CN109449149A - Encapsulating structure based on highly sensitive high voltage optical coupling chip module - Google Patents

Encapsulating structure based on highly sensitive high voltage optical coupling chip module Download PDF

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Publication number
CN109449149A
CN109449149A CN201811493322.9A CN201811493322A CN109449149A CN 109449149 A CN109449149 A CN 109449149A CN 201811493322 A CN201811493322 A CN 201811493322A CN 109449149 A CN109449149 A CN 109449149A
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CN
China
Prior art keywords
triode
optical coupling
chip module
lead frame
frame
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Application number
CN201811493322.9A
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Chinese (zh)
Inventor
全庆霄
姜岩峰
张巧杏
袁野
王辉
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Wuxi Haobang Hi-Tech Co Ltd
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Wuxi Haobang Hi-Tech Co Ltd
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Priority to CN201811493322.9A priority Critical patent/CN109449149A/en
Publication of CN109449149A publication Critical patent/CN109449149A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

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Abstract

A kind of encapsulating structure based on highly sensitive high voltage optical coupling chip module of the present invention, it is characterized in that it includes metal lead wire frame, active device and passive device are welded by tin cream on metal lead wire frame, pass through elargol adhering chip on metal lead wire frame.There is a chip that there is the sensitive control integrated circuit of light in chip, includes the first triode, the second triode, third transistor, the 4th triode, first resistor and second resistance in the sensitive control integrated circuit of light；Wherein: the first triode and the 4th triode are PNP transistors, and the second triode and third transistor are NPN transistors.A kind of encapsulating structure based on highly sensitive high voltage optical coupling chip module of the invention, which has, improves production efficiency, reduces production cost, guarantees the advantages of producing product quality.

Description

Encapsulating structure based on highly sensitive high voltage optical coupling chip module
Technical field
The present invention relates to a kind of encapsulating structures based on highly sensitive high voltage optical coupling chip module.
Background technique
Traditional SIP integrated circuit package structure generally individually uses one of level package or second level package form It is produced.
Level package, refers to the encapsulation that component and various chips are done on metal lead wire frame, and chip is pacified by elargol Dress is on the lead frames.
Second level package refers to various components and integrated circuit, is welded in the circuit board by SMT mode.SMT is surface The installation of package technique (surface mounting technology) (abbreviation of Surface Mount Technology), referred to as surface mount or surface Technology.It is a kind of most popular technology and technique in current electronic assembly industry.SMT be it is a kind of will be without pin or short leg surface It assembles component (abbreviation SMC/SMD, Chinese claim sheet component) and is mounted on printed circuit board (Printed Circuit Board, PCB) surface or other substrates surface on, by the methods of Reflow Soldering or immersed solder be subject to welding assembly circuit fill Even technology.Pcb board precision does not meet Moore's Law not enough, and second level package haves the defects that heat dissipation is difficult.
The multiple semiconductor chips of level package and component encapsulated on metal framework all be by the way of load elargol, It is bonded on metal framework.
And second level package using tin cream by various components and integrated circuit and joint weld in the circuit board.
Load elargol processing performance is good, and electric conductivity heat dissipation performance is also quite excellent.But in a variety of component packages When, active device such as MOS, when the chip package of passive device such as resistance capacitance and silicon materials is in same packaging body, 0.05mm2When the resistance capacitance of weld size uses the elargol load technique of the silicon chip of 1mm rank, speed is slow, precision is low.
The optical receiving circuit in photoelectric coupled circuit in traditional multichip packaging structure, driving energy small with driving current The weak feature of power, circuit structure are complicated.
Summary of the invention
The purpose of the present invention is to overcome the above shortcomings and to provide production efficiency is improved, production cost is reduced, guarantees that production produces A kind of encapsulating structure based on highly sensitive high voltage optical coupling chip module of quality, and the light in internal photoelectric coupled circuit connects Receiving circuit has the characteristics that driving current is big, driving capability is strong, which can be directly connected to the alternating voltage of 220V, simplify Circuit structure.
The object of the present invention is achieved like this:
A kind of encapsulating structure based on highly sensitive high voltage optical coupling chip module, it includes metal lead wire frame, metal Active device and passive device are welded by tin cream on lead frame, pass through elargol adhering chip on metal lead wire frame.
There is a chip that there is the sensitive control integrated circuit of light in chip, includes the one or three in the sensitive control integrated circuit of light Pole pipe, the second triode, third transistor, the 4th triode, first resistor and second resistance；
Wherein: the first triode and the 4th triode are PNP transistors,
Second triode and third transistor are NPN transistors,
Wherein: the first triode, the second triode and first resistor form positive half cycle circuit, the 4th triode, the three or three Pole pipe and second resistance form negative half period circuit, positive half cycle circuit and negative half period circuit is from beginning to end constitutes entire circuit, the One triode, the second triode, the 4th triode, third transistor form a circuit counterclockwise, and first resistor is connected to Between the emitter and base stage of second triode, second resistance is connected between the emitter of third transistor and base stage；
Wherein: the collector of the first triode connects the base stage of the second triode, the base stage connection first of the second triode The base stage of triode, the circuit connect alternating voltage.
