CN104148795A - Parallel seam welding packaging device - Google Patents
Parallel seam welding packaging device Download PDFInfo
- Publication number
- CN104148795A CN104148795A CN201410417287.8A CN201410417287A CN104148795A CN 104148795 A CN104148795 A CN 104148795A CN 201410417287 A CN201410417287 A CN 201410417287A CN 104148795 A CN104148795 A CN 104148795A
- Authority
- CN
- China
- Prior art keywords
- metal shell
- seam welding
- parallel seam
- square groove
- dual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/36—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/06—Resistance welding; Severing by resistance heating using roller electrodes
- B23K11/061—Resistance welding; Severing by resistance heating using roller electrodes for welding rectilinear seams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
Abstract
The invention discloses a parallel seam welding packaging device. The device comprises a base (4) which is arranged on a parallel seam welding piece bearing table, and a square groove (7) is formed in the top surface of the base (4). The depth of the square groove is smaller than the height of a dual-in-line outer metal shell (3) needing clamping, and rectangular pillars (9) are evenly distributed vertically in the square groove (7) in an arrayed mode. The number of the rectangular pillars (9) is an odd number in the transverse direction and an even number in the longitudinal direction. Grooves (10) are formed between the adjacent rectangular pillars and are uniform in width. The grooves (10) are in clearance fit with pins (8) of the outer metal shell (3) to form pair insertion. Because the distance of the pins of the dual-in-line outer metal shell is integer multiples of 2.54 mm, various types of dual-in-line outer metal shells can be accurately clamped and positioned, cost is reduced, frequent device replacing is not needed, and production efficiency is improved.
Description
Technical field
The present invention relates to electronic manufacturing field, specifically a kind of parallel seam welding packaging system.
Background technology
Known, parallel seam welding is the weldering of one side bipolar electrode contact resistance, is a kind of of roll welding, and it is a kind of new microelectronic component solder technology growing up in order to adapt to the capping of ceramic double-row straight-plug-type integrated circuit.But the appearance and size of the metal shell of dual-in-line is not of uniform size, pin number and pin distance are also different, therefore must design separately packaging system for the metal shell of various models, can not reuse, material cost is high, when the metal shell of parallel seam welding different model, need change corresponding packaging system, production efficiency is low.
Summary of the invention
The object of the present invention is to provide a kind of parallel seam welding packaging system, this device can be realized the clamping position to various model dual-in-line metal shells, cost-saving, and need not be frequently changing device more, improved production efficiency.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of parallel seam welding packaging system, comprise the base of being located on parallel seam welding wafer-supporting platform, the end face of described base is provided with square groove, the square groove degree of depth is less than the height of the dual-in-line metal shell that needs clamping, in square groove, be vertically provided with and be the equally distributed rectangular column of array, the number of rectangular column, along be laterally odd number, being longitudinally even number, forms the consistent groove of width between adjacent rectangular column; Described groove matches with the pin of metal shell, and described rectangular column matches with the gap of metal shell pin, forms inserting.
Further, be also provided with for preventing the positive stop of metal shell skew in described square groove, positive stop is L-shaped, and bottom is provided with rectangular column and forms the draw-in groove coordinating.
Further, the end face of described base is along laterally and being longitudinally respectively equipped with neutrality line mark.
The invention has the beneficial effects as follows, on base, arrange with dual-in-line metal shell and form slotting array rectangular column and groove, due to the pin-pitch of the dual-in-line metal shell integral multiple that is 2.54mm, so can both realize clamping position accurately to various model dual-in-line metal shells, saved cost, and need not be frequently changing device more, improved production efficiency.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described:
Fig. 1 is structural representation of the present invention;
Fig. 2 is the assembling enlarged diagram of dual-in-line metal shell and base in Fig. 1;
Fig. 3 is the assembling side-looking enlarged drawing of dual-in-line metal shell and base in Fig. 1;
Fig. 4 is the assembling plan view of base in the present invention, dual-in-line metal shell and positive stop;
Fig. 5 is the enlarged diagram of positive stop in the present invention;
Fig. 6 is the A-A cutaway view of Fig. 5.
The specific embodiment
As shown in Figure 1, the invention provides a kind of parallel seam welding packaging system, comprise the base 4 of being located on parallel seam welding wafer-supporting platform 6, base 4 is provided with locating hole 11, by realizing locating hole 11 and coordinating of alignment pin 5 location of base 4 and wafer-supporting platform 6; The end face of described base 4 is provided with square groove 7, and the degree of depth of square groove 7 is less than the height of the dual-in-line metal shell 3 that needs clamping; Shown in Fig. 2 and Fig. 3, interior being vertically provided with of square groove 7 is the equally distributed rectangular column 9 of array, and the number of rectangular column 9, along be laterally odd number, being longitudinally even number, forms the consistent groove of width 10 between adjacent rectangular column; Described groove 10 matches with the pin 8 of metal shell, and described rectangular column 9 matches with the gap of metal shell pin, forms inserting; Shown in Fig. 4, described device also comprises the positive stop 12 that prevents metal shell 3 skews; Shown in Fig. 5 and Fig. 6, positive stop 12 is L-shaped, and bottom is provided with rectangular column 9 and forms the draw-in groove 13 coordinating, when reality is used, can on four angles of metal shell 3, positive stop be all set, also can only at metal shell 3, be on cornerwise two angles positive stop is set; In order more quickly metal shell 3 to be placed in to device center, the end face of described base 4 is along laterally and being longitudinally respectively equipped with neutrality line mark 14.At metal shell 3, be positioned after clamping, wafer-supporting platform 6 is set track with metal shell 3 by parallel seam welding together with this device and is moved to electrode 1 below, and at metal shell 3 upper cover upper cover plates 2, then electrode 1 presses down and starts parallel seam welding, completes encapsulation.
Due to the pin-pitch of the dual-in-line metal shell integral multiple that is 2.54mm, therefore by setting, be uniformly distributed rectangular column and the groove of array formula, no matter the metal shell of which kind of model can form inserting with device, when odd-multiple that the pin-pitch of metal shell is 2.54mm, metal shell in device laterally to inserting, when even-multiple that the pin-pitch of metal shell is 2.54mm, metal shell in device longitudinally to inserting; When inserting, can utilize neutrality line mark 14 to observe, thereby guarantee metal shell can positioning clamping at the center of device.
The above, be only preferred embodiment of the present invention, not the present invention done to any pro forma restriction; Any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible changes and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, be equal to replacements, equivalence changes and modify, all still belong in the scope that technical solution of the present invention protects.
Claims (3)
1. a parallel seam welding packaging system, comprise the base (4) of being located on parallel seam welding wafer-supporting platform, it is characterized in that, the end face of described base (4) is provided with square groove (7), the square groove degree of depth is less than the height of the dual-in-line metal shell (3) that needs clamping, in square groove (4), be vertically provided with and be the equally distributed rectangular column of array (9), the number of rectangular column (9), along be laterally odd number, being longitudinally even number, forms the consistent groove of width (10) between adjacent rectangular column; Described groove (10) matches with the pin (8) of metal shell (3), and described rectangular column (9) matches with the gap of metal shell pin, forms inserting.
2. a kind of parallel seam welding packaging system according to claim 1, it is characterized in that, in described square groove (7), be provided with for preventing the positive stop (12) of metal shell (3) skew, positive stop (12) is L-shaped, and bottom is provided with rectangular column (9) and forms the draw-in groove (13) coordinating.
3. a kind of parallel seam welding packaging system according to claim 1 and 2, is characterized in that, the end face of described base (4) is along laterally and being longitudinally respectively equipped with neutrality line mark (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410417287.8A CN104148795A (en) | 2014-08-23 | 2014-08-23 | Parallel seam welding packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410417287.8A CN104148795A (en) | 2014-08-23 | 2014-08-23 | Parallel seam welding packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104148795A true CN104148795A (en) | 2014-11-19 |
Family
ID=51874515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410417287.8A Pending CN104148795A (en) | 2014-08-23 | 2014-08-23 | Parallel seam welding packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104148795A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105728995A (en) * | 2014-12-09 | 2016-07-06 | 深圳新飞通光电子技术有限公司 | Parallel seam welder sealing cap clamp |
| CN108098232A (en) * | 2018-01-30 | 2018-06-01 | 中国电子科技集团公司第三十八研究所 | The array holder and the welding method using the fixture of a kind of parallel seam welding capping |
| CN111730185A (en) * | 2020-07-27 | 2020-10-02 | 烟台华创智能装备有限公司 | Automatic parallel sealing device and sealing method based on image recognition |
| CN115781115A (en) * | 2022-11-17 | 2023-03-14 | 青岛航天半导体研究所有限公司 | Parallel seam welding method for fan-shaped shell |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011119338A (en) * | 2009-12-01 | 2011-06-16 | Misuzu Kogyo:Kk | Method of joining metal member, and joined metal member unit |
| CN201974186U (en) * | 2010-12-13 | 2011-09-14 | 华东光电集成器件研究所 | Flat package acceleration centrifugal test fixture of integrated circuit |
| CN102646607A (en) * | 2012-01-15 | 2012-08-22 | 中国电子科技集团公司第十研究所 | Technology method of parallel seam welding of MMW (Millimeter Waves) T/R assembly high conduction material |
| CN102837136A (en) * | 2012-09-11 | 2012-12-26 | 陕西华经微电子股份有限公司 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
| CN103624463A (en) * | 2013-11-29 | 2014-03-12 | 中国电子科技集团公司第四十七研究所 | FP-type ceramic tube-shell parallel seam welding packaging clamp |
| CN203631527U (en) * | 2013-09-29 | 2014-06-04 | 安徽华东光电技术研究所 | Parallel seam welding encapsulation shell |
-
2014
- 2014-08-23 CN CN201410417287.8A patent/CN104148795A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011119338A (en) * | 2009-12-01 | 2011-06-16 | Misuzu Kogyo:Kk | Method of joining metal member, and joined metal member unit |
| CN201974186U (en) * | 2010-12-13 | 2011-09-14 | 华东光电集成器件研究所 | Flat package acceleration centrifugal test fixture of integrated circuit |
| CN102646607A (en) * | 2012-01-15 | 2012-08-22 | 中国电子科技集团公司第十研究所 | Technology method of parallel seam welding of MMW (Millimeter Waves) T/R assembly high conduction material |
| CN102837136A (en) * | 2012-09-11 | 2012-12-26 | 陕西华经微电子股份有限公司 | Parallel seam welding process and apparatus of special-shaped structure packaging housing |
| CN203631527U (en) * | 2013-09-29 | 2014-06-04 | 安徽华东光电技术研究所 | Parallel seam welding encapsulation shell |
| CN103624463A (en) * | 2013-11-29 | 2014-03-12 | 中国电子科技集团公司第四十七研究所 | FP-type ceramic tube-shell parallel seam welding packaging clamp |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105728995A (en) * | 2014-12-09 | 2016-07-06 | 深圳新飞通光电子技术有限公司 | Parallel seam welder sealing cap clamp |
| CN108098232A (en) * | 2018-01-30 | 2018-06-01 | 中国电子科技集团公司第三十八研究所 | The array holder and the welding method using the fixture of a kind of parallel seam welding capping |
| CN111730185A (en) * | 2020-07-27 | 2020-10-02 | 烟台华创智能装备有限公司 | Automatic parallel sealing device and sealing method based on image recognition |
| CN111730185B (en) * | 2020-07-27 | 2020-11-20 | 烟台华创智能装备有限公司 | Automatic parallel sealing device and sealing method based on image recognition |
| CN115781115A (en) * | 2022-11-17 | 2023-03-14 | 青岛航天半导体研究所有限公司 | Parallel seam welding method for fan-shaped shell |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104148795A (en) | Parallel seam welding packaging device | |
| CN205763349U (en) | High-precision stamping mould | |
| US9397065B1 (en) | Fixture design for pre-attachment package on package component assembly | |
| CN103038872B (en) | For the peelable mixing Trayconcept of electronic device | |
| CN106211541A (en) | A kind of positioning datum point improving circuit board cutting accuracy and method | |
| CN103056411A (en) | Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing | |
| CN203884088U (en) | Printing tray used for LED lamp bars in liquid crystal displays | |
| KR101364043B1 (en) | Flux tool and ball tool of solder ball mount apparatus | |
| CN103635034A (en) | BGA (ball grid array) chip bonding pad printing solder paste positioning jig | |
| US20100273297A1 (en) | Chip packaging method | |
| CN203984779U (en) | Be applied to the anti-offset correction module in soft printed circuit board production | |
| CN204348684U (en) | A kind of QFP device pin apparatus for shaping | |
| JP6462529B2 (en) | Power semiconductor module manufacturing method and power semiconductor module | |
| CN103325712B (en) | IGBT module welded encapsulation servicing unit and system | |
| CN108289373B (en) | Forming method of unit board | |
| CN204069470U (en) | A kind of structure detecting the anti-welding aligning accuracy of high-precision circuit board | |
| CN207765639U (en) | Arrange needle female seat and pcb board component | |
| CN206136443U (en) | PCB makeup on no technology limit | |
| CN203301871U (en) | IC chip placement jig | |
| CN202750345U (en) | Circuit board fixing clamp | |
| CN201498509U (en) | Loading clamp of small-size SMD product | |
| CN102105024A (en) | Soft pin support jig | |
| CN204316884U (en) | A kind of MOSFET weld mold | |
| CN204131855U (en) | A kind of reflow soldering auxiliary mould of flexible circuit board | |
| CN204836780U (en) | Flexible circuit board with counterpoint target |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141119 |