CN204131837U - The anti-welding exposure fixture of a kind of PCB - Google Patents
The anti-welding exposure fixture of a kind of PCB Download PDFInfo
- Publication number
- CN204131837U CN204131837U CN201420439838.6U CN201420439838U CN204131837U CN 204131837 U CN204131837 U CN 204131837U CN 201420439838 U CN201420439838 U CN 201420439838U CN 204131837 U CN204131837 U CN 204131837U
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- CN
- China
- Prior art keywords
- exposure
- pcb
- welding
- glass
- fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to circuit printing plate field, in particular to a kind of anti-welding exposure fixture of PCB for improving film print, described anti-welding exposure process takes double-sided exposure mode, comprises and is located at housing in exposure machine table top and pad, the pressure to described pcb board during for alleviating double-sided exposure.Adopt this technical scheme effectively can improve pcb board film print.
Description
Technical field
The utility model relates to circuit printing plate field, particularly a kind of anti-welding exposure fixture of PCB for improving film print.
Background technology
Along with market is to the continuous lifting of PCB product quality requirement, each factory introduces automation equipment one after another, and anti-welding operation glass is also widely used glass automatic exposure machine, to improve contraposition precision and production efficiency.But more and more higher owing to requiring, some bad orders also become necessary requirement.In PCB production process, anti-welding operation part PCB product structure due to ink thickness higher, exposure before ink softer, often occur during exposure that the film prints.But if lengthen the pre-baked time ink curing after betterly can often occur again that development is unclean.
Summary of the invention
In view of the above problems, the object of the utility model embodiment is to provide the anti-welding exposure fixture of a kind of PCB, effectively can improve pcb board film print.
The anti-welding exposure fixture of a kind of PCB that the utility model embodiment provides, described anti-welding exposure process takes double-sided exposure mode, comprises and is located at housing in exposure machine table top and pad, the pressure to described pcb board during for alleviating double-sided exposure.
Alternatively, adopt glass to the sided exposure machine of glass, described housing is located in exposure machine table top on arbitrary glass surface, and during for alleviating exposure, double-sided glass is to the pressure of described pcb board.
Alternatively, described housing to be located in exposure machine table top on lower-glass face.
Alternatively, described pad is located on the film place of windowing or the film and falls to locate corresponding position to described pcb board gong.
Therefore, application the present embodiment technical scheme, due to when being provided with housing and pad to carry exposure from top to bottom moment the pressure that produces, the pressure to described pcb board when alleviating double-sided exposure, makes the described pcb board welding resisting layer film print and improves.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
A kind of PCB anti-welding exposure fixture schematic cross-section that Fig. 1 provides for the utility model;
A kind of PCB anti-welding exposure fixture floor map that Fig. 2 provides for the utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
embodiment:
The present embodiment provides the anti-welding exposure fixture of a kind of PCB, and described anti-welding exposure process takes double-sided exposure mode, comprises and is located at housing in exposure machine table top and pad, the pressure to described pcb board during for alleviating double-sided exposure.
As illustrated in fig. 1 and 2, adopt glass to the sided exposure machine of glass, described housing 21 to be located in exposure machine table top on glass 11 or the arbitrary glass surface of lower-glass 12, and during for alleviating exposure, double-sided glass is to the pressure of described pcb board 51.Can be, but not limited to, described housing 21 to be located in exposure machine table top on lower-glass 12.
Can be, but not limited to, on the film 41, garbage area arranges pad 31 described in several as required, such as is located at the film 41 place of windowing or the film 41 fall to locate corresponding position to described pcb board 51 gong to arrange pad 31 described in several, avoids affecting product quality.
Therefore this technical scheme effectively improves described pcb board welding resisting layer film print, and structure is simple, put plate when deft design, exposure operation and get plate process and facilitate and conveniently do not affect manufacturing schedule, better improve production efficiency.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (4)
1. the anti-welding exposure fixture of PCB, described anti-welding exposure process takes double-sided exposure mode, it is characterized in that, comprises and is located at housing in exposure machine table top and pad, the pressure to described pcb board during for alleviating double-sided exposure.