Active device is that perhaps integrated circuit passive device is resistance, inductance or capacitor to discrete device, and discrete device is Diode, triode, metal-oxide-semiconductor or silicon-controlled.
A kind of production line of the encapsulating structure based on highly sensitive high voltage optical coupling chip module, it in the past after according to It is secondary include feeding device of lead frame, steel mesh printing equipment, the first AOI automatic optical detection device, active device mounting device, Passive device mounting device, reflow soldering apparatus, the 2nd AOI automatic optical detection device, chip installation device, the first baking dress It sets, bonding apparatus, Plastic packaging apparatus, the second apparatus for baking, marking device, electroplanting device, molding tendon-cutting device, appearance detection packaging Device.
Inside is full of nitrogen protection when reflow soldering apparatus enables.
A kind of production method of the encapsulating structure based on highly sensitive high voltage optical coupling chip module is as follows:
Step 1: feeding device of lead frame is by material loading of lead frame；
Step 2: steel mesh printing equipment is printed on the lead frames by steel mesh；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device prints steel mesh detects；
Step 4: active device mounting device installs active device on metal lead wire frame；
Step 5: active device mounting device installs passive device on metal lead wire frame；
Step 6: the metal lead wire frame for installing device of having chance with is carried out Reflow Soldering in reflow soldering apparatus, in this process Nitrogen protection is kept to keep active device close with metal framework by the reflow soldering apparatus of nitrogen protection in middle reflow soldering apparatus Bonding；
Step 7: the metal lead wire frame that the 2nd AOI automatic optical detection device completes Reflow Soldering detects；Have not Qualified place record is to database, without subsequent chip installation exercise at this；
Step 8: chip installation device installs chip on metal lead wire frame, according to the number of chip, chip Multiple groups or one group has can be set in mounting device；
Step 9: the first apparatus for baking toasts the metal lead wire frame of adhering chip；
Step 10: bonding apparatus carries out bonding operation to the intermediate product that above-mentioned steps are completed；
Step 11: Plastic packaging apparatus carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Step 12: the second apparatus for baking carries out baking operation to the intermediate product that above-mentioned steps are completed；
Step 13: marking device carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 14: electroplanting device carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 15: molding tendon-cutting device carries out molding rib cutting operation to the intermediate product that above-mentioned steps are completed；
Step 16: appearance detects, packing device carries out appearance detection to the intermediate product that above-mentioned steps are completed and packaging is made Industry.
The feeding of plastic packaging material, the plastic packaging material stock shelf packet are carried out when Plastic packaging apparatus plastic packaging operation using plastic packaging material stock shelf Main body frame and cross bar are included, main body frame is internally provided with cross bar, main body frame and cross bar by being welded to connect, passes through welding Connection, so as to improve integrally-built stability, the middle side of cross bar is provided with connection frame, and cross bar passes through welding with frame is connect Connection, the left and right ends of main body frame are provided with blowing circular hole, and the lower end of main body frame is provided with press strip, the right end of main body frame Upper and lower ends are each provided with a grip handle, and grip handle can to facilitate to take, and the inside of handle is held in two sides It is provided with handle, the left end of handle is provided with control device, and the left end of control device is provided with link block.
The composition of main body frame includes fixing end, material hole, epipleural, transmission device and lower side panel, the right end of fixing end Upside is provided with epipleural, and epipleural is internally provided with material hole, so that epipleural and lower side panel can move to Same axle center, the lower end of epipleural are provided with lower side panel, and the right end of lower side panel is internally provided with transmission device, and main body frame passes through Fixing end is fixedly connected with cross bar.
The composition of transmission device includes driving chain, reset spring, attachment base and drive rod, and the lower end of driving chain is set It is equipped with reset spring, reset spring can to restore original state, and the lower end of reset spring is provided with attachment base, attachment base Lower end be provided with drive rod, transmission device is fixedly connected by drive rod with link block.
The composition of control device includes push-pull rod, fixing seat, compressed spring, fixed block, connecting plate and control-rod, push-and-pull The right end of bar is provided with fixing seat, and the right end of fixing seat is provided with compressed spring, so as under the action of compressed spring into Row movement, the right end of compressed spring are provided with fixed block, and the right end of fixed block is provided with connecting plate, and the right end of connecting plate is provided with Control-rod, control device are fixedly connected by control-rod with handle.
The composition of control-rod includes connecting hole, connecting rod, fixed fixture block and transmission strut, the lower end right side of fixed fixture block It is provided with transmission strut, the left side lower end for being driven strut is provided with connecting rod, so that preferably being rotated, connects The lower end of bar is provided with connecting hole, and control-rod is fixedly connected by transmission strut with handle.
Compared with prior art, the beneficial effects of the present invention are:
1, due to being using SMT technique load, it is only necessary to one-step print, it can be by several leads within the scope of a piece of steel mesh Frame fills tin cream simultaneously, and a point can only once be put by not needing picture point sizing process.
2, elargol technique, load speed are inversely proportional with chip size, and chip area is bigger, and load speed is slower.With production The power consumption of product increases, and chip area is bigger, and load speed is slower.We use SMT technique, active chip load speed now Degree is unrelated with area, substantially increases load speed.
3, tin cream is made of tin silver copper, and the electric conductivity, heat dissipation performance after Reflow Soldering are significantly better than elargol, heat dissipation performance It is two times of elargol.
4, elargol cost is much higher than tin cream, is approximately 10-20 times of price of tin cream.
Therefore a kind of encapsulating structure based on highly sensitive high voltage optical coupling chip module of the invention, which has, improves production The advantages of efficiency reduces production cost, guarantees production product quality.
Detailed description of the invention
Fig. 1 is the schematic diagram of embodiment 1.
Fig. 2 is the schematic diagram of embodiment 2.
Fig. 3 is the schematic diagram of embodiment 3.
Fig. 4 is a kind of production line of encapsulating structure based on highly sensitive high voltage optical coupling chip module of the invention Schematic diagram.
Fig. 5 is the structural schematic diagram of plastic packaging material stock shelf.
Fig. 6 is the main frame structure schematic diagram of plastic packaging material stock shelf.
Fig. 7 is the transmission structures schematic diagram of plastic packaging material stock shelf.
Fig. 8 is the controling device structure diagram of plastic packaging material stock shelf.
Fig. 9 is the control-rod structural schematic diagram of plastic packaging material stock shelf.
Figure 10 is the schematic diagram of the sensitive control integrated circuit of light.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiment is only invention a part of the embodiment, instead of all the embodiments.Based on this Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts Example is applied, shall fall within the protection scope of the present invention.
A kind of encapsulating structure based on highly sensitive high voltage optical coupling chip module of the present invention, it includes that metal draws Wire frame welds active device by tin cream on metal lead wire frame, active by elargol adhering chip on metal lead wire frame Device includes discrete device and integrated circuit, and passive device is resistance, inductance or capacitor, discrete device include diode, Triode, metal-oxide-semiconductor and silicon-controlled etc..
Referring to figure Fig. 4, a kind of production line of the encapsulating structure based on highly sensitive high voltage optical coupling chip module, it It in the past successively include feeding device of lead frame 101, steel mesh printing equipment 102, the first AOI automatic optical detection device after 103, active device mounting device 104, passive device mounting device 105, reflow soldering apparatus 106, the 2nd AOI automatic optics inspection Device 107, chip installation device 108, the first apparatus for baking 109, bonding apparatus 110, Plastic packaging apparatus 111, the second apparatus for baking 112, marking device 113, electroplanting device 114, molding tendon-cutting device 115, appearance detect packing device 116.
Inside is full of nitrogen protection when wherein reflow soldering apparatus 106 enables.
A kind of production method of the encapsulating structure based on highly sensitive high voltage optical coupling chip module is as follows:
Step 1: feeding device of lead frame 101 is by material loading of lead frame；
Step 2: steel mesh printing equipment 102 is printed on the lead frames by steel mesh；
General assembly line can at least use two complete metal lead wire frame operations together, therefore corresponding steel mesh area It can be put into two complete metal lead wire frames simultaneously, it is corresponding (to be used for the position for filling active device and passive device opening Upper tin cream), opening area and active device shape size are completely the same, then use paste solder printing, metal lead wire frame surface 0.08mm (the lead-free tin cream of positive and negative 5%) thickness in printing (selection steel mesh thickness accurately controls tin cream thickness)；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device 103 prints steel mesh detects； There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 4: active device mounting device 104 installs active device on metal lead wire frame；
Step 5: passive device mounting device 105 installs passive device on metal lead wire frame；
Step 6: the have chance with metal lead wire frame of device of installation is carried out Reflow Soldering, herein mistake in reflow soldering apparatus 106 Nitrogen protection is kept to make active device and metal framework by the reflow soldering apparatus of nitrogen protection in reflow soldering apparatus 106 in journey It closely bonds；
Step 7: the metal lead wire frame that the 2nd AOI automatic optical detection device 107 completes Reflow Soldering detects； There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 8: chip installation device 108 installs chip on metal lead wire frame, according to the number of chip, Multiple groups or one group has can be set in chip installation device 108；
Here by general integrated circuit load technique, load region is being needed, shape is similar on point, leads similar in area Electric elargol or insulation elargol, by control chip or storaging chip, on the designated position of metal lead wire frame；
Step 9: the first apparatus for baking 109 toasts the metal lead wire frame of adhering chip；The baking temperature of this step Degree is 170 degrees Celsius -180 degrees Celsius, and barbecue curing time is -150 minutes 90 minutes；
Step 10: the intermediate product that bonding apparatus 110 completes above-mentioned steps carry out bonding operation；
Step 11: Plastic packaging apparatus 111 carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Referring to Fig. 5-Fig. 9, the upper of plastic packaging material is wherein carried out using plastic packaging material stock shelf when 111 plastic packaging operation of Plastic packaging apparatus Material, the plastic packaging material stock shelf includes main body frame 5 and cross bar 4, and main body frame 5 is internally provided with cross bar 4, main body frame 5 With cross bar 4 by being welded to connect, by being welded to connect, so as to improve integrally-built stability, the middle side setting of cross bar 4 There is connection frame 3, cross bar 4 passes through welded connecting with frame 3 is connect, and the left and right ends of main body frame 5 are provided with blowing circular hole 2, main body The lower end of frame 5 is provided with press strip 1, and the right end upper and lower ends of main body frame 5 are each provided with a grip handle 6, holds handle 6 It can to facilitate to take, grip handle 6 in two sides is internally provided with handle 9, and the left end of handle 9 is provided with control device 8, the left end of control device 8 is provided with link block 7.
