CN109273375A - MCM integrated circuit packaging method integrating SMT - Google Patents

MCM integrated circuit packaging method integrating SMT Download PDF

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Publication number
CN109273375A
CN109273375A CN201811050739.8A CN201811050739A CN109273375A CN 109273375 A CN109273375 A CN 109273375A CN 201811050739 A CN201811050739 A CN 201811050739A CN 109273375 A CN109273375 A CN 109273375A
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CN
China
Prior art keywords
integrated circuit
smt
frame
lead frame
metal lead
Prior art date
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Granted
Application number
CN201811050739.8A
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Chinese (zh)
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CN109273375B (en
Inventor
王辉
全庆霄
姜岩峰
符爱风
王嫚
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Wuxi Haobang Hi-Tech Co Ltd
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Wuxi Haobang Hi-Tech Co Ltd
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Priority to CN201811050739.8A priority Critical patent/CN109273375B/en
Publication of CN109273375A publication Critical patent/CN109273375A/en
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A kind of MCM integrated circuit packaging method merging SMT of the present invention, it is characterized in that carrying out operation using a kind of production line of MCM integrated circuit package structure for merging SMT, active device is welded by tin cream on metal lead wire frame, passes through elargol adhering chip on metal lead wire frame；A kind of production line for the MCM integrated circuit package structure merging SMT, it successively detects packing device including feeding device of lead frame, steel mesh printing equipment, the first AOI automatic optical detection device, active device mounting device, reflow soldering apparatus, the 2nd AOI automatic optical detection device, chip installation device, the first apparatus for baking, bonding apparatus, Plastic packaging apparatus, the second apparatus for baking, marking device, electroplanting device, molding tendon-cutting device, appearance later in the past.The MCM integrated circuit packaging method of fusion SMT of the invention a kind of, which has, improves production efficiency, reduces production cost, guarantees the advantages of producing product quality.

Description

A kind of MCM integrated circuit packaging method merging SMT
Technical field
The present invention relates to a kind of MCM integrated circuit packaging methods for merging SMT.
Background technique
Traditional MCM integrated circuit package structure generally individually uses one of level package or second level package form It is produced.
Level package, refers to the encapsulation that single-chip package or multi-chip are done on metal lead wire frame, and chip passes through elargol Installation is on the lead frames.
Second level package refers to various components and integrated circuit, is welded in the circuit board by SMT mode.SMT is surface The installation of package technique (surface mounting technology) (abbreviation of Surface Mount Technology), referred to as surface mount or surface Technology.It is a kind of most popular technology and technique in current electronic assembly industry.SMT be it is a kind of will be without pin or short leg surface It assembles component (abbreviation SMC/SMD, Chinese claim sheet component) and is mounted on printed circuit board (Printed Circuit Board, PCB) surface or other substrates surface on, by the methods of Reflow Soldering or immersed solder be subject to welding assembly circuit fill Even technology.Pcb board precision does not meet Moore's Law not enough, and second level package haves the defects that heat dissipation is difficult.
It is to be bonded in metal framework by the way of load elargol that multiple semiconductor chips encapsulate all on metal framework On.
And second level package using tin cream by various components and integrated circuit and joint weld in the circuit board.
Load elargol processing performance is good, and electric conductivity heat dissipation performance is also quite excellent.But in a variety of component packages When, active device such as MOS, when the chip package of passive device such as resistance capacitance and silicon materials is in same packaging body, 0.1mm2 When the resistance capacitance of weld size uses the elargol load technique of the silicon chip of 1mm rank, speed is slow, precision is low.
Summary of the invention
The purpose of the present invention is to overcome the above shortcomings and to provide production efficiency is improved, production cost is reduced, guarantees that production produces The MCM integrated circuit packaging method of fusion SMT of quality a kind of.
The object of the present invention is achieved like this:
A kind of MCM integrated circuit packaging method merging SMT, using a kind of MCM integrated circuit package structure for merging SMT Production line carry out operation, by tin cream welding active device on metal lead wire frame, pass through on metal lead wire frame Elargol adhering chip.
A kind of production line for the MCM integrated circuit package structure merging SMT, it successively includes lead frame from front to back Frame feeding device, steel mesh printing equipment, the first AOI automatic optical detection device, active device mounting device, reflow soldering apparatus, 2nd AOI automatic optical detection device, chip installation device, the first apparatus for baking, bonding apparatus, Plastic packaging apparatus, the second baking Device, marking device, electroplanting device, molding tendon-cutting device, appearance detect packing device.
Specific production method is as follows:
Step 1: feeding device of lead frame is by material loading of lead frame；
Step 2: steel mesh printing equipment is printed on the lead frames by steel mesh；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device prints steel mesh detects；
Step 4: active device mounting device installs active device on metal lead wire frame；
Step 5: the metal lead wire frame for installing device of having chance with is carried out Reflow Soldering in reflow soldering apparatus, in this process Nitrogen protection is kept to keep active device close with metal framework by the reflow soldering apparatus of nitrogen protection in middle reflow soldering apparatus Bonding；
Step 6: the metal lead wire frame that the 2nd AOI automatic optical detection device completes Reflow Soldering detects；Have not Qualified place record is to database, without subsequent chip installation exercise at this；
Step 7: chip installation device installs chip on metal lead wire frame, according to the number of chip, chip Multiple groups or one group has can be set in mounting device；
Step 8: the first apparatus for baking toasts the metal lead wire frame of adhering chip；
Step 9: bonding apparatus carries out bonding operation to the intermediate product that above-mentioned steps are completed；
Step 10: Plastic packaging apparatus carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Step 11: the second apparatus for baking carries out baking operation to the intermediate product that above-mentioned steps are completed；
Step 12: marking device carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 13: electroplanting device carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 14: molding tendon-cutting device carries out molding rib cutting operation to the intermediate product that above-mentioned steps are completed；
Step 15: appearance detects, packing device carries out appearance detection to the intermediate product that above-mentioned steps are completed and packaging is made Industry.
The feeding of plastic packaging material, the plastic packaging material stock shelf packet are carried out when Plastic packaging apparatus plastic packaging operation using plastic packaging material stock shelf Main body frame and cross bar are included, main body frame is internally provided with cross bar, main body frame and cross bar by being welded to connect, passes through welding Connection, so as to improve integrally-built stability, the middle side of cross bar is provided with connection frame, and cross bar passes through welding with frame is connect Connection, the left and right ends of main body frame are provided with blowing circular hole, and the lower end of main body frame is provided with press strip, the right end of main body frame Upper and lower ends are each provided with a grip handle, and grip handle can to facilitate to take, and the inside of handle is held in two sides It is provided with handle, the left end of handle is provided with control device, and the left end of control device is provided with link block.
The composition of main body frame includes fixing end, material hole, epipleural, transmission device and lower side panel, the right end of fixing end Upside is provided with epipleural, and epipleural is internally provided with material hole, so that epipleural and lower side panel can move to Same axle center, the lower end of epipleural are provided with lower side panel, and the right end of lower side panel is internally provided with transmission device, and main body frame passes through Fixing end is fixedly connected with cross bar.
The composition of transmission device includes driving chain, reset spring, attachment base and drive rod, and the lower end of driving chain is set It is equipped with reset spring, reset spring can to restore original state, and the lower end of reset spring is provided with attachment base, attachment base Lower end be provided with drive rod, transmission device is fixedly connected by drive rod with link block.
The composition of control device includes push-pull rod, fixing seat, compressed spring, fixed block, connecting plate and control-rod, push-and-pull The right end of bar is provided with fixing seat, and the right end of fixing seat is provided with compressed spring, so as under the action of compressed spring into Row movement, the right end of compressed spring are provided with fixed block, and the right end of fixed block is provided with connecting plate, and the right end of connecting plate is provided with Control-rod, control device are fixedly connected by control-rod with handle.
The composition of control-rod includes connecting hole, connecting rod, fixed fixture block and transmission strut, the lower end right side of fixed fixture block It is provided with transmission strut, the left side lower end for being driven strut is provided with connecting rod, so that preferably being rotated, connects The lower end of bar is provided with connecting hole, and control-rod is fixedly connected by transmission strut with handle.
Compared with prior art, the beneficial effects of the present invention are:
1, due to being using SMT technique load, it is only necessary to one-step print, it can be by several leads within the scope of a piece of steel mesh Frame fills tin cream simultaneously, and a point can only once be put by not needing picture point sizing process.
2, elargol technique, load speed are inversely proportional with chip size, and chip area is bigger, and load speed is slower.With production The power consumption of product increases, and chip area is bigger, and load speed is slower.We use SMT technique, active chip load speed now Degree is unrelated with area, substantially increases load speed.
3, tin cream is made of tin silver copper, and the electric conductivity, heat dissipation performance after Reflow Soldering are significantly better than elargol, heat dissipation performance It is two times of elargol.
4, elargol cost is much higher than tin cream, is approximately 10-20 times of price of tin cream.
Therefore the MCM integrated circuit package structure of fusion SMT of the invention a kind of, which has, improves production efficiency, reduces production Cost guarantees the advantages of producing product quality.
Detailed description of the invention
Fig. 1 is the schematic diagram of embodiment 1.
Fig. 2 is the schematic diagram of embodiment 2.
Fig. 3 is the schematic diagram of embodiment 3.
Fig. 4 is a kind of production line schematic diagram of the MCM integrated circuit package structure of fusion SMT of the invention.
Fig. 5 is the structural schematic diagram of plastic packaging material stock shelf.
Fig. 6 is the main frame structure schematic diagram of plastic packaging material stock shelf.
Fig. 7 is the transmission structures schematic diagram of plastic packaging material stock shelf.
Fig. 8 is the controling device structure diagram of plastic packaging material stock shelf.
Fig. 9 is the control-rod structural schematic diagram of plastic packaging material stock shelf.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiment is only invention a part of the embodiment, instead of all the embodiments.Based on this Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts Example is applied, shall fall within the protection scope of the present invention.
A kind of MCM integrated circuit package structure merging SMT of the present invention, it includes metal lead wire frame, metal Active device is welded by tin cream on lead frame, passes through elargol adhering chip on metal lead wire frame, active device includes point Vertical device and integrated circuit, discrete device include diode, triode, metal-oxide-semiconductor and silicon-controlled etc..
Referring to figure Fig. 4, a kind of production line for the MCM integrated circuit package structure merging SMT, after its past successively Including feeding device of lead frame 101, steel mesh printing equipment 102, the first AOI automatic optical detection device 103, active device peace Assembling device 104, reflow soldering apparatus 105, the 2nd AOI automatic optical detection device 106, the baking dress of chip installation device 107, first 108, bonding apparatus 109 is set, Plastic packaging apparatus 110, the second apparatus for baking 111, marking device 112, electroplanting device 113, forms and cuts Muscle device 114, appearance detect packing device 115.
Inside is full of nitrogen protection when wherein reflow soldering apparatus 105 enables.
