CN209133467U - A kind of multi-chip package production line merging SMT process - Google Patents
A kind of multi-chip package production line merging SMT process Download PDFInfo
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- CN209133467U CN209133467U CN201821473821.7U CN201821473821U CN209133467U CN 209133467 U CN209133467 U CN 209133467U CN 201821473821 U CN201821473821 U CN 201821473821U CN 209133467 U CN209133467 U CN 209133467U
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Abstract
The utility model relates to a kind of fusion SMT process multi-chip package production line, it is characterized in that successively including feeding device of lead frame (101) after in the past, steel mesh printing equipment (102), first AOI automatic optical detection device (103), active device mounting device (104), reflow soldering apparatus (105), 2nd AOI automatic optical detection device (106), chip installation device (107), first apparatus for baking (108), bonding apparatus (109), Plastic packaging apparatus (110), second apparatus for baking (111), marking device (112), electroplanting device (113), it forms tendon-cutting device (114), appearance detects packing device (115).The advantages of a kind of multi-chip package production line of fusion SMT process of the utility model has and improves production efficiency, reduces production cost, guarantees production product quality.
Description
Technical field
The utility model relates to a kind of multi-chip package production lines for merging SMT process.
Background technique
Traditional MCM integrated circuit package structure generally individually uses one of level package or second level package form
It is produced.
Level package, refers to the encapsulation that single-chip package or multi-chip are done on metal lead wire frame, and chip passes through elargol
Installation is on the lead frames.
Second level package refers to various components and integrated circuit, is welded in the circuit board by SMT mode.SMT is surface
The installation of package technique (surface mounting technology) (abbreviation of Surface Mount Technology), referred to as surface mount or surface
Technology.It is a kind of most popular technology and technique in current electronic assembly industry.SMT be it is a kind of will be without pin or short leg surface
It assembles component (abbreviation SMC/SMD, Chinese claim sheet component) and is mounted on printed circuit board (Printed Circuit
Board, PCB) surface or other substrates surface on, by the methods of Reflow Soldering or immersed solder be subject to welding assembly circuit fill
Even technology.Pcb board precision does not meet Moore's Law not enough, and second level package haves the defects that heat dissipation is difficult.
It is to be bonded in metal framework by the way of load elargol that multiple semiconductor chips encapsulate all on metal framework
On.
And second level package using tin cream by various components and integrated circuit and joint weld in the circuit board.
Load elargol processing performance is good, and electric conductivity heat dissipation performance is also quite excellent.But in a variety of component packages
When, active device such as MOS, when the chip package of passive device such as resistance capacitance and silicon materials is in same packaging body, 0.1mm2
When the resistance capacitance of weld size uses the elargol load technique of the silicon chip of 1mm rank, speed is slow, precision is low.
Utility model content
Purpose of the utility model is to overcome the above-mentioned shortcomings and provide production efficiency is improved, production cost is reduced, guarantees life
Produce a kind of multi-chip package production line of fusion SMT process of product quality.
Purpose of the utility model is realized as follows:
A kind of multi-chip package production line merging SMT process, it successively includes material loading of lead frame later in the past
Device, steel mesh printing equipment, the first AOI automatic optical detection device, active device mounting device, reflow soldering apparatus, the 2nd AOI
Automatic optical detection device, the first apparatus for baking, bonding apparatus, Plastic packaging apparatus, the second apparatus for baking, is beaten chip installation device
Device for mark, electroplanting device, molding tendon-cutting device, appearance detect packing device.
Inside is full of nitrogen protection when reflow soldering apparatus enables.
A kind of production method for the multi-chip package production line merging SMT process is as follows:
Step 1: feeding device of lead frame is by material loading of lead frame；
Step 2: steel mesh printing equipment is printed on the lead frames by steel mesh；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device prints steel mesh detects；
Step 4: active device mounting device installs active device on metal lead wire frame；
Step 5: the metal lead wire frame for installing device of having chance with is carried out Reflow Soldering in reflow soldering apparatus, in this process
Nitrogen protection is kept to keep active device close with metal framework by the reflow soldering apparatus of nitrogen protection in middle reflow soldering apparatus
Bonding；
Step 6: the metal lead wire frame that the 2nd AOI automatic optical detection device completes Reflow Soldering detects；Have not
Qualified place record is to database, without subsequent chip installation exercise at this；
Step 7: chip installation device installs chip on metal lead wire frame, according to the number of chip, chip
Multiple groups or one group has can be set in mounting device；
Step 8: the first apparatus for baking toasts the metal lead wire frame of adhering chip；
Step 9: bonding apparatus carries out bonding operation to the intermediate product that above-mentioned steps are completed；
Step 10: Plastic packaging apparatus carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Step 11: the second apparatus for baking carries out baking operation to the intermediate product that above-mentioned steps are completed；
Step 12: marking device carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 13: electroplanting device carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 14: molding tendon-cutting device carries out molding rib cutting operation to the intermediate product that above-mentioned steps are completed；
Step 15: appearance detects, packing device carries out appearance detection to the intermediate product that above-mentioned steps are completed and packaging is made
Industry.
