CN217719507U - Ball grid array integrated circuit repairing and ball mounting device - Google Patents

Abstract

The utility model discloses a ball coral array integrated circuit reprocesses and plants ball ware, including location base, soldering paste print the mould and plant the ball on the mould, location base middle part is provided with supplementary adjusting device, and the soldering paste print the mould and can dismantle with planting the ball on the mould and be connected, and the location base can dismantle with planting the ball on the mould and be connected. This ball planting ware can effectively solve the problem that can only plant the ball to single size components and parts that current ball planting frock exists.

Description

Ball grid array integrated circuit repairing and ball mounting device

Technical Field

The utility model belongs to the technical field of the ball planting ware, concretely relates to ball shop integrated circuit reprocesses ball planting ware.

Background

After a BGA (Ball grid array) Ball grid array package device is soldered to a printed board, the device needs to be repaired due to device failure, cold solder, and the like. After the BGA (Ball grid array) Ball grid array package component and the printed circuit board are separated by heating and melting the solder balls, the solder balls of the component can not meet the requirement of re-welding. The other condition is that the indexes of no sealing defect or solderability and the like of the solder balls of the BGA (Ball grid array) Ball grid array packaging component do not meet the process requirements. The solder on the device pad is cleaned, solder paste printing and ball planting are carried out, and then heating fusion welding is carried out, so that the ball grid array packaging component meeting the electric fitting process requirements is obtained. The ball-planting device for repairing the ball grid array integrated circuit can complete two procedures of soldering paste printing and ball planting in the process flow.

The conventional manual operation mode is manual spot welding paste, the solder balls are manually placed on the bonding pads of the device, the problems of uneven given amount of the solder paste and low ball planting positioning precision exist, the size of the solder balls after fusion welding is different, the coplanarity is poor, and the subsequent welding quality is influenced. The solder balls of BGA (Ball grid array) Ball grid array package components have a size as small as 0.2mm in diameter and as many as one or two thousand, so that the manual operation is difficult and the efficiency is very low.

At present, some ball planting tools also appear, and although the operation efficiency can be improved, the existing ball planting tools can only be used for processing components with fixed sizes, and if components with various sizes exist, a plurality of sets of ball planting tools need to be purchased, so that the production cost is increased.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned not enough, the utility model provides a ball-planting ware is reprocessed to ball-planting array integrated circuit, the problem that can only plant the ball to single size components and parts that this ball-planting ware can effectively solve current ball-planting frock and exist.

In order to achieve the above object, the technical solution of the present invention to solve the technical problem is:

the utility model provides a ball ware is planted in repairing of ball-grid array integrated circuit, includes that location base, soldering paste print the mould and plant the ball and go up the mould, and location base middle part is provided with supplementary adjusting device, and the mould is gone up in the soldering paste print and plant the ball and go up the mould and can dismantle the connection, and the location base can dismantle the connection with planting the ball and go up the mould.

Furthermore, the auxiliary adjusting device comprises a fixed seat, and two triangular positioning plates are movably connected to the fixed seat.

Furthermore, a rectangular settling tank, a long-strip-shaped settling tank and an open slot are arranged on the positioning base, the long-strip-shaped settling tank is arranged on the diagonal line of the rectangular settling tank, the open slot is arranged at one end of the long-strip-shaped settling tank, the fixing seat is arranged in the long-strip-shaped settling tank, and the positioning plate is arranged in the rectangular settling tank.

Furthermore, a groove is formed in the middle of the fixing seat, a screw rod is arranged in the groove, two ends of the screw rod respectively penetrate through the fixing seat and are movably connected with the fixing seat, a nut is sleeved on the screw rod, and the nut is fixedly connected with the positioning plate.

Furthermore, the locating plate is a right triangle, and a baffle is arranged on the right-angle side of the locating plate.

Furthermore, a plurality of through holes are formed in the upper soldering paste printing die.

Furthermore, the upper ball planting die is of an annular structure, and a channel is arranged on the bottom surface of the upper ball planting die.

Furthermore, the shape of the upper ball planting die is the same as that of the positioning base, a supporting column is arranged on the lower bottom surface of the upper ball planting die, a positioning groove is formed in the positioning base, and the supporting column is arranged in the positioning groove.

