CN102883552B - LGA and BGA Rework Technics - Google Patents
LGA and BGA Rework Technics Download PDFInfo
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- CN102883552B CN102883552B CN201210346047.4A CN201210346047A CN102883552B CN 102883552 B CN102883552 B CN 102883552B CN 201210346047 A CN201210346047 A CN 201210346047A CN 102883552 B CN102883552 B CN 102883552B
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- lga
- bga
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- pcb board
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Abstract
The invention discloses a kind of LGA and BGA Rework Technics, belong to microelectronics technology.By by direct for tin cream silk-screen on device and the silk-screen mould using FR4 material to be made, make to reprocess operation more simple and convenient, and cut the waste, reduce cost, can be used widely.
Description
Technical field
The present invention relates to a kind of LGA and BGA Rework Technics, belong to microelectronics technology.
Background technology
Along with the IC(of Background Grid array packages (hereinafter referred to as LGA) and ball grid array structure is hereinafter referred to as BGA) development that encapsulates and extensive use, it will become the optimal selection of high density, high-performance, multi-functional encapsulation.Due to the packing forms that LGA and BGA is special, solder joint is positioned at package bottom, if there is failure welding, then needs special rework equipments and corresponding technique to reprocess.
Existing repair method is described below: 1, adopt the mode of heating of hot air convection to be heated by LGA/BGA packaging body; 2, after the whole solder joints under LGA/BGA all melt, LGA/BGA is disassembled from pcb board; 3, the pad in PCB and LGA/BGA encapsulation is flattened and cleaned; 4, on PCB pad, tin cream or weld-aiding cream is printed with special silk-screen mould; 5, LGA/BGA is mounted on PCB; 6, cross Reflow Soldering to weld.
But, prior art Shortcomings, first, a set of silk-screen mould and fixture are merely able to the device for a kind of size shape, but have various device in actual production, therefore many molds and fixture is just needed, so not only cost is high, and need manpower to go to safeguard, a special silk-screen mould, cost about 200 yuan, but also special rework equipments need be equipped with, the cost of a rework equipments several ten thousand to hundreds of thousands not etc., so be no small burden for the company of small scale.In addition, when device is very little, such as 5mm × 5mm, the scraper of silk-screen is difficult to operate on silk-screen mould; And when device is larger, as shown in Figure 1, existing silk-screen mould is difficult to again overlap completely with the solder joint on pcb board, easily stopped by the device of periphery.
Summary of the invention
For solving the problem, the invention provides a kind of simply easy to operate, cost is low, LGA and the BGA Rework Technics that efficiency is high.
The technical scheme that the present invention adopts for its problem of solution is:
LGA and BGA Rework Technics, comprises the following steps:
1) LGA/BGA is taken apart from pcb board, hot air convection or heating station can be adopted to heat device package, after the whole solder joints under device package all melt, with vacuum slot or tweezers, device package is taken off from pcb board;
2) pad in leveling and clean pcb board and LGA/BGA encapsulation, after device takes off from pcb board, the pad place of pcb board and device all remains scolding tin, and the scolding tin after hot melt siphons away by available tin sucking gun;
3) be placed on location-plate by LGA/BGA there being the side of solder joint face up, described location-plate is silica gel plate, it has certain viscosity, and operator is placed on the device back side on location-plate, then light voltage device, device is bonded on location-plate, like this when operating, device would not arbitrarily be walked about, and the more important thing is, on device, operation is welded with tin, avoids on pcb board by problem that other components and parts stop;
4) be placed on the pad of LGA/BGA by silk-screen mould, silk-screen mould generally adopts thinner and has the material of certain degree of hardness, for convenience of operation, and preferably transparent or translucent material.Silk-screen mould is provided with the through hole corresponding with device solder joint, and after through hole aligns with solder joint, operator uses scraper print solder paste.According to the actual conditions of company, the present invention adopts FR4 material to make silk-screen mould, and the film etc. such as making the film certainly can also be adopted to meet the material of above-mentioned condition.FR4 material all can have in general wiring board manufacturing factory, and manufacturing process is also very simple, according to the drawing designed in advance, completes with radium-shine cutting, a FR4 can do the solder joint of multiple different size simultaneously, save a large amount of materials and expense;
5) LGA/BGA is mounted on pcb board, according to the size of practical devices, manually actuated or operate with special equipment;
6) cross Reflow Soldering to weld, complete and reprocess.
The invention has the beneficial effects as follows: 1, easy and simple to handle.In operating process, avoid the problem that other components and parts on pcb board stop, easily just can on IC tin cream on silk-screen; And the silk-screen Mold Making cycle is short, substantially reduce the production cycle of product.The time that general making particular manufacturing craft needs is 1 day, and with the silk-screen mould that FR4 makes, only needs 10 minutes.
2, cut the waste, reduce costs.Each part pcb board from first operation to this operation of SMT, there are tens operations, the required production time was at about three days, if because last one welding sequence occurs bad and does not reprocess, waste will be caused, Rework Technics of the present invention can improve repair rate greatly, thus decreases waste.Because Rework Technics of the present invention adopts the mode of tin cream silk-screen to IC pad, and the silk-screen mould used makes with FR4, and cost is more than original 150,000, and reduce to 20 yuan, cost reduces thousands of times.
3, popularization is wide.Because this Rework Technics is simple for production and cost of manufacture is low, general SMT manufacturer can use.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is prior art silk-screen operation chart;
Fig. 2 is operational flowchart of the present invention;
Fig. 3 is the schematic diagram of silk-screen of the present invention operation.
Embodiment
As shown in accompanying drawing 2, accompanying drawing 3, LGA and BGA Rework Technics, comprises the following steps:
Step S1, LGA/BGA is taken apart from pcb board, hot air convection or heating station can be adopted to heat device 4 packaging body, after the whole solder joints under device 4 packaging body all melt, with vacuum slot or tweezers, device 4 packaging body is taken off from pcb board.
Step S2, leveling and clean PCB and LGA/BGA encapsulation on pad, after device 4 takes off from pcb board, the pad place of pcb board and device 4 all remains scolding tin, and the scolding tin after hot melt siphons away by available tin sucking gun.
Step S3, be placed on location-plate 5 by LGA/BGA there being the side of solder joint face up, described location-plate 5 is silica gel plate, and it has certain viscosity, operator is placed on device 4 back side on location-plate 5, then light voltage device 4, is bonded at device 4 on location-plate 5, like this when operating, device 4 would not arbitrarily be walked about, the more important thing is, on device 4, operation is welded with tin 2, avoids on pcb board by problem that other components and parts stop.
Step S4, is placed on the pad of LGA/BGA by silk-screen mould 3, and silk-screen mould 3 generally adopts thinner and has the material of certain degree of hardness, for convenience of operation, and preferably transparent or translucent material.Silk-screen mould 3 is provided with the through hole corresponding with device 4 solder joint, after through hole aligns with solder joint, operator is by scraper 1 print solder paste 2.According to the actual conditions of company, the present invention adopts FR4 material to make silk-screen mould 3, and the film etc. such as making the film certainly can also be adopted to meet the material of above-mentioned condition.FR4 material all can have in general wiring board manufacturing factory, and manufacturing process is also very simple, according to the drawing designed in advance, complete with radium-shine cutting, a FR4 can do simultaneously the solder joint of multiple different size, meet the silk-screen operation of dissimilar device 4 simultaneously, save a large amount of materials and expense;
Step S5, is mounted on LGA/BGA on pcb board, according to the size of practical devices 4, manually actuated or operate with special equipment;
Step S6, crosses Reflow Soldering and welds, complete and reprocess.
Can be recognized by the operating process of the invention described above, the present invention has the following advantages: first, easy and simple to handle, in operating process, avoid the problem that on pcb board, other components and parts stop, after being alignd with device 4 by silk-screen mould 3, operator just can easily tin cream 2 on silk-screen on device 4; And silk-screen mould 3 fabrication cycle is short, substantially reduce the production cycle of product.The time that general making particular manufacturing craft needs is 1 day, and with the silk-screen mould 3 that FR4 makes, only needs 10 minutes.
Secondly, can cut the waste, reduce costs, each part pcb board is to this operation of SMT from first operation, and have tens operations, the required production time was at about three days, if because last one welding sequence occurs bad and does not reprocess, will cause waste, Rework Technics of the present invention can improve repair rate greatly, thus decreases waste.Because Rework Technics of the present invention adopts the mode of tin cream 2 silk-screen to device 4 pad, and the silk-screen mould 3 used makes with FR4 material, and cost is more than original 150,000, and reduce to 20 yuan, cost reduces thousands of times.
Finally, because Rework Technics of the present invention is simple for production and cost of manufacture is low, general SMT manufacturer can use, so can be popularized widely.
Described in above specification, be only principle of the present invention and embodiment, everyly carry out any simple amendment and change according to essence of the present invention, all belong within protection range of the presently claimed invention.
Claims (1)
1.LGA and BGA Rework Technics, is characterized in that, comprises the following steps:
1) LGA/BGA is taken apart from pcb board;
2) pad in leveling and clean pcb board and LGA/BGA encapsulation;
3) be placed on silica gel plate by LGA/BGA there being the side of solder joint face up;
4) the silk-screen mould that will FR4 material be adopted to make is placed on the pad of LGA/BGA, makes print solder paste after through hole on silk-screen mould and solder joint one_to_one corresponding;
5) LGA/BGA is mounted on pcb board;
6) cross Reflow Soldering to weld.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210346047.4A CN102883552B (en) | 2012-09-18 | 2012-09-18 | LGA and BGA Rework Technics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210346047.4A CN102883552B (en) | 2012-09-18 | 2012-09-18 | LGA and BGA Rework Technics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102883552A CN102883552A (en) | 2013-01-16 |
| CN102883552B true CN102883552B (en) | 2016-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210346047.4A Expired - Fee Related CN102883552B (en) | 2012-09-18 | 2012-09-18 | LGA and BGA Rework Technics |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472959A (en) * | 2014-09-04 | 2016-04-06 | 上海唐盛信息科技有限公司 | BGA repairing encapsulation method |
| CN105101668B (en) * | 2015-07-21 | 2017-12-22 | 中国航天科工集团第三研究院第八三五七研究所 | The quick repair method of ultra dense spacing QFN device on a kind of printed board assembly |
| CN105235366B (en) * | 2015-11-09 | 2017-12-22 | 惠州Tcl移动通信有限公司 | The pcb board fixing device of stencil printer |
| US10211120B2 (en) * | 2015-12-23 | 2019-02-19 | Intel Corporation | Rework grid array interposer with direct power |
| CN107864567A (en) * | 2017-11-07 | 2018-03-30 | 威创集团股份有限公司 | A kind of BGA repair methods, device, system |
| CN110148565A (en) * | 2019-05-24 | 2019-08-20 | 深圳市视景达科技有限公司 | A kind of simplified method of plant ball of bga chip recycling |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5695109A (en) * | 1995-11-22 | 1997-12-09 | Industrial Technology Research Institute | Solder paste inter-layer alignment apparatus for area-array on-board rework |
| CN1265424C (en) * | 2002-11-15 | 2006-07-19 | 华为技术有限公司 | Method for reprocessing power device |
| CN101207049A (en) * | 2006-12-18 | 2008-06-25 | 比亚迪股份有限公司 | Tin paste printing apparatus and CSP, BGA chip repairing method using the same |
| CN202021909U (en) * | 2011-04-19 | 2011-11-02 | 深圳市万泰电路有限公司 | Net frame capable of adjusting thickness of strippable silk-screen glue |
-
2012
- 2012-09-18 CN CN201210346047.4A patent/CN102883552B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5695109A (en) * | 1995-11-22 | 1997-12-09 | Industrial Technology Research Institute | Solder paste inter-layer alignment apparatus for area-array on-board rework |
| CN1265424C (en) * | 2002-11-15 | 2006-07-19 | 华为技术有限公司 | Method for reprocessing power device |
| CN101207049A (en) * | 2006-12-18 | 2008-06-25 | 比亚迪股份有限公司 | Tin paste printing apparatus and CSP, BGA chip repairing method using the same |
| CN202021909U (en) * | 2011-04-19 | 2011-11-02 | 深圳市万泰电路有限公司 | Net frame capable of adjusting thickness of strippable silk-screen glue |
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| CN102883552A (en) | 2013-01-16 |
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