CN206293416U - A kind of BGA ball-planting devices - Google Patents
A kind of BGA ball-planting devices Download PDFInfo
- Publication number
- CN206293416U CN206293416U CN201621252989.6U CN201621252989U CN206293416U CN 206293416 U CN206293416 U CN 206293416U CN 201621252989 U CN201621252989 U CN 201621252989U CN 206293416 U CN206293416 U CN 206293416U
- Authority
- CN
- China
- Prior art keywords
- ball
- bga
- chip
- planting devices
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000000875 corresponding Effects 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000001105 regulatory Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The utility model belongs to the plant ball technical field of tools of chip, there is provided a kind of BGA ball-planting devices, the BGA ball-planting devices include chip fixed station, plant ball plate and plant net, ball placement plate is fixed on the chip fixed station top by alignment pin, groove is provided with inside the chip fixed station, the groove is provided with some slideways, one end of the slideway comes together in the groove center, the other end is distributed from the center to surrounding, block is equipped with each described slideway, screw and nut are respectively mounted on the block, the block can be slided on the slideway, the groove center is provided with through hole and arranges screw bolt and nut, the bolt head is used to place the chip, the height of the chip in the face of being placed on it is adjusted by adjusting the bolt highly.The utility model solves the problems, such as that existing bga chip is difficult to position, while overcoming the defect of poor universality again, has the advantages that easy to operate, plant ball is quick, has a wide range of application.
Description
Technical field
The utility model is related to the plant ball instrument of chip, in particular it relates to a kind of BGA ball-planting devices.
Background technology
With advances in technology, chip integration is improved constantly, and BGA (English Ball Grid Array Package) is
BGA Package technology is increasingly pursued, and the I/O terminals of BGA package are distributed with circular or column solder joint by array format
Face under the package, and a pattern similar to grid is arranged in, the technology has advantages below：The distance between pin is big,
Improve yield rate；The welding of control collapsed chip method is used, such that it is able to improve electric heating property；Signal transmission delay is small,
Frequency is adapted to greatly improve；Assembling can use coplanar welding, and reliability is greatly improved.Therefore, the chip of BGA package is also just increasingly
Popularization.
BGA pins are generally stanniferous material, on the one hand, during circuit board assembling is carried out, device because through high-temperature soldering,
Scolding tin on device can melt, and be welded together with the line scan pickup coil side on circuit board.In addition, if BGA device needs to reprocess, from
When being disassembled on circuit board, because pin material melts deformation at high temperature, after device is disassembled, the pin of BGA just becomes
Into all in tumble shape, it is therefore desirable to be implanted into new solder ball again.
The fixed billiard table of planting of prior art is disadvantageous in that one is：Due between the template and the BGA device
Distance to be equal to or slightly less than the diameter of the tin ball, it is necessary to adjust the vertical position of the template according to different BGA device
Put, it is cumbersome, it is necessary to operating personnel have consummate operation skill；Two are：Because the template will be with the BGA device
Pad is aligned, it is necessary to adjust the horizontal level of the template, and the fixed billiard table of planting does not have corresponding adjusting means, it cannot
Suitable for a variety of BGA devices.As can be seen here, existing BGA ball-planting devices poor universality, cumbersome.
The content of the invention
For defect of the prior art, the purpose of this utility model is to provide a kind of BGA ball-planting devices, it is intended to solve existing
There is bga chip to be difficult to the problem for positioning, while overcome the defect of poor universality again, with it is easy to operate, plant ball it is quick, using model
The advantages of enclosing wide.
In order to solve the above technical problems, the utility model provides a kind of BGA ball-planting devices, the BGA ball-planting devices include
Chip fixed station, plant ball plate and plant net, ball placement plate are fixed on the chip fixed station top, the core by alignment pin
It is provided with groove inside piece fixed station, the groove is provided with some slideways, one end of the slideway is come together in the groove
The heart, the other end is distributed from the center to surrounding, and block is equipped with each described slideway, and spiral shell is respectively mounted on the block
Silk and nut, the block can be slided on the slideway, and the groove center is provided with through hole and arranges screw bolt and nut, institute
Bolt head is stated for placing the chip, the chip in the face of being placed on it is adjusted by adjusting the bolt highly
Highly.
Preferably, ball placement plate is integrally formed with ball placement net, is supported the use with corresponding bga chip, the plant
Net is located at ball placement plate centre position, and ball placement edges of boards edge is provided with the location hole, saves artificial alignment operation, time saving
It is laborsaving.
Preferably, ball placement plate include upper plate and lower plate, upper plate insertion corresponding with the middle part of the lower plate,
Port is formed, ball placement net is placed in the passage port；The upper plate and the lower plate edge are correspondingly provided with through hole respectively, and lead to
Screw connection is crossed, ball placement net is located between the upper plate and the lower plate；The upper plate and the lower plate edge are additionally provided with
Location hole, it is corresponding with the alignment pin.
Preferably, ball placement net mesh is in array distribution.
Preferably, the distance that the mesh diameter is placed in when on the bolt with ball placement net than the bga chip is big
0.5-1.5 millimeters, it is easy to tin ball accurately to fall into the solder joint of the chip.
Preferably, the alignment pin number is 3-4, is distributed in the chip and fixes edge of table, with ball placement edges of boards
Edge or the upper plate are corresponding with the location hole at the lower plate edge, and ball placement net is limited into certain position, are easy to plant
Ball.
Preferably, the number of the upper plate and lower plate edge through hole is 3 or 5 respectively, and scattering device is in described
Upper plate and the lower plate edge, for fastening ball placement net.
Preferably, the slideway number is at least 2, and the bga chip can be fixed on the fixed station.
Preferably, the bolt head is socket cap, and the bga chip can be made relatively to be stably placed on the bolt.
Preferably, the socket cap basal diameter can be accommodated described more than 1.5 centimetres and less than the groove diameter
Bga chip.
Compared with prior art, the utility model has following beneficial effect：
(1) the BGA ball-planting devices that the utility model is provided are provided with through hole at the heart and arrange screw bolt and nut in a groove, institute
Bolt is stated for placing the chip, the height of the chip in the face of being placed on it is adjusted by adjusting the bolt highly
Degree, simple structure is easy to operate；
(2) the BGA ball-planting devices that the utility model is provided, it is supporting to be provided with plant ball plate, ball placement plate and ball placement
Net is integrally formed, and is supported the use with corresponding bga chip, and ball placement net is located at ball placement plate centre position, ball placement
Edges of boards edge is provided with the location hole, saves artificial alignment operation, time saving and energy saving；
(3) the BGA ball-planting devices that the utility model is provided, ball placement plate includes upper plate and lower plate, the upper plate and institute
The middle part correspondence insertion of lower plate is stated, port is formed, ball placement net is placed in the passage port；The upper plate and the lower plate
Edge is correspondingly provided with through hole respectively, and by screw connection, the bga chip is located between the upper plate and the lower plate；Institute
State upper plate and the lower plate edge is additionally provided with location hole, accurate positioning corresponding with the alignment pin, and can be according to bga chip
Difference, exchange corresponding plant net, versatility is good.
Brief description of the drawings
The detailed description made to non-limiting example with reference to the following drawings by reading, other spies of the present utility model
Levy, objects and advantages will become more apparent upon：
Fig. 1 is the BGA ball-planting device figures that embodiment 1 is provided；
Fig. 2 is that the BGA that embodiment 2 is provided plants ball panel assembly figure；
Marked in figure：Chip fixed station 1, plant ball plate 2, plant net 3, upper plate 4, lower plate 5, port 6, through hole 7, screw 8,
Alignment pin 9, location hole 10, groove 11, slideway 12, block 13, block screw 14, bolt 15.
Specific embodiment
With reference to specific embodiment, the utility model is expanded on further.It should be understood that these embodiments are merely to illustrate this
Utility model rather than limitation scope of the present utility model.