A kind of production method for the MCM integrated circuit package structure merging SMT is as follows:
Step 1: feeding device of lead frame 101 is by material loading of lead frame；
Step 2: steel mesh printing equipment 102 is printed on the lead frames by steel mesh；
General assembly line can at least use two complete metal lead wire frame operations together, therefore corresponding steel mesh area It can be put into two complete metal lead wire frames simultaneously, the corresponding position opening (for upper tin cream) that will fill active device is opened Open area and active device shape size are completely the same, paste solder printing are then used, on metal lead wire frame surface printing 0.08mm (the lead-free tin cream of positive and negative 5%) thickness (selection steel mesh thickness accurately controls tin cream thickness)；
Step 3: the metal lead wire frame after the first AOI automatic optical detection device 103 prints steel mesh detects； There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 4: active device mounting device 104 installs active device on metal lead wire frame；
Step 5: the have chance with metal lead wire frame of device of installation is carried out Reflow Soldering, herein mistake in reflow soldering apparatus 105 Nitrogen protection is kept to make active device and metal framework by the reflow soldering apparatus of nitrogen protection in reflow soldering apparatus 105 in journey It closely bonds；
Step 6: the metal lead wire frame that the 2nd AOI automatic optical detection device 106 completes Reflow Soldering detects； There is unqualified place to record to database, without subsequent chip installation exercise at this；
Step 7: chip installation device 107 installs chip on metal lead wire frame, according to the number of chip, Multiple groups or one group has can be set in chip installation device 107；
Here by general integrated circuit load technique, load region is being needed, shape is similar on point, leads similar in area Electric elargol or insulation elargol, by control chip or storaging chip, on the designated position of metal lead wire frame；
Step 8: the first apparatus for baking 108 toasts the metal lead wire frame of adhering chip；The baking temperature of this step Degree is 170 degrees Celsius -180 degrees Celsius, and barbecue curing time is -150 minutes 90 minutes；
Step 9: the intermediate product that bonding apparatus 109 completes above-mentioned steps carry out bonding operation；
Step 10: Plastic packaging apparatus 110 carries out plastic packaging operation to the intermediate product that above-mentioned steps are completed；
Referring to Fig. 5-Fig. 9, the upper of plastic packaging material is wherein carried out using plastic packaging material stock shelf when 110 plastic packaging operation of Plastic packaging apparatus Material, the plastic packaging material stock shelf includes main body frame 5 and cross bar 4, and main body frame 5 is internally provided with cross bar 4, main body frame 5 With cross bar 4 by being welded to connect, by being welded to connect, so as to improve integrally-built stability, the middle side setting of cross bar 4 There is connection frame 3, cross bar 4 passes through welded connecting with frame 3 is connect, and the left and right ends of main body frame 5 are provided with blowing circular hole 2, main body The lower end of frame 5 is provided with press strip 1, and the right end upper and lower ends of main body frame 5 are each provided with a grip handle 6, holds handle 6 It can to facilitate to take, grip handle 6 in two sides is internally provided with handle 9, and the left end of handle 9 is provided with control device 8, the left end of control device 8 is provided with link block 7.
Further, the composition of main body frame 5 includes fixing end 51, material hole 52, epipleural 53, transmission device 54 and downside Plate 55, the right end upside of fixing end 51 are provided with epipleural 53, and epipleural 53 is internally provided with material hole 52, so that Epipleural 53 and lower side panel 55 can move to same axle center, and the lower end of epipleural 53 is provided with lower side panel 55, lower side panel 55 Right end is internally provided with transmission device 54, and main body frame 5 is fixedly connected by fixing end 51 with cross bar 4.
Further, the composition of transmission device 54 includes driving chain 541, reset spring 542, attachment base 543 and transmission Bar 544, the lower end of driving chain 541 are provided with reset spring 542, and reset spring 542 can to restore original state, multiple The lower end of position spring 542 is provided with attachment base 543, and the lower end of attachment base 543 is provided with drive rod 544, and transmission device 54 passes through Drive rod 544 is fixedly connected with link block 7.
Further, the composition of control device 8 includes push-pull rod 81, fixing seat 82, compressed spring 83, fixed block 84, connects Fishplate bar 85 and control-rod 86, the right end of push-pull rod 81 are provided with fixing seat 82, and the right end of fixing seat 82 is provided with compressed spring 83, So as to be moved under the action of compressed spring 83, the right end of compressed spring 83 is provided with fixed block 84, fixed block 84 Right end be provided with connecting plate 85, the right end of connecting plate 85 is provided with control-rod 86, and control device 8 passes through control-rod 86 and handle 9 are fixedly connected.
Further, the composition of control-rod 86 includes connecting hole 861, connecting rod 862, fixed fixture block 863 and transmission strut 864, the lower end right side of fixed fixture block 863 is provided with transmission strut 864, and the left side lower end of transmission strut 864 is provided with connecting rod 862, so that preferably being rotated, the lower end of connecting rod 862 is provided with connecting hole 861, and control-rod 86 passes through biography Dynamic strut 864 is fixedly connected with handle 9.
Further, there are two grip handle 6 is arranged altogether, two grip handles 6 are symmetrical set respectively in main body frame 5 Right end face and with main body frame 5 by be welded to connect, work to facilitate, two grip handles 6 inside be all provided with It is equipped with a through slot.
Further, blowing circular hole 2 is provided with 16 altogether, and 16 blowing circular holes 2 are symmetrical set respectively in body frame The left and right ends of frame 5, so as to disposably place multiple materials, so as to improve working efficiency, 16 blowing circular holes 2 It is six centimetres that left and right ends, which are each provided with eight and depth,.
Further, main body frame 5 is the cuboid structure of inner hollow, so as to support the load that top is subject to, The length of main body frame 5 is 40 centimetres, width is 15 centimetres and with a thickness of five centimetres.
The working principle and process for using of the plastic packaging material stock shelf: plastic packaging material is sequentially placed into putting for plastic packaging material stock shelf Expect in circular hole 2,16 blowing circular holes 2 are symmetrical set respectively in the left and right ends of main body frame 5, so as to disposably put Multiple materials are set, so as to improve working efficiency, then hold grip handle 6 with hand, two grip handles 6 are respectively in symmetrical The right end face of main body frame 5 is set and with main body frame 5 by being welded to connect, is worked to facilitate, by plastic packaging Material stock shelf is put into the inside of Plastic packaging apparatus mold, at this moment presses control-rod 86, and subsequent blend stop is mobile, and Plastic packaging apparatus mold is opened Directly eight plastic packaging materials are put into plastic package die simultaneously after mould, at this point, control device 8 need to be only pressed, so that compressed spring 83 compressions, so that the center of one-to-one epipleural 53 and lower side panel 55 is overlapped, eight plastic packaging materials can be from correspondence at this time Lower material through hole fall into plastic package die, which save the working times, using the time of the moulding press course of work, while handle manually Eight plastic packaging materials are put into the stock shelf, and plastic packaging material will fall to corresponding plastic packaging discharge position in mold from material hole, then Control-rod 86 bounces automatically, and blend stop restores to material hole, and making Plastic packaging apparatus, work efficiency is high.
Step 11: the intermediate product that the second apparatus for baking 111 completes above-mentioned steps carry out baking operation；
Step 12: marking device 112 carries out mark operation to the intermediate product that above-mentioned steps are completed；
Step 13: electroplanting device 113 carries out electroplating activity to the intermediate product that above-mentioned steps are completed；
Step 14: the intermediate product that molding tendon-cutting device 114 completes above-mentioned steps carry out molding rib cutting operation；
Step 15: appearance, which detects packing device 115, carries out appearance detection and packaging to the intermediate product that above-mentioned steps are completed Operation.
It is for a kind of three groups of embodiments and comparative example that the MCM integrated circuit package structure for merging SMT is done below Data analysis comparison:
Embodiment 1, referring to Fig. 1, be provided with one on a kind of lead frame for the MCM integrated circuit package structure merging SMT A triode and two chips.Triode is welded on the lead frames using tin cream, and chip is pasted onto lead frame using elargol On.
Embodiment 2, referring to fig. 2 is provided with one on a kind of lead frame for the MCM integrated circuit package structure for merging SMT A metal-oxide-semiconductor and three chips.Metal-oxide-semiconductor is welded on the lead frames using tin cream, and chip is pasted on the lead frames using elargol.
Embodiment 3, referring to Fig. 3, be provided with one on a kind of lead frame for the MCM integrated circuit package structure merging SMT A ordinary silicon and four chips.Ordinary silicon is welded on the lead frames using tin cream, and chip is pasted onto lead frame using elargol On.
The above is only specific application examples of the invention, are not limited in any way to protection scope of the present invention.All uses Equivalent transformation or equivalent replacement and the technical solution formed, all fall within rights protection scope of the present invention.

Claims (6)

1.一种融合SMT的MCM集成电路封装方法，其特征在于采用一种融合SMT的MCM集成电路封装结构的生产流水线进行作业，在金属引线框架上通过锡膏焊接有源器件，金属引线框架上通过银胶粘贴芯片；A MCM integrated circuit packaging method for merging SMT, characterized in that a production line of an MCM integrated circuit package structure fused with SMT is used, and an active device is soldered on a metal lead frame by a solder paste, on a metal lead frame Pasting the chip with silver glue; 一种融合SMT的MCM集成电路封装结构的生产流水线从前至后依次包括引线框架上料装置(101)、钢网印刷装置(102)、第一AOI自动光学检测装置(103)、有源器件安装装置(104)、回流焊装置(105)、第二AOI自动光学检测装置(106)、芯片安装装置(107)、第一烘烤装置(108)、键合装置(109)、塑封装置(110)、第二烘烤装置(111)、打标装置(112)、电镀装置(113)、成型切筋装置(114)、外观检测包装装置(115)；A production line of an MCM integrated circuit package structure incorporating SMT includes a lead frame loading device (101), a stencil printing device (102), a first AOI automatic optical detecting device (103), and an active device mounting from front to back. Device (104), reflow soldering device (105), second AOI automatic optical detecting device (106), chip mounting device (107), first baking device (108), bonding device (109), plastic sealing device (110) a second baking device (111), a marking device (112), a plating device (113), a forming cutting device (114), an appearance detecting packaging device (115); 一种融合SMT的MCM集成电路封装方法的具体步骤如下：The specific steps of an MCM integrated circuit packaging method incorporating SMT are as follows: 步骤一、引线框架上料装置(101)将引线框架上料；Step 1. The lead frame loading device (101) feeds the lead frame; 步骤二、钢网印刷装置(102)通过钢网在引线框架上进行印刷；Step two, the stencil printing device (102) prints on the lead frame through the steel mesh; 步骤三、第一AOI自动光学检测装置(103)对钢网印刷后的金属引线框架进行检测；Step 3: The first AOI automatic optical detecting device (103) detects the metal lead frame after the stencil printing; 步骤四、有源器件安装装置(104)在金属引线框架上安装有源器件；Step 4: The active device mounting device (104) mounts an active device on the metal lead frame; 步骤五、在回流焊装置(105)内将安装有缘器件的金属引线框架进行回流焊，在此过程中回流焊装置(105)内保持氮气保护，通过氮气保护的回流焊装置，使有源器件与金属框架紧密粘接；Step 5. Reflow soldering the metal lead frame with the edge device in the reflow soldering device (105). During this process, the reflow soldering device (105) maintains nitrogen protection, and the active device is protected by a nitrogen-protected reflow soldering device. Tightly bonded to the metal frame; 步骤六、第二AOI自动光学检测装置(106)对回流焊完成的金属引线框架进行检测；有不合格之处记录至数据库，该处不进行后续芯片安装作业；Step 6. The second AOI automatic optical detecting device (106) detects the metal lead frame of the reflow soldering; if there is any defect, records it to the database, where no subsequent chip mounting operation is performed; 步骤七、芯片安装装置(107)将芯片在金属引线框架上进行安装，根据芯片的多少，芯片安装装置(107)可以设置有多组或者一组；Step 7. The chip mounting device (107) mounts the chip on the metal lead frame. According to the number of chips, the chip mounting device (107) may be provided with multiple groups or groups; 步骤八、第一烘烤装置(108)将粘贴芯片的金属引线框架进行烘烤；Step 8. The first baking device (108) bakes the metal lead frame of the pasting chip; 步骤九、键合装置(109)对上述步骤完成的中间品进行键合作业；Step 9. The bonding device (109) performs a key cooperation on the intermediate products completed in the above steps; 步骤十、塑封装置(110)对上述步骤完成的中间品进行塑封作业；Step 10: The plastic sealing device (110) performs a plastic sealing operation on the intermediate product completed in the above steps; 步骤十一、第二烘烤装置(111)对上述步骤完成的中间品进行烘烤作业；Step 11: The second baking device (111) performs a baking operation on the intermediate product completed in the above step; 步骤十二、打标装置(112)对上述步骤完成的中间品进行打标作业；Step 12: The marking device (112) performs marking operation on the intermediate product completed in the above steps; 步骤十三、电镀装置(113)对上述步骤完成的中间品进行电镀作业；Step 13: The electroplating device (113) performs an electroplating operation on the intermediate product completed in the above steps; 步骤十四、成型切筋装置(114)对上述步骤完成的中间品进行成型切筋作业；Step 14: The forming and cutting device (114) performs the forming and ribbing operation on the intermediate product completed in the above steps; 步骤十五、外观检测包装装置(115)对上述步骤完成的中间品进行外观检测和包装作业。Step 15: The appearance detecting packaging device (115) performs an appearance inspection and a packaging operation on the intermediate product completed in the above steps. 2.根据权利要求1所述的一种融合SMT的MCM集成电路封装方法，其特征在于步骤十中，塑封装置(110)塑封作业时采用塑封料上料架进行塑封料的上料，所述塑封料上料架包括主体框架(5)与横杆(4)，主体框架(5)的内部设置有横杆(4)，主体框架(5)与横杆(4)通过焊接连接，通过焊接连接，从而可以提高整体结构的稳定性，横杆(4)的中侧设置有连接框(3)，横杆(4)与连接框(3)通过焊接连接，主体框架(5)的左右两端设置有放料圆孔(2)，主体框架(5)的下端设置有压条(1)，主体框架(5)的右端上下两端各设置有一个持握手柄(6)，持握手柄(6)可以使得方便进行拿取，两侧持握手柄(6)的内部设置有握把(9)，握把(9)的左端设置有控制装置(8)，控制装置(8)的左端设置有连接块(7)。2 . The MCM integrated circuit packaging method for fused SMT according to claim 1 , wherein in the tenth step, the plastic sealing device ( 110 ) is used for loading the molding material by using a molding material loading frame. The molding material loading rack comprises a main body frame (5) and a cross bar (4). The main body frame (5) is internally provided with a cross bar (4), and the main body frame (5) and the cross bar (4) are connected by welding through welding. Connection, so as to improve the stability of the overall structure, the middle side of the crossbar (4) is provided with a connecting frame (3), the crossbar (4) and the connecting frame (3) are connected by welding, and the left and right sides of the main body frame (5) The end is provided with a discharge round hole (2), and the lower end of the main body frame (5) is provided with a bead (1), and the right end of the right end of the main body frame (5) is provided with a holding handle (6), and the handle is held ( 6) It can be easily taken, and the handle (9) is provided inside the grip handle (6) on both sides, and the left end of the grip (9) is provided with a control device (8), and the left end of the control device (8) is set. There is a connection block (7). 3.根据权利要求2所述的一种融合SMT的MCM集成电路封装方法，其特征在于主体框架(5)的组成包括有固定端(51)、料孔(52)、上侧板(53)、传动装置(54)和下侧板(55)，固定端(51)的右端上侧设置有上侧板(53)，上侧板(53)的内部设置有料孔(52)，从而可以使得上侧板(53)和下侧板(55)能够运动到同一轴心，上侧板(53)的下端设置有下侧板(55)，下侧板(55)的右端内部设置有传动装置(54)，主体框架(5)通过固定端(51)与横杆(4)固定连接。