CN207573716U - A kind of laminar structure of copper-clad plate - Google Patents
A kind of laminar structure of copper-clad plate Download PDFInfo
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- CN207573716U CN207573716U CN201721660927.3U CN201721660927U CN207573716U CN 207573716 U CN207573716 U CN 207573716U CN 201721660927 U CN201721660927 U CN 201721660927U CN 207573716 U CN207573716 U CN 207573716U
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- copper
- clad plate
- molding board
- stainless molding
- plate
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Abstract
The utility model is related to a kind of laminar structures of copper-clad plate, copper-clad plate is single-side coated copper plate, upper Stainless Molding Board (1) including being used to suppress copper-clad plate up and down, lower Stainless Molding Board (5) and the release film (3) positioned at centre, the first copper-clad plate (2) to be pressed is provided between upper Stainless Molding Board (1) and release film (3), second copper-clad plate (4) to be pressed is provided between release film (3) and lower Stainless Molding Board (5), the prepreg (202) of first copper-clad plate (2), top and bottom of the prepreg (402) of second copper-clad plate (4) respectively with release film (3) contact, the copper foil (201) of first copper-clad plate (2), the copper foil (401) of second copper-clad plate (4) respectively with upper Stainless Molding Board (1), the corresponding contact of lower Stainless Molding Board (5).The utility model can avoid the contaminated technical barrier of Stainless Molding Board used in single-side coated copper plate lamination production process, while improve compacting efficiency.
Description
Technical field
The utility model is related to the laminar structure of copper-clad plate, it can especially improve production efficiency, energy-saving and environment-friendly cover copper
Plate.
Background technology
With social development, scientific and technological progress, electronic product has become people's routine office work and lives indispensable
Product, the demand of the production element of electronic product increase year by year.The dosage for producing the main material copper-clad plate of electronic product is also fast
Surge plus, show according to electronics industry statistical data, demand has reached nearly 500,000,000 square metre/year, and also year by year it is increased become
Gesture, for meet so it is huge the needs of, each copper-clad plate industrial chain manufacturing enterprise continually develop equipment, production technology, new material with
Meet efficient, the environmentally friendly production of copper-clad plate.
Third road lamination process in copper-clad plate production process is very crucial one step of production, existing single-side coated copper plate
--- copper foil --- prepreg --- is release as shown in Figure 1, being from top to bottom followed successively by tooling (Stainless Molding Board) for laminar structure
(polypropylene screen, mylar, thickness are generally 40 μm to film, 160~240 DEG C of heatproof, according to compacting copper-clad plate type choosing
Select) --- Stainless Molding Board.After laminar structure assembles, it is sent into hot press compacting.In pressing process under the high temperature conditions from
Type film heated portion melts, and is sticked to stainless steel mold plate surface, if compacting number is more, stainless steel mold plate surface is easy to be stained with
More tiny release membrane granule, and for lamination line, often double face copper and single-side coated copper plate be alternately
Production, in this case, when alternately producing double face copper, the fine particle being sticked on Stainless Molding Board can be transferred to two-sided cover
On the copper foil of copper coin, it is mainly copper face finish so as to influence copper foil surface quality, is etched in downstream process in copper foil surface
Circuit causes product rejection.To solve the problems, such as this, current way is to change the Stainless Molding Board for being infected with particle, and is changed
Under Stainless Molding Board change buck foam washing to be carried out and sanding and polishing, on the one hand which influences the work effect of lamination line
Rate, cleaning, the polishing of another aspect Stainless Molding Board are time-consuming and laborious, also add the disposal of pollutants of enterprise.
The third procedure that the utility model patent focuses on to produce from copper-clad plate is started with, and develops a kind of single-side coated copper plate
Efficient and environmentally friendly laminar structure, to solve, single-side coated copper plate production efficiency is not high, Stainless Molding Board is easy to pollute, cleaning form cost
When present situation that is laborious and generating sewage.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of lamination knot of copper-clad plate for above-mentioned production status
Structure is mainly used for the lamination of single-side coated copper plate, can avoid in single-side coated copper plate lamination production process, used stainless steel
Template is contaminated, while can improve compacting efficiency.
The technical scheme in the invention for solving the above technical problem is：A kind of laminar structure of copper-clad plate, this covers copper
Plate is single-side coated copper plate, including being used for the upper Stainless Molding Board of compacting copper-clad plate, lower Stainless Molding Board up and down and positioned at centre
Release film, is provided with the first copper-clad plate to be pressed between the upper Stainless Molding Board and release film, the release film and under not
Second copper-clad plate to be pressed, the prepreg of the first copper-clad plate, the semi-solid preparation of second copper-clad plate are provided between rust steel form
Piece contacts respectively with the top and bottom of release film, the copper foil of the first copper-clad plate, the copper foil of second copper-clad plate respectively with upper stainless steel mold
Plate, lower Stainless Molding Board correspond to contact.
Preferably, the first copper-clad plate is identical with the structure of second copper-clad plate, and the two is symmetrical with release film mirror.
Come again, the structure of the first copper-clad plate and second copper-clad plate can not also be identical, and different part refers to that single side covers
The layer structure of the prepreg of copper coin differs.
Usually, the prepreg of the first copper-clad plate, second copper-clad plate prepreg be multilayered structure.
Compared with prior art, the utility model has the advantage of：The application design copper-clad plate laminar structure, be by
Two pieces of single-side coated copper plates are laminated simultaneously, and the pressing structure of single-side coated copper plate such as is designed as Stainless Molding Board --- copper foil --- half
--- --- prepreg --- copper foil --- Stainless Molding Board, such Stainless Molding Board contact is copper to release film to cured sheets
Foil, what upper Stainless Molding Board contacted is the copper foil of upper copper-clad plate, and the copper foil of copper-clad plate, avoids under being of lower Stainless Molding Board contact
Release film is directly contacted with Stainless Molding Board, realizes the effect of Stainless Molding Board adhesion under high temperature, it is ensured that stainless steel mold
Plate surface is bright and clean always as before.Specific effect is as follows
(1) efficiency is improved：Two copper-clad plates can be achieved to suppress together, doubled than original efficiency, single side on production line
Also without Stainless Molding Board is replaced when copper-clad plate compacting and dual platen are alternately suppressed, saved replace Stainless Molding Board when
Between, improve production efficiency.
(2) Operational preparation working hour is reduced, Stainless Molding Board is pollution-free, without frequent cleans, saves a large amount of manpower and materials.
(3) it is environmental-friendly：Save the cleaning sullage of Stainless Molding Board.
Description of the drawings
Fig. 1 is the laminar structure of existing single-side coated copper plate；
Stainless Molding Board, 102 copper foils, 103 prepregs, 104 release films, 105 times Stainless Molding Boards on 101 in Fig. 1；
Fig. 2 is the laminar structure of the copper-clad plate of the utility model.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing embodiment.
As shown in Fig. 2, a kind of laminar structure of copper-clad plate in the present embodiment, is pressed together using two pieces of single-side coated copper plates
System specifically includes upper Stainless Molding Board 1, lower Stainless Molding Board 5 and the release film positioned at centre for suppressing copper-clad plate up and down
3, the first copper-clad plate 2 to be pressed, release film 3 and lower Stainless Molding Board 5 are provided between upper Stainless Molding Board 1 and release film 3
Between be provided with second copper-clad plate 4 to be pressed, the prepreg 202 of the first copper-clad plate 2, the prepreg of second copper-clad plate 4
402 top and bottom respectively with release film 3 contact, the copper foil 201 of the first copper-clad plate 2, the copper foil 401 of second copper-clad plate 4 respectively with
Upper Stainless Molding Board 1, lower Stainless Molding Board 5 correspond to contact.
The first copper-clad plate 2 in the present embodiment is identical with the structure of second copper-clad plate 4, and the two is with 3 minute surface pair of release film
Claim.
The prepreg 202 of first copper-clad plate 2, the prepreg 402 of second copper-clad plate 4 are identical multilayered structure.
In addition to the implementation, the utility model has further included other embodiment, all to use equivalents or equivalent
The technical solution that alternative is formed, should all fall within the protection domain of the utility model claims.
Claims (4)
1. a kind of laminar structure of copper-clad plate, the copper-clad plate is single-side coated copper plate, it is characterised in that：Including being used to suppress up and down
Upper Stainless Molding Board (1), lower Stainless Molding Board (5) and the release film (3) positioned at centre of copper-clad plate, the upper Stainless Molding Board
(1) the first copper-clad plate (2) to be pressed, the release film (3) and lower Stainless Molding Board (5) are provided between release film (3)
Between be provided with second copper-clad plate (4) to be pressed, the prepreg (202) of the first copper-clad plate (2), second copper-clad plate (4)
Top and bottom of the prepreg (402) respectively with release film (3) contact, copper foil (201), the second copper-clad plate of the first copper-clad plate (2)
(4) copper foil (401) contacts respectively with upper Stainless Molding Board (1), lower Stainless Molding Board (5) correspondence.
2. the laminar structure of copper-clad plate according to claim 1, it is characterised in that：First copper-clad plate (2) and second
The structure of copper-clad plate (4) is identical, and the two is symmetrical with the release film (3) minute surface.
3. the laminar structure of copper-clad plate according to claim 1, it is characterised in that：First copper-clad plate (2) and second
The structure of copper-clad plate (4) differs.
4. the laminar structure of copper-clad plate according to claim 1, it is characterised in that：The half of first copper-clad plate (2) is solid
Change piece (202), the prepreg (402) of second copper-clad plate (4) is multilayered structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721660927.3U CN207573716U (en) | 2017-11-30 | 2017-11-30 | A kind of laminar structure of copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721660927.3U CN207573716U (en) | 2017-11-30 | 2017-11-30 | A kind of laminar structure of copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207573716U true CN207573716U (en) | 2018-07-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721660927.3U Active CN207573716U (en) | 2017-11-30 | 2017-11-30 | A kind of laminar structure of copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207573716U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148376A (en) * | 2019-12-24 | 2020-05-12 | 江门崇达电路技术有限公司 | Laminating method of thick dielectric layer PCB |
-
2017
- 2017-11-30 CN CN201721660927.3U patent/CN207573716U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148376A (en) * | 2019-12-24 | 2020-05-12 | 江门崇达电路技术有限公司 | Laminating method of thick dielectric layer PCB |
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