heating plate of machine, referred to as impurity.Accumulate over a long period, the small molecule of adhesion is more and more.And due to high often in high temperature
In the state of pressure, some can be carbonized these impurity, be adhere strongly in the heating plate of hot press, form hot pressing high pressure
Area, can influence thickness of compressive plate and substrate mass when serious.
The method of current cleaning impurity is mainly manually is scalped the small-molecule substance of adhesion or carbon slag using perching knife,
But manual work, not only inefficiency, and effect on driving birds is not good.Furthermore, heating plate is easily damaged using perching knife.
The content of the invention
It is an object of the present invention to：A kind of method for cleaning hot press is provided, hot press is fast and effeciently removed
Residual impurity in heating plate.
It is that, up to this purpose, the present invention uses following technical scheme：
A kind of method for cleaning hot press, including,
S10：Metallic plate is placed between the heating plate for being attached with impurity, wherein, the thermal coefficient of expansion of the metallic plate is big
In the thermal coefficient of expansion of the heating plate；
S20：Start hot press, hot pressing is carried out to metallic plate；
S30：Metallic plate is taken out.
Specifically, when start hot press hot pressing is carried out to metallic plate when, it is microcosmic on, the original on the surface of heating plate and metallic plate
It is big when sub- gap is compared with normal temperature.Near some atom gap after being heated up into heating plate of the impurity of the side of heating plate
In, in some atom gap after being heated up into metallic plate of the impurity of the side of metallic plate.When heating plate and gold
Belong to after the temperature drop of plate, the atom gap on the surface of heating plate and metallic plate reduces, and the surface of heating plate is entered into originally
Atom gap in impurity heat up board clamping, the impurity in the atom gap on the surface for entering into metallic plate is just by metal
Board clamping.Due to the thermal coefficient of expansion of the thermal coefficient of expansion more than heating plate of metallic plate, so after heating up between the atom of metallic plate
Gap is larger, and the impurity entered into metallic plate is more, after temperature drop, the firmness combined between metallic plate and impurity
It is greater than the firmness combined between heating plate and impurity.So when metallic plate is taken out, metallic plate can be impurity in the lump
Take away, realize that impurity is separated with heating plate.
Further, in S10：Thickness of the thickness of metallic plate more than or equal to impurity.
Specifically, in order to allow metallic plate atom between can produce enough gaps to accommodate impurity, and in order to meet heat
The condition of work of press, it is ensured that to the hot pressing effect of metallic plate, so the thickness of metallic plate should be more than or equal to impurity
Thickness.Being so designed that can effectively improve elimination effect of the metallic plate to impurity.
Further, the S20 is specially：Start hot press, heating plate and metallic plate heated, when heating plate and
After the temperature of metallic plate reaches design temperature, pressed.
Specifically, it is heated to after design temperature when heating plate and metallic plate, the surface of heating plate and metallic plate produces
Larger atom gap, is now pressed, can just make the side for being close to heating plate impurity some enter heating plate liter
In gap after temperature, can also make to be close in some gap after being heated up into metallic plate of the impurity of the side of metallic plate.
Further, carburizing temperature of the design temperature less than impurity.
Specifically, if design temperature is higher than the carburizing temperature of impurity, impurity will be carbonized, and produce waste gas, impurity can also
Become excessively loose due to carbonization, easy tomography division is difficult to make impurity with heating by the effect of expanding with heat and contract with cold of metallic plate
Plate departs from.
Further, also include between the S20 and S30：
S21：Cooling heating plate and metallic plate.
Specifically, after the temperature drop of heating plate and metallic plate, the atom gap on the surface of heating plate and metallic plate
Reduce, the impurity in the atom gap on the surface for entering into heating plate originally heats up board clamping, enters into metallic plate
Impurity in the atom gap on surface is just by metal board clamping.
As one kind preferred embodiment, the difference of the thermal coefficient of expansion between the heating plate and the metallic plate is big
In or equal to 5.0 × 10-6/℃。
Specifically, the difference of thermal expansion coefficient between the heating plate and the metallic plate is bigger, its effect for removing impurity
Fruit is better, and removal of impurities is cleaner.Proved by many experiments, when the thermal expansion system between the heating plate and the metallic plate
Several differences is more than or equal to 5.0 × 10-6/ DEG C when, impurity can just be substantially achieved removing, almost not remain.
Further, the difference of the thermal coefficient of expansion between the heating plate and the metallic plate is 11 × 10-6/℃。
Specifically, proved by many experiments, when the difference of the thermal coefficient of expansion between the heating plate and the metallic plate
Be worth is 11 × 10-6/ DEG C when, impurity can just be removed completely, without residual.
