CN204316884U - A kind of MOSFET weld mold - Google Patents
A kind of MOSFET weld mold Download PDFInfo
- Publication number
- CN204316884U CN204316884U CN201420786658.5U CN201420786658U CN204316884U CN 204316884 U CN204316884 U CN 204316884U CN 201420786658 U CN201420786658 U CN 201420786658U CN 204316884 U CN204316884 U CN 204316884U
- Authority
- CN
- China
- Prior art keywords
- mosfet
- substrate layer
- general plate
- screw
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 230000006641 stabilisation Effects 0.000 claims description 2
- 238000011105 stabilization Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 20
- 238000012797 qualification Methods 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The utility model relates to a kind of MOSFET weld mold, comprise location general plate, top substrate layer, middle laminar substrate and screw, middle laminar substrate, top substrate layer and locate general plate order is fixing successively from bottom to top by screw, in top substrate layer, interval is shaped with multiple groove, and the plurality of groove forms the groove hole for locating MOSFET to be welded.The utility model makes the welding of wiring board more convenient, and outward appearance is more attractive in appearance, and rate of finished products is higher, meets the requirement of modern crafts.Common human weld's first-time qualification rate can reach about 90%, can up to about 98% with this device welding first-time qualification rate.
Description
Technical field
The utility model belongs to pcb board welding field, relates to the welding aid of its relevant MOSFET, especially a kind of MOSFET weld mold.
Background technology
Along with the development of the industries such as communication, computer, consumer electronics, printed circuit board (PCB) (PCB) industry is also fast-developing.Design, the level of processing of current PCB welding have reached quite high level, but the quality problems of soldered circuit board also more and more obtain the attention of people while obtaining high speed development.Pursue high-quality weld horizontal forces us must reduce pure making by hand by means of certain mould in production wiring board as far as possible, and to making wiring board more attractive in appearance, welding job is also more convenient.
At present, conventional welding method uses pilot pin positioning electronic components such as utility model patent (patent No. CN200820128107.4), and locking pin fixing circuit board, weld, due to pilot pin itself steadiness not enough, in practical operation, electronic component slides sometimes, thus the accuracy of impact welding, cause wiring board to weld disunity, unsightly.
Utility model content
The purpose of this utility model is the wiring board welding disunity, the inaesthetic shortcoming that overcome prior art, the MOSFET weld mold providing a kind of simplicity of design, weld precisely, can weld in batches.
The utility model solves its technical problem and takes following technical scheme to realize:
A kind of MOSFET weld mold, comprise location general plate, top substrate layer, middle laminar substrate and screw, middle laminar substrate, top substrate layer and locate general plate order is fixing successively from bottom to top by screw, in top substrate layer, interval is shaped with multiple groove, and the plurality of groove forms the groove hole for locating MOSFET to be welded.
And the bottom of described middle laminar substrate is provided with the underlying substrate of stabilization together, this underlying substrate is together fixedly mounted with location general plate, top substrate layer and middle laminar substrate.
And, described middle laminar substrate, top substrate layer and locate and uniformly in the middle part of the corner of general plate and four limits be shaped with screw hole and by screw fastening to together.
Advantage of the present utility model and good effect are:
1, this Mold Making is simple, cost is lower, upper, middle and lower layer is formed by three pieces of acrylic boards, the acrylic board of lower floor is mainly in order to make this device steady, the acrylic board in middle level arranges in order to the acrylic board on fixing upper strata, the acrylic board on upper strata is in order to fixing MOSFET manages, and fixing general plate is then above being conveniently placed in by pcb board.
2, this mould makes welding operation more convenient, first will the wiring board welding MOSFT pipe be needed to be placed on mould, then the MOSFET press-fited in advance is put into relevant position, then carry out welding.
3, the utility model makes the welding of wiring board more convenient, and outward appearance is more attractive in appearance, and rate of finished products is higher, meets the requirement of modern crafts, and common human weld's first-time qualification rate can reach about 90%, can up to about 98% with this device welding first-time qualification rate.
