CN109378307A - A kind of modular package structure of multi-chip - Google Patents
A kind of modular package structure of multi-chip Download PDFInfo
- Publication number
- CN109378307A CN109378307A CN201811493307.4A CN201811493307A CN109378307A CN 109378307 A CN109378307 A CN 109378307A CN 201811493307 A CN201811493307 A CN 201811493307A CN 109378307 A CN109378307 A CN 109378307A
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- chip
- triode
- package structure
- frame
- lead wire
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- 239000002184 metal Substances 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 239000010703 silicon Substances 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000006071 cream Substances 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims description 25
- 238000005476 soldering Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 22
- 239000005022 packaging material Substances 0.000 claims description 22
- 238000004806 packaging method and process Methods 0.000 claims description 22
- 239000013067 intermediate product Substances 0.000 claims description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 16
- 238000009434 installation Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 229910000831 Steel Inorganic materials 0.000 claims description 15
- 239000010959 steel Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 12
- 230000003321 amplification Effects 0.000 claims description 11
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000005622 photoelectricity Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 235000021168 barbecue Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The modular package structure of a kind of multi-chip of the present invention, it is characterised in that it includes metal lead wire frame, welds active device by tin cream on metal lead wire frame, passes through elargol adhering chip on metal lead wire frame.Active device is that perhaps integrated circuit discrete device is diode, triode, metal-oxide-semiconductor or silicon-controlled to discrete device.A kind of modular package structure of multi-chip of the invention, which has, improves production efficiency, reduces production cost, guarantees the advantages of producing product quality.
Description
Technical field
The present invention relates to a kind of modular package structures of multi-chip.
Background technique
Traditional MCM integrated circuit package structure generally individually uses one of level package or second level package form
It is produced.
Level package, refers to the encapsulation that single-chip package or multi-chip are done on metal lead wire frame, and chip passes through elargol
Installation is on the lead frames.
Second level package refers to various components and integrated circuit, is welded in the circuit board by SMT mode.SMT is surface
The installation of package technique (surface mounting technology) (abbreviation of Surface Mount Technology), referred to as surface mount or surface
Technology.It is a kind of most popular technology and technique in current electronic assembly industry.SMT be it is a kind of will be without pin or short leg surface
It assembles component (abbreviation SMC/SMD, Chinese claim sheet component) and is mounted on printed circuit board (Printed Circuit
Board, PCB) surface or other substrates surface on, by the methods of Reflow Soldering or immersed solder be subject to welding assembly circuit fill
Even technology.Pcb board precision does not meet Moore's Law not enough, and second level package haves the defects that heat dissipation is difficult.
It is to be bonded in metal framework by the way of load elargol that multiple semiconductor chips encapsulate all on metal framework
On.
And second level package using tin cream by various components and integrated circuit and joint weld in the circuit board.
Load elargol processing performance is good, and electric conductivity heat dissipation performance is also quite excellent.But in a variety of component packages
When, active device such as MOS, when the chip package of passive device such as resistance capacitance and silicon materials is in same packaging body, 0.1mm2
When the resistance capacitance of weld size uses the elargol load technique of the silicon chip of 1mm rank, speed is slow, precision is low.
In addition mainly there are three chips to constitute for traditional photoelectricity solid-state relay, including the reception of light emitting end, optical signal is put
Big end and power control end, wherein light emitting end is generally a LED light emitting diode, and wavelength is near-infrared and visible light model
It encloses, the main function that optical signal receives amplification end is to receive optical signal, optical signal is then converted to electric signal, and put
Greatly, power control end is generally semiconductor power switch device, including silicon-controlled, VDMOS, LDMOS or IGBT etc., power device
Gate pole (or grid) control terminal and optical signal receive amplification end signal and be connected, anode and cathode as solid-state relay port,
Connection needs the forceful electric power port controlled.Such infrastructure cost is high, reliability is low, assembly difficulty is big, electromagnetic interference possibility is big.
