CN204067308U - Bga chip plant ball instrument - Google Patents

Bga chip plant ball instrument Download PDF

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Publication number
CN204067308U
CN204067308U CN201420481106.3U CN201420481106U CN204067308U CN 204067308 U CN204067308 U CN 204067308U CN 201420481106 U CN201420481106 U CN 201420481106U CN 204067308 U CN204067308 U CN 204067308U
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China
Prior art keywords
chip
clamping plate
bga
lower clamping
template
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CN201420481106.3U
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Chinese (zh)
Inventor
袁敏
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Fiberhome Telecommunication Technologies Co Ltd
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Fiberhome Telecommunication Technologies Co Ltd
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Priority to CN201420481106.3U priority Critical patent/CN204067308U/en
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Abstract

What the utility model discloses a kind of bga chip plants ball instrument, and chip mounting table comprises workbench and is located at the cushion block of worktable upper surface, and cushion block is used for fixing bga chip; Plant the steel net template that ball template comprises upper and lower clamping plate and is folded between upper and lower clamping plate, the center of upper and lower clamping plate is provided with the through hole of up/down perforation, upper and lower clamping plate are provided with the through screwed hole of many groups around through hole, are wherein screwed with adjusting bolt in one group of screwed hole.The utility model, utilize adjusting bolt can regulate the distance of steel net template and bga chip to be processed, and steel net template is provided with different size, mesh array number can cover the number of arrays of most of chip, therefore can be used for the maintenance of most of chip, not by number of pins and the thickness limits of chip, manufacture simple, with low cost, highly versatile.

