CN204160014U - A kind of environment-friendly high-efficiency BGA that guarantees the quality reprocesses and plants ball tool - Google Patents
A kind of environment-friendly high-efficiency BGA that guarantees the quality reprocesses and plants ball tool Download PDFInfo
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- CN204160014U CN204160014U CN201420606351.2U CN201420606351U CN204160014U CN 204160014 U CN204160014 U CN 204160014U CN 201420606351 U CN201420606351 U CN 201420606351U CN 204160014 U CN204160014 U CN 204160014U
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Abstract
The utility model discloses a kind of environment-friendly high-efficiency BGA that guarantees the quality and reprocesses and plant ball tool, comprises base; Be located at the BGA screens groove of base central authorities, for fixing bga chip; Folder steel disc frame, is placed on base, for fixing steel disc; Steel disc, being fastened in folder steel disc frame, steel disc offering the through hole corresponding with the pad of bga chip, for implanting tin sweat(ing) in the pad of bga chip; Wherein, BGA screens groove is the groove of size consistent with bga chip, and is provided with the ear of arc in the relative both sides of groove, inserts or extract bga chip for staff.It adopts the BGA screens groove of fixed dimension to fix bga chip, significantly improves the positioning precision of pad and tin sweat(ing) on bga chip, and avoids with the prolongation of service time, the increasing and cause precise decreasing and bring reprocessing error problem of access times.
Description
Technical field
The utility model relates to circuit board SMT technical field, discloses a kind of environment-friendly high-efficiency BGA that guarantees the quality especially and reprocesses and plant ball tool.
Background technology
The full name of BGA is Ball Grid Array (PCB of ball grid array structure), and it is a kind of package method that integrated circuit adopts organic support plate.If bga chip is bad directly scrap process, such cost of idleness, and not environmentally.General producer all can carry out BGA and reprocess, and conventional BGA reprocesses step and comprises: 1: dismounting BGA; 2: dehumidify; 3: Printing Paste; 4: cleaning pad; 5: dehumidify; 6: Printing Paste; 7: attachment BGA; 8: reflow welding connects; 9: inspection.Wherein, plant ball processing step to comprise: 1: the residue solder in the BGA bottom land of place to go also cleans; 2: print fluxing in BGA bottom land; 3: select soldered ball; 4: plant ball; 5: reflow welding connects; 6: after welding.Ball-establishing method has several as follows:
A) ball device method is planted in employing:
Ball device is planted if had, select one piece with the template of BGA pad matched, the accurate paster welding system accurate paster welding system mouth size of opening of template should 0.05-0.1mm larger than Diameter of Solder Ball, soldered ball is sprinkling upon in template equably, rock and plant ball device, unnecessary soldered ball is rolled into from template and plants in the soldered ball feeder of ball device, make to retain a soldered ball in the lucky each small opening of template surface.Place on the table planting ball device, the BGA device of printed scaling powder or soldering paste is inhaled on suction nozzle, aim at according to the method for attachment BGA, suction nozzle is moved down, BGA device is mounted on the soldered ball of planting ball device template surface, then BGA device sucked up, soldered ball is bonded on the corresponding pad of BGA device by the stickiness by scaling powder or soldering paste.Clamp the outer rim of BGA device with tweezers, close vavuum pump, by the soldered ball of BGA device towards upper placement on the table, checking the place with or without lacking soldered ball, if having, using tweezers polishing.
B) template is adopted
The BGA device of printed scaling powder or soldering paste is placed on the table, and scaling powder or soldering paste are towards upper.Prepare the template of one piece of BGA pad matched, the opening size of template should 0.05 ~ 0.1mm larger than Diameter of Solder Ball, high for template surrounding cushion block frame, above the BGA device being placed on printed scaling powder or soldering paste, make the distance between template and BGA be equal to or slightly less than the diameter of soldered ball, aim under the microscope.Soldered ball is sprinkling upon in template uniformly, unnecessary soldered ball tweezers is dialled (getting) and gets off, make to retain a soldered ball in the lucky each small opening of template surface.Remove template, check and polishing.
C) manual attachment
The BGA device of printed scaling powder or soldering paste is placed on the table, and scaling powder or soldering paste are towards upper.With tweezers or suction pen, soldered ball is put well one by one as paster.
D) appropriate soldering paste method is brushed
During processing template, template thickness is thickeied, and slightly amplify the opening size of template, soldering paste is directly printed on the pad of BGA.Due to capillary effect, after reflow welding, form solder ball.