Further, the composition of main body frame 5 includes fixing end 51, material hole 52, epipleural 53, transmission device 54 and downside Plate 55, the right end upside of fixing end 51 are provided with epipleural 53, and epipleural 53 is internally provided with material hole 52, so that Epipleural 53 and lower side panel 55 can move to same axle center, and the lower end of epipleural 53 is provided with lower side panel 55, lower side panel 55 Right end is internally provided with transmission device 54, and main body frame 5 is fixedly connected by fixing end 51 with cross bar 4.
Further, the composition of transmission device 54 includes driving chain 541, reset spring 542, attachment base 543 and transmission Bar 544, the lower end of driving chain 541 are provided with reset spring 542, and reset spring 542 can to restore original state, multiple The lower end of position spring 542 is provided with attachment base 543, and the lower end of attachment base 543 is provided with drive rod 544, and transmission device 54 passes through Drive rod 544 is fixedly connected with link block 7.
Further, the composition of control device 8 includes push-pull rod 81, fixing seat 82, compressed spring 83, fixed block 84, connects Fishplate bar 85 and control-rod 86, the right end of push-pull rod 81 are provided with fixing seat 82, and the right end of fixing seat 82 is provided with compressed spring 83, So as to be moved under the action of compressed spring 83, the right end of compressed spring 83 is provided with fixed block 84, fixed block 84 Right end be provided with connecting plate 85, the right end of connecting plate 85 is provided with control-rod 86, and control device 8 passes through control-rod 86 and handle 9 are fixedly connected.
Further, the composition of control-rod 86 includes connecting hole 861, connecting rod 862, fixed fixture block 863 and transmission strut 864, the lower end right side of fixed fixture block 863 is provided with transmission strut 864, and the left side lower end of transmission strut 864 is provided with connecting rod 862, so that preferably being rotated, the lower end of connecting rod 862 is provided with connecting hole 861, and control-rod 86 passes through biography Dynamic strut 864 is fixedly connected with handle 9.
Further, there are two grip handle 6 is arranged altogether, two grip handles 6 are symmetrical set respectively in main body frame 5 Right end face and with main body frame 5 by be welded to connect, work to facilitate, two grip handles 6 inside be all provided with It is equipped with a through slot.
Further, blowing circular hole 2 is provided with 16 altogether, and 16 blowing circular holes 2 are symmetrical set respectively in body frame The left and right ends of frame 5, so as to disposably place multiple materials, so as to improve working efficiency, 16 blowing circular holes 2 It is six centimetres that left and right ends, which are each provided with eight and depth,.
Further, main body frame 5 is the cuboid structure of inner hollow, so as to support the load that top is subject to, The length of main body frame 5 is 40 centimetres, width is 15 centimetres and with a thickness of five centimetres.
The working principle and process for using of the plastic packaging material stock shelf: plastic packaging material is sequentially placed into putting for plastic packaging material stock shelf Expect in circular hole 2,16 blowing circular holes 2 are symmetrical set respectively in the left and right ends of main body frame 5, so as to disposably put Multiple materials are set, so as to improve working efficiency, then hold grip handle 6 with hand, two grip handles 6 are respectively in symmetrical The right end face of main body frame 5 is set and with main body frame 5 by being welded to connect, is worked to facilitate, by plastic packaging Material stock shelf is put into the inside of Plastic packaging apparatus mold, at this moment presses control-rod 86, and subsequent blend stop is mobile, and Plastic packaging apparatus mold is opened Directly eight plastic packaging materials are put into plastic package die simultaneously after mould, at this point, control device 8 need to be only pressed, so that compressed spring 83 compressions, so that the center of one-to-one epipleural 53 and lower side panel 55 is overlapped, eight plastic packaging materials can be from correspondence at this time Lower material through hole fall into plastic package die, which save the working times, using the time of the moulding press course of work, while handle manually Eight plastic packaging materials are put into the stock shelf, and plastic packaging material will fall to corresponding plastic packaging discharge position in mold from material hole, then Control-rod 86 bounces automatically, and blend stop restores to material hole, and making Plastic packaging apparatus, work efficiency is high.