Summary of the invention
The purpose of the present invention is to overcome the above shortcomings and to provide production efficiency is improved, production cost is reduced, guarantees that production produces
In addition a kind of modular package structure of multi-chip of quality uses single-chip integration photoelectricity solid-state relay, so that knot is constituted
This reduction, reliability increase, assembly difficulty reduces, reduce electromagnetic interference possibility.
The object of the present invention is achieved like this:
A kind of modular package structure of multi-chip, it includes metal lead wire frame, passes through tin cream on metal lead wire frame
Active device is welded, passes through elargol adhering chip on metal lead wire frame.
Having a chip in above-mentioned chip is integrated electro solid-state relay, and the integrated electro solid-state relay includes
Optical signal receives amplification end and power control end two parts, and integrated electro solid-state relay includes the first triode, the two or three
Pole pipe, metal-oxide-semiconductor, pull down resistor and pull-up resistor, in which:
Optical signal inputs the base stage of the first triode, and the collector of the first triode accesses high level, the first triode
Emitter is grounded through pull down resistor, and the emitter of the first triode is connected to the base stage of the second triode, the second triode
Collector accesses high level, the emitter ground connection of the second triode through pull-up resistor；The collector of second triode is connected to MOS
The gate pole of pipe, for the anode and cathode of the metal-oxide-semiconductor as solid-state relay port, the first triode and pull down resistor composition are photosensitive
Signal receiver stage, the second triode and pull-up resistor constitute low level signal amplification grade, and metal-oxide-semiconductor is power tube.
Active device is that perhaps integrated circuit discrete device is diode, triode, metal-oxide-semiconductor or controllable to discrete device
Silicon.
Integrated electro solid-state relay is integrated using bipolar integrated circuit technique, the power device compatible with bipolar process
Part includes GTR and silicon-controlled, photosensor signal receiver stage and the common bipolar integrated circuit technique realization of low level signal amplification grade, can
Control silicon part draws silicon-controlled anode with substrate, and base diffusion area is as silicon-controlled gate pole, and emitter diffusion conduct
Silicon-controlled cathode, to realize the SCR structure of vertical structure.
A kind of production line of the modular package structure of multi-chip, it successively includes material loading of lead frame later in the past
Device, steel mesh printing equipment, the first AOI automatic optical detection device, active device mounting device, reflow soldering apparatus, the 2nd AOI
Automatic optical detection device, the first apparatus for baking, bonding apparatus, Plastic packaging apparatus, the second apparatus for baking, is beaten chip installation device
Device for mark, electroplanting device, molding tendon-cutting device, appearance detect packing device.
Inside is full of nitrogen protection when reflow soldering apparatus enables.
A kind of production method of the modular package structure of multi-chip is as follows:
Step 1: feeding device of lead frame is by material loading of lead frame；
Step 2: steel mesh printing equipment is printed on the lead frames by steel mesh；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device prints steel mesh detects；
Step 4: active device mounting device installs active device on metal lead wire frame；
Step 5: the metal lead wire frame for installing device of having chance with is carried out Reflow Soldering in reflow soldering apparatus, in this process
Nitrogen protection is kept to keep active device close with metal framework by the reflow soldering apparatus of nitrogen protection in middle reflow soldering apparatus
Bonding；
Step 6: the metal lead wire frame that the 2nd AOI automatic optical detection device completes Reflow Soldering detects；Have not
Qualified place record is to database, without subsequent chip installation exercise at this；
Step 7: chip installation device installs chip on metal lead wire frame, according to the number of chip, chip
Multiple groups or one group has can be set in mounting device；
Step 8: the first apparatus for baking toasts the metal lead wire frame of adhering chip；
Step 9: bonding apparatus carries out bonding operation to the intermediate product that above-mentioned steps are completed；
Step 10: Plastic packaging apparatus carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Step 11: the second apparatus for baking carries out baking operation to the intermediate product that above-mentioned steps are completed；
Step 12: marking device carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 13: electroplanting device carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 14: molding tendon-cutting device carries out molding rib cutting operation to the intermediate product that above-mentioned steps are completed；
Step 15: appearance detects, packing device carries out appearance detection to the intermediate product that above-mentioned steps are completed and packaging is made
Industry.
The feeding of plastic packaging material, the plastic packaging material stock shelf packet are carried out when Plastic packaging apparatus plastic packaging operation using plastic packaging material stock shelf
Main body frame and cross bar are included, main body frame is internally provided with cross bar, main body frame and cross bar by being welded to connect, passes through welding
Connection, so as to improve integrally-built stability, the middle side of cross bar is provided with connection frame, and cross bar passes through welding with frame is connect
Connection, the left and right ends of main body frame are provided with blowing circular hole, and the lower end of main body frame is provided with press strip, the right end of main body frame
Upper and lower ends are each provided with a grip handle, and grip handle can to facilitate to take, and the inside of handle is held in two sides
It is provided with handle, the left end of handle is provided with control device, and the left end of control device is provided with link block.
The composition of main body frame includes fixing end, material hole, epipleural, transmission device and lower side panel, the right end of fixing end
Upside is provided with epipleural, and epipleural is internally provided with material hole, so that epipleural and lower side panel can move to
Same axle center, the lower end of epipleural are provided with lower side panel, and the right end of lower side panel is internally provided with transmission device, and main body frame passes through
Fixing end is fixedly connected with cross bar.
The composition of transmission device includes driving chain, reset spring, attachment base and drive rod, and the lower end of driving chain is set
It is equipped with reset spring, reset spring can to restore original state, and the lower end of reset spring is provided with attachment base, attachment base
Lower end be provided with drive rod, transmission device is fixedly connected by drive rod with link block.
The composition of control device includes push-pull rod, fixing seat, compressed spring, fixed block, connecting plate and control-rod, push-and-pull
The right end of bar is provided with fixing seat, and the right end of fixing seat is provided with compressed spring, so as under the action of compressed spring into
Row movement, the right end of compressed spring are provided with fixed block, and the right end of fixed block is provided with connecting plate, and the right end of connecting plate is provided with
Control-rod, control device are fixedly connected by control-rod with handle.
The composition of control-rod includes connecting hole, connecting rod, fixed fixture block and transmission strut, the lower end right side of fixed fixture block
It is provided with transmission strut, the left side lower end for being driven strut is provided with connecting rod, so that preferably being rotated, connects
The lower end of bar is provided with connecting hole, and control-rod is fixedly connected by transmission strut with handle.
Compared with prior art, the beneficial effects of the present invention are:
1, due to being using SMT technique load, it is only necessary to one-step print, it can be by several leads within the scope of a piece of steel mesh
Frame fills tin cream simultaneously, and a point can only once be put by not needing picture point sizing process.
2, elargol technique, load speed are inversely proportional with chip size, and chip area is bigger, and load speed is slower.With production
The power consumption of product increases, and chip area is bigger, and load speed is slower.We use SMT technique, active chip load speed now
Degree is unrelated with area, substantially increases load speed.
3, tin cream is made of tin silver copper, and the electric conductivity, heat dissipation performance after Reflow Soldering are significantly better than elargol, heat dissipation performance
It is two times of elargol.
4, elargol cost is much higher than tin cream, is approximately 10-20 times of price of tin cream.
Therefore a kind of modular package structure of multi-chip of the invention, which has, improves production efficiency, reduces production cost,
The advantages of guaranteeing production product quality.
Detailed description of the invention
Fig. 1 is the schematic diagram of embodiment 1.
Fig. 2 is the schematic diagram of embodiment 2.
Fig. 3 is the schematic diagram of embodiment 3.
Fig. 4 is a kind of production line schematic diagram of the modular package structure of multi-chip of the invention.
Fig. 5 is the structural schematic diagram of plastic packaging material stock shelf.
Fig. 6 is the main frame structure schematic diagram of plastic packaging material stock shelf.
Fig. 7 is the transmission structures schematic diagram of plastic packaging material stock shelf.
Fig. 8 is the controling device structure diagram of plastic packaging material stock shelf.
Fig. 9 is the control-rod structural schematic diagram of plastic packaging material stock shelf.
Figure 10 is integrated electro solid-state relay schematic diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only invention a part of the embodiment, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
A kind of modular package structure of multi-chip of the present invention, it includes metal lead wire frame, die-attach area
Active device is welded by tin cream on frame, passes through elargol adhering chip on metal lead wire frame, active device includes discrete device
And integrated circuit, discrete device include diode, triode, metal-oxide-semiconductor and silicon-controlled etc..
Referring to figure Fig. 4, a kind of production line of the modular package structure of multi-chip, it successively includes drawing later in the past
Wire frame feeding device 101, steel mesh printing equipment 102, the first AOI automatic optical detection device 103, active device mounting device
104, reflow soldering apparatus 105, the 2nd AOI automatic optical detection device 106, chip installation device 107, the first apparatus for baking 108,
Bonding apparatus 109, Plastic packaging apparatus 110, the second apparatus for baking 111, marking device 112, electroplanting device 113, molding tendon-cutting device
114, appearance detects packing device 115.
Inside is full of nitrogen protection when wherein reflow soldering apparatus 105 enables.
A kind of production method of the modular package structure of multi-chip is as follows:
Step 1: feeding device of lead frame 101 is by material loading of lead frame；
Step 2: steel mesh printing equipment 102 is printed on the lead frames by steel mesh；
General assembly line can at least use two complete metal lead wire frame operations together, therefore corresponding steel mesh area
It can be put into two complete metal lead wire frames simultaneously, the corresponding position opening (for upper tin cream) that will fill active device is opened
Open area and active device shape size are completely the same, paste solder printing are then used, on metal lead wire frame surface printing
0.08mm (the lead-free tin cream of positive and negative 5%) thickness (selection steel mesh thickness accurately controls tin cream thickness)；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device 103 prints steel mesh detects；
There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 4: active device mounting device 104 installs active device on metal lead wire frame；
Step 5: the have chance with metal lead wire frame of device of installation is carried out Reflow Soldering, herein mistake in reflow soldering apparatus 105
Nitrogen protection is kept to make active device and metal framework by the reflow soldering apparatus of nitrogen protection in reflow soldering apparatus 105 in journey
It closely bonds；
Step 6: the metal lead wire frame that the 2nd AOI automatic optical detection device 106 completes Reflow Soldering detects；
There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 7: chip installation device 107 installs chip on metal lead wire frame, according to the number of chip,
Multiple groups or one group has can be set in chip installation device 107；
Here by general integrated circuit load technique, load region is being needed, shape is similar on point, leads similar in area
Electric elargol or insulation elargol, by control chip or storaging chip, on the designated position of metal lead wire frame；
Step 8: the first apparatus for baking 108 toasts the metal lead wire frame of adhering chip；The baking temperature of this step
Degree is 170 degrees Celsius -180 degrees Celsius, and barbecue curing time is -150 minutes 90 minutes；
Step 9: the intermediate product that bonding apparatus 109 completes above-mentioned steps carry out bonding operation；
Step 10: Plastic packaging apparatus 110 carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Referring to Fig. 5-Fig. 9, the upper of plastic packaging material is wherein carried out using plastic packaging material stock shelf when 110 plastic packaging operation of Plastic packaging apparatus
Material, the plastic packaging material stock shelf includes main body frame 5 and cross bar 4, and main body frame 5 is internally provided with cross bar 4, main body frame 5
With cross bar 4 by being welded to connect, by being welded to connect, so as to improve integrally-built stability, the middle side setting of cross bar 4
There is connection frame 3, cross bar 4 passes through welded connecting with frame 3 is connect, and the left and right ends of main body frame 5 are provided with blowing circular hole 2, main body
The lower end of frame 5 is provided with press strip 1, and the right end upper and lower ends of main body frame 5 are each provided with a grip handle 6, holds handle 6
It can to facilitate to take, grip handle 6 in two sides is internally provided with handle 9, and the left end of handle 9 is provided with control device
8, the left end of control device 8 is provided with link block 7.
Further, the composition of main body frame 5 includes fixing end 51, material hole 52, epipleural 53, transmission device 54 and downside
Plate 55, the right end upside of fixing end 51 are provided with epipleural 53, and epipleural 53 is internally provided with material hole 52, so that
Epipleural 53 and lower side panel 55 can move to same axle center, and the lower end of epipleural 53 is provided with lower side panel 55, lower side panel 55
Right end is internally provided with transmission device 54, and main body frame 5 is fixedly connected by fixing end 51 with cross bar 4.
Further, the composition of transmission device 54 includes driving chain 541, reset spring 542, attachment base 543 and transmission
Bar 544, the lower end of driving chain 541 are provided with reset spring 542, and reset spring 542 can to restore original state, multiple
The lower end of position spring 542 is provided with attachment base 543, and the lower end of attachment base 543 is provided with drive rod 544, and transmission device 54 passes through
Drive rod 544 is fixedly connected with link block 7.
Further, the composition of control device 8 includes push-pull rod 81, fixing seat 82, compressed spring 83, fixed block 84, connects
Fishplate bar 85 and control-rod 86, the right end of push-pull rod 81 are provided with fixing seat 82, and the right end of fixing seat 82 is provided with compressed spring 83,
So as to be moved under the action of compressed spring 83, the right end of compressed spring 83 is provided with fixed block 84, fixed block 84
Right end be provided with connecting plate 85, the right end of connecting plate 85 is provided with control-rod 86, and control device 8 passes through control-rod 86 and handle
9 are fixedly connected.
Further, the composition of control-rod 86 includes connecting hole 861, connecting rod 862, fixed fixture block 863 and transmission strut
864, the lower end right side of fixed fixture block 863 is provided with transmission strut 864, and the left side lower end of transmission strut 864 is provided with connecting rod
862, so that preferably being rotated, the lower end of connecting rod 862 is provided with connecting hole 861, and control-rod 86 passes through biography
Dynamic strut 864 is fixedly connected with handle 9.
Further, there are two grip handle 6 is arranged altogether, two grip handles 6 are symmetrical set respectively in main body frame 5
Right end face and with main body frame 5 by be welded to connect, work to facilitate, two grip handles 6 inside be all provided with
It is equipped with a through slot.
Further, blowing circular hole 2 is provided with 16 altogether, and 16 blowing circular holes 2 are symmetrical set respectively in body frame
The left and right ends of frame 5, so as to disposably place multiple materials, so as to improve working efficiency, 16 blowing circular holes 2
It is six centimetres that left and right ends, which are each provided with eight and depth,.
Further, main body frame 5 is the cuboid structure of inner hollow, so as to support the load that top is subject to,
The length of main body frame 5 is 40 centimetres, width is 15 centimetres and with a thickness of five centimetres.
The working principle and process for using of the plastic packaging material stock shelf: plastic packaging material is sequentially placed into putting for plastic packaging material stock shelf
Expect in circular hole 2,16 blowing circular holes 2 are symmetrical set respectively in the left and right ends of main body frame 5, so as to disposably put
Multiple materials are set, so as to improve working efficiency, then hold grip handle 6 with hand, two grip handles 6 are respectively in symmetrical
The right end face of main body frame 5 is set and with main body frame 5 by being welded to connect, is worked to facilitate, by plastic packaging
Material stock shelf is put into the inside of Plastic packaging apparatus mold, at this moment presses control-rod 86, and subsequent blend stop is mobile, and Plastic packaging apparatus mold is opened
Directly eight plastic packaging materials are put into plastic package die simultaneously after mould, at this point, control device 8 need to be only pressed, so that compressed spring
83 compressions, so that the center of one-to-one epipleural 53 and lower side panel 55 is overlapped, eight plastic packaging materials can be from correspondence at this time
Lower material through hole fall into plastic package die, which save the working times, using the time of the moulding press course of work, while handle manually
Eight plastic packaging materials are put into the stock shelf, and plastic packaging material will fall to corresponding plastic packaging discharge position in mold from material hole, then
Control-rod 86 bounces automatically, and blend stop restores to material hole, and making Plastic packaging apparatus, work efficiency is high.
Step 11: the intermediate product that the second apparatus for baking 111 completes above-mentioned steps carry out baking operation；
Step 12: marking device 112 carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 13: electroplanting device 113 carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 14: the intermediate product that molding tendon-cutting device 114 completes above-mentioned steps carry out molding rib cutting operation；
Step 15: appearance, which detects packing device 115, carries out appearance detection and packaging to the intermediate product that above-mentioned steps are completed
Operation.
It is the data point of the three groups of embodiments and comparative example done for a kind of modular package structure of multi-chip below
Analysis comparison:
Embodiment 1, referring to Fig. 1, be provided with three poles on a kind of lead frame of the modular package structure of multi-chip
Pipe and two chips.Triode is welded on the lead frames using tin cream, and chip is pasted on the lead frames using elargol.
Embodiment 2, referring to fig. 2 is provided with a metal-oxide-semiconductor on a kind of lead frame of the modular package structure of multi-chip
With three chips.Metal-oxide-semiconductor is welded on the lead frames using tin cream, and chip is pasted on the lead frames using elargol.
Embodiment 3, referring to Fig. 3, be provided on a kind of lead frame of the modular package structure of multi-chip one it is common
Silicon and four chips.Ordinary silicon is welded on the lead frames using tin cream, and chip is pasted on the lead frames using elargol.
Having a chip in the chip of above-mentioned chip installation device installation is integrated electro solid-state relay, referring to figure
10, the integrated electro solid-state relay contains optical signal reception amplification end and power control end two parts, integrated electro are solid
State relay includes the first triode Q1, the second triode Q2, metal-oxide-semiconductor Q3, pull down resistor R1 and pull-up resistor R2, in which:
Optical signal inputs the base stage of the first triode Q1, and the collector of the first triode Q1 accesses high level VCC, and the one or three
The emitter of pole pipe Q1 is grounded through pull down resistor R1, and the emitter of the first triode Q1 is connected to the base of the second triode Q2
The collector of pole, the second triode Q2 accesses high level VCC, the emitter ground connection of the second triode Q2 through pull-up resistor R2；The
The collector of two triode Q2 is connected to the gate pole of metal-oxide-semiconductor Q3, and the anode and cathode of the metal-oxide-semiconductor Q3 is as solid-state relay end
Mouthful.
Wherein: wherein the first triode Q1 and pull down resistor R1 constitute photosensor signal receiver stage, the second triode Q2 and upper
Pull-up resistor R2 constitutes low level signal amplification grade, and metal-oxide-semiconductor Q3 is power tube.
Integrated electro solid-state relay is integrated using bipolar integrated circuit technique, the power device compatible with bipolar process
Part includes GTR and silicon-controlled, photosensor signal receiver stage and the common bipolar integrated circuit technique of low level signal amplification grade
It realizes, and silicon-controlled part, draws silicon-controlled anode with substrate, base diffusion area is as silicon-controlled gate pole, and emitter
Diffusion region is as silicon-controlled cathode, to realize the SCR structure of vertical structure.
The above is only specific application examples of the invention, are not limited in any way to protection scope of the present invention.All uses
Equivalent transformation or equivalent replacement and the technical solution formed, all fall within rights protection scope of the present invention.