Adopt and plant ball device and carry out BGA and reprocess that to plant ball be at present conventional mode.Patent CN301595340S and CN302051893S discloses one kind and plants Zhu Tai, reprocessing of ball and chip bga is planted for manual bga chip, plant in the middle of pearl platform at BGA and run through a screw rod, on screw rod, correspondence is provided with two the core of the card horses, and BGA plants the knob being provided with drive screw rotation outside pearl platform.Patent CN2613881Y discloses a kind of implantation device for welding-ball, comprise eccentric ball seat, let slip a remark and driving lever, eccentric ball seat has eccentric material hole, central axis position of leting slip a remark has small opening, driving lever front end has aperture and chute, eccentric ball seat and junction surface of leting slip a remark have the slot of allowing that driving lever is come in and gone out, and diameter and the Diameter of Solder Ball of described bias material hole, small opening, aperture adapt, and track length and bias expect that the eccentric distance of the hole heart between hole and small opening adapts.Patent CN203418199U discloses a kind of BGA and plants ball tool, comprise folder steel disc frame (1), steel disc, support, two folder steel disc frames (1) by steel piece clip wherein, folder steel disc frame (1) is provided with locating hole (4) and lock screw hole (5), lock screw hole is provided with lock screw in (5), support (2) includes pedestal (6), alignment pin (7), mobile block (8), screw (9) and nut, described pedestal is provided with " cross " groove frame (10), groove frame (10) is respectively arranged with four slideways (11), each slideway is provided with mobile block (8), mobile block (8) is installed screw (9) and nut respectively, mobile block (8) is movable in groove frame (10), by screw (9) and fastening nuts, pedestal (6) is provided with the alignment pin (7) corresponding with the locating hole pressing from both sides steel disc frame (1) (4).Above-mentioned patent meets BGA all preferably and reprocesses the requirement of planting ball, and can adapt to reprocessing of different size BGA plants ball simultaneously, but its fixing precision is poor, and particularly after Long-Time Service, screw rod or screw easily loosen, and cause BGA alignment accuracy poor.
Utility model content
The purpose of this utility model is to provide a kind of environment-friendly high-efficiency BGA that guarantees the quality to reprocess and plant ball tool, it adopts the BGA screens groove of fixed dimension to fix bga chip, significantly improve the positioning precision of pad and tin sweat(ing) on bga chip, and avoid with the prolongation of service time, the increasing and cause precise decreasing and bring reprocessing error problem of access times.
The utility model provides a kind of environment-friendly high-efficiency BGA that guarantees the quality to reprocess and plant ball tool, comprises base;
Be located at the BGA screens groove of base central authorities, for fixing bga chip;
Folder steel disc frame, is placed on base, for fixing steel disc;
Steel disc, being fastened in folder steel disc frame, steel disc offering the through hole corresponding with the pad of bga chip, for implanting tin sweat(ing) in the pad of bga chip;
Wherein, BGA screens groove is the groove of size consistent with bga chip, and is provided with the ear of arc in the relative both sides of groove, inserts or extract bga chip for staff.
The BGA screens groove of fixed dimension is adopted to fix bga chip, although it is not strong that its single BGA reprocesses the versatility of planting ball tool, but it significantly improves the positioning precision of pad on bga chip and tin sweat(ing), and can not with the prolongation of service time, the increasing and cause precise decreasing and bring reprocessing error of access times.
Preferably, described folder steel disc frame forms by the middle part of surrounding framework and the hollow out for fixing steel disc, surrounding framework is offered in the middle part of hollow out in inside gradient, in the middle part of the gradient hollow out that upper opening is relatively large to be formed, lower openings is relatively little, is convenient to the quick insertion of steel disc and extracts.
Preferably, described surrounding framework is also provided with an oblique breach, the degree of depth of breach, deeply to the bottom of steel disc, is convenient to staff and will be implanted tin sweat(ing) and steel disc after reflow process takes out.
Preferably, four angles in the middle part of described hollow out are rounded corners, corresponding, four angles of steel disc are rounded corners, avoid staff unexpected scuffing when operating the insertion of steel disc or extracting.
Preferably, the number of openings on described steel disc is identical with the number of pads of BGA, and the aperture of through hole is the 80%-120% in pad aperture, and its aperture can be identical with the diameter of pad; Also can be slightly less than the diameter of pad, avoid climbing tin phenomenon between different pad; Also slightly larger than the diameter of pad, the plumpness of tin on pad can be ensured.