As one kind preferred embodiment, the heating plate is iron plate, and the metallic plate is aluminium sheet.
As one kind preferred embodiment, it is characterised in that the heating plate is iron plate, the metallic plate is magnesium plate.
As one kind preferred embodiment, it is characterised in that the heating plate is manganese plate, the metallic plate is cadmium plate.
As one kind preferred embodiment, the pressing-in temp between metallic plate and heating plate is room temperature to 450 DEG C.
As one kind preferred embodiment, the pressing pressure between metallic plate and heating plate is 5kg/cm2~60kg/
cm2。
Beneficial effects of the present invention are：A kind of method for cleaning hot press is provided, by using the thermal coefficient of expansion of material
Difference, fast and effeciently remove hot press heating plate on residual impurity.
Brief description of the drawings
The present invention is described in further detail below according to drawings and Examples.
Fig. 1 is the method block diagram of the cleaning hot press described in embodiment.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
A kind of method for cleaning hot press, it includes：
S10：Metallic plate is placed between the heating plate for being attached with impurity, wherein, the thermal coefficient of expansion of metallic plate is more than and adds
The thermal coefficient of expansion of hot plate, and metallic plate thickness more than or equal to impurity thickness；
S20：Start hot press, heating plate and metallic plate are heated, set when the temperature of heating plate and metallic plate reaches
After constant temperature degree, pressed；
S21：Cooling heating plate and metallic plate；
S30：Metallic plate is taken out.
When start hot press hot pressing is carried out to metallic plate when, it is microcosmic on, the atom gap on the surface of heating plate and metallic plate
It is big during compared with normal temperature.In some atom gap after being heated up into heating plate of the impurity of the side of heating plate, it is close to
In some atom gap after being heated up into metallic plate of the impurity of the side of metallic plate.When heating plate and the temperature of metallic plate
After degree declines, the atom gap on the surface of heating plate and metallic plate reduces, between the atom on the surface for entering into heating plate originally
Impurity in gap heats up board clamping, and the impurity in the atom gap on the surface for entering into metallic plate is just by metal board clamping.
Due to the thermal coefficient of expansion of the thermal coefficient of expansion more than heating plate of metallic plate, so the atom gap of metallic plate is larger after heating up,
The impurity entered into metallic plate is more, and after temperature drop, the firmness combined between metallic plate and impurity is greater than
The firmness combined between heating plate and impurity.So when metallic plate is taken out, metallic plate can in the lump take away impurity, it is real
Existing impurity is separated with heating plate.
In order to allow metallic plate atom between can produce enough gaps to accommodate impurity, and in order to meet the work of hot press
Make condition, it is ensured that to the hot pressing effect of metallic plate, so the thickness of metallic plate should be more than or equal to the thickness of impurity.So
Design can effectively improve elimination effect of the metallic plate to impurity.
In S20, carburizing temperature of the design temperature less than impurity.If design temperature is higher than the carburizing temperature of impurity, miscellaneous
Matter will be carbonized, and produce waste gas, impurity also to become excessively loose due to carbonization, easy tomography division, by metallic plate
Effect of expanding with heat and contract with cold is difficult to make impurity depart from heating plate.
In the present embodiment, heating plate is iron plate, and its thermal coefficient of expansion is 12.2 × 10-6/℃；Metallic plate is aluminium sheet, its
Thermal coefficient of expansion is 23.2 × 10-6/ DEG C, impurity can be removed completely, without residual.It is of course also possible to heating plate is set to
Iron plate, its thermal coefficient of expansion is 12.2 × 10-6/℃；Metallic plate is set to silver plate, its thermal coefficient of expansion is 19.5 × 10-6/ DEG C,
Impurity can be substantially achieved removing, almost not remain.Heating plate can also be set to iron plate, its thermal coefficient of expansion be 12.2 ×
10-6/℃；Metallic plate is set to magnesium plate, its thermal coefficient of expansion is 26.0 × 10-6/ DEG C, impurity can be removed completely, not residual
Stay.Heating plate can also be set to manganese plate, its thermal coefficient of expansion is 23.0 × 10-6/℃；Metallic plate is set to cadmium plate, its heat is swollen
Swollen coefficient is 41.0 × 10-6/ DEG C, impurity can be removed completely, without residual.Heating plate can also be set to iron plate, its heat
The coefficient of expansion is 12.2 × 10-6/℃；Metallic plate is set to alfer plate, its thermal coefficient of expansion is 17.2 × 10-6/ DEG C, it is miscellaneous
Mass-energy is substantially achieved removing, does not almost remain.
Difference of thermal expansion coefficient between heating plate and metallic plate is bigger, and the effect that it removes impurity is better, and removal of impurities is just
It is cleaner.Proved by many experiments, when the difference of the thermal coefficient of expansion between heating plate and metallic plate is more than or equal to 5.0
×10-6/ DEG C when, impurity can just be substantially achieved removing, almost not remain.And work as the thermal expansion system between heating plate and metallic plate
Several differences is 11 × 10-6/ DEG C when, impurity can just be removed completely, without residual.
In the present embodiment, when heating plate is pressed with metallic plate, pressing-in temp is 400 DEG C, and pressing pressure is 30kg/cm2。
In other embodiments, according to the physical attribute of different metallic plate and heating plate, pressing-in temp can also be in room temperature to 450 DEG C
Between selected, pressing pressure can be in 5kg/cm2~60kg/cm2Between selected.
It is to be understood that, above-mentioned specific embodiment is only former presently preferred embodiments of the present invention and institute's application technology
Reason, in technical scope disclosed in this invention, change that any one skilled in the art is readily apparent that or
Replace, should all cover within the scope of the present invention.
Claims (10)
1. it is a kind of clean hot press method, it is characterised in that
S10：Metallic plate is placed between the heating plate for being attached with impurity, wherein, the thermal coefficient of expansion of the metallic plate is more than institute
State the thermal coefficient of expansion of heating plate；
S20：Start hot press, hot pressing is carried out to metallic plate；
S30：Metallic plate is taken out.
2. it is according to claim 1 cleaning hot press method, it is characterised in that in S10：The thickness of metallic plate is more than
Or equal to the thickness of impurity.
3. it is according to claim 1 cleaning hot press method, it is characterised in that the S20 is specially：Start hot pressing
Machine, heats to heating plate and metallic plate, after the temperature of heating plate and metallic plate reaches design temperature, is pressed.
4. it is according to claim 3 cleaning hot press method, it is characterised in that the design temperature less than impurity carbon
Change temperature.
5. it is according to claim 1 cleaning hot press method, it is characterised in that also include between the S20 and S30：
S21：Cooling heating plate and metallic plate.
6. it is according to claim 1 cleaning hot press method, it is characterised in that the heating plate and the metallic plate it
Between thermal coefficient of expansion difference be more than or equal to 5.0 × 10-6/℃。
7. it is according to claim 6 cleaning hot press method, it is characterised in that the heating plate and the metallic plate it
Between thermal coefficient of expansion difference be 11 × 10-6/℃。
8. it is according to claim 1 cleaning hot press method, it is characterised in that the heating plate be iron plate, the gold
Category plate is aluminium sheet.
9. it is according to claim 1 cleaning hot press method, it is characterised in that the heating plate be iron plate, the gold
Category plate is magnesium plate.
10. it is according to claim 1 cleaning hot press method, it is characterised in that the heating plate be manganese plate, the gold
Category plate is cadmium plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611121996.7A CN106739392B (en) | 2016-12-08 | 2016-12-08 | The method for cleaning hot press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611121996.7A CN106739392B (en) | 2016-12-08 | 2016-12-08 | The method for cleaning hot press |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106739392A true CN106739392A (en) | 2017-05-31 |
| CN106739392B CN106739392B (en) | 2019-03-19 |
Family
ID=58881447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611121996.7A Active CN106739392B (en) | 2016-12-08 | 2016-12-08 | The method for cleaning hot press |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102407626A (en) * | 2011-09-08 | 2012-04-11 | 鹤山东力电子科技有限公司 | Pressing technology of aluminum base copper-clad plate |
| CN103429014A (en) * | 2013-07-31 | 2013-12-04 | 深圳市博敏电子有限公司 | Multilayer board lamination device |
| JP2014036070A (en) * | 2012-08-08 | 2014-02-24 | Hitachi High-Tech Control Systems Corp | Minienvironment and temperature control method thereof |
| CN203843951U (en) * | 2014-05-19 | 2014-09-24 | 云南司珈尔木业股份有限公司 | Hot press for density boards |
-
2016
- 2016-12-08 CN CN201611121996.7A patent/CN106739392B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102407626A (en) * | 2011-09-08 | 2012-04-11 | 鹤山东力电子科技有限公司 | Pressing technology of aluminum base copper-clad plate |
| JP2014036070A (en) * | 2012-08-08 | 2014-02-24 | Hitachi High-Tech Control Systems Corp | Minienvironment and temperature control method thereof |
| CN103429014A (en) * | 2013-07-31 | 2013-12-04 | 深圳市博敏电子有限公司 | Multilayer board lamination device |
| CN203843951U (en) * | 2014-05-19 | 2014-09-24 | 云南司珈尔木业股份有限公司 | Hot press for density boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106739392B (en) | 2019-03-19 |
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