CN110148565A - A kind of simplified method of plant ball of bga chip recycling - Google Patents
A kind of simplified method of plant ball of bga chip recycling Download PDFInfo
- Publication number
- CN110148565A CN110148565A CN201910437775.8A CN201910437775A CN110148565A CN 110148565 A CN110148565 A CN 110148565A CN 201910437775 A CN201910437775 A CN 201910437775A CN 110148565 A CN110148565 A CN 110148565A
- Authority
- CN
- China
- Prior art keywords
- bga
- contact
- chip
- web plate
- bga chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
Abstract
The present invention provides a kind of plant balls of bga chip recycling to simplify method, and contact cleaning uneven on bga chip is smooth；Contact on bga chip is cleaned up, web plate is made according to the model of BGA；Contact on bga chip is upward and fixed；It is aligned according to the contact of BGA with web plate hole, web plate is taken away after tin cream is applied on web plate and effectively solves the problem of that circuit board bga chip goes wrong (non-chip is burnt out) recycling；The tin ball made in this way, which is more advantageous to, to be installed on circuit printing plate；Technique is extremely simple, and no high request, ordinary people grasps the technology quickly.
Description
Technical field
The present invention relates to the plant ball recovery technique fields of chip, and in particular to a kind of plant ball letter of bga chip recycling
Change method.
Background technique
Highly integrated on the device of electronic product at present, the highly integrated of integrated circuit makes its encapsulation generate new change,
By pervious DIP, PDIP, SDIP, SOP, HSOP, TSOP, SSOP, QFP, QFJ, FQFP, LQFP, QFN, QFI, QFJ, LGA etc.
Until BGA package.It is to display out in the form of spherical point contacts by die bottom surface since BGA does not have pin directly to come out；Unlike
Other encapsulation directly can be mounted directly or be dismantled using electric iron；So that the exception that its maintenance or recycling become is tired
It is difficult；Once failure welding, or slightly put small minor issue and can only just scrap whole circuit board, cause very big waste.
In order to overcome the maintenance and recycling of chip bga, meet it is different after sale or the dimension of each electronic product
Repair personnel.
Summary of the invention
The purpose of the present invention is to solve the problemss of the above-mentioned prior art, provide a kind of dimension for solving bga chip
Repair recycling, especially vast electronic product maintenance personal, the no professional equipment and BGA matched pearl ball the case where
Under, complexity is solved the problems, such as with simple technique.
The purpose of the present invention is achieved through the following technical solutions: a kind of plant ball of bga chip recycling is simplified
Method, which comprises
Contact cleaning uneven on bga chip is smooth；The welding for being conducive to bga chip contact, reduces contact pad
Fraction defective.
Contact on bga chip is cleaned up, the welding of bga chip contact is conducive to, reduces the bad of contact pad
Rate makes web plate according to the model of BGA；The waste of tin cream is advantageously reduced, while having saved cost.
Contact on bga chip is upward and fixed；
It is aligned according to the contact of BGA with web plate hole, takes away web plate after tin cream is applied on web plate.
Preferably, the method also includes: the bga chip for having planted tin ball is mounted on electronic circuit mainboard.
Preferably, include: by contact cleaning uneven on bga chip is smooth
It is using electric iron that the uneven contact cleaning of ginseng ginseng is smooth, be conducive to the welding of bga chip contact, reduce contact weldering
The fraction defective of point.
Preferably, the contact on bga chip is cleaned up and includes:
The contact of BGA is cleaned up with dedicated board-washing water, is conducive to the welding of bga chip contact, reduces contact pad
Fraction defective.
Preferably, making web plate according to the model of BGA includes:
Corresponding web plate is made according to the model of BGA；And/or
It is set to correspond to the contact of a variety of bga chips in a setting mesh on plate of throwing the net,
Preferably, web plate is made according to the model of BGA further include:
Corresponding web plate is made with thin plastic sheet and needle.
Preferably, it is aligned according to the contact of BGA with web plate hole, taking away web plate after tin cream is applied on web plate includes:
Tin cream thawing is welded into the forming tin ball on the contact of bga chip, is aligned according to the size of tin ball, then web plate
The contact of bga chip is put on, then one layer of tin cream of wiper, and web plate is taken away, and is blown with electrothermal blowing alignment tin ball, is melted tin cream,
Repetition is done 2 to 3 times.
Preferably, the bga chip for having planted tin ball is mounted on electronic circuit mainboard and includes:
The tin point of contact weld pad in BGA package on electronic circuit mainboard and residue are welded clearly smooth clean；Favorably
The fraction defective of contact pad is reduced in welding in bga chip contact.
The contact of BGA package is cleaned up；The fraction defective of contact pad is reduced in the welding for being conducive to bga chip contact.
By scaling powder on the contact of BGA package；
The bga chip for having planted tin ball is placed on the position of circuit main board BGA package, moving bga chip is stained with tin ball also
Upper scaling powder is directed at the package position of BGA；
Circuit main board is fixed, the position BGA is outstanding to expose, and the bottom of electrothermal blowing circuit board bga chip encapsulation makes
It when bga chip has pico- gas to come out, then is heated to the upper surface of bga chip, circuit board and chip is allowed slowly to cool down；
The plant ball of bga chip and welding are completed.
Preferably, the tin point of the contact weld pad in the BGA package on electronic circuit mainboard and residue are welded clearly smooth dry
Only include:
With electric iron and solder by the tin point and residue of the circular contact pad in the BGA package on electronic circuit mainboard
It welds clearly smooth clean.The fraction defective of contact pad is reduced in the welding for being conducive to bga chip contact.
Preferably, the contact of BGA package is cleaned up and includes:
The contact of BGA package is cleaned with dedicated board-washing water；Be conducive to the welding of bga chip contact, reduce contact weldering
The fraction defective of point.
Beneficial effects of the present invention: a kind of simplified method of plant ball of bga chip recycling, it will be uneven on bga chip
Contact cleaning is smooth；Contact on bga chip is cleaned up, web plate is made according to the model of BGA；By the touching on bga chip
Point is upward and fixed；It is aligned according to the contact of BGA with web plate hole, takes away web plate after tin cream is applied on web plate and effectively solve electricity
The problem of road plate bga chip goes wrong (non-chip is burnt out), recycling；The tin ball made in this way, which is more advantageous to, is installed to electricity
It prints on plank on road；Technique is extremely simple, and no high request, ordinary people grasps the technology quickly.
Detailed description of the invention
Fig. 1 is the flow diagram planted ball and simplify method that a kind of bga chip of the embodiment of the present invention reuses；
Fig. 2 is the flow diagram planted ball and simplify method that a kind of bga chip of the embodiment of the present invention reuses；
Fig. 3 is that a kind of bga chip of the embodiment of the present invention is mounted on the flow diagram on electronic circuit mainboard.
Specific embodiment
The preferred embodiment of the present invention is described below, those of ordinary skill in the art will be according to described below with this
The relevant technologies in field are realized, and can be more clearly understood that innovation and bring benefit of the invention.
As shown in Figure 1, the plant ball for providing a kind of recycling of bga chip simplify method the following steps are included:
S101: using electric iron that the uneven circular contact cleaning of ginseng ginseng is smooth by bga chip.
S102: the contact on bga chip is cleaned up, and makes web plate according to the model of BGA；If same BGA's
The a fairly large number of words of model can be dedicated for this model and open a corresponding web plate；If BGA model is a variety of, diversified in specifications, can
To open an omnipotent steel mesh, Multiple Type can be taken into account.If not opening steel mesh urgent need again, thin plastic sheet and needle can be used
Make one simple " steel mesh " by oneself.
S103: the bga chip that will be cleaned up, circular contact upward, are clamped and are fixed with clip or other tools, use steel
On square.
S104: the circular contact of steel mesh hole alignment bga chip；Gang Wang &BGA chip is compressed using other articles；Tin cream
It is placed on steel mesh, using the plastic sheet or other article wiper tin creams of pingbian, tin cream is made to flow to BGA's by the aperture on steel mesh
On circular contact, steel mesh is lightly taken away；It is blown with the circular contact of electric-heating air blower against bga chip, the tin on circular contact
Cream thawing welds the forming tin ball on the circular contact of bga chip, if tin ball at this moment is not big enough, then steel mesh is directed at BGA
The circular contact (being exactly the tin ball shaped just now) of chip is put on, then one layer of tin cream of wiper, steel mesh is taken away, with electrothermal blowing pair
Quasi- tin ball is blown, and melts tin cream, is combined with the tin ball of last time, and bigger tin ball is shaped.Usual repetition does 2 to 3 times must
To more satisfactory tin ball.
As shown in Fig. 2, the plant ball for providing a kind of recycling of bga chip simplify method the following steps are included:
S201: using electric iron that the uneven circular contact cleaning of ginseng ginseng is smooth by bga chip.
S202: the contact on bga chip is cleaned up, and makes web plate according to the model of BGA.
S203: the contact on bga chip is upward and fixed.
S204: it is aligned according to the contact of BGA with web plate hole, takes away web plate after tin cream is applied on web plate.
S205: the bga chip for having planted tin ball is mounted on electronic circuit mainboard.
As shown in figure 3, the step that the bga chip for having planted tin ball is mounted on electronic circuit mainboard is as follows:
S2051: using electric iron and solder by the tin point of the circular contact pad in the BGA package on electronic circuit mainboard
And residue weld clearly it is smooth clean.
S2052: the circular contact of BGA package is cleaned with dedicated board-washing water.
S2053: some scaling powders on the circular contact of BGA package.
S2054；The bga chip for having planted tin ball is placed on the position of circuit main board BGA package, moving bga chip makes tin
Ball is also stained with scaling powder, then makes the package position of bga chip alignment BGA.
S2055: circuit main board is fixed using clip or other articles, the position BGA, which hangs to expose, (makes the bottom BGA can also
To use electrothermal blowing to blow to), if as soon as first blowing the bottom of circuit board bga chip encapsulation only electric-heating air blower, blowing to
When bga chip has pico- gas to come out at once blown in the upper surface of bga chip, blow to feel bga chip it is somewhat low when；It will blow
Air pressure gun positions higher from bga chip, then slowly far from chip；Circuit board and chip is allowed slowly to cool down.
S2056: at this moment the plant ball of bga chip and welding are completed.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
A specific embodiment of the invention is only limited to these instructions.General technical staff of the technical field of the invention is come
It says, without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to this hair
Bright protection scope.
Claims (10)
1. a kind of plant ball of bga chip recycling simplifies method, which is characterized in that the described method includes: by bga chip not
Flat contact cleaning is smooth；Contact on bga chip is cleaned up, web plate is made according to the model of BGA；It will be on bga chip
Contact it is upward and fixed；It is aligned according to the contact of BGA with web plate hole, takes away web plate after tin cream is applied on web plate.
2. the method according to claim 1, wherein the method also includes: will plant tin ball bga chip peace
On electronic circuit mainboard.
3. the method according to claim 1, wherein it includes: to make that contact uneven on bga chip, which is cleared up smooth,
It is with electric iron that the uneven contact cleaning of ginseng ginseng is smooth.
4. the method according to claim 1, wherein it includes: with dedicated that the contact on bga chip, which is cleaned up,
Board-washing water cleans up the contact of BGA.
5. the method according to claim 1, wherein making web plate according to the model of BGA includes: according to BGA's
Model makes corresponding web plate；And/or it is set to correspond to the contact of a variety of bga chips in a setting mesh on plate of throwing the net.
6. the method according to claim 1, wherein making web plate according to the model of BGA further include: with thin modeling
Tablet and needle make corresponding web plate.