Preferably, described ear semicircular in shape.
The beneficial effects of the utility model have:
1, adopt the BGA screens groove of fixed dimension to fix bga chip, significantly improve the positioning precision of pad and tin sweat(ing) on bga chip, and avoid with the prolongation of service time, the increasing and cause precise decreasing and bring and reprocess error problem of access times.
2, in the middle part of the gradient hollow out by folder steel disc frame, the detailed structure design such as oblique breach, rounded corners, improve BGA and reprocess the efficiency of planting ball, ensure that its BGA reprocesses the quality of planting ball.
Below in conjunction with the drawings and specific embodiments, the utility model is described further.
Accompanying drawing explanation
Fig. 1 is that BGA of the present utility model reprocesses the plan structure schematic diagram of planting ball tool.
Fig. 2 is that BGA of the present utility model reprocesses the main TV structure schematic diagram of planting ball tool.
In figure, 1-base, 2-BGA screens groove, 3-BGA chip, 4-presss from both sides steel disc frame, 5-steel disc, 6-ear, 41-surrounding framework, in the middle part of 42-hollow out, 43-breach.
Detailed description of the invention
The present embodiment is the utility model preferred embodiment, and other its principles all are identical with the present embodiment or approximate with basic structure, all within the utility model protection domain.
Incorporated by reference to referring to accompanying drawing 1 to 2, the environment-friendly high-efficiency of the present utility model BGA that guarantees the quality reprocesses and plants ball tool, comprises base 1;
Be located at the BGA screens groove 2 of base 1 central authorities, for fixing bga chip 3;
Folder steel disc frame 4, is placed on base 1, for fixing steel disc 5;
Steel disc 5, being fastened in folder steel disc frame 4, steel disc 5 offering the through hole corresponding with the pad of bga chip 3, for implanting tin sweat(ing) in the pad of bga chip 3;
Wherein, BGA screens groove 2 is the groove of size consistent with bga chip 3, and is provided with semicircular ear 6 in the relative both sides of groove, inserts or extract bga chip 3 for staff.Folder steel disc frame 4 comprises surrounding framework 41 and in the middle part of the hollow out of fixing steel disc 5 42, surrounding framework 41 to offer in the middle part of hollow out 42 in inside gradient, form that upper opening is relatively large, in the middle part of gradient hollow out that lower openings is relatively little 42, be convenient to the quick insertion of steel disc 5 and extract.Surrounding framework 41 is also provided with an oblique breach 43, the degree of depth of breach 43, deeply to the bottom of steel disc 5, is convenient to staff and will be implanted tin sweat(ing) and steel disc 5 after reflow process takes out.In the middle part of hollow out, four angles of 42 are rounded corners, corresponding, four angles of steel disc 5 are also rounded corners, thus avoid staff unexpected scuffing when operating the insertion of steel disc 5 or extracting.
In the present embodiment, the number of openings on steel disc 5 is identical with the number of pads of BGA, and the aperture of through hole is identical with the diameter of pad.Certainly, the aperture of through hole also can be selected within the scope of the 80%-120% in pad aperture.The aperture of through hole also can be slightly less than the diameter of pad, avoids climbing tin phenomenon between different pad; Also slightly larger than the diameter of pad, the plumpness of tin on pad can be ensured.
The BGA screens groove 2 of fixed dimension is adopted to fix bga chip 3, although it is not strong that single BGA reprocesses the versatility of planting ball tool, but it significantly improves the positioning precision of pad and tin sweat(ing) on bga chip 3, and can not with the prolongation of service time, the increasing and cause precise decreasing and bring reprocessing error of access times.
Its course of work is as follows:
1, the bga chip flatiron dismantled drags flat, and brush one deck tin cream or weld-aiding cream, for subsequent use;
2, take out the steel disc in folder steel disc frame, bga chip for subsequent use inserts in BGA screens groove by staff;
3, cover steel disc, the pad of BGA is automatically corresponding with the lead to the hole site of steel disc, and steel disc imports tin sweat(ing), shakes tool back and forth, and tin ball, by the through hole of steel disc, is evenly bonded on the pad of the bga chip having smeared tin cream or weld-aiding cream;
4, take out the steel disc in folder steel disc frame, extract bga chip, adopt the mode high-temperature molten tin such as reflux heating, form complete bga chip, can recycle.
Above disclosedly be only preferred embodiment of the present utility model, certainly can not limit the interest field of the utility model with this, therefore according to the equivalent variations that the utility model claim is done, still belong to the scope that the utility model is contained.
Claims (7)
1. the environment-friendly high-efficiency BGA that guarantees the quality reprocesses and plants a ball tool, it is characterized in that: comprise base;
Be located at the BGA screens groove of base central authorities, for fixing bga chip;
Folder steel disc frame, is placed on base, for fixing steel disc;
Steel disc, is fastened in folder steel disc frame, steel disc offers the pad with bga chip
Corresponding through hole, for implanting tin sweat(ing) in the pad of bga chip;
Wherein, BGA screens groove is the groove of size consistent with bga chip, and is provided with the ear of arc in the relative both sides of groove, inserts or extract bga chip for staff.
2. the environment-friendly high-efficiency according to claim 1 BGA that guarantees the quality reprocesses and plants ball tool, it is characterized in that: described folder steel disc frame forms by the middle part of surrounding framework and the hollow out for fixing steel disc, surrounding framework is offered in the middle part of hollow out, in the middle part of the gradient hollow out that upper opening is relatively large to be formed, lower openings is relatively little in inside gradient.
3. the environment-friendly high-efficiency according to claim 2 BGA that guarantees the quality reprocesses and plants ball tool, it is characterized in that: described surrounding framework is also provided with an oblique breach.
4. the environment-friendly high-efficiency according to claim 2 BGA that guarantees the quality reprocesses and plants ball tool, it is characterized in that: four angles in the middle part of described hollow out are rounded corners, corresponding, four angles of steel disc are rounded corners.
5. the environment-friendly high-efficiency according to claim 1 and 2 BGA that guarantees the quality reprocesses and plants ball tool, and it is characterized in that: the number of openings on described steel disc is identical with the number of pads of BGA, the aperture of through hole is the 80%-120% in pad aperture.
6. the environment-friendly high-efficiency according to claim 5 BGA that guarantees the quality reprocesses and plants ball tool, it is characterized in that: the aperture of through hole is identical with the diameter of pad.
7. the environment-friendly high-efficiency according to claim 1 and 2 BGA that guarantees the quality reprocesses and plants ball tool, it is characterized in that: described ear semicircular in shape.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420606351.2U CN204160014U (en) | 2014-10-20 | 2014-10-20 | A kind of environment-friendly high-efficiency BGA that guarantees the quality reprocesses and plants ball tool |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420606351.2U CN204160014U (en) | 2014-10-20 | 2014-10-20 | A kind of environment-friendly high-efficiency BGA that guarantees the quality reprocesses and plants ball tool |
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| CN204160014U true CN204160014U (en) | 2015-02-18 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105772896A (en) * | 2016-04-15 | 2016-07-20 | 株洲中车时代电气股份有限公司 | Patch positioning tool |
| CN106783650A (en) * | 2016-12-14 | 2017-05-31 | 深圳清华大学研究院 | For the fixing device of the automatic routing of semiconductor laser |
| CN109152237A (en) * | 2018-09-04 | 2019-01-04 | 深圳市华讯方舟微电子科技有限公司 | A kind of ball-establishing method and device |
-
2014
- 2014-10-20 CN CN201420606351.2U patent/CN204160014U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105772896A (en) * | 2016-04-15 | 2016-07-20 | 株洲中车时代电气股份有限公司 | Patch positioning tool |
| CN106783650A (en) * | 2016-12-14 | 2017-05-31 | 深圳清华大学研究院 | For the fixing device of the automatic routing of semiconductor laser |
| CN106783650B (en) * | 2016-12-14 | 2019-12-06 | 深圳清华大学研究院 | Fixing device for automatic routing of semiconductor laser |
| CN109152237A (en) * | 2018-09-04 | 2019-01-04 | 深圳市华讯方舟微电子科技有限公司 | A kind of ball-establishing method and device |
| CN109152237B (en) * | 2018-09-04 | 2020-10-30 | 深圳市华讯方舟微电子科技有限公司 | Ball planting method and device |
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| C14 | Grant of patent or utility model | ||
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| CP01 | Change in the name or title of a patent holder |
Address after: 518000, Guangdong Province, Longgang District, Pinghu District, Shenzhen street, Pinghu community Fumin industrial zone two, tenth to the third floor of the district Patentee after: Shenzhen sea and Polytron Technologies Inc Address before: 518000, Guangdong Province, Longgang District, Pinghu District, Shenzhen street, Pinghu community Fumin industrial zone two, tenth to the third floor of the district Patentee before: SHENZHEN HAIHE ELECTRON CO., LTD. |