Step 12: the intermediate product that the second apparatus for baking 112 completes above-mentioned steps carry out baking operation；
Step 13: marking device 113 carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 14: electroplanting device 114 carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 15: the intermediate product that molding tendon-cutting device 115 completes above-mentioned steps carry out molding rib cutting operation；
Step 16: appearance, which detects packing device 116, carries out appearance detection and packaging to the intermediate product that above-mentioned steps are completed Operation.
It is for a kind of three groups of embodiments that the encapsulating structure based on highly sensitive high voltage optical coupling chip module is done below And the data of comparative example analyze comparison:
Embodiment 1, referring to Fig. 1, a kind of lead frame of the encapsulating structure based on highly sensitive high voltage optical coupling chip module A resistance, a triode and a chip are provided on frame.Resistance and triode are welded on the lead frames using tin cream, Chip is pasted on the lead frames using elargol.
Embodiment 2, referring to fig. 2, a kind of lead frame of the encapsulating structure based on highly sensitive high voltage optical coupling chip module A capacitor, a metal-oxide-semiconductor and a chip are provided on frame.Capacitor and metal-oxide-semiconductor are welded on the lead frames using tin cream, core Piece is pasted on the lead frames using elargol.
Embodiment 3, referring to Fig. 3, a kind of lead frame of the encapsulating structure based on highly sensitive high voltage optical coupling chip module A resistance, an ordinary silicon and a chip are provided on frame.Resistance and ordinary silicon are welded on the lead frames using tin cream, Chip is pasted on the lead frames using elargol.
There is a chip that there is the sensitive control integrated circuit of light in the chip of above-mentioned chip installation device installation, wherein light Sensitive control integrated circuit uses bipolar process, and the sensitive control integrated circuit of light includes two parts: optical signal receiving portion and electricity Current amplifier part, it is that optical signal is received and converted into electric signal that optical signal receiving portion, which completes function,；Current amplification circuit Completing function is to amplify electric signal, and form driving capability.The piece with the sensitive control integrated circuit of light works electric Pressure is 220V industrial frequency AC, and current amplification circuit is provided simultaneously with high voltage ability to bear, is resistant to 220V industrial frequency AC or more Voltage (corresponding direct current 600V).
It include the first triode Q1, the second triode Q2, third transistor Q3, the four or three in the sensitive control integrated circuit of light Pole pipe Q4, first resistor R1 and second resistance R2；
Wherein: the first triode Q1 and the 4th triode Q4 is PNP transistor, 10 square micron of emitter area to 1000 Square micron；
Second triode Q2 and third transistor Q3 is NPN transistor, and 10 square micron of emitter area is to 2000 squares Micron；
The resistance value of first resistor R1 and second resistance R2 are at 500 ohm to 1M Ω.
Wherein: the first triode Q1, the second triode Q2 and first resistor R1 form positive half cycle circuit, the 4th triode Q4, third transistor Q3 and second resistance R2 form negative half period circuit, positive half cycle circuit and negative half period circuit composition from beginning to end Entire circuit.First triode Q1, the second triode Q2, the 4th triode Q4, third transistor Q3 form one counterclockwise Circuit, first resistor R1 is connected between the emitter and base stage of the second triode Q2, and second resistance R2 is connected to the three or three Between the emitter and base stage of pole pipe Q3；
Wherein: the collector of the first triode Q1 connects the base stage of the second triode Q2, and the base stage of the second triode Q2 connects The base stage of the first triode Q1 is connect,
The circuit can directly connect alternating voltage, when positive half cycle, when thering is light to be incident in positive half cycle circuit, The base stage of second triode Q2 or the base stage of the first triode Q1 generate base current, and the base current of the first triode Q1 passes through After first triode Q1 amplification, exported from the collector of the first triode Q1, and the collector and the two or three of the first triode Q1 The base stage of pole pipe Q2 is connected, so the base current of the second triode Q2 increases quickly, then passes through putting for the second triode Q2 After big, exported from the collector of the second triode Q2, and the base stage of the collector of the second triode Q2 and the first triode Q1 It is connected, so, by several circulations, electric current becomes very big, so that the circuit is opened.It thereby realizes with faint light Signal controls the control that entire circuit is opened.
When alternating current circuit is in negative half period, third transistor Q3 and the 4th triode Q4 use same principle work Make.
So the above circuit is allowed in the case where no matter circuit adds positive voltage or negative voltage, entire circuit can and The control response of Shi Jinhang optical signal.
The above is only specific application examples of the invention, are not limited in any way to protection scope of the present invention.All uses Equivalent transformation or equivalent replacement and the technical solution formed, all fall within rights protection scope of the present invention.

Claims (10)

1.一种基于高灵敏高耐压光耦合芯片模块的封装结构，其特征在于它包括金属引线框架，金属引线框架上通过锡膏焊接有源器件和无源器件，金属引线框架上通过银胶粘贴芯片；A package structure based on a highly sensitive high-withstand voltage optical coupling chip module, characterized in that it comprises a metal lead frame, the active device and the passive device are soldered by a solder paste on the metal lead frame, and the silver metal paste is passed through the metal lead frame Paste the chip; 芯片中有一个芯片具有光灵敏控制集成电路，光灵敏控制集成电路中包括第一三极管、第二三极管、第三三极管、第四三极管、第一电阻以及第二电阻；One chip in the chip has a light sensitive control integrated circuit, and the light sensitive control integrated circuit includes a first triode, a second triode, a third triode, a fourth triode, a first resistor and a second resistor ; 其中：第一三极管和第四三极管是PNP晶体管，Wherein: the first triode and the fourth triode are PNP transistors, 第二三极管和第三三极管是NPN晶体管，The second triode and the third triode are NPN transistors, 其中：第一三极管、第二三极管和第一电阻组成正半周电路，第四三极管、第三三极管和第二电阻组成负半周电路，正半周电路和负半周电路头尾相连构成了整个电路，第一三极管、第二三极管、第四三极管、第三三极管形成一个逆时针的回路，第一电阻连接于第二三极管的发射极和基极之间，第二电阻连接于第三三极管的发射极和基极之间；Wherein: the first triode, the second triode and the first resistor form a positive half circuit, the fourth triode, the third triode and the second resistor form a negative half cycle circuit, the positive half cycle circuit and the negative half cycle circuit head The tails are connected to form the entire circuit, and the first triode, the second triode, the fourth triode, and the third triode form a counterclockwise loop, and the first resistor is connected to the emitter of the second triode Between the base and the base, the second resistor is connected between the emitter and the base of the third transistor; 其中：第一三极管的集电极连接第二三极管的基极，第二三极管的基极连接第一三极管的基极，该电路接交流电压。Wherein: the collector of the first triode is connected to the base of the second triode, and the base of the second triode is connected to the base of the first triode, and the circuit is connected to an alternating voltage. 2.根据权利要求1所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，其特征在于有源器件为分立器件或者集成电路，无源器件为电阻、电感或者电容，分立器件为二极管、三极管、MOS管或者可控硅。2 . The package structure of a high-sensitivity high-voltage-resistant optical coupling chip module according to claim 1 , wherein the active device is a discrete device or an integrated circuit, and the passive device is a resistor, an inductor or a capacitor, and the discrete device. It is a diode, a triode, a MOS tube or a thyristor. 3.根据权利要求1所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，它采用一种基于高灵敏高耐压光耦合芯片模块的封装结构的生产流水线进行生产，一种基于高灵敏高耐压光耦合芯片模块的封装结构的生产流水线从前至后依次包括引线框架上料装置(101)、钢网印刷装置(102)、第一AOI自动光学检测装置(103)、有源器件安装装置(104)、无源器件安装装置(105)、回流焊装置(106)、第二AOI自动光学检测装置(107)、芯片安装装置(108)、第一烘烤装置(109)、键合装置(110)、塑封装置(111)、第二烘烤装置(112)、打标装置(113)、电镀装置(114)、成型切筋装置(115)、外观检测包装装置(116)。3 . The package structure of a high-sensitivity high-voltage-resistant optical coupling chip module according to claim 1 , which adopts a production pipeline based on a package structure of a high-sensitivity high-voltage optical coupling chip module, The production line of the package structure based on the high-sensitivity high-voltage optical coupling chip module includes a lead frame loading device (101), a stencil printing device (102), a first AOI automatic optical detecting device (103), and a production line from the front to the rear. Source device mounting device (104), passive device mounting device (105), reflow soldering device (106), second AOI automatic optical detecting device (107), chip mounting device (108), first baking device (109) , bonding device (110), plastic sealing device (111), second baking device (112), marking device (113), plating device (114), forming and cutting device (115), appearance inspection packaging device (116) ). 4.根据权利要求3所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，回流焊装置(106)启用时内部充满氮气保护。4. A package structure based on a high-sensitivity, high-withstand voltage optical coupling chip module according to claim 3, wherein the reflow soldering device (106) is internally filled with nitrogen gas protection when activated. 5.根据权利要求1所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，其特征在于它的生产方法如下：5 . The package structure of a high-sensitivity high-voltage-resistant optical coupling chip module according to claim 1 , wherein the production method is as follows: 步骤一、引线框架上料装置(101)将引线框架上料；Step 1. The lead frame loading device (101) feeds the lead frame; 步骤二、钢网印刷装置(102)通过钢网在引线框架上进行印刷；Step two, the stencil printing device (102) prints on the lead frame through the steel mesh; 步骤三、第一AOI自动光学检测装置(103)对钢网印刷后的金属引线框架进行检测；Step 3: The first AOI automatic optical detecting device (103) detects the metal lead frame after the stencil printing; 步骤四、有源器件安装装置(104)在金属引线框架上安装有源器件；Step 4: The active device mounting device (104) mounts an active device on the metal lead frame; 步骤五、有源器件安装装置(105)在金属引线框架上安装有源器件；Step 5: The active device mounting device (105) mounts the active device on the metal lead frame; 步骤六、在回流焊装置(106)内将安装有缘器件的金属引线框架进行回流焊，在此过程中回流焊装置(106)内保持氮气保护，通过氮气保护的回流焊装置，使有源器件与金属框架紧密粘接；Step 6. Reflow soldering the metal lead frame with the edge device in the reflow soldering device (106). During this process, the reflow soldering device (106) maintains nitrogen protection, and the active device is protected by a nitrogen-protected reflow soldering device. Tightly bonded to the metal frame; 步骤七、第二AOI自动光学检测装置(107)对回流焊完成的金属引线框架进行检测；有不合格之处记录至数据库，该处不进行后续芯片安装作业；Step 7. The second AOI automatic optical detecting device (107) detects the metal lead frame of the reflow soldering; if there is any defect, records it to the database, where no subsequent chip mounting operation is performed; 步骤八、芯片安装装置(108)将芯片在金属引线框架上进行安装，根据芯片的多少，芯片安装装置(108)可以设置有多组或者一组；Step 8. The chip mounting device (108) mounts the chip on the metal lead frame. According to the number of the chips, the chip mounting device (108) may be provided with multiple groups or groups; 步骤九、第一烘烤装置(109)将粘贴芯片的金属引线框架进行烘烤；Step IX, the first baking device (109) bakes the metal lead frame of the pasting chip; 步骤十、键合装置(110)对上述步骤完成的中间品进行键合作业；Step 10: The bonding device (110) performs a key cooperation process on the intermediate product completed in the above steps; 步骤十一、塑封装置(111)对上述步骤完成的中间品进行塑封作业；Step 11: The plastic sealing device (111) performs a plastic sealing operation on the intermediate product completed in the above steps; 步骤十二、第二烘烤装置(112)对上述步骤完成的中间品进行烘烤作业；Step 12: The second baking device (112) performs a baking operation on the intermediate product completed in the above steps; 步骤十三、打标装置(113)对上述步骤完成的中间品进行打标作业；Step 13: The marking device (113) performs marking operation on the intermediate product completed in the above steps; 步骤十四、电镀装置(114)对上述步骤完成的中间品进行电镀作业；Step 14: The electroplating device (114) performs an electroplating operation on the intermediate product completed in the above steps; 步骤十五、成型切筋装置(115)对上述步骤完成的中间品进行成型切筋作业；Step fifteen, the forming and cutting device (115) performs the forming and ribbing operation on the intermediate product completed in the above steps; 步骤十六、外观检测包装装置(116)对上述步骤完成的中间品进行外观检测和包装作业。Step 16. The visual inspection packaging device (116) performs an appearance inspection and a packaging operation on the intermediate product completed in the above steps. 6.根据权利要求5所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，其特征在于步骤十一中，塑封装置(110)塑封作业时采用塑封料上料架进行塑封料的上料，所述塑封料上料架包括主体框架(5)与横杆(4)，主体框架(5)的内部设置有横杆(4)，主体框架(5)与横杆(4)通过焊接连接，通过焊接连接，从而可以提高整体结构的稳定性，横杆(4)的中侧设置有连接框(3)，横杆(4)与连接框(3)通过焊接连接，主体框架(5)的左右两端设置有放料圆孔(2)，主体框架(5)的下端设置有压条(1)，主体框架(5)的右端上下两端各设置有一个持握手柄(6)，持握手柄(6)可以使得方便进行拿取，两侧持握手柄(6)的内部设置有握把(9)，握把(9)的左端设置有控制装置(8)，控制装置(8)的左端设置有连接块(7)。6 . The package structure of the high-sensitivity high-voltage-resistant optical coupling chip module according to claim 5 , wherein in the step 11 , the plastic sealing material loading device is used for molding the plastic sealing device ( 110 ) during the plastic sealing operation. Loading, the molding material loading rack comprises a main body frame (5) and a cross bar (4), the main frame (5) is internally provided with a cross bar (4), the main body frame (5) and the cross bar (4) The connection of the joint is welded, so that the stability of the overall structure can be improved. The middle side of the crossbar (4) is provided with a connecting frame (3), and the crossbar (4) and the connecting frame (3) are connected by welding, the main frame (5) The left and right ends are provided with a discharge round hole (2), and the lower end of the main body frame (5) is provided with a bead (1), and the right end of the main frame (5) is provided with a holding handle (6). ), holding the handle (6) can make it easy to take, the grip handles (6) are arranged inside the grip handles (6) on both sides, and the left end of the grip (9) is provided with a control device (8), the control device The left end of (8) is provided with a connection block (7). 7.根据权利要求6所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，其特征在于主体框架(5)的组成包括有固定端(51)、料孔(52)、上侧板(53)、传动装置(54)和下侧板(55)，固定端(51)的右端上侧设置有上侧板(53)，上侧板(53)的内部设置有料孔(52)，从而可以使得上侧板(53)和下侧板(55)能够运动到同一轴心，上侧板(53)的下端设置有下侧板(55)，下侧板(55)的右端内部设置有传动装置(54)，主体框架(5)通过固定端(51)与横杆(4)固定连接。The package structure based on the high-sensitivity high-voltage-resistant optical coupling chip module according to claim 6, wherein the main frame (5) comprises a fixed end (51), a hole (52), and an upper portion. The side plate (53), the transmission device (54) and the lower side plate (55), the upper end of the right end of the fixed end (51) is provided with an upper side plate (53), and the inside of the upper side plate (53) is provided with a hole (52) Therefore, the upper side plate (53) and the lower side plate (55) can be moved to the same axis, the lower side of the upper side plate (53) is provided with a lower side plate (55), and the right side of the lower side plate (55) A transmission device (54) is disposed inside, and the main body frame (5) is fixedly connected to the cross bar (4) through the fixed end (51). 8.根据权利要求7所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，其特征在于传动装置(54)的组成包括有传动链条(541)、复位弹簧(542)、连接座(543)和传动杆(544)，传动链条(541)的下端设置有复位弹簧(542)，复位弹簧(542)可以使得恢复原来的状态，复位弹簧(542)的下端设置有连接座(543)，连接座(543)的下端设置有传动杆(544)，传动装置(54)通过传动杆(544)与连接块(7)固定连接。The package structure of the high-sensitivity high-voltage-resistant optical coupling chip module according to claim 7, wherein the transmission device (54) comprises a transmission chain (541), a return spring (542), and a connection. The seat (543) and the transmission rod (544), the lower end of the transmission chain (541) is provided with a return spring (542), the return spring (542) can be restored to the original state, and the lower end of the return spring (542) is provided with a connecting seat ( 543), the lower end of the connecting seat (543) is provided with a transmission rod (544), and the transmission device (54) is fixedly connected to the connecting block (7) through the transmission rod (544). 9.根据权利要求5所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，其特征在于控制装置(8)的组成包括有推拉杆(81)、固定座(82)、压缩弹簧(83)、固定块(84)、连接板(85)和控制杆(86)，推拉杆(81)的右端设置有固定座(82)，固定座(82)的右端设置有压缩弹簧(83)，从而可以在压缩弹簧(83)的作用下进行运动，压缩弹簧(83)的右端设置有固定块(84)，固定块(84)的右端设置有连接板(85)，连接板(85)的右端设置有控制杆(86)，控制装置(8)通过控制杆(86)与握把(9)固定连接。The package structure of the high-sensitivity high-voltage-resistant optical coupling chip module according to claim 5, characterized in that the control device (8) comprises a push-pull rod (81), a fixed seat (82), and a compression The spring (83), the fixing block (84), the connecting plate (85) and the control rod (86), the right end of the push-pull rod (81) is provided with a fixing seat (82), and the right end of the fixing seat (82) is provided with a compression spring ( 83), thereby being movable under the action of the compression spring (83), the right end of the compression spring (83) is provided with a fixing block (84), and the right end of the fixing block (84) is provided with a connecting plate (85), the connecting plate ( The right end of 85) is provided with a control lever (86), and the control device (8) is fixedly connected to the grip (9) via a control lever (86). 10.根据权利要求9所述的一种基于高灵敏高耐压光耦合芯片模块的封装结构，其特征在于控制杆(86)的组成包括有连接孔(861)、连接杆(862)、固定卡块(863)和传动支杆(864)，固定卡块(863)的下端右侧设置有传动支杆(864)，传动支杆(864)的左侧下端设置有连接杆(862)，从而可以使得更好的进行转动，连接杆(862)的下端设置有连接孔(861)，控制杆(86)通过传动支杆(864)与握把(9)固定连接。The package structure of the high-sensitivity high-voltage-resistant optical coupling chip module according to claim 9, wherein the control rod (86) comprises a connecting hole (861), a connecting rod (862), and a fixing A clamping block (864) is disposed on the right side of the lower end of the fixing block (863), and a connecting rod (862) is disposed at the lower left end of the driving strut (864). Thereby, the rotation can be made better, the lower end of the connecting rod (862) is provided with a connecting hole (861), and the control rod (86) is fixedly connected to the grip (9) through the transmission rod (864).
CN201811493322.9A 2018-12-07 2018-12-07 Encapsulating structure based on highly sensitive high voltage optical coupling chip module Withdrawn CN109449149A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110323214A (en) * 2019-07-10 2019-10-11 深圳摩特智能控制有限公司 Photoelectric sensor control system and its packaging method
CN111128825A (en) * 2020-01-08 2020-05-08 佛山市蓝箭电子股份有限公司 Lead frame material loading frame with automatic fixing function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110323214A (en) * 2019-07-10 2019-10-11 深圳摩特智能控制有限公司 Photoelectric sensor control system and its packaging method
CN111128825A (en) * 2020-01-08 2020-05-08 佛山市蓝箭电子股份有限公司 Lead frame material loading frame with automatic fixing function

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