The feeding of plastic packaging material, the plastic packaging material stock shelf packet are carried out when Plastic packaging apparatus plastic packaging operation using plastic packaging material stock shelf
Main body frame and cross bar are included, main body frame is internally provided with cross bar, main body frame and cross bar by being welded to connect, passes through welding
Connection, so as to improve integrally-built stability, the middle side of cross bar is provided with connection frame, and cross bar passes through welding with frame is connect
Connection, the left and right ends of main body frame are provided with blowing circular hole, and the lower end of main body frame is provided with press strip, the right end of main body frame
Upper and lower ends are each provided with a grip handle, and grip handle can to facilitate to take, and the inside of handle is held in two sides
It is provided with handle, the left end of handle is provided with control device, and the left end of control device is provided with link block.
The composition of main body frame includes fixing end, material hole, epipleural, transmission device and lower side panel, the right end of fixing end
Upside is provided with epipleural, and epipleural is internally provided with material hole, so that epipleural and lower side panel can move to
Same axle center, the lower end of epipleural are provided with lower side panel, and the right end of lower side panel is internally provided with transmission device, and main body frame passes through
Fixing end is fixedly connected with cross bar.
The composition of transmission device includes driving chain, reset spring, attachment base and drive rod, and the lower end of driving chain is set
It is equipped with reset spring, reset spring can to restore original state, and the lower end of reset spring is provided with attachment base, attachment base
Lower end be provided with drive rod, transmission device is fixedly connected by drive rod with link block.
The composition of control device includes push-pull rod, fixing seat, compressed spring, fixed block, connecting plate and control-rod, push-and-pull
The right end of bar is provided with fixing seat, and the right end of fixing seat is provided with compressed spring, so as under the action of compressed spring into
Row movement, the right end of compressed spring are provided with fixed block, and the right end of fixed block is provided with connecting plate, and the right end of connecting plate is provided with
Control-rod, control device are fixedly connected by control-rod with handle.
The composition of control-rod includes connecting hole, connecting rod, fixed fixture block and transmission strut, the lower end right side of fixed fixture block
It is provided with transmission strut, the left side lower end for being driven strut is provided with connecting rod, so that preferably being rotated, connects
The lower end of bar is provided with connecting hole, and control-rod is fixedly connected by transmission strut with handle.
Compared with prior art, the utility model has the beneficial effects that
1, due to being using SMT technique load, it is only necessary to one-step print, it can be by several leads within the scope of a piece of steel mesh
Frame fills tin cream simultaneously, and a point can only once be put by not needing picture point sizing process.
2, elargol technique, load speed are inversely proportional with chip size, and chip area is bigger, and load speed is slower.With production
The power consumption of product increases, and chip area is bigger, and load speed is slower.We use SMT technique, active chip load speed now
Degree is unrelated with area, substantially increases load speed.
3, tin cream is made of tin silver copper, and the electric conductivity, heat dissipation performance after Reflow Soldering are significantly better than elargol, heat dissipation performance
It is two times of elargol.
4, elargol cost is much higher than tin cream, is approximately 10-20 times of price of tin cream.
Therefore the MCM integrated circuit package structure of fusion SMT of the utility model a kind of, which has, improves production efficiency, reduces
Production cost guarantees the advantages of producing product quality.
Detailed description of the invention
Fig. 1 is the schematic diagram of embodiment 1.
Fig. 2 is the schematic diagram of embodiment 2.
Fig. 3 is the schematic diagram of embodiment 3.
Fig. 4 is a kind of multi-chip package production line schematic diagram of fusion SMT process of the utility model.
Fig. 5 is the structural schematic diagram of plastic packaging material stock shelf.
Fig. 6 is the main frame structure schematic diagram of plastic packaging material stock shelf.
Fig. 7 is the transmission structures schematic diagram of plastic packaging material stock shelf.
Fig. 8 is the controling device structure diagram of plastic packaging material stock shelf.