2. the anti-welding exposure fixture of a kind of PCB as claimed in claim 1, is characterized in that, adopt glass to the sided exposure machine of glass, described housing is located in exposure machine table top on arbitrary glass surface, and during for alleviating exposure, double-sided glass is to the pressure of described pcb board.
3. the anti-welding exposure fixture of a kind of PCB as claimed in claim 2, is characterized in that, described housing to be located in exposure machine table top on lower-glass face.
4. the anti-welding exposure fixture of a kind of PCB as described in claim 1,2 or 3, is characterized in that, described pad is located on the film place of windowing or the film and falls to locate corresponding position to described pcb board gong.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420439838.6U CN204131837U (en) | 2014-08-06 | 2014-08-06 | The anti-welding exposure fixture of a kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420439838.6U CN204131837U (en) | 2014-08-06 | 2014-08-06 | The anti-welding exposure fixture of a kind of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204131837U true CN204131837U (en) | 2015-01-28 |
Family
ID=52388149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420439838.6U Expired - Fee Related CN204131837U (en) | 2014-08-06 | 2014-08-06 | The anti-welding exposure fixture of a kind of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204131837U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105278263A (en) * | 2015-11-25 | 2016-01-27 | 四川聚能核技术工程有限公司 | 8CCD double-side simultaneous aligning method for exposure machine |
| CN106604549A (en) * | 2016-12-07 | 2017-04-26 | 广州杰赛科技股份有限公司 | Circuit board and exposure process thereof |
| CN107371334A (en) * | 2017-07-04 | 2017-11-21 | 江门崇达电路技术有限公司 | A kind of method for preventing from forming film print on solder mask |
| CN109688714A (en) * | 2019-02-26 | 2019-04-26 | 东莞科视自动化科技有限公司 | A kind of device and anti-adhesion method for preventing pcb board from gluing the film |
| CN113099622A (en) * | 2021-03-03 | 2021-07-09 | 奥士康科技股份有限公司 | Method for solving solder mask ink film printing |
-
2014
- 2014-08-06 CN CN201420439838.6U patent/CN204131837U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105278263A (en) * | 2015-11-25 | 2016-01-27 | 四川聚能核技术工程有限公司 | 8CCD double-side simultaneous aligning method for exposure machine |
| CN106604549A (en) * | 2016-12-07 | 2017-04-26 | 广州杰赛科技股份有限公司 | Circuit board and exposure process thereof |
| CN106604549B (en) * | 2016-12-07 | 2019-10-25 | 广州杰赛科技股份有限公司 | Wiring board and its exposure technology |
| CN107371334A (en) * | 2017-07-04 | 2017-11-21 | 江门崇达电路技术有限公司 | A kind of method for preventing from forming film print on solder mask |
| CN109688714A (en) * | 2019-02-26 | 2019-04-26 | 东莞科视自动化科技有限公司 | A kind of device and anti-adhesion method for preventing pcb board from gluing the film |
| CN109688714B (en) * | 2019-02-26 | 2024-02-13 | 广东科视光学技术股份有限公司 | Device and anti-sticking method for preventing PCB from sticking film |
| CN113099622A (en) * | 2021-03-03 | 2021-07-09 | 奥士康科技股份有限公司 | Method for solving solder mask ink film printing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170704 Address after: 516100 Guangdong County of Boluo city in Huizhou Province Long Xi Zhen Qiu Gang Cun Ling tou Gang Lang group under the fox (soil) area Patentee after: Huizhou Huifeng Electronic Material Co., Ltd. Address before: 516008 Guangdong province Huizhou City Road seven Lane 3, eling Park in Beijing Patentee before: Huizhou China Eagle Electronic Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20180806 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |