CN201498509U - Loading clamp of small-size SMD product - Google Patents
Loading clamp of small-size SMD product Download PDFInfo
- Publication number
- CN201498509U CN201498509U CN2009203060598U CN200920306059U CN201498509U CN 201498509 U CN201498509 U CN 201498509U CN 2009203060598 U CN2009203060598 U CN 2009203060598U CN 200920306059 U CN200920306059 U CN 200920306059U CN 201498509 U CN201498509 U CN 201498509U
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- hole
- top board
- base plate
- positioning device
- loading fixture
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Abstract
The utility model relates to a loading clamp of a small-size SMD (surface mount device) product. The loading clamp comprises a bottom plate and a top plate, wherein a horizontal positioning device and a vertical positioning device are arranged between the bottom plate and the top plate; the bottom plate is provided with a product slot; the top plate is provided with a through hole corresponding to the product slot; and a copper cylinder is assembled in the through hole. In the use of the loading clamp, a shell of the small-size SMD product and a cover are put in the product slot of the bottom plate, the copper cylinder is pressed on a corresponding product and the gravity of the copper cylinder leads to higher fit between the cover and the shell, thus reducing the deviation of the cover.
Description
(1) technical field
The utility model relates to the frock of the ceramic packaging reflow soldering process use of a kind of miniaturized SMD (surface mount device) product, is specially the loading fixture of miniaturized SMD products.
(2) background technology
Miniaturized SMD products is meant that package dimension is the SMD product of 2mm * 2.5mm, comprise lid and shell, in the ceramic packaging reflow soldering process of this miniaturization product, lid is easy to generate skew, cause the right very difficult assurance of carving of lid and shell, thereby influence package quality.
(3) summary of the invention
At the problems referred to above, the utility model provides a kind of loading fixture of miniaturized SMD products, uses these anchor clamps can reduce the skew of its lid of miniaturized SMD products in the encapsulation reflow soldering process, and carving of raising lid and shell is right, thereby guarantees package quality.
The loading fixture of miniaturized SMD products, it is characterized in that: it comprises base plate and top board, be provided with horizontal positioning device and perpendicular positioning device between described base plate and the described top board, described base plate is provided with the product groove, described top board is provided with and the corresponding through hole of described product groove, is equipped with the copper post in the described through hole.
It further is characterized as:
Described horizontal positioning device comprises base plate location hole, top board location hole and reference column, and described reference column matches with described base plate location hole and top board location hole;
Described reference column is a multidiameter, and its small diameter portion matches with described top board, and its major diameter part matches with described base plate;
Described perpendicular positioning device comprises the projection at the step and the described top board edge of described bottom edge, and described projection is pressed on the described step;
The turning point of described step is provided with chamfering, and the turning point of described projection is provided with fillet, and described chamfering matches with described fillet;
Described perpendicular positioning device comprises jacking block and jacking block hole, and described jacking block hole is positioned on the described top board, and described jacking block is a multidiameter, and its small diameter portion matches with described jacking block hole;
Described product groove is a rectangle, and its four angles are provided with fillet, and the center of described product groove is provided with the circular hole that runs through described base plate;
Described product groove and through hole corresponding with it have a plurality of, by rectangular array.
Technique effect of the present utility model is: when the utility model uses, in the product groove that the shell and the lid of miniaturized SMD products is placed on base plate, the copper post is pressed on the corresponding product, and the gravity by the copper post makes carving of lid and shell right higher, has reduced the skew of lid; Product groove on the utility model and through hole corresponding with it have improved the loading stocks amount by rectangular array.
(4) description of drawings
Fig. 1 is the structural representation of first kind of embodiment of the utility model;
Fig. 2 is the upward view of the top board among Fig. 1;
Fig. 3 is the vertical view of the base plate among Fig. 1;
Fig. 4 is the enlarged drawing at the A place among Fig. 3;
Fig. 5 is the B-B cutaway view among Fig. 4;
Fig. 6 is the structural representation of second kind of embodiment of the utility model;
Fig. 7 is the upward view of the top board among Fig. 6;
Fig. 8 is the vertical view of the base plate among Fig. 6.
(5) embodiment
As Fig. 1, Fig. 2, Fig. 3 and Fig. 6, Fig. 7, shown in Figure 8, the utility model is a kind of loading fixture of miniaturized SMD products, and it comprises base plate 5 and top board 1, and base plate 5 and top board 1 are made by graphite material.Be provided with horizontal positioning device and perpendicular positioning device between base plate 5 and top board 1, base plate 5 is provided with product groove 11, and product 2 is loaded in the product groove 11, and top board 1 is provided with and product groove 11 corresponding through holes 7, is equipped with copper post 3 in the through hole 7.Product groove 11 and through hole 7 corresponding with it have a plurality of, by rectangular array.
Described horizontal positioning device comprises two base plate location holes 13 being positioned on the base plate 5, is positioned at two top board location holes 9 and two reference columns 2 on the top board 1, and reference column 2 matches with base plate location hole 13 and top board location hole 9.Reference column 2 is a multidiameter, and its small diameter portion matches with top board location hole 9, and its major diameter part matches with base plate location hole 13.
Perpendicular positioning device in the utility model has two kinds of embodiment:
Fig. 1～Fig. 3 is first kind of embodiment, and it comprises step 10 that is positioned at base plate 5 edges and the projection 6 that is positioned at top board 1 edge, and projection 6 is pressed on the step 10 during assembling.
In order to make the perpendicular positioning device assembling between base plate 5 and the top board 1 simple and convenient, be provided with chamfering 12 in the turning point of step 10, be provided with fillet 8 in the turning point of projection 6, chamfering 12 matches with fillet 8.
Fig. 6～Fig. 8 is second kind of embodiment, and its perpendicular positioning device comprises jacking block 16 and jacking block hole 17, and jacking block hole 17 is positioned on the top board 1.Jacking block 16 is a multidiameter, and its small diameter portion matches with jacking block hole 17, and the end of its major diameter part is positioned on the base plate 1.
As Fig. 4, shown in Figure 5, product groove 11 is a rectangle, because the very difficult processing in four angles of rectangle is rectangular, therefore these four angles are provided with fillet 15, and the product 4 that has four right angles like this can be put into the product groove easily.Be provided with the circular hole 14 that runs through base plate at the center of product groove 11,14 conductive force of circular hole, temperature enters product and heats when heating from this hole.
Claims (8)
1. the loading fixture of miniaturized SMD products, it is characterized in that: it comprises base plate and top board, be provided with horizontal positioning device and perpendicular positioning device between described base plate and the described top board, described base plate is provided with the product groove, described top board is provided with and the corresponding through hole of described product groove, is equipped with the copper post in the described through hole.
2. the loading fixture of miniaturized SMD products according to claim 1, it is characterized in that: described horizontal positioning device comprises base plate location hole, top board location hole and reference column, described reference column matches with described base plate location hole and top board location hole.
3. the loading fixture of miniaturized SMD products according to claim 2, it is characterized in that: described reference column is a multidiameter, and its small diameter portion matches with described top board location hole, and its major diameter part matches with described base plate location hole.
4. according to the loading fixture of claim 1,2 or 3 described miniaturized SMD products, it is characterized in that: described perpendicular positioning device comprises the projection at the step and the described top board edge of described bottom edge, and described projection is pressed on the described step.
5. the loading fixture of miniaturized SMD products according to claim 4, it is characterized in that: the turning point of described step is provided with chamfering, and the turning point of described projection is provided with fillet, and described chamfering matches with described fillet.
6. the loading fixture of miniaturized SMD products according to claim 5, it is characterized in that: described perpendicular positioning device comprises jacking block and jacking block hole, described jacking block hole is positioned on the described top board, and described jacking block is a multidiameter, and its small diameter portion matches with described jacking block hole.
7. the loading fixture of miniaturized SMD products according to claim 6, it is characterized in that: described product groove is a rectangle, and its four angles are provided with fillet, and the center of described product groove is provided with the circular hole that runs through described base plate.
8. the loading fixture of miniaturized SMD products according to claim 7 is characterized in that: described product groove and through hole corresponding with it have a plurality of, press rectangular array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203060598U CN201498509U (en) | 2009-07-13 | 2009-07-13 | Loading clamp of small-size SMD product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203060598U CN201498509U (en) | 2009-07-13 | 2009-07-13 | Loading clamp of small-size SMD product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201498509U true CN201498509U (en) | 2010-06-02 |
Family
ID=42441710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009203060598U Expired - Fee Related CN201498509U (en) | 2009-07-13 | 2009-07-13 | Loading clamp of small-size SMD product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201498509U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105537839A (en) * | 2016-02-22 | 2016-05-04 | 盐城市宏辉机械有限公司 | Welding tool for connector for folding safety shelf |
| CN112139623A (en) * | 2020-08-14 | 2020-12-29 | 武汉光迅科技股份有限公司 | Optical device assembly, reflow soldering equipment of optical device assembly and reflow soldering process method |
-
2009
- 2009-07-13 CN CN2009203060598U patent/CN201498509U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105537839A (en) * | 2016-02-22 | 2016-05-04 | 盐城市宏辉机械有限公司 | Welding tool for connector for folding safety shelf |
| CN112139623A (en) * | 2020-08-14 | 2020-12-29 | 武汉光迅科技股份有限公司 | Optical device assembly, reflow soldering equipment of optical device assembly and reflow soldering process method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 Termination date: 20120713 |