Fig. 9 is the control-rod structural schematic diagram of plastic packaging material stock shelf.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It clearly and completely describes, it is clear that described embodiment is only utility model a part of the embodiment, rather than whole realities
Apply example.Based on the embodiments of the present invention, those of ordinary skill in the art institute without making creative work
The every other embodiment obtained, fall within the protection scope of the utility model.
The utility model relates to a kind of fusion SMT MCM integrated circuit package structure, it includes metal lead wire frame,
Active device is welded by tin cream on metal lead wire frame, passes through elargol adhering chip, active device packet on metal lead wire frame
Include discrete device and integrated circuit, discrete device includes diode, triode, metal-oxide-semiconductor and silicon-controlled etc..
Referring to figure Fig. 4, a kind of multi-chip package production line merging SMT process, it successively includes drawing later in the past
Wire frame feeding device 101, steel mesh printing equipment 102, the first AOI automatic optical detection device 103, active device mounting device
104, reflow soldering apparatus 105, the 2nd AOI automatic optical detection device 106, chip installation device 107, the first apparatus for baking 108,
Bonding apparatus 109, Plastic packaging apparatus 110, the second apparatus for baking 111, marking device 112, electroplanting device 113, molding tendon-cutting device
114, appearance detects packing device 115.
Inside is full of nitrogen protection when wherein reflow soldering apparatus 105 enables.
A kind of production method for the multi-chip package production line merging SMT process is as follows:
Step 1: feeding device of lead frame 101 is by material loading of lead frame；
Step 2: steel mesh printing equipment 102 is printed on the lead frames by steel mesh；
General assembly line can at least use two complete metal lead wire frame operations together, therefore corresponding steel mesh area
It can be put into two complete metal lead wire frames simultaneously, the corresponding position opening (for upper tin cream) that will fill active device is opened
Open area and active device shape size are completely the same, paste solder printing are then used, on metal lead wire frame surface printing
0.08mm (the lead-free tin cream of positive and negative 5%) thickness (selection steel mesh thickness accurately controls tin cream thickness)；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device 103 prints steel mesh detects；
There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 4: active device mounting device 104 installs active device on metal lead wire frame；
Step 5: the have chance with metal lead wire frame of device of installation is carried out Reflow Soldering, herein mistake in reflow soldering apparatus 105
Nitrogen protection is kept to make active device and metal framework by the reflow soldering apparatus of nitrogen protection in reflow soldering apparatus 105 in journey
It closely bonds；
Step 6: the metal lead wire frame that the 2nd AOI automatic optical detection device 106 completes Reflow Soldering detects；
There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 7: chip installation device 107 installs chip on metal lead wire frame, according to the number of chip,
Multiple groups or one group has can be set in chip installation device 107；
Here by general integrated circuit load technique, load region is being needed, shape is similar on point, leads similar in area
Electric elargol or insulation elargol, by control chip or storaging chip, on the designated position of metal lead wire frame；
Step 8: the first apparatus for baking 108 toasts the metal lead wire frame of adhering chip；The baking temperature of this step
Degree is 170 degrees Celsius -180 degrees Celsius, and barbecue curing time is -150 minutes 90 minutes；
Step 9: the intermediate product that bonding apparatus 109 completes above-mentioned steps carry out bonding operation；
Step 10: Plastic packaging apparatus 110 carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Referring to Fig. 5-Fig. 9, the upper of plastic packaging material is wherein carried out using plastic packaging material stock shelf when 110 plastic packaging operation of Plastic packaging apparatus
Material, the plastic packaging material stock shelf includes main body frame 5 and cross bar 4, and main body frame 5 is internally provided with cross bar 4, main body frame 5
With cross bar 4 by being welded to connect, by being welded to connect, so as to improve integrally-built stability, the middle side setting of cross bar 4
There is connection frame 3, cross bar 4 passes through welded connecting with frame 3 is connect, and the left and right ends of main body frame 5 are provided with blowing circular hole 2, main body
The lower end of frame 5 is provided with press strip 1, and the right end upper and lower ends of main body frame 5 are each provided with a grip handle 6, holds handle 6
It can to facilitate to take, grip handle 6 in two sides is internally provided with handle 9, and the left end of handle 9 is provided with control device
8, the left end of control device 8 is provided with link block 7.
Further, the composition of main body frame 5 includes fixing end 51, material hole 52, epipleural 53, transmission device 54 and downside
Plate 55, the right end upside of fixing end 51 are provided with epipleural 53, and epipleural 53 is internally provided with material hole 52, so that
Epipleural 53 and lower side panel 55 can move to same axle center, and the lower end of epipleural 53 is provided with lower side panel 55, lower side panel 55
Right end is internally provided with transmission device 54, and main body frame 5 is fixedly connected by fixing end 51 with cross bar 4.