Description

Bga chip plant ball instrument
Technical field
The utility model relates to plants ball instrument for chip, and what be specifically related to bga chip plants ball instrument
Background technology
The nineties in 20th century, along with the progress of technology, chip integration improves constantly, and I/O pin number sharply increases, and power consumption also increases thereupon, also stricter to the requirement of integrated antenna package.In order to the needs of satisfied development, BGA package starts to be applied to producing, BGA (English Ball Grid Array Package) i.e. BGA Package technology, the I/O terminal of BGA package is distributed in below encapsulation with circular or column solder joint by array format, and be arranged in the pattern that is similar to grid, this technology has the following advantages: although I/O number of pins increases, and the distance between pin is large, improves rate of finished products; Although the power consumption of BGA increases, be the welding of control collapsed chip method due to what adopt, thus can electric heating property be improved; Signal transmission delay is little, adapts to frequency and greatly improves; Assemble available coplanar welding, reliability improves greatly.Therefore BGA is the optimal selection of the high density such as CPU, mainboard south, north bridge chips, high-performance, many pin package, and a lot of chip device producer used, and the chip of BGA package is also just more and more universal.
Because BGA pin mostly is stanniferous material, carrying out in circuit board group process of assembling, device is because of through high-temperature soldering, and the scolding tin on device can melt, and is welded together with the line scan pickup coil side on circuit board, if when BGA device needs are reprocessed and are disassembled from circuit board, because pin material at high temperature melts distortion, after device disassembles, the pin of BGA just becomes all in tumble shape, at this moment bga chip cannot use, and therefore chip needs again to implant new solder ball.
Existing BGA plants ball technique and usually adopts steel net template to carry out, and disclosed in Chinese invention patent CN102881599A, BGA plants ball technique, steel mesh is installed to and printing machine carries out contraposition fixes, and tin cream is coated onto on steel mesh; Several BGA are contained on carrier, and carrier is installed on printing machine, steel mesh is overlapped with carrier and carries out paste solder printing; After being completed for printing, check whether the tin cream on each BGA pad prints evenly, after confirming printing OK, be put into Reflow Soldering baking, complete and plant ball.Following shortcoming is there is in above-mentioned technique:
(1) array way of steel net template and chip, the size of soldered ball and spacing one_to_one corresponding is needed, poor universality;
(2) steel net template surrounding needs with cushion block frame high, makes it keep accurate distance, complex operation with the BGA device of printed scaling powder or soldering paste, needs operating personnel to have the operation skill of consummation;
(3) due to the thickness of different chip and not of uniform size, what have also needs at the enterprising line operate of Rework station, and therefore, above-mentioned technique is not suitable for the unified maintenance of various chip.
As can be seen here, existing BGA plants ball technique poor universality, complex operation, is not suitable for the unified maintenance of various chip.
Utility model content
Technical problem to be solved in the utility model be existing bga chip plant ball technique poor universality, complex operation, be not suitable for the problem of the unified maintenance of various chip.
In order to solve the problems of the technologies described above, what the technical scheme that the utility model adopts was to provide a kind of bga chip plants ball instrument, comprise chip mounting table and be arranged on and described chip mounting table plants ball template, the end face of described chip mounting table is provided with the cushion block for placing bga chip;
Described ball template of planting comprises upper and lower clamping plate and is folded in the steel net template between described upper and lower clamping plate, the center of described upper and lower clamping plate is provided with the through hole of up/down perforation, described upper and lower clamping plate are provided with the through screwed hole of many groups around described through hole, are wherein screwed with adjusting bolt in screwed hole described in a group.
Plant in ball instrument at above-mentioned bga chip, the diameter of the described through screwed hole of each group is different.
Plant in ball instrument at above-mentioned bga chip, described upper and lower clamping plate passed through assembling bolt to be fixed, and is fixed between described upper and lower clamping plate by described steel net template.
What the utility model provided plants ball instrument, and soldered ball can be allowed by the mesh of steel net template to be dropped down onto solder joint on chip smoothly, manufactures simple, with low cost.
In addition, steel net template is provided with different size, and mesh array number can cover the number of arrays of most of chip, therefore can be used for the maintenance of most of chip, not by number of pins and the thickness limits of chip, and highly versatile.
Accompanying drawing explanation
Fig. 1 is the front view after the utility model exactitude position;
Fig. 2 is structural representation of the present utility model;
Fig. 3 is the exploded view of planting ball template in the utility model.
Embodiment
The utility model provides a kind of bga chip and plants ball instrument, bga chip is positioned on the cushion block of chip mounting table, the height of clamping plate is regulated by arrangement for adjusting height, steel net template is made to be positioned at the distance being about a Diameter of Solder Ball above bga chip, and the mesh on steel net template and the solder joint on chip are aimed at, can soldered ball be allowed to drop down onto solder joint by mesh smoothly.Below in conjunction with specific embodiment and Figure of description, the utility model is described in detail.
As shown in Figure 1, the bga chip that the utility model provides is planted ball instrument and is comprised chip mounting table 1 and be arranged on chip mounting table 1 plants ball template 2.
As shown in Figures 2 and 3, chip mounting table 1 comprises workbench 11 and is located at the cushion block 12 of workbench 11 upper surface, and the upper surface of cushion block 12 is provided with the locating groove for fixing bga chip, and bga chip 10 to be processed is placed in the locating groove on cushion block 12.
Plant ball template 2 and comprise steel net template 20 and upper and lower clamping plate 21,22, the middle part of two clamping plate is provided with the through hole of up/down perforation, steel net template 20 is clamped by train wheel bridge 21 and lower plate 22, mesh-portion is in the through hole of two clamping plate, through hole around middle part on upper and lower clamping plate 21,22 is also provided with some groups of screws 23 and adjusting bolt 24, be provided with three groups in the present embodiment, screw 23 is arranged on the surrounding of train wheel bridge 21, lower plate 22 and steel net template 20, and adaptive with adjusting bolt 24.The bottom of adjusting bolt 24 is positioned at the upper surface of workbench 11.Be respectively equipped with four pilot holes 25 in the surrounding of train wheel bridge 21, lower plate 22 and steel net template 20, in pilot hole 25, be provided with the assembling bolt 26 of coupling.
Wherein, steel net template 20 is provided with some specifications, and the size of mesh and Mesh distance are arranged according to the pin feature of common bga chip on the market, and the mesh on each steel net template is multiple array distribution, can cover the array way of most of bga chip.Therefore select suitable steel net template according to the bga chip reprocessed, fast soldered ball can be put into the pin place of the bga chip reprocessed.
Adjusting bolt 21 is also provided with some different sizes, and be provided with the adjusting bolt of 3 specifications and 3 corresponding screws in the utility model, the diameter of adjusting bolt 24 is less, then degree of regulation is higher.
Be below concrete using method of the present utility model:
Bga chip 10 to be processed is positioned on the cushion block 12 on workbench 11;
Suitable steel net template 20 is selected according to the pin size of bga chip 10 to be processed and spacing, the mesh of steel net template 20 needs to be a bit larger tham Diameter of Solder Ball, steel net template 20 train wheel bridge 21 and lower plate 22 are clamped, with assembling bolt 26 two Boards wall is formed as one and plants ball template 2;
The adjusting bolt 24 of appropriate size is selected according to the size of Diameter of Solder Ball, the bottom of adjusting bolt 24 is placed in the upper surface of workbench 11, regulate each adjusting bolt 24 successively, making steel net template 20 be placed in the distance of about Diameter of Solder Ball above bga chip 10 to be processed, is doubly good with the 0.8-1.2 of Diameter of Solder Ball, in general, pin-pitch is larger, soldered ball is larger, then degree of regulation is lower, and the adjusting bolt selecting screw diameter larger just can satisfy the demands;
Because steel net template 20 contains more mesh array, after mesh array corresponding with it for bga chip 10 to be processed is aimed at, to stop unnecessary mesh with adhesive tape, then soldered ball is poured on the mesh-portion of steel net template 20, make soldered ball fall into solder joint on bga chip 10 to be processed, the worktable upper surface that adhesive tape can avoid soldered ball to fall below from mesh splashes.
By chip mounting table 1 together with bga chip to be processed 10 with plant ball template 2 and put into reflow ovens or carry out welding of heating on Rework station.
After having welded, ball template 2 will be planted and pick up from workbench 11, lower plate 22, steel net template 20 and train wheel bridge 21 will be disassembled successively, bga chip 10 to be processed will be taken off from cushion block 12.
Learn thus, the utility model utilizes arrangement for adjusting height can regulate the distance of steel net template and chip to be processed, and steel net template is provided with different size, mesh array number can cover the number of arrays of most of chip, therefore can be used for the maintenance of most of chip, not by number of pins and the thickness limits of chip, manufacture simple, with low cost, highly versatile.
The utility model is not limited to above-mentioned preferred forms, and anyone should learn the structural change made under enlightenment of the present utility model, and every have identical or close technical scheme with the utility model, all falls within protection range of the present utility model.