Claims (10)
1. a kind of modular package structure of multi-chip, it is characterised in that it includes metal lead wire frame, on metal lead wire frame
Active device is welded by tin cream, passes through elargol adhering chip on metal lead wire frame,
Having a chip in above-mentioned chip is integrated electro solid-state relay, and the integrated electro solid-state relay contains light
Signal receives amplification end and power control end two parts, integrated electro solid-state relay include the first triode, the second triode,
Metal-oxide-semiconductor, pull down resistor and pull-up resistor, in which:
Optical signal inputs the base stage of the first triode, and the collector of the first triode accesses high level, the transmitting of the first triode
Pole is grounded through pull down resistor, and the emitter of the first triode is connected to the base stage of the second triode, the current collection of the second triode
High level, the emitter ground connection of the second triode are accessed through pull-up resistor in pole；The collector of second triode is connected to metal-oxide-semiconductor
The anode and cathode of gate pole, the metal-oxide-semiconductor constitutes photosensor signal as solid-state relay port, the first triode and pull down resistor
Receiver stage, the second triode and pull-up resistor constitute low level signal amplification grade, and metal-oxide-semiconductor is power tube.
2. a kind of modular package structure of multi-chip according to claim 1, it is characterised in that active device is discrete
Device perhaps integrated circuit discrete device be diode, triode, metal-oxide-semiconductor or silicon-controlled,
Integrated electro solid-state relay is integrated using bipolar integrated circuit technique, the power device packet compatible with bipolar process
GTR and silicon-controlled, photosensor signal receiver stage and the common bipolar integrated circuit technique realization of low level signal amplification grade are included, it is silicon-controlled
Part draws silicon-controlled anode with substrate, and base diffusion area is as silicon-controlled gate pole, and emitter diffusion is as controllable
The cathode of silicon, to realize the SCR structure of vertical structure.
3. a kind of modular package structure of multi-chip according to claim 1, it uses a kind of modular of multi-chip
The production line of encapsulating structure is produced, a kind of production line of the modular package structure of multi-chip from front to back according to
It is secondary include feeding device of lead frame (101), steel mesh printing equipment (102), the first AOI automatic optical detection device (103), have
Source device-mounting apparatus (104), reflow soldering apparatus (105), the 2nd AOI automatic optical detection device (106), chip installation device
(107), the first apparatus for baking (108), bonding apparatus (109), Plastic packaging apparatus (110), the second apparatus for baking (111), mark dress
Set (112), electroplanting device (113), molding tendon-cutting device (114), appearance detection packing device (115).
4. a kind of modular package structure of multi-chip according to claim 3, inside is full of when reflow soldering apparatus enables
Nitrogen protection.
5. a kind of modular package structure of multi-chip according to claim 1, it is characterised in that its production method is such as
Under:
Step 1: feeding device of lead frame (101) is by material loading of lead frame；
Step 2: steel mesh printing equipment (102) is printed on the lead frames by steel mesh；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device (103) prints steel mesh detects；
Step 4: active device mounting device (104) installs active device on metal lead wire frame；
Step 5: the metal lead wire frame for installing device of having chance with is carried out Reflow Soldering in reflow soldering apparatus (105), in this process
Nitrogen protection is kept to make active device and metal framework by the reflow soldering apparatus of nitrogen protection in middle reflow soldering apparatus (105)
It closely bonds；
Step 6: the metal lead wire frame that the 2nd AOI automatic optical detection device (106) completes Reflow Soldering detects；Have
Unqualified place is recorded to database, without subsequent chip installation exercise at this；
Step 7: chip installation device (107) installs chip on metal lead wire frame, according to the number of chip, core
Multiple groups or one group has can be set in piece mounting device (107)；
Step 8: the first apparatus for baking (108) toasts the metal lead wire frame of adhering chip；
Step 9: the intermediate product that bonding apparatus (109) completes above-mentioned steps carry out bonding operation；
Step 10: Plastic packaging apparatus (110) carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Step 11: the intermediate product that the second apparatus for baking (111) completes above-mentioned steps carry out baking operation；
Step 12: marking device (112) carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 13: electroplanting device (113) carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 14: the intermediate product that above-mentioned steps are completed in molding tendon-cutting device (114) carry out molding rib cutting operation；
Step 15: appearance, which detects packing device (115), carries out appearance detection and packaging work to the intermediate product that above-mentioned steps are completed
Industry.