Embodiment 1
With reference to Fig. 1, the BGA ball-planting devices that the present embodiment is provided include chip fixed station 1, plant ball plate 2 and plant net 3.Institute
Stating plant ball plate 2 includes upper plate 4 and lower plate 5, and the insertion corresponding with the middle part of the lower plate 5 of the upper plate 4 forms port 6, institute
Plant net 3 is stated to be placed at the port 6；The upper plate 4 and the edge of the lower plate 5 are correspondingly provided with through hole 7 respectively, and by screw
8 connections, ball placement net 3 is located between the upper plate 4 and the lower plate 5, the upper plate 4 and the edge through hole 7 of the lower plate 5
Number is 3 or 5 respectively, for fastening ball placement net 3.Ball placement plate 2 is fixed on the chip and fixes by alignment pin 9
The top of platform 1, the upper plate 4 and the edge of the lower plate 5 are additionally provided with location hole 10, the alignment pin corresponding with the alignment pin 9
9 numbers are 3-4, are distributed in the edge of chip fixed station 1, with the edge of ball placement plate 2 or the upper plate 4 and it is described under
The location hole 10 at the edge of plate 5 is corresponding, and ball placement net 3 is limited into certain position, is easy to plant ball.The chip fixed station 1
Inside is provided with groove 11, and the groove 11 is provided with least 2 slideways 12, for the bga chip to be fixed on into the fixation
On platform 1, one end of the slideway 12 comes together in the center of the groove 11, and the other end is distributed from the center to surrounding, each institute
State and block 13 is equipped with slideway 12, screw 14 and nut are respectively mounted on the block 13, the block 13 can be described
Slided on slideway 12, the center of the groove 11 is provided with through hole and arranges bolt 15 and nut, the head of the bolt 15 is cylinder
Head, can be such that the bga chip is relatively stably placed on the bolt 15, and the bottom cylindrical face is with diameter greater than 1.5 centimetres and small
In the diameter of the groove 11, the bga chip can be accommodated, the face of being placed on it is adjusted by adjusting the height of the bolt 15
The chip height.The mesh of ball placement net 3 is in array distribution, and the mesh diameter is placed in described than the bga chip
Distance when on bolt 15 with ball placement net 3 is big 0.5-1.5 millimeters, is easy to tin ball accurately to fall into the weldering of the chip
Point.
Embodiment 2
With reference to Fig. 2, the present embodiment and embodiment 1 differ only in ball placement plate 2 and the one of ball placement net 3 into
Type, supports the use with bga chip, and ball placement net 3 is set in the centre position of ball placement plate 2, and the edge of ball placement plate 2 is provided with
The location hole 10, saves artificial alignment operation, time saving and energy saving.
The course of work of the present utility model is：
1st, the screw on the upper and lower plate for planting ball plate is pulled down, net will be planted and be placed between upper and lower plate, fastening screw (plants ball plate
Then operated without this step when net is integrally formed with being planted, other steps are identical)；2nd, the bga chip will be planted ball is placed on spiral shell
Bolt head, loose nut, the height of regulating bolt is located at when can accurately receive the tin ball position for falling and fixes, then
The screw on block is loosened, sliding block adjusts the horizontal level of bga chip, after making its solder joint corresponding with the mesh for planting net,
Fastening screw, makes bga chip be fixed on fixed station；3rd, ball plate will be planted by alignment pin and is fixed on chip fixed station top；4、
Corresponding tin ball is added, ball-planting device is shaken back and forth, tin ball is uniformly bonded at the bga chip weldering for having smeared weld-aiding cream by mesh
On point, after remove BGA, after being heated at reflux, form the tin ball of complete BGA.
Specific embodiment of the utility model is described above.It is to be appreciated that the utility model not office
It is limited to above-mentioned particular implementation, those skilled in the art can within the scope of the claims make various deformations or amendments,
This has no effect on substance of the present utility model.
Claims (10)
1. a kind of BGA ball-planting devices, the BGA ball-planting devices include chip fixed station, plant ball plate and plant net, ball placement plate
The chip fixed station top is fixed on by the alignment pin set on the chip fixed station, it is characterised in that：The chip
Groove is provided with inside fixed station, the groove is provided with some slideways, and one end of the slideway comes together in the groove center,
The other end is distributed from the center to surrounding, and block is equipped with each described slideway, and screw is separately installed with the block
And nut, the block can slide on the slideway, and the groove center is provided with through hole and arranges screw bolt and nut, described
Bolt head is used to place the chip, and the core being placed on above the bolt is adjusted by adjusting the bolt highly
The height of piece.
2. a kind of BGA ball-planting devices according to claim 1, it is characterised in that：Ball placement plate and ball placement net one
Body formed, ball placement net is located at ball placement plate centre position, and ball placement edges of boards edge is provided with the location hole.