Accompanying drawing explanation
Fig. 1 is the utility model package assembly schematic diagram;
Fig. 2 is top substrate layer structure chart of the present utility model;
Fig. 3 is middle level of the present utility model substrate junction composition;
Fig. 4 is underlying substrate structure chart of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, also by specific embodiment, the utility model is described in further detail, and following examples are descriptive, are not determinate, can not limit protection range of the present utility model with this.
A kind of MOSFET weld mold, comprise location general plate 1, top substrate layer 2, middle laminar substrate 3, underlying substrate 4 and screw 5, underlying substrate, middle laminar substrate, top substrate layer and locate general plate order is fixing successively from bottom to top, underlying substrate, middle laminar substrate, top substrate layer and locate and uniformly in the middle part of the corner of general plate and four limits be shaped with screw hole 7 and by screw fastening to together, convenient welding;
In top substrate layer, interval is shaped with multiple groove 6, and the plurality of groove cuts out corresponding size formation for locating the groove hole of MOSFET to be welded according to respective lines plate needing the position of welding MOSFET pipe.
The upper strata acrylic board of described mould arranges in order to fixing MOSFET pipe, and have corresponding slotted eye, as shown in Figure 2; The middle level acrylic board of described mould sets in order to fixing upper strata acrylic board, as shown in Figure 3; Lower floor's acrylic board of described mould is to make this device place steadily, preventing the welding mistake brought because being uneven, as shown in Figure 4; Locate the topmost edge place that general plate is arranged on whole mould, the general plate thickness in this location is moderate, is to make the wiring board of the die substrate on upper strata and required welding keep certain distance, thus makes wiring board be fixed to corresponding height, convenient welding MOSFET pipe.
As the wiring board of different size need be welded, only top substrate layer need be replaced with dimension.
Directly by general plate through processing and fabricating be the mould of corresponding height in order to fixing circuit board, it is more firm that such fixed form makes wiring board place, convenient welding.This mould is not with pilot pin positioning electronic components but direct acrylic board processes a through hole, and such element more firmly can not slide in groove hole.
Although disclose embodiment of the present utility model and accompanying drawing for the purpose of illustration, but it will be appreciated by those skilled in the art that: in the spirit and scope not departing from the utility model and claims, various replacement, change and amendment are all possible, therefore, scope of the present utility model is not limited to the content disclosed in embodiment and accompanying drawing.
Claims (3)
1. a MOSFET weld mold, it is characterized in that: comprise location general plate, top substrate layer, middle laminar substrate and screw, middle laminar substrate, top substrate layer and locate general plate order is fixing successively from bottom to top by screw, in top substrate layer, interval is shaped with multiple groove, and the plurality of groove forms the groove hole for locating MOSFET to be welded.
2. MOSFET weld mold according to claim 1, is characterized in that: the bottom of described middle laminar substrate is provided with the underlying substrate of stabilization together, and this underlying substrate is together fixedly mounted with location general plate, top substrate layer and middle laminar substrate.
3. MOSFET weld mold according to claim 1, is characterized in that: described middle laminar substrate, top substrate layer and locate and uniformly in the middle part of the corner of general plate and four limits be shaped with screw hole and by screw fastening to together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420786658.5U CN204316884U (en) | 2014-12-12 | 2014-12-12 | A kind of MOSFET weld mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420786658.5U CN204316884U (en) | 2014-12-12 | 2014-12-12 | A kind of MOSFET weld mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204316884U true CN204316884U (en) | 2015-05-06 |
Family
ID=53139177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420786658.5U Expired - Fee Related CN204316884U (en) | 2014-12-12 | 2014-12-12 | A kind of MOSFET weld mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204316884U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112251A (en) * | 2019-04-17 | 2019-08-09 | 上海空间电源研究所 | A kind of welding of space solar battery module and positioning mold |
-
2014
- 2014-12-12 CN CN201420786658.5U patent/CN204316884U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112251A (en) * | 2019-04-17 | 2019-08-09 | 上海空间电源研究所 | A kind of welding of space solar battery module and positioning mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150506 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |