CN209487504U - Integrated circuit package structure based on highly sensitive high voltage optical coupling chip module - Google Patents
Integrated circuit package structure based on highly sensitive high voltage optical coupling chip module Download PDFInfo
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- CN209487504U CN209487504U CN201822049799.XU CN201822049799U CN209487504U CN 209487504 U CN209487504 U CN 209487504U CN 201822049799 U CN201822049799 U CN 201822049799U CN 209487504 U CN209487504 U CN 209487504U
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- triode
- integrated circuit
- high voltage
- optical coupling
- highly sensitive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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Abstract
The utility model relates to a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module, it is characterized in that it includes metal lead wire frame, active device and passive device are welded by tin cream on metal lead wire frame, pass through elargol adhering chip on metal lead wire frame.There is a chip that there is the sensitive control integrated circuit of light in chip, includes the first triode, the second triode, third transistor, the 4th triode, first resistor and second resistance in the sensitive control integrated circuit of light；Wherein: the first triode and the 4th triode are PNP transistors, and the second triode and third transistor are NPN transistors.A kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module of the utility model, which has, improves production efficiency, reduces production cost, guarantees the advantages of producing product quality.
Description
Technical field
The utility model relates to a kind of integrated circuit package structures based on highly sensitive high voltage optical coupling chip module.
Background technique
Traditional SIP integrated circuit package structure generally individually uses one of level package or second level package form
It is produced.
Level package, refers to the encapsulation that component and various chips are done on metal lead wire frame, and chip is pacified by elargol
Dress is on the lead frames.
Second level package refers to various components and integrated circuit, is welded in the circuit board by SMT mode.SMT is surface
The installation of package technique (surface mounting technology) (abbreviation of Surface Mount Technology), referred to as surface mount or surface
Technology.It is a kind of most popular technology and technique in current electronic assembly industry.SMT be it is a kind of will be without pin or short leg surface
It assembles component (abbreviation SMC/SMD, Chinese claim sheet component) and is mounted on printed circuit board (Printed Circuit
Board, PCB) surface or other substrates surface on, by the methods of Reflow Soldering or immersed solder be subject to welding assembly circuit fill
Even technology.Pcb board precision does not meet Moore's Law not enough, and second level package haves the defects that heat dissipation is difficult.
The multiple semiconductor chips of level package and component encapsulated on metal framework all be by the way of load elargol,
It is bonded on metal framework.
And second level package using tin cream by various components and integrated circuit and joint weld in the circuit board.
Load elargol processing performance is good, and electric conductivity heat dissipation performance is also quite excellent.But in a variety of component packages
When, active device such as MOS, when the chip package of passive device such as resistance capacitance and silicon materials is in same packaging body,
0.05mm2When the resistance capacitance of weld size uses the elargol load technique of the silicon chip of 1mm rank, speed is slow, precision is low.
The optical receiving circuit in photoelectric coupled circuit in traditional multichip packaging structure, driving energy small with driving current
The weak feature of power, circuit structure are complicated.
Utility model content
Purpose of the utility model is to overcome the above-mentioned shortcomings and provide production efficiency is improved, production cost is reduced, guarantees life
Produce a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module of product quality, and internal optocoupler
Optical receiving circuit in circuit has the characteristics that driving current is big, driving capability is strong, which can be directly connected to the friendship of 220V
Galvanic electricity pressure, simplifies circuit structure.
Purpose of the utility model is realized as follows:
A kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module, it includes die-attach area
Frame welds active device and passive device by tin cream on metal lead wire frame, pastes core by elargol on metal lead wire frame
Piece.
There is a chip that there is the sensitive control integrated circuit of light in chip, includes the one or three in the sensitive control integrated circuit of light
Pole pipe, the second triode, third transistor, the 4th triode, first resistor and second resistance；
Wherein: the first triode and the 4th triode are PNP transistors,
Second triode and third transistor are NPN transistors,
Wherein: the first triode, the second triode and first resistor form positive half cycle circuit, the 4th triode, the three or three
Pole pipe and second resistance form negative half period circuit, positive half cycle circuit and negative half period circuit is from beginning to end constitutes entire circuit, the
One triode, the second triode, the 4th triode, third transistor form a circuit counterclockwise, and first resistor is connected to
Between the emitter and base stage of second triode, second resistance is connected between the emitter of third transistor and base stage；
Wherein: the collector of the first triode connects the base stage of the second triode, the base stage connection first of the second triode
The base stage of triode, the circuit connect alternating voltage.
Active device is that perhaps integrated circuit passive device is resistance, inductance or capacitor to discrete device, and discrete device is
Diode, triode, metal-oxide-semiconductor or silicon-controlled.
A kind of production line of the integrated circuit package structure based on highly sensitive high voltage optical coupling chip module, it from
It successively include feeding device of lead frame, steel mesh printing equipment, the first AOI automatic optical detection device, active device after preceding
Mounting device, passive device mounting device, reflow soldering apparatus, the 2nd AOI automatic optical detection device, chip installation device,
One apparatus for baking, bonding apparatus, Plastic packaging apparatus, the second apparatus for baking, marking device, electroplanting device, molding tendon-cutting device, appearance
Detect packing device.
Inside is full of nitrogen protection when reflow soldering apparatus enables.
A kind of production method of the integrated circuit package structure based on highly sensitive high voltage optical coupling chip module is as follows:
Step 1: feeding device of lead frame is by material loading of lead frame；
Step 2: steel mesh printing equipment is printed on the lead frames by steel mesh；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device prints steel mesh detects；
Step 4: active device mounting device installs active device on metal lead wire frame；
Step 5: active device mounting device installs passive device on metal lead wire frame；
Step 6: the metal lead wire frame for installing device of having chance with is carried out Reflow Soldering in reflow soldering apparatus, in this process
Nitrogen protection is kept to keep active device close with metal framework by the reflow soldering apparatus of nitrogen protection in middle reflow soldering apparatus
Bonding；
Step 7: the metal lead wire frame that the 2nd AOI automatic optical detection device completes Reflow Soldering detects；Have not
Qualified place record is to database, without subsequent chip installation exercise at this；
Step 8: chip installation device installs chip on metal lead wire frame, according to the number of chip, chip
Multiple groups or one group has can be set in mounting device；
Step 9: the first apparatus for baking toasts the metal lead wire frame of adhering chip；
Step 10: bonding apparatus carries out bonding operation to the intermediate product that above-mentioned steps are completed；
Step 11: Plastic packaging apparatus carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Step 12: the second apparatus for baking carries out baking operation to the intermediate product that above-mentioned steps are completed；
Step 13: marking device carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 14: electroplanting device carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 15: molding tendon-cutting device carries out molding rib cutting operation to the intermediate product that above-mentioned steps are completed；
Step 16: appearance detects, packing device carries out appearance detection to the intermediate product that above-mentioned steps are completed and packaging is made
Industry.
The feeding of plastic packaging material, the plastic packaging material stock shelf packet are carried out when Plastic packaging apparatus plastic packaging operation using plastic packaging material stock shelf
Main body frame and cross bar are included, main body frame is internally provided with cross bar, main body frame and cross bar by being welded to connect, passes through welding
Connection, so as to improve integrally-built stability, the middle side of cross bar is provided with connection frame, and cross bar passes through welding with frame is connect
Connection, the left and right ends of main body frame are provided with blowing circular hole, and the lower end of main body frame is provided with press strip, the right end of main body frame
Upper and lower ends are each provided with a grip handle, and grip handle can to facilitate to take, and the inside of handle is held in two sides
It is provided with handle, the left end of handle is provided with control device, and the left end of control device is provided with link block.