Further, the composition of transmission device 54 includes driving chain 541, reset spring 542, attachment base 543 and transmission
Bar 544, the lower end of driving chain 541 are provided with reset spring 542, and reset spring 542 can to restore original state, multiple
The lower end of position spring 542 is provided with attachment base 543, and the lower end of attachment base 543 is provided with drive rod 544, and transmission device 54 passes through
Drive rod 544 is fixedly connected with link block 7.
Further, the composition of control device 8 includes push-pull rod 81, fixing seat 82, compressed spring 83, fixed block 84, connects
Fishplate bar 85 and control-rod 86, the right end of push-pull rod 81 are provided with fixing seat 82, and the right end of fixing seat 82 is provided with compressed spring 83,
So as to be moved under the action of compressed spring 83, the right end of compressed spring 83 is provided with fixed block 84, fixed block 84
Right end be provided with connecting plate 85, the right end of connecting plate 85 is provided with control-rod 86, and control device 8 passes through control-rod 86 and handle
9 are fixedly connected.
Further, the composition of control-rod 86 includes connecting hole 861, connecting rod 862, fixed fixture block 863 and transmission strut
864, the lower end right side of fixed fixture block 863 is provided with transmission strut 864, and the left side lower end of transmission strut 864 is provided with connecting rod
862, so that preferably being rotated, the lower end of connecting rod 862 is provided with connecting hole 861, and control-rod 86 passes through biography
Dynamic strut 864 is fixedly connected with handle 9.
Further, there are two grip handle 6 is arranged altogether, two grip handles 6 are symmetrical set respectively in main body frame 5
Right end face and with main body frame 5 by be welded to connect, work to facilitate, two grip handles 6 inside be all provided with
It is equipped with a through slot.
Further, blowing circular hole 2 is provided with 16 altogether, and 16 blowing circular holes 2 are symmetrical set respectively in body frame
The left and right ends of frame 5, so as to disposably place multiple materials, so as to improve working efficiency, 16 blowing circular holes 2
It is six centimetres that left and right ends, which are each provided with eight and depth,.
Further, main body frame 5 is the cuboid structure of inner hollow, so as to support the load that top is subject to,
The length of main body frame 5 is 40 centimetres, width is 15 centimetres and with a thickness of five centimetres.
The working principle and process for using of the plastic packaging material stock shelf: plastic packaging material is sequentially placed into putting for plastic packaging material stock shelf
Expect in circular hole 2,16 blowing circular holes 2 are symmetrical set respectively in the left and right ends of main body frame 5, so as to disposably put
Multiple materials are set, so as to improve working efficiency, then hold grip handle 6 with hand, two grip handles 6 are respectively in symmetrical
The right end face of main body frame 5 is set and with main body frame 5 by being welded to connect, is worked to facilitate, by plastic packaging
Material stock shelf is put into the inside of Plastic packaging apparatus mold, at this moment presses control-rod 86, and subsequent blend stop is mobile, and Plastic packaging apparatus mold is opened
Directly eight plastic packaging materials are put into plastic package die simultaneously after mould, at this point, control device 8 need to be only pressed, so that compressed spring
83 compressions, so that the center of one-to-one epipleural 53 and lower side panel 55 is overlapped, eight plastic packaging materials can be from correspondence at this time
Lower material through hole fall into plastic package die, which save the working times, using the time of the moulding press course of work, while handle manually
Eight plastic packaging materials are put into the stock shelf, and plastic packaging material will fall to corresponding plastic packaging discharge position in mold from material hole, then
Control-rod 86 bounces automatically, and blend stop restores to material hole, and making Plastic packaging apparatus, work efficiency is high.
Step 11: the intermediate product that the second apparatus for baking 111 completes above-mentioned steps carry out baking operation；
Step 12: marking device 112 carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 13: electroplanting device 113 carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 14: the intermediate product that molding tendon-cutting device 114 completes above-mentioned steps carry out molding rib cutting operation；
Step 15: appearance, which detects packing device 115, carries out appearance detection and packaging to the intermediate product that above-mentioned steps are completed
Operation.
It is for a kind of three groups of embodiments and comparative example that the MCM integrated circuit package structure for merging SMT is done below
Data analysis comparison:
Embodiment 1, referring to Fig. 1, be provided with one on a kind of lead frame for the MCM integrated circuit package structure merging SMT
A triode and two chips.Triode is welded on the lead frames using tin cream, and chip is pasted onto lead frame using elargol
On.