3. a kind of BGA ball-planting devices according to claim 1, it is characterised in that：Ball placement plate includes upper plate and lower plate,
The upper plate is corresponding with the middle part of the lower plate to be formed through port, and ball placement net is placed in the passage port；On described
Plate and the lower plate edge are correspondingly provided with through hole respectively, and by screw connection, and ball placement net is located at the upper plate and described
Between lower plate；The upper plate and the lower plate edge are additionally provided with location hole, corresponding with the alignment pin.
4. a kind of BGA ball-planting devices according to claim 1, it is characterised in that：Ball placement net mesh is in array distribution.
5. a kind of BGA ball-planting devices according to claim 4, it is characterised in that：The mesh diameter is than the bga chip
The distance being placed in when on the bolt with ball placement net is big 0.5-1.5 millimeters.
6. a kind of BGA ball-planting devices according to claim 1, it is characterised in that：The alignment pin number is 3-4.
7. a kind of BGA ball-planting devices according to claim 3, it is characterised in that：The upper plate and the lower plate edge are logical
The number in hole is respectively 3 or 5, and scattering device is in the edge surrounding.
8. a kind of BGA ball-planting devices according to claim 1, it is characterised in that：The slideway number is at least 2.
9. a kind of BGA ball-planting devices according to claim 1, it is characterised in that：The bolt head is socket cap.
10. a kind of BGA ball-planting devices according to claim 9, it is characterised in that：The socket cap basal diameter is more than
1.5 centimetres and less than the groove diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621252989.6U CN206293416U (en) | 2016-11-22 | 2016-11-22 | A kind of BGA ball-planting devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621252989.6U CN206293416U (en) | 2016-11-22 | 2016-11-22 | A kind of BGA ball-planting devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206293416U true CN206293416U (en) | 2017-06-30 |
Family
ID=59100160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621252989.6U Active CN206293416U (en) | 2016-11-22 | 2016-11-22 | A kind of BGA ball-planting devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206293416U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020011233A1 (en) * | 2018-07-12 | 2020-01-16 | 新冠科技有限公司 | Ball mounter |
-
2016
- 2016-11-22 CN CN201621252989.6U patent/CN206293416U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020011233A1 (en) * | 2018-07-12 | 2020-01-16 | 新冠科技有限公司 | Ball mounter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204067308U (en) | Bga chip plant ball instrument | |
| CN205069597U (en) | A plant ball instrument for BGA chip | |
| CN103429006A (en) | BGA (Ball Grid Array) ball embedding method using SMT (Surface Mounting Technology) chip mounter | |
| CN206293416U (en) | A kind of BGA ball-planting devices | |
| CN201736141U (en) | Circuit board fixing support | |
| CN204498475U (en) | A kind of PCB universal carrier | |
| CN102335790A (en) | Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table | |
| CN209626187U (en) | A kind of BGA device, which is reprocessed, plants ball tooling | |
| CN105336633B (en) | A kind of plant ball instrument for bga chip | |
| CN204160014U (en) | A kind of environment-friendly high-efficiency BGA that guarantees the quality reprocesses and plants ball tool | |
| CN106971951A (en) | A kind of plant column method for CuCGA devices | |
| CN207396616U (en) | More feedback pin antenna measurement frocks | |
| CN212161757U (en) | BGA ball mounting device capable of realizing three-degree-of-freedom accurate adjustment | |
| CN217719507U (en) | Ball grid array integrated circuit repairing and ball mounting device | |
| CN210283570U (en) | Solder paste silk screen printing platform device | |
| CN207720518U (en) | A kind of PCB pads component | |
| CN205609476U (en) | A plant ball instrument for BGA chip | |
| CN204696080U (en) | Bga chip reprocesses ball-planting device | |
| CN108807188B (en) | Column planting method of automatic ceramic column grid array column planting machine | |
| CN208210456U (en) | A kind of tool for crossing Reflow Soldering for assembling patch contact pin | |
| CN204486979U (en) | A kind of welding jigs and fixtures | |
| CN202411607U (en) | Fixture for repairing integrated circuit with ball grid array structure | |
| CN105870027B (en) | A kind of plant ball instrument for bga chip | |
| CN201464680U (en) | Frock clamp for coupling electro-optical module | |
| CN205194660U (en) | Wafer ink distribution seal device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |