CN210959020U - DIP tray - Google Patents
DIP tray Download PDFInfo
- Publication number
- CN210959020U CN210959020U CN201921993776.2U CN201921993776U CN210959020U CN 210959020 U CN210959020 U CN 210959020U CN 201921993776 U CN201921993776 U CN 201921993776U CN 210959020 U CN210959020 U CN 210959020U
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- CN
- China
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- upper cover
- bottom plate
- dip tray
- tray according
- dip
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Abstract
A DIP tray belongs to the field of circuit board production tools. Comprises an upper cover and a bottom plate; the bottom plate is equipped with the standing groove, and the standing groove bottom is porose, and the standing groove both sides are equipped with the recess, and the bottom plate both sides are equipped with a supporting bench, and a supporting bench one side is equipped with the couple, and upper cover one end is located between the hookup portion of couple and the supporting bench, still is equipped with the reference column that is used for stretching into the upper cover on the bottom plate, and the upper cover bottom surface is equipped with the pressure stick, still is equipped with the shelves strip on the bottom. The utility model discloses a couple and supporting bench are spacing to the upper cover, make the pressure stick press the circuit board top in the standing groove, and the components and parts that need wave-soldering this moment are located the corresponding downthehole, prevent that components and parts from droing, the welding of being convenient for.
Description
Technical Field
The utility model relates to a circuit board production frock field especially relates to a DIP tray.
Background
In the design and development process of the circuit board, many design BOT surfaces need printing processes, the BOT surface products of the circuit board are usually dispensing processes, the function is to bond the components and the circuit board together, the components and the circuit board are welded through wave soldering, because of the requirements of substrate design and production, the BOT surfaces need to print soldering paste processes, the purpose is to enable the conductivity of the components to be better, ideal parameters are achieved, but although the soldering paste is in a curing state after passing through a reflow oven, the soldering paste can be melted again when meeting high temperature, so the wave soldering cannot be passed through, therefore, a DIP tray is urgently needed to enable the printed soldering paste components to be isolated from soldering tin in the wave soldering, the wave soldering is carried out, the printed components are prevented from being melted again after being subjected to high temperature, and the components are prevented from falling off, so that bad.
SUMMERY OF THE UTILITY MODEL
Receive once more after the high temperature to melt and lead to components and parts to drop when solving current solder paste portion article that have printed through wave-soldering, cause the problem of bad emergence, the utility model provides a DIP tray.
In order to achieve the above object, the utility model adopts the following technical scheme: a DIP tray comprises an upper cover and a bottom plate; the bottom plate is equipped with the standing groove, and the standing groove bottom is porose, and the standing groove both sides are equipped with the recess, and the bottom plate both sides are equipped with a supporting bench, and every supporting bench one side all is equipped with the couple, and the upper cover both ends are located respectively between the hookup portion and the supporting bench of corresponding couple, still are equipped with the reference column that is used for stretching into the upper cover on the bottom plate, and the upper cover bottom surface is equipped with presses the stick, still is equipped with the shelves strip on the bottom.
The shelves strip encircles and is sealed rectangle, and standing groove, recess, brace table and pressure stick all are located sealed rectangle.
The upper end diameter of the positioning column is smaller than the lower end diameter so as to form a boss, the top surface of the boss and the top surface of the supporting platform are located on the same plane, and the upper cover is arranged on the boss.
The bottom surface of the placing groove is provided with a positioning bulge.
The stop strip is installed on the bottom plate through screws.
The support table is installed on the bottom plate through screws.
The positioning column is installed on the bottom plate through screws.
The placing grooves are arranged in pairs.
The upper cover, the bottom plate, the hooks, the supporting table and the blocking strips are made of synthetic stone.
The utility model has the advantages that: couple and supporting bench are spacing to the upper cover, make the pressure stick press the circuit board top in the standing groove, and the components and parts that need wave-soldering this moment are located the downthehole that corresponds, prevent that components and parts from droing, the welding of being convenient for.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the bottom plate of the present invention;
fig. 3 is a schematic structural diagram of the upper cover of the present invention.
In the figure, 1, an upper cover, 2, a bottom plate, 3, a positioning column, 4, a hook, 5, a pressing rod, 6, a groove, 7, a stop strip, 8, a bulge, 9, a supporting table and 10, a placing groove are arranged.
Detailed Description
A DIP tray can meet the requirement of circuit board processing with the height of parts below 6mm of a BOT surface and comprises an upper cover 1 and a bottom plate 2; the bottom plate 2 is equipped with standing groove 10, and standing groove 10 bottom is porose, and standing groove 10 both sides are equipped with recess 6, and 2 both sides of bottom plate are equipped with brace table 9, and every brace table 9 one side all is equipped with couple 4, and 1 both ends of upper cover are located respectively between corresponding couple 4's the hookup portion and the brace table 9, still are equipped with the reference column 3 that is used for stretching into upper cover 1 on the bottom plate 2, and 1 bottom surface of upper cover is equipped with pressure stick 5, still is equipped with shelves strip 7 on the bottom plate 2.
The shelves strip 7 encircles and is sealed the rectangle, and standing groove 10, recess 6, brace table 9 and pressure stick 5 all are located sealed the rectangle, and the shelves strip 7 can avoid circuit board or components and parts to scatter and fall into in the wave-soldering groove.
The upper end diameter of reference column 3 is less than the lower extreme diameter in order to form the boss, and the top surface of boss and the top surface of brace table 9 are located the coplanar, and the upper cover is arranged in on the boss.
The bottom surface of the placing groove 10 is provided with a positioning bulge 8 for positioning the circuit board.
The stop bar 7 is arranged on the bottom plate 2 through screws, so that the circuit board or the components are prevented from falling into a wave soldering groove.
The support 9 is mounted on the base plate 2 by screws.
The positioning column 3 is installed on the bottom plate 2 through a screw to position the upper cover 1.
The placing grooves 10 are provided in pairs.
The upper cover 1, the bottom plate 2, the hooks 4, the supporting platform 9 and the stop bars 7 are made of synthetic stone, are high-temperature resistant and are not easy to deform.
When the device is used, the device of the circuit board is aligned with the hole at first, then the device is embedded into the hole, the device is located in the hole and exposes a point needing to be welded, the circuit board is located in the placing groove 10, the positioning protrusion 8 is embedded into the circuit board, the groove 6 is convenient to hold by hands, then the upper cover 1 is placed on the supporting table 9, the positioning column 3 stretches into the upper cover 1 at the moment, the hook 4 clamps the upper cover 1, the pressing rod 5 compresses the circuit board to prevent the circuit board from moving, and then wave soldering is carried out.
The above description is only the specific implementation manner of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution of the present invention and the design of the present invention within the technical scope of the present invention.
Claims (9)
1. The DIP tray is characterized by comprising an upper cover (1) and a bottom plate (2); the bottom plate (2) is provided with a placing groove (10), the bottom of the placing groove (10) is provided with a hole, two sides of the placing groove (10) are provided with grooves (6), two sides of the bottom plate (2) are provided with support tables (9), one side of each support table (9) is provided with a hook (4), two ends of the upper cover (1) are respectively arranged between the hook part of the corresponding hook (4) and the support tables (9), the bottom plate (2) is further provided with a positioning column (3) used for stretching into the upper cover (1), the bottom surface of the upper cover (1) is provided with a pressing rod (5), and the bottom plate (2) is further provided with a blocking strip (7.
2. The DIP tray according to claim 1, wherein the stop strips (7) are surrounded by a closed rectangle, and the holding groove (10), the groove (6), the support platform (9) and the press bar (5) are all located in the closed rectangle.
3. The DIP tray according to claim 1, wherein the positioning posts (3) have an upper end diameter smaller than a lower end diameter to form a boss, a top surface of the boss and a top surface of the support base (9) are located on the same plane, and the upper cover is placed on the boss.
4. The DIP tray according to claim 1, wherein the bottom surface of the placement groove (10) is provided with positioning projections (8).
5. The DIP tray according to claim 2, wherein the stop strips (7) are mounted on the base plate (2) by screws.
6. The DIP tray according to claim 1, wherein the support (9) is mounted on the base plate (2) by screws.
7. The DIP tray according to claim 1, wherein the positioning posts (3) are mounted on the base plate (2) by screws.
8. A DIP tray according to claim 1, wherein the standing grooves (10) are arranged in pairs.
9. The DIP tray according to claim 1, wherein the upper cover (1), the bottom plate (2), the hooks (4), the support base (9) and the stop strips (7) are made of synthetic stone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921993776.2U CN210959020U (en) | 2019-11-19 | 2019-11-19 | DIP tray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921993776.2U CN210959020U (en) | 2019-11-19 | 2019-11-19 | DIP tray |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210959020U true CN210959020U (en) | 2020-07-07 |
Family
ID=71376492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921993776.2U Active CN210959020U (en) | 2019-11-19 | 2019-11-19 | DIP tray |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210959020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113020746A (en) * | 2021-01-29 | 2021-06-25 | 赛尔康技术（深圳）有限公司 | Wave soldering jig |
-
2019
- 2019-11-19 CN CN201921993776.2U patent/CN210959020U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113020746A (en) * | 2021-01-29 | 2021-06-25 | 赛尔康技术（深圳）有限公司 | Wave soldering jig |
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