7. tin cream is smeared the method according to claim 1, wherein being aligned according to the contact of BGA with web plate hole
It includes: that tin cream thawing is welded the forming tin ball on the contact of bga chip that web plate is taken away after on to web plate, according to the big of tin ball
It is small, then the contact of web plate alignment bga chip is put on, then one layer of tin cream of wiper, web plate is taken away, is directed at tin ball with electrothermal blowing
It blows, melts tin cream, repetition is done 2 to 3 times.
8. according to the method described in claim 2, it is characterized in that, the bga chip for having planted tin ball is mounted on electronic circuit master
Include: on plate the tin point of the contact weld pad in the BGA package on electronic circuit mainboard and residue are welded clearly it is smooth clean；It will
The contact of BGA package cleans up；By scaling powder on the contact of BGA package；The bga chip for having planted tin ball is placed on circuit main board
On the position of BGA package, moving bga chip makes tin ball also be stained with scaling powder, is directed at the package position of BGA；Circuit main board is consolidated
It sets, the position BGA is outstanding to expose, and the bottom of electrothermal blowing circuit board bga chip encapsulation makes bga chip have pico- gas to go out
It when coming, then is heated to the upper surface of bga chip, circuit board and chip is allowed slowly to cool down；It the plant ball of bga chip and has welded
At.
9. according to the method described in claim 8, it is characterized in that, by the contact weldering in the BGA package on electronic circuit mainboard
The tin point and residue of disk weld clearly it is smooth completely include: will be in the BGA package on electronic circuit mainboard with electric iron and solder
The tin point and residue of circular contact pad are welded clearly smooth clean.
10. according to the method described in claim 8, it is characterized in that, it includes: with dedicated that the contact of BGA package, which is cleaned up,
The contact of board-washing water cleaning BGA package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910437775.8A CN110148565A (en) | 2019-05-24 | 2019-05-24 | A kind of simplified method of plant ball of bga chip recycling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910437775.8A CN110148565A (en) | 2019-05-24 | 2019-05-24 | A kind of simplified method of plant ball of bga chip recycling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110148565A true CN110148565A (en) | 2019-08-20 |
Family
ID=67593139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910437775.8A Pending CN110148565A (en) | 2019-05-24 | 2019-05-24 | A kind of simplified method of plant ball of bga chip recycling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110148565A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201123172Y (en) * | 2007-12-13 | 2008-09-24 | 福建星网锐捷网络有限公司 | Otter board |
| CN100431123C (en) * | 2005-06-15 | 2008-11-05 | 英华达(上海)电子有限公司 | Method for restoring integrated circuit chip and printed steel plate private for the same |
| CN102883552A (en) * | 2012-09-18 | 2013-01-16 | 奈电软性科技电子(珠海)有限公司 | LGA and BGA repair process |
| CN103855041A (en) * | 2012-12-06 | 2014-06-11 | 北京普源精电科技有限公司 | Chip reballing device and method |
| CN204067308U (en) * | 2014-08-25 | 2014-12-31 | 烽火通信科技股份有限公司 | Bga chip plant ball instrument |
-
2019
- 2019-05-24 CN CN201910437775.8A patent/CN110148565A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100431123C (en) * | 2005-06-15 | 2008-11-05 | 英华达(上海)电子有限公司 | Method for restoring integrated circuit chip and printed steel plate private for the same |
| CN201123172Y (en) * | 2007-12-13 | 2008-09-24 | 福建星网锐捷网络有限公司 | Otter board |
| CN102883552A (en) * | 2012-09-18 | 2013-01-16 | 奈电软性科技电子(珠海)有限公司 | LGA and BGA repair process |
| CN103855041A (en) * | 2012-12-06 | 2014-06-11 | 北京普源精电科技有限公司 | Chip reballing device and method |
| CN204067308U (en) * | 2014-08-25 | 2014-12-31 | 烽火通信科技股份有限公司 | Bga chip plant ball instrument |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190820 |
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| RJ01 | Rejection of invention patent application after publication |