Claims (3)

1.BGA chip plant ball instrument, comprise chip mounting table and be arranged on and described chip mounting table plants ball template, it is characterized in that:
The end face of described chip mounting table is provided with the cushion block for placing bga chip;
Described ball template of planting comprises upper and lower clamping plate and is folded in the steel net template between described upper and lower clamping plate, the center of described upper and lower clamping plate is provided with the through hole of up/down perforation, described upper and lower clamping plate are provided with the through screwed hole of many groups around described through hole, are wherein screwed with adjusting bolt in screwed hole described in a group.
2. bga chip as claimed in claim 1 plant ball instrument, it is characterized in that, the diameter of the described through screwed hole of each group is different.
3. bga chip as claimed in claim 1 plant ball instrument, it is characterized in that, described upper and lower clamping plate are fixed by assembling bolt, are fixed between described upper and lower clamping plate by described steel net template.
CN201420481106.3U 2014-08-25 2014-08-25 Bga chip plant ball instrument Active CN204067308U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420481106.3U CN204067308U (en) 2014-08-25 2014-08-25 Bga chip plant ball instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420481106.3U CN204067308U (en) 2014-08-25 2014-08-25 Bga chip plant ball instrument

Publications (1)

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CN204067308U true CN204067308U (en) 2014-12-31

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105764264A (en) * 2016-03-31 2016-07-13 苏州亚思科精密数控有限公司 Flexible BGA carrier plate
CN105764263A (en) * 2016-03-31 2016-07-13 苏州亚思科精密数控有限公司 BGA carrier plate
CN105792542A (en) * 2016-03-31 2016-07-20 苏州亚思科精密数控有限公司 Dimension adjustment method for flexible BGA carrier board
CN105870027A (en) * 2016-05-10 2016-08-17 付淑珍 Ball mounting tool for BGA chips
CN110148565A (en) * 2019-05-24 2019-08-20 深圳市视景达科技有限公司 A kind of simplified method of plant ball of bga chip recycling
WO2020011233A1 (en) * 2018-07-12 2020-01-16 新冠科技有限公司 Ball mounter
CN110901216A (en) * 2019-12-02 2020-03-24 珠海格力新元电子有限公司 Steel mesh and device for semiconductor lead frame printing

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105764264A (en) * 2016-03-31 2016-07-13 苏州亚思科精密数控有限公司 Flexible BGA carrier plate
CN105764263A (en) * 2016-03-31 2016-07-13 苏州亚思科精密数控有限公司 BGA carrier plate
CN105792542A (en) * 2016-03-31 2016-07-20 苏州亚思科精密数控有限公司 Dimension adjustment method for flexible BGA carrier board
CN105870027A (en) * 2016-05-10 2016-08-17 付淑珍 Ball mounting tool for BGA chips
CN105870027B (en) * 2016-05-10 2018-05-11 海门市卓维纺织品有限公司 A kind of plant ball instrument for bga chip
WO2020011233A1 (en) * 2018-07-12 2020-01-16 新冠科技有限公司 Ball mounter
CN110148565A (en) * 2019-05-24 2019-08-20 深圳市视景达科技有限公司 A kind of simplified method of plant ball of bga chip recycling
CN110901216A (en) * 2019-12-02 2020-03-24 珠海格力新元电子有限公司 Steel mesh and device for semiconductor lead frame printing

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