Embodiment 2, referring to fig. 2 is provided with one on a kind of lead frame for the MCM integrated circuit package structure for merging SMT
A metal-oxide-semiconductor and three chips.Metal-oxide-semiconductor is welded on the lead frames using tin cream, and chip is pasted on the lead frames using elargol.
Embodiment 3, referring to Fig. 3, be provided with one on a kind of lead frame for the MCM integrated circuit package structure merging SMT
A ordinary silicon and four chips.Ordinary silicon is welded on the lead frames using tin cream, and chip is pasted onto lead frame using elargol
On.
The above is only the specific application examples of the utility model, do not constitute any limit to the protection scope of the utility model
System.Any technical scheme formed by adopting equivalent transformation or equivalent replacement, all fall within the utility model rights protection scope it
It is interior.
Claims (1)
1. a kind of multi-chip package production line for merging SMT process, it is characterised in that successively include lead frame after in the past
Frame feeding device (101), steel mesh printing equipment (102), the first AOI automatic optical detection device (103), active device installation dress
Set (104), reflow soldering apparatus (105), the 2nd AOI automatic optical detection device (106), chip installation device (107), the first baking
Roasting device (108), bonding apparatus (109), Plastic packaging apparatus (110), the second apparatus for baking (111), marking device (112), plating
Device (113), molding tendon-cutting device (114), appearance detection packing device (115)；
Plastic packaging apparatus (110) includes plastic packaging material stock shelf, and the plastic packaging material stock shelf includes main body frame (5) and cross bar (4), master
Body frame (5) is internally provided with cross bar (4), and main body frame (5) and cross bar (4) are by being welded to connect, by being welded to connect, from
And integrally-built stability can be improved, the middle side of cross bar (4) is provided with connection frame (3), and cross bar (4) leads to frame (3) are connect
Welded connecting is crossed, the left and right ends of main body frame (5) are provided with blowing circular hole (2), and the lower end of main body frame (5) is provided with press strip
(1), the right end upper and lower ends of main body frame (5) are each provided with a grip handle (6), and grip handle (6) can make conveniently
It takes, two sides grip handle (6) is internally provided with handle (9), and the left end of handle (9) is provided with control device (8), control
The left end of device (8) processed is provided with link block (7)；
The composition of main body frame (5) includes fixing end (51), material hole (52), epipleural (53), transmission device (54) and downside
The right end upside of plate (55), fixing end (51) is provided with epipleural (53), and epipleural (53) is internally provided with material hole (52), from
And can make epipleural (53) and lower side panel (55) that same axle center can be moved to, the lower end of epipleural (53) is provided with downside
Plate (55), the right end of lower side panel (55) are internally provided with transmission device (54), and main body frame (5) passes through fixing end (51) and cross bar
(4) it is fixedly connected；
The composition of transmission device (54) includes driving chain (541), reset spring (542), attachment base (543) and drive rod
(544), the lower end of driving chain (541) is provided with reset spring (542), and reset spring (542) can to restore originally
State, the lower end of reset spring (542) are provided with attachment base (543), and the lower end of attachment base (543) is provided with drive rod (544),
Transmission device (54) is fixedly connected by drive rod (544) with link block (7).
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192683A (en) * | 2018-09-10 | 2019-01-11 | 无锡豪帮高科股份有限公司 | A kind of MCM integrated antenna package production line merging SMT process |
| CN110572561A (en) * | 2019-10-30 | 2019-12-13 | 无锡豪帮高科股份有限公司 | production process of VCM mobile phone camera module |
| CN114121743A (en) * | 2021-10-29 | 2022-03-01 | 广东汇芯半导体有限公司 | Semiconductor circuit manufacturing plant |
-
2018
- 2018-09-10 CN CN201821473821.7U patent/CN209133467U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109192683A (en) * | 2018-09-10 | 2019-01-11 | 无锡豪帮高科股份有限公司 | A kind of MCM integrated antenna package production line merging SMT process |
| CN109192683B (en) * | 2018-09-10 | 2024-03-29 | 无锡豪帮高科股份有限公司 | MCM integrated circuit packaging production line integrating SMT procedures |
| CN110572561A (en) * | 2019-10-30 | 2019-12-13 | 无锡豪帮高科股份有限公司 | production process of VCM mobile phone camera module |
| CN110572561B (en) * | 2019-10-30 | 2020-10-23 | 无锡豪帮高科股份有限公司 | Production process of VCM mobile phone camera module |
| CN114121743A (en) * | 2021-10-29 | 2022-03-01 | 广东汇芯半导体有限公司 | Semiconductor circuit manufacturing plant |
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