The composition of main body frame includes fixing end, material hole, epipleural, transmission device and lower side panel, the right end of fixing end
Upside is provided with epipleural, and epipleural is internally provided with material hole, so that epipleural and lower side panel can move to
Same axle center, the lower end of epipleural are provided with lower side panel, and the right end of lower side panel is internally provided with transmission device, and main body frame passes through
Fixing end is fixedly connected with cross bar.
The composition of transmission device includes driving chain, reset spring, attachment base and drive rod, and the lower end of driving chain is set
It is equipped with reset spring, reset spring can to restore original state, and the lower end of reset spring is provided with attachment base, attachment base
Lower end be provided with drive rod, transmission device is fixedly connected by drive rod with link block.
The composition of control device includes push-pull rod, fixing seat, compressed spring, fixed block, connecting plate and control-rod, push-and-pull
The right end of bar is provided with fixing seat, and the right end of fixing seat is provided with compressed spring, so as under the action of compressed spring into
Row movement, the right end of compressed spring are provided with fixed block, and the right end of fixed block is provided with connecting plate, and the right end of connecting plate is provided with
Control-rod, control device are fixedly connected by control-rod with handle.
The composition of control-rod includes connecting hole, connecting rod, fixed fixture block and transmission strut, the lower end right side of fixed fixture block
It is provided with transmission strut, the left side lower end for being driven strut is provided with connecting rod, so that preferably being rotated, connects
The lower end of bar is provided with connecting hole, and control-rod is fixedly connected by transmission strut with handle.
Compared with prior art, the utility model has the beneficial effects that
1, due to being using SMT technique load, it is only necessary to one-step print, it can be by several leads within the scope of a piece of steel mesh
Frame fills tin cream simultaneously, and a point can only once be put by not needing picture point sizing process.
2, elargol technique, load speed are inversely proportional with chip size, and chip area is bigger, and load speed is slower.With production
The power consumption of product increases, and chip area is bigger, and load speed is slower.We use SMT technique, active chip load speed now
Degree is unrelated with area, substantially increases load speed.
3, tin cream is made of tin silver copper, and the electric conductivity, heat dissipation performance after Reflow Soldering are significantly better than elargol, heat dissipation performance
It is two times of elargol.
4, elargol cost is much higher than tin cream, is approximately 10-20 times of price of tin cream.
Therefore a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module of the utility model
The advantages of with production efficiency is improved, reducing production cost, guaranteeing production product quality.
Detailed description of the invention
Fig. 1 is the schematic diagram of embodiment 1.
Fig. 2 is the schematic diagram of embodiment 2.
Fig. 3 is the schematic diagram of embodiment 3.
Fig. 4 is a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module of the utility model
Production line schematic diagram.
Fig. 5 is the structural schematic diagram of plastic packaging material stock shelf.
Fig. 6 is the main frame structure schematic diagram of plastic packaging material stock shelf.
Fig. 7 is the transmission structures schematic diagram of plastic packaging material stock shelf.
Fig. 8 is the controling device structure diagram of plastic packaging material stock shelf.
Fig. 9 is the control-rod structural schematic diagram of plastic packaging material stock shelf.
Figure 10 is the schematic diagram of the sensitive control integrated circuit of light.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It clearly and completely describes, it is clear that described embodiment is only utility model a part of the embodiment, rather than whole realities
Apply example.Based on the embodiments of the present invention, those of ordinary skill in the art institute without making creative work
The every other embodiment obtained, fall within the protection scope of the utility model.
The utility model relates to a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module,
It includes metal lead wire frame, welds active device by tin cream on metal lead wire frame, passes through elargol on metal lead wire frame
Adhering chip, active device include discrete device and integrated circuit, and passive device is resistance, inductance or capacitor, deviding device
Part includes diode, triode, metal-oxide-semiconductor and silicon-controlled etc..
Referring to figure Fig. 4, a kind of production of the integrated circuit package structure based on highly sensitive high voltage optical coupling chip module
Assembly line, it successively includes feeding device of lead frame 101, steel mesh printing equipment 102, the first AOI automated optical later in the past
Detection device 103, active device mounting device 104, passive device mounting device 105, reflow soldering apparatus 106, the 2nd AOI are automatic
Optical detection apparatus 107, chip installation device 108, the first apparatus for baking 109, bonding apparatus 110, Plastic packaging apparatus 111, second
Apparatus for baking 112, marking device 113, electroplanting device 114, molding tendon-cutting device 115, appearance detect packing device 116.
Inside is full of nitrogen protection when wherein reflow soldering apparatus 106 enables.
A kind of production method of the integrated circuit package structure based on highly sensitive high voltage optical coupling chip module is as follows:
Step 1: feeding device of lead frame 101 is by material loading of lead frame；
Step 2: steel mesh printing equipment 102 is printed on the lead frames by steel mesh；
General assembly line can at least use two complete metal lead wire frame operations together, therefore corresponding steel mesh area
It can be put into two complete metal lead wire frames simultaneously, it is corresponding (to be used for the position for filling active device and passive device opening
Upper tin cream), opening area and active device shape size are completely the same, then use paste solder printing, metal lead wire frame surface
0.08mm (the lead-free tin cream of positive and negative 5%) thickness in printing (selection steel mesh thickness accurately controls tin cream thickness)；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device 103 prints steel mesh detects；
There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 4: active device mounting device 104 installs active device on metal lead wire frame；
Step 5: passive device mounting device 105 installs passive device on metal lead wire frame；
Step 6: the have chance with metal lead wire frame of device of installation is carried out Reflow Soldering, herein mistake in reflow soldering apparatus 106
Nitrogen protection is kept to make active device and metal framework by the reflow soldering apparatus of nitrogen protection in reflow soldering apparatus 106 in journey
It closely bonds；
Step 7: the metal lead wire frame that the 2nd AOI automatic optical detection device 107 completes Reflow Soldering detects；
There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 8: chip installation device 108 installs chip on metal lead wire frame, according to the number of chip,
Multiple groups or one group has can be set in chip installation device 108；
Here by general integrated circuit load technique, load region is being needed, shape is similar on point, leads similar in area
Electric elargol or insulation elargol, by control chip or storaging chip, on the designated position of metal lead wire frame；
Step 9: the first apparatus for baking 109 toasts the metal lead wire frame of adhering chip；The baking temperature of this step
Degree is 170 degrees Celsius -180 degrees Celsius, and barbecue curing time is -150 minutes 90 minutes；
Step 10: the intermediate product that bonding apparatus 110 completes above-mentioned steps carry out bonding operation；
Step 11: Plastic packaging apparatus 111 carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Referring to Fig. 5-Fig. 9, the upper of plastic packaging material is wherein carried out using plastic packaging material stock shelf when 111 plastic packaging operation of Plastic packaging apparatus
Material, the plastic packaging material stock shelf includes main body frame 5 and cross bar 4, and main body frame 5 is internally provided with cross bar 4, main body frame 5
With cross bar 4 by being welded to connect, by being welded to connect, so as to improve integrally-built stability, the middle side setting of cross bar 4
There is connection frame 3, cross bar 4 passes through welded connecting with frame 3 is connect, and the left and right ends of main body frame 5 are provided with blowing circular hole 2, main body
The lower end of frame 5 is provided with press strip 1, and the right end upper and lower ends of main body frame 5 are each provided with a grip handle 6, holds handle 6
It can to facilitate to take, grip handle 6 in two sides is internally provided with handle 9, and the left end of handle 9 is provided with control device
8, the left end of control device 8 is provided with link block 7.
Further, the composition of main body frame 5 includes fixing end 51, material hole 52, epipleural 53, transmission device 54 and downside
Plate 55, the right end upside of fixing end 51 are provided with epipleural 53, and epipleural 53 is internally provided with material hole 52, so that
Epipleural 53 and lower side panel 55 can move to same axle center, and the lower end of epipleural 53 is provided with lower side panel 55, lower side panel 55
Right end is internally provided with transmission device 54, and main body frame 5 is fixedly connected by fixing end 51 with cross bar 4.
Further, the composition of transmission device 54 includes driving chain 541, reset spring 542, attachment base 543 and transmission
Bar 544, the lower end of driving chain 541 are provided with reset spring 542, and reset spring 542 can to restore original state, multiple
The lower end of position spring 542 is provided with attachment base 543, and the lower end of attachment base 543 is provided with drive rod 544, and transmission device 54 passes through
Drive rod 544 is fixedly connected with link block 7.
Further, the composition of control device 8 includes push-pull rod 81, fixing seat 82, compressed spring 83, fixed block 84, connects
Fishplate bar 85 and control-rod 86, the right end of push-pull rod 81 are provided with fixing seat 82, and the right end of fixing seat 82 is provided with compressed spring 83,
So as to be moved under the action of compressed spring 83, the right end of compressed spring 83 is provided with fixed block 84, fixed block 84
Right end be provided with connecting plate 85, the right end of connecting plate 85 is provided with control-rod 86, and control device 8 passes through control-rod 86 and handle
9 are fixedly connected.
Further, the composition of control-rod 86 includes connecting hole 861, connecting rod 862, fixed fixture block 863 and transmission strut
864, the lower end right side of fixed fixture block 863 is provided with transmission strut 864, and the left side lower end of transmission strut 864 is provided with connecting rod
862, so that preferably being rotated, the lower end of connecting rod 862 is provided with connecting hole 861, and control-rod 86 passes through biography
Dynamic strut 864 is fixedly connected with handle 9.
Further, there are two grip handle 6 is arranged altogether, two grip handles 6 are symmetrical set respectively in main body frame 5
Right end face and with main body frame 5 by be welded to connect, work to facilitate, two grip handles 6 inside be all provided with
It is equipped with a through slot.
Further, blowing circular hole 2 is provided with 16 altogether, and 16 blowing circular holes 2 are symmetrical set respectively in body frame
The left and right ends of frame 5, so as to disposably place multiple materials, so as to improve working efficiency, 16 blowing circular holes 2
It is six centimetres that left and right ends, which are each provided with eight and depth,.
Further, main body frame 5 is the cuboid structure of inner hollow, so as to support the load that top is subject to,
The length of main body frame 5 is 40 centimetres, width is 15 centimetres and with a thickness of five centimetres.
The working principle and process for using of the plastic packaging material stock shelf: plastic packaging material is sequentially placed into putting for plastic packaging material stock shelf
Expect in circular hole 2,16 blowing circular holes 2 are symmetrical set respectively in the left and right ends of main body frame 5, so as to disposably put
Multiple materials are set, so as to improve working efficiency, then hold grip handle 6 with hand, two grip handles 6 are respectively in symmetrical
The right end face of main body frame 5 is set and with main body frame 5 by being welded to connect, is worked to facilitate, by plastic packaging
Material stock shelf is put into the inside of Plastic packaging apparatus mold, at this moment presses control-rod 86, and subsequent blend stop is mobile, and Plastic packaging apparatus mold is opened
Directly eight plastic packaging materials are put into plastic package die simultaneously after mould, at this point, control device 8 need to be only pressed, so that compressed spring
83 compressions, so that the center of one-to-one epipleural 53 and lower side panel 55 is overlapped, eight plastic packaging materials can be from correspondence at this time
Lower material through hole fall into plastic package die, which save the working times, using the time of the moulding press course of work, while handle manually
Eight plastic packaging materials are put into the stock shelf, and plastic packaging material will fall to corresponding plastic packaging discharge position in mold from material hole, then
Control-rod 86 bounces automatically, and blend stop restores to material hole, and making Plastic packaging apparatus, work efficiency is high.
Step 12: the intermediate product that the second apparatus for baking 112 completes above-mentioned steps carry out baking operation；
Step 13: marking device 113 carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 14: electroplanting device 114 carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 15: the intermediate product that molding tendon-cutting device 115 completes above-mentioned steps carry out molding rib cutting operation；
Step 16: appearance, which detects packing device 116, carries out appearance detection and packaging to the intermediate product that above-mentioned steps are completed
Operation.
It is three done for a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module below
The data of group embodiment and comparative example analyze comparison:
Embodiment 1, referring to Fig. 1, a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module
Lead frame on be provided with a resistance, a triode and a chip.Resistance and triode are welded on using tin cream to be drawn
On wire frame, chip is pasted on the lead frames using elargol.
Embodiment 2, referring to fig. 2, a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module
Lead frame on be provided with a capacitor, a metal-oxide-semiconductor and a chip.Capacitor and metal-oxide-semiconductor use tin cream to be welded on lead
On frame, chip is pasted on the lead frames using elargol.
Embodiment 3, referring to Fig. 3, a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module
Lead frame on be provided with a resistance, an ordinary silicon and a chip.Resistance and ordinary silicon are welded on using tin cream draws
On wire frame, chip is pasted on the lead frames using elargol.
There is a chip that there is the sensitive control integrated circuit of light in the chip of above-mentioned chip installation device installation, wherein light
Sensitive control integrated circuit uses bipolar process, and the sensitive control integrated circuit of light includes two parts: optical signal receiving portion and electricity
Current amplifier part, it is that optical signal is received and converted into electric signal that optical signal receiving portion, which completes function,；Current amplification circuit
Completing function is to amplify electric signal, and form driving capability.The piece with the sensitive control integrated circuit of light works electric
Pressure is 220V industrial frequency AC, and current amplification circuit is provided simultaneously with high voltage ability to bear, is resistant to 220V industrial frequency AC or more
Voltage (corresponding direct current 600V).
It include the first triode Q1, the second triode Q2, third transistor Q3, the four or three in the sensitive control integrated circuit of light
Pole pipe Q4, first resistor R1 and second resistance R2；
Wherein: the first triode Q1 and the 4th triode Q4 is PNP transistor, 10 square micron of emitter area to 1000
Square micron；
Second triode Q2 and third transistor Q3 is NPN transistor, and 10 square micron of emitter area is to 2000 squares
Micron；
The resistance value of first resistor R1 and second resistance R2 are at 500 ohm to 1M Ω.
Wherein: the first triode Q1, the second triode Q2 and first resistor R1 form positive half cycle circuit, the 4th triode
Q4, third transistor Q3 and second resistance R2 form negative half period circuit, positive half cycle circuit and negative half period circuit composition from beginning to end
Entire circuit.First triode Q1, the second triode Q2, the 4th triode Q4, third transistor Q3 form one counterclockwise
Circuit, first resistor R1 is connected between the emitter and base stage of the second triode Q2, and second resistance R2 is connected to the three or three
Between the emitter and base stage of pole pipe Q3；
Wherein: the collector of the first triode Q1 connects the base stage of the second triode Q2, and the base stage of the second triode Q2 connects
The base stage of the first triode Q1 is connect,
The circuit can directly connect alternating voltage, when positive half cycle, when thering is light to be incident in positive half cycle circuit,
The base stage of second triode Q2 or the base stage of the first triode Q1 generate base current, and the base current of the first triode Q1 passes through
After first triode Q1 amplification, exported from the collector of the first triode Q1, and the collector and the two or three of the first triode Q1
The base stage of pole pipe Q2 is connected, so the base current of the second triode Q2 increases quickly, then passes through putting for the second triode Q2
After big, exported from the collector of the second triode Q2, and the base stage of the collector of the second triode Q2 and the first triode Q1
It is connected, so, by several circulations, electric current becomes very big, so that the circuit is opened.It thereby realizes with faint light
Signal controls the control that entire circuit is opened.
When alternating current circuit is in negative half period, third transistor Q3 and the 4th triode Q4 use same principle work
Make.
So the above circuit is allowed in the case where no matter circuit adds positive voltage or negative voltage, entire circuit can and
The control response of Shi Jinhang optical signal.
The above is only the specific application examples of the utility model, do not constitute any limit to the protection scope of the utility model
System.Any technical scheme formed by adopting equivalent transformation or equivalent replacement, all fall within the utility model rights protection scope it
It is interior.
Claims (4)
1. a kind of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module, it is characterised in that it includes gold
Belong to lead frame, by tin cream welding active device and passive device on metal lead wire frame, passes through silver on metal lead wire frame
Glue chip；
There is a chip that there is the sensitive control integrated circuit of light in chip, includes the one or three pole in the sensitive control integrated circuit of light
Pipe, the second triode, third transistor, the 4th triode, first resistor and second resistance；
Wherein: the first triode and the 4th triode are PNP transistors,
Second triode and third transistor are NPN transistors,
Wherein: the first triode, the second triode and first resistor form positive half cycle circuit, the 4th triode, third transistor
Negative half period circuit is formed with second resistance, positive half cycle circuit and negative half period circuit is from beginning to end constitutes entire circuit, the one or three
Pole pipe, the second triode, the 4th triode, third transistor form a circuit counterclockwise, and first resistor is connected to second
Between the emitter and base stage of triode, second resistance is connected between the emitter of third transistor and base stage；
Wherein: the collector of the first triode connects the base stage of the second triode, and the base stage of the second triode connects the one or three pole
The base stage of pipe, the circuit connect alternating voltage.
2. a kind of integrated antenna package knot based on highly sensitive high voltage optical coupling chip module according to claim 1
Structure, it is characterised in that active device is that perhaps integrated circuit passive device is resistance, inductance or capacitor to discrete device, discrete
Device is diode, triode, metal-oxide-semiconductor or silicon-controlled.
3. a kind of integrated antenna package knot based on highly sensitive high voltage optical coupling chip module according to claim 1
Structure, it is carried out using a kind of production line of integrated circuit package structure based on highly sensitive high voltage optical coupling chip module
Production, a kind of production line of the integrated circuit package structure based on highly sensitive high voltage optical coupling chip module is from front to back
Successively include feeding device of lead frame (101), steel mesh printing equipment (102), the first AOI automatic optical detection device (103),
Active device mounting device (104), passive device mounting device (105), reflow soldering apparatus (106), the inspection of the 2nd AOI automated optical
Survey device (107), chip installation device (108), the first apparatus for baking (109), bonding apparatus (110), Plastic packaging apparatus (111),
Second apparatus for baking (112), marking device (113), electroplanting device (114), molding tendon-cutting device (115), appearance detection packaging
Device (116).
4. a kind of integrated antenna package knot based on highly sensitive high voltage optical coupling chip module according to claim 3
Structure, inside is full of nitrogen protection when reflow soldering apparatus (106) enables.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822049799.XU CN209487504U (en) | 2018-12-07 | 2018-12-07 | Integrated circuit package structure based on highly sensitive high voltage optical coupling chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822049799.XU CN209487504U (en) | 2018-12-07 | 2018-12-07 | Integrated circuit package structure based on highly sensitive high voltage optical coupling chip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209487504U true CN209487504U (en) | 2019-10-11 |
Family
ID=68117813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822049799.XU Active CN209487504U (en) | 2018-12-07 | 2018-12-07 | Integrated circuit package structure based on highly sensitive high voltage optical coupling chip module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209487504U (en) |
-
2018
- 2018-12-07 CN CN201822049799.XU patent/CN209487504U/en active Active
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