The MCM integrated circuit packaging method for fused SMT according to claim 2, wherein the main frame (5) comprises a fixed end (51), a hole (52), and an upper side plate (53). , the transmission device (54) and the lower side plate (55), the upper end of the fixed end (51) is provided with an upper side plate (53), and the inside of the upper side plate (53) is provided with a hole (52), thereby making it possible The upper side plate (53) and the lower side plate (55) are movable to the same axis, the lower side of the upper side plate (53) is provided with a lower side plate (55), and the right side of the lower side plate (55) is provided with a transmission device (54) The main body frame (5) is fixedly coupled to the crossbar (4) through the fixed end (51). 4.根据权利要求3所述的一种融合SMT的MCM集成电路封装方法，其特征在于传动装置(54)的组成包括有传动链条(541)、复位弹簧(542)、连接座(543)和传动杆(544)，传动链条(541)的下端设置有复位弹簧(542)，复位弹簧(542)可以使得恢复原来的状态，复位弹簧(542)的下端设置有连接座(543)，连接座(543)的下端设置有传动杆(544)，传动装置(54)通过传动杆(544)与连接块(7)固定连接。4 . The MCM integrated circuit packaging method for fused SMT according to claim 3 , wherein the transmission device comprises a transmission chain ( 541 ), a return spring ( 542 ), a connecting base ( 543 ) and The transmission rod (544), the lower end of the transmission chain (541) is provided with a return spring (542), the return spring (542) can be restored to the original state, and the lower end of the return spring (542) is provided with a connecting seat (543), the connecting seat The lower end of (543) is provided with a transmission rod (544), and the transmission (54) is fixedly connected to the connecting block (7) via a transmission rod (544). 5.根据权利要求2所述的一种融合SMT的MCM集成电路封装方法，其特征在于控制装置(8)的组成包括有推拉杆(81)、固定座(82)、压缩弹簧(83)、固定块(84)、连接板(85)和控制杆(86)，推拉杆(81)的右端设置有固定座(82)，固定座(82)的右端设置有压缩弹簧(83)，从而可以在压缩弹簧(83)的作用下进行运动，压缩弹簧(83)的右端设置有固定块(84)，固定块(84)的右端设置有连接板(85)，连接板(85)的右端设置有控制杆(86)，控制装置(8)通过控制杆(86)与握把(9)固定连接。The method of claim 2, wherein the control device (8) comprises a push-pull rod (81), a fixing base (82), a compression spring (83), The fixing block (84), the connecting plate (85) and the control rod (86), the right end of the push-pull rod (81) is provided with a fixing seat (82), and the right end of the fixing seat (82) is provided with a compression spring (83), so that The movement is performed by the compression spring (83). The right end of the compression spring (83) is provided with a fixing block (84), and the right end of the fixing block (84) is provided with a connecting plate (85), and the right end of the connecting plate (85) is disposed. There is a lever (86), and the control device (8) is fixedly connected to the grip (9) via a lever (86). 6.根据权利要求5所述的一种融合SMT的MCM集成电路封装结构，其特征在于控制杆(86)的组成包括有连接孔(861)、连接杆(862)、固定卡块(863)和传动支杆(864)，固定卡块(863)的下端右侧设置有传动支杆(864)，传动支杆(864)的左侧下端设置有连接杆(862)，从而可以使得更好的进行转动，连接杆(862)的下端设置有连接孔(861)，控制杆(86)通过传动支杆(864)与握把(9)固定连接。6 . The MCM integrated circuit package structure of claim 5 , wherein the control rod ( 86 ) comprises a connection hole ( 861 ), a connecting rod ( 862 ) and a fixed block ( 863 ). And a transmission struts (864), a fixed struts (864) are disposed on the right side of the lower end of the fixed block (863), and a connecting rod (862) is disposed at the lower left end of the transmission struts (864), thereby making it better For the rotation, the lower end of the connecting rod (862) is provided with a connecting hole (861), and the control rod (86) is fixedly connected to the grip (9) through the transmission rod (864).
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