To sum up, the utility model has the advantages of it is following:

be provided with supplementary adjusting device in the device, through the size of the adjustable fixed plate of supplementary adjusting device, and then can fix the components and parts of multiple size to improve fixed effect, select the mould in the soldering paste printing of suitable size according to the size of components and parts, the device can be adjusted according to the size of needs, and the practicality is stronger, can reduce the production input simultaneously.

Drawings

FIG. 1 is an isometric view of the device;

FIG. 2 is a schematic view of the positioning base of the apparatus;

FIG. 3 is a schematic structural view of an upper solder paste printing die;

FIG. 4 is a schematic structural view of an upper die for ball attachment;

wherein, 1, positioning the base; 2. an upper mould for printing soldering paste; 3. planting a ball upper die; 4. an auxiliary adjustment device; 5. a fixed seat; 6. positioning a plate; 7. a rectangular settling tank; 8. a long strip-shaped settling tank; 9. an open slot; 10. a groove; 11. a screw rod; 12. a baffle plate; 13. a channel.

Detailed Description

The following describes the embodiments of the present invention in detail with reference to the attached drawings.

The utility model discloses an embodiment, as shown in fig. 1-4, provides a ball-grid array integrated circuit reprocesses and plants ball ware, including positioning base 1, soldering paste printing upper die 2 and ball planting upper die 3, positioning base 1 is used for fixing and bearing whole device structure, positioning base 1 middle part is provided with auxiliary adjusting device 4, auxiliary adjusting device 4 and positioning base 1 fixed connection realize the relative fixation of the two, improve the accuracy that the through-hole on the soldering paste printing upper die 2 corresponds with the components and parts, soldering paste printing upper die 2 and ball planting upper die 3 can be dismantled and connected, can change the adjustment according to the size needs; the positioning base 1 and the upper ball planting die 3 are detachably connected, so that components can be conveniently taken and placed.

Optimally, the upper soldering paste printing die 2 is made of a steel membrane, and a plurality of through holes are formed in the upper soldering paste printing die 2 and used for solder balls to pass through, so that the solder balls fall on the components. Optimally, mould 3 sets up to the loop configuration on the planting ball, is provided with passageway 13 on its bottom surface, and mould 2 is gone up in the solder paste printing and mould 3 fixed back on the planting ball, alright be used for planting the ball operation with mould 3 on the planting ball, and the solder ball falls on the components and parts of bottom through the through-hole on mould 2 is printed to the solder paste, after the planting ball operation, can pour out the inside unnecessary solder ball of mould 3 on the planting ball through passageway 13, improves the convenience of operation. Optimally, the shape of the upper ball planting die 3 is the same as that of the positioning base 1, and the shapes of the upper ball planting die and the positioning base are the same, so that the installation and the subsequent operation are convenient; be provided with the support column under the ball planting goes up mould 3 on the bottom surface, be provided with the constant head tank on the location base, the support column sets up in the constant head tank, is convenient for carry out relatively fixed with location base 1 on the ball planting mould 3, improves the degree of accuracy of solder ball whereabouts position.

Optimally, the auxiliary adjusting device 4 comprises a fixed seat 5, and two positioning plates 6 are movably connected to the fixed seat 5. Optimally, a rectangular settling tank 7, a long-strip-shaped settling tank 8 and an open slot 9 are arranged on a positioning base 1, the long-strip-shaped settling tank 8 is arranged on a diagonal line of the rectangular settling tank 7, the depth of the long-strip-shaped settling tank 8 is greater than that of the rectangular settling tank 7, the open slot 9 is arranged at one end of the long-strip-shaped settling tank 8, a fixing seat 5 is arranged in the long-strip-shaped settling tank 8, the width of the fixing seat 5 is consistent with that of the long-strip-shaped settling tank 8, and the fixing base is 5 times extruded and fixed after being placed; the positioning plate 6 is arranged in the rectangular settling tank 7, and the positioning plate 6 can move relatively in the rectangular settling tank 7 to realize size adjustment. Optimally, the middle of the fixed seat 5 is provided with a groove 10, a screw rod 11 is arranged in the groove, two ends of the screw rod 11 respectively penetrate through the fixed seat 5 and are movably connected with the fixed seat 5 through a bearing, a nut is sleeved on the screw rod 11, and the nut is fixedly connected with the positioning plate 6. Optimally, the positioning plate 6 is a right triangle, the baffle plate 12 is arranged on the right-angled edge of the positioning plate, the baffle plate 12 and the positioning plate 6 are integrally formed or fixedly connected, the baffle plate 12 is arranged, the limiting effect on the component can be improved, and the accuracy of the contact position of the solder ball and the component is further improved.

The use process of the device is as follows:

1. according to the size of a basal body of the ball grid array packaging component, a screw rod 11 is rotated at an open slot 9, so that a nut drives positioning plates 6 to move until baffle plates 12 of the two positioning plates 6 are in contact with the edge of the ball grid array packaging component, and the ball grid array packaging component is fixed;

2. fixedly mounting a soldering paste printing upper die 2 and a ball planting upper die 3 corresponding to the ball grid array packaging component through structures such as pin holes and the like, and then inserting a support column on the ball planting upper die 3 into a positioning groove on a positioning base 1 to relatively fix the ball planting upper die 3 and the positioning base 1, wherein the ball grid array packaging component is positioned between the positioning base 1 and the ball planting upper die 3;

3. and placing the solder balls into the ball-planting upper die 3, plugging the channel 13 on the ball-planting upper die 3, slightly shaking the positioning base 1, enabling the solder balls to fall on the ball grid array packaging component at the bottom through the through holes on the solder paste printing upper die 2, taking down the ball-planting upper die 3 after filling, and pouring out the residual solder balls from the channel 13.

While the present invention has been described in detail and with reference to the accompanying drawings, it is not to be considered as limited to the scope of the invention. Various modifications and changes may be made by those skilled in the art without inventive step within the scope of the appended claims.

Claims (8)

1. The utility model provides a ball-grid array integrated circuit reprocesses and plants ball ware, its characterized in that, mould (2) and plant ball and go up mould (3) including location base (1), soldering paste printing, location base (1) middle part is provided with supplementary adjusting device (4), soldering paste printing go up mould (2) with it can dismantle the connection to plant ball last mould (3), location base (1) with it can dismantle the connection to plant ball last mould (3).

2. The ball grid array integrated circuit rework ball-planting device of claim 1, wherein said auxiliary adjusting means (4) comprises a fixing base (5), said fixing base (5) being movably connected with two positioning plates (6).

3. The ball grid array integrated circuit repairing ball planting device according to claim 2, wherein a rectangular settling tank (7), an elongated settling tank (8) and an open slot (9) are arranged on the positioning base (1), the elongated settling tank (8) is arranged on a diagonal line of the rectangular settling tank (7), the open slot (9) is arranged at one end of the elongated settling tank (8), the fixing seat (5) is arranged in the elongated settling tank (8), and the positioning plate (6) is arranged in the rectangular settling tank (7).

4. The ball grid array integrated circuit repairing ball-planting device according to claim 3, wherein a groove (10) is provided in the middle of the fixing base (5), a screw rod (11) is provided in the groove, two ends of the screw rod (11) respectively penetrate through the fixing base (5) and are movably connected with the fixing base (5), a nut is sleeved on the screw rod (11), and the nut is fixedly connected with the positioning plate (6).

5. The ball grid array ic rework ball placement machine of claim 2, wherein said positioning board (6) is a right triangle with a baffle (12) on its right-angled side.

6. The ball grid array integrated circuit rework ball mounter according to claim 1, wherein said upper solder paste printing die (2) is provided with a plurality of through holes.

7. The ball grid array ic rework ball placement machine of claim 1, wherein said upper ball placement mold (3) is configured as a ring structure with a channel (13) on its bottom surface.

8. The ball grid array integrated circuit repairing ball-planting device according to claim 1, wherein the shape of the upper ball-planting die (3) is the same as the shape of the positioning base (1), a supporting column is arranged on the lower bottom surface of the upper ball-planting die (3), a positioning slot is arranged on the positioning base, and the supporting column is arranged in the positioning slot.

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