6. a kind of modular package structure of multi-chip according to claim 5, it is characterised in that in step 10, packaged by plastic
The feeding of plastic packaging material is carried out when setting (110) plastic packaging operation using plastic packaging material stock shelf, the plastic packaging material stock shelf includes body frame
Frame (5) and cross bar (4), main body frame (5) are internally provided with cross bar (4), and main body frame (5) and cross bar (4) are connected by welding
It connects, by being welded to connect, so as to improve integrally-built stability, the middle side of cross bar (4) is provided with connection frame (3), horizontal
Bar (4) passes through welded connecting with frame (3) are connect, and the left and right ends of main body frame (5) are provided with blowing circular hole (2), main body frame
(5) lower end is provided with press strip (1), and the right end upper and lower ends of main body frame (5) are each provided with a grip handle (6), grip
Handle (6) can to facilitate to take, and two sides grip handle (6) is internally provided with handle (9), the left end of handle (9)
It is provided with control device (8), the left end of control device (8) is provided with link block (7).
7. a kind of modular package structure of multi-chip according to claim 6, it is characterised in that the group of main body frame (5)
At including fixing end (51), material hole (52), epipleural (53), transmission device (54) and lower side panel (55), fixing end (51)
It is provided with epipleural (53) on the upside of right end, epipleural (53) is internally provided with material hole (52), so that epipleural
(53) and lower side panel (55) can move to same axle center, and the lower end of epipleural (53) is provided with lower side panel (55), lower side panel
(55) right end is internally provided with transmission device (54), and main body frame (5) is fixedly connected by fixing end (51) with cross bar (4).
8. a kind of modular package structure of multi-chip according to claim 7, it is characterised in that transmission device (54)
Composition includes driving chain (541), reset spring (542), attachment base (543) and drive rod (544), driving chain (541)
Lower end be provided with reset spring (542), reset spring (542) can to restore original state, reset spring (542)
Lower end is provided with attachment base (543), and the lower end of attachment base (543) is provided with drive rod (544), and transmission device (54) passes through transmission
Bar (544) is fixedly connected with link block (7).
9. a kind of modular package structure of multi-chip according to claim 5, it is characterised in that the group of control device (8)
At including push-pull rod (81), fixing seat (82), compressed spring (83), fixed block (84), connecting plate (85) and control-rod (86),
The right end of push-pull rod (81) is provided with fixing seat (82), and the right end of fixing seat (82) is provided with compressed spring (83), so as to
It is moved under the action of compressed spring (83), the right end of compressed spring (83) is provided with fixed block (84), fixed block (84)
Right end be provided with connecting plate (85), the right end of connecting plate (85) is provided with control-rod (86), and control device (8) passes through control-rod
(86) it is fixedly connected with handle (9).
10. a kind of modular package structure of multi-chip according to claim 9, it is characterised in that the group of control-rod (86)
At including connecting hole (861), connecting rod (862), fixed fixture block (863) and transmission strut (864), fixture block (863) are fixed
Transmission strut (864) is provided on the right side of lower end, the left side lower end of transmission strut (864) is provided with connecting rod (862), so as to
So that preferably being rotated, the lower end of connecting rod (862) is provided with connecting hole (861), and control-rod (86) passes through transmission strut
(864) it is fixedly connected with handle (9).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811493307.4A CN109378307B (en) | 2018-12-07 | 2018-12-07 | Production method of multi-chip module type packaging structure |
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|---|---|---|---|
| CN201811493307.4A CN109378307B (en) | 2018-12-07 | 2018-12-07 | Production method of multi-chip module type packaging structure |
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| CN109378307B CN109378307B (en) | 2023-11-10 |
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Cited By (1)
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| CN111128825A (en) * | 2020-01-08 | 2020-05-08 | 佛山市蓝箭电子股份有限公司 | Lead frame material loading frame with automatic fixing function |
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| CN109378307B (en) | 